TW201249272A - Manufacturing method for electronic substrate and binding agent applied to the same - Google Patents

Abstract

Disclosed are a manufacturing method for an electronic substrate, and a binding agent applied to the method. In one embodiment, a first step in the method is to prepare a first substrate, preferably a hard substrate; after that, a liquid-state binding agent is coated on the first substrate. Next, a dry film with adhesiveness is formed by heating the liquid-state binding agent. A second substrate, especially the flexible material, other than the physical property of the first substrate is combined with the first substrate via the binding agent. The electronic substrate is formed as performing a required treatment to the second substrate. The electronic substrate is then removed from the first substrate. In particular, the agent formed to process bonding as heating, and debonding as cooling may be recyclable material.

Description

201249272, invention description: [Technical field to which the invention pertains] ^ The disclosure proposes a process and application of an electronic substrate. In particular, it refers to a temperature-controlled adhesive, and the application of this adhesive. [Prior Art] = The application of the circuit board is becoming more and more extensive and powerful, and the application produces 曰, , ,. A circuit board or a structure in which a plurality of layers of material are laminated. There is a certain physical difference between j. For example, when the materials of each layer are heated, the difference between the structure of the crucible and the specific heat of the material is not: because of the reaction of the layers to the temperature due to heating or low temperature in the process, which makes The layers cannot be closely fitted. Hygiene 2: Γί Figure 1 shows a schematic diagram of the warpage phenomenon of a multilayer circuit board in the prior art. 1 Saki double-pressure diagram shows a circuit board structure 1Q, $ π, the second layer circuit board 12 and the third layer circuit board 13 according to the board, each layer should have different wiring (_ting), and the two are uneven 'Making # varies between layers. Because the process, := 妾 is not: R warming and other procedures, at this time the upper: degree of reaction is not - and the problem of producing _ 曲, as shown in the range of 15 traditionally The process may cause distortions, and the shadows will be combined. For sophisticated electronic devices, it will also cause group i;

S 4/15 201249272 SUMMARY OF THE INVENTION In order to improve the manufacturing process of a multilayer material, the manufacturing process may be caused by the difference in physical properties between the layers of materials and the substrate. The present disclosure particularly proposes a temperature application process in an electronic substrate process. Controlled adhesive, using the improvement of the process and the interlayer adhesives described in this disclosure, in addition to preventing errors in the process, can also be processed through temperature control or other optical methods, so that the adhesive can be processed smoothly Bonding and peeling between substrates. According to the embodiment, the process of the electronic substrate includes preparing the first substrate, which can be a rigid substrate, especially applied to a general machine, and then coating a liquid adhesive on the first plate, which can be reused. Temperature control causes the liquid adhesive to form an adhesive dry film of the adhesive. The liquid adhesive is cured to form a dry film, so that the second substrate is subsequently grounded on the first substrate, such as by a roller pressing process or a germanium layer pressing process, particularly for the first substrate and the second substrate. With different physical impurities. Thereafter, the second substrate is formed into an electron button by a __ processing procedure, which may be a semiconductor process, forming an electronic component on the second substrate, or a process of forming a circuit. * In particular, the 'f-shaped shape is used to remove the adhesion of the adhesive dry film by the temperature-controlled optical method, and the electronic substrate can be smoothly peeled off. According to the embodiment, the composition of the above liquid adhesive mainly has a temperature-increasing solidification so as to have a subsequent dry film, and also causes the dry film to lose its adhesion when the temperature is lowered. [Embodiment] 5/15 201249272 The present disclosure proposes an adhesive, a bonding procedure between different substrate materials, and the brain = applied to the layer structure can be re-recorded by temperature and is not temperature-controlled. Secondly, when the temperature is lowered to -^ temperature (such as room temperature), the method of (4) may be (10) according to the composition of the adhesive, and the composition of the adhesive having the temperature control property includes two main components. The Mohr ratios are respectively the subscripts X, y, ζ of the following figure. According to the composition of only %, the range of Mohr ratio between the main components is x==0~5; y=5~25; zHO. The following examples of the composition are as follows:

Ki R3

I I Ο

Ι T I C=0 j^jj c=o 0 o

among them:

Ri is one of hydrogen (Hydrogen) and sulfhydryl (Methyl); the core is Nonyl, ethoxylated ruthenium (Ethoxylated Nonyl 6/15 201249272 R3 is hydrogen (Hydrogen), methyl (Methyl); R4 It is one of the following compounds, including: methyl (Methy), ethyl (Ethyl), butyl (Butyl), ethylhexyl (Ethyl Hexyl), glycidyl (Glycidy 1), octadecyl (Steary 1) ), Aikoxy丨ated Lauryl, Tetrahydrofurfuryl, 2-Phenoxy Ethyl, is〇deCyj, octyl, Decyl and Is 〇b〇rnyl. The above-mentioned adhesives can be used to control the adhesion of the adhesive, especially in the process, which is recyclable in certain embodiments. Reusable material. In another embodiment, the viscosity can be controlled by optical means, such as curing the liquid adhesive with heat or ultraviolet light (uv) to form a viscous adhesive dry film, and then At the end of the process, the same method is used to make the adhesive dry film. Loss of viscosity, which makes it easy to peel off the substrate. However, the adhesives used in such a phase-generating contact and _ optical method cannot be recycled. "& Using the above-mentioned adhesive dry film, the multilayer material can be improved in the process. It is possible that b is produced on the basis of the difference in the 'substrate__ characteristics of the material of each layer. When the process is applied to the soft substrate in the process of the curve, the high temperature will cause the base to bend, or the difference in the material of the different layers will form a koji phenomenon. The error generated in the process can be transmitted through the temperature and the optical method to make the adhesive dry film easily fit and peel off the layers in the process. The process disclosed in the disclosure can be in the case of the second machine. 'Because such machines are usually hard-type when the substrate is attached, the physical difference between the two often causes errors in the process." The adhesive disclosed in this disclosure can improve this phenomenon. 2A to 21 then show a process example of the flexible substrate of the present invention, in which the above process with a temperature-controlled adhesive is not used, but still in the system Each of the financial reserves is returned to the ship membrane. The process is pre-installed on the machine table and the carrier, and as shown in FIG. 2A, the first substrate 20 is provided, which may be a hard substrate such as a glass substrate or a (four) substrate, and may be a round process. The carrier is Βθ. Next, as shown in FIG. 2B, a liquid adhesive 22 is applied on the first substrate 2, and the liquid adhesive is a material for subsequent use, and can be controlled to control its characteristics, such as temperature control adhesion. Characteristics. As shown in Fig. 2c, it is difficult to form a dry film 22' having an adhesiveness after a treatment. Then, a second substrate 欲 for forming various electronic substrates is prepared, for example, the substrate 24 is made of a substrate having different characteristics from the first substrate 2g, such as a soft substrate, and the special substrate is two substrates. The difference between the material and the implanted content produces different expansion coefficients and different specific heats. The second substrate 24 passes through the adhesive dry film 22 and is bonded to 2 turns, as shown in FIG. 2E. The laminating method is as follows: using a roll-pressing method _ to r〇U), or a lamination (a la-〇1 〇 plate 24 is formed on the first substrate 2Q. & As shown in FIG. 2F, after the second substrate 24 is bonded, other electronic components or wiring substrates are fabricated. As shown in the figure, the electronic component 2 can be fabricated on the second substrate by other semiconductor processes. It can also be made through lithography (lithQgraphy), etched pattern, etc., or by using the printing process (pr-g) (four) into various types of electric 8/15 201249272 boards. After the above process, the program is shown in Figure 2G. It is shown that the temperature control bite is a way of illuminating the light, so that the adhesive dry film 22 can lose the adhesion, and the electronic substrate formed by the second substrate 24 can be easily peeled off. Then, as shown in FIG. 2H, the loss of adhesion is left. The adhesive dry film 22, after the dry film is removed, the process leaves a first substrate 2, such as 21. In the above process, the step of bonding the second substrate 24 can be performed by using a roller pressing process or layer. Pressing process, and an alignment procedure can be applied before these steps A substrate 2A and a second substrate 24. In particular, the two substrates of different characteristics can be flattened by a dry film of the adhesive, and the subsequent process can be performed by Shunhe. The fabrication of the electronic substrate as described in FIG. EXAMPLES, _ _ Figure 3 'Step (4) 1 after the first substrate is prepared, 'step by step' coating - a liquid adhesive, such as solvent-type glue. After solvent removal, the well becomes a follow-up money, such as The second substrate is adhered to the second substrate (step S3G7), and the first substrate and the second substrate have the same physical characteristics: after being processed by other processes, electronic parts, wiring, etc. are formed on the second substrate. To form a specific function of the electron base S (step S309, ^ to make the film lose the adhesion (step training), so that the electronic substrate can be smoothly separated (step S313). / ^ Figure 4阙, this embodiment is an embodiment in which the characteristics of the dry film of the adhesive are controlled by temperature treatment, and the adhesive dry film on the first substrate in the subsequent stage of the film processing is a repeatable step such as S·'. Especially for - not easy to bend

9/15 201249272 Hard substrate, not limited to this. Further, as step s4〇3, the agent is applied to the first substrate. After heating to ^ cloth one night state). , the liquid adhesive forms an adhesive connection. At this time, as in step S409, the first piece to be fitted is placed in the -, in the alignment, 'specially - the new chain, such as her electronic The thin substrate is formed into a electronic substrate by a specific process (step S413). _. After completion, it can be cooled down, and the W__ is lost and then easily stripped (step S4). The step of attaching the first substrate to the electronic substrate can be carried out in a vacuum environment of θ/impurity, and the other processes can be reduced. Ύ 执行 Ύ 加热 加热 加热 加热 加热 加热 加热 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 加压 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变 变Following the dry film of the above, if the night on the first substrate, the solvent can be applied to form the adhesive with the solvent-like glue =:== The adhesive can be referred to the adhesive film of the adhesive described herein. Subsequently, the s temple can use the optical method of temperature control to change the adhesive dry film to a specific light irradiation procedure. The preferred embodiment is not preferred.

The equivalent structural changes for the contents of I 201249272 are included in the scope of the present invention and are combined with Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a surface curvature phenomenon of a multilayer circuit board in the prior art; FIG. 2A to FIG. 21 are diagrams showing a process example of an electronic substrate of the present invention; FIG. FIG. 4 illustrates the second warpage range of the embodiment of the electronic substrate manufacturing process of the present invention. 15 second layer circuit board 12 first substrate 20 followed by dry film 22' electronic component 201 [main component symbol description] circuit board structure 10 first layer circuit board 11 third layer circuit board 13 liquid adhesive 22 second substrate 24 steps S301~S313 electronic substrate process one step S401~S417 electronic substrate process two 11/15

Claims (1)

201249272 VII. Patent application scope: 1. A process for electronic substrate, comprising: preparing a first substrate; coating a liquid substrate on the first substrate; and using a == program to make the (4) subsequent connection The second substrate/substrate having different physical properties of the first substrate and the adhesive dry film is subjected to a processing procedure to form the second substrate into a sub-substrate. The adhesive dry film loses adhesion; and the soil is peeled off. Electronic substrate. 2. If the scope of the patent application is 〗 〖3, the formation of the connection = the base = Cheng' of the system 3. If the application of the scope of the patent is the second film--the cooling process makes the subsequent J-process' !·生. (5) She is at a constant temperature and loses 4. As in the patent application, the second continuation of the adhesive chapter, the process of the 4-layer substrate, which is the case. I_ _1 phase _ loss of adhesion 5. As described in the patent application scope of the second substrate of the electronic substrate process, wherein the process. The step of 胄 称 系 应用 应用 应用 应用 应用 应用 一 一 一 一 一 一 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如_水., Τ〇海7. - Seeding of electronic substrates, including: S I2/J5 201249272 A first substrate is prepared; a liquid adhesive solvent is applied on the first substrate; The liquid adhesive solvent is formed into an adhesive dry film of the adhesive; a second substrate having a different physical property from the first substrate is bonded to the first substrate and the dry film of the adhesive; The process is such that the second substrate forms an electronic substrate; the adhesive is dried by a cooling process to lose the adhesive adhesion; and the electronic substrate is peeled off. 8. The process of the electronic substrate comprises: preparing a first a liquid substrate is coated on the first substrate; the liquid adhesive is formed into an adhesive film dry film by a heating process; and the first substrate is bonded to the adhesive film And the first substrate a second substrate having different physical properties; the second substrate is formed into an electronic substrate by a processing procedure; the adhesive dry film is lost in adhesion by a light irradiation process; and the electronic substrate is peeled off. The adhesive for the electronic substrate process described in claim 1 or 7 is composed of: 13/15 201249272 R R3 (CH C ^ <CH 2 -CH )-(CH 2 - C 1 I I c=o c=o 0 R4 Ri is one of hydrogen (Hydrogen) and sulfhydryl (Methyl); Rule 2 is one of Nonyl and EthoxylatedNonyl; R3 is one of hydrogen (Hydrogen) and sulfhydryl (Methyl); R4 is one of the following compounds, including: Methyl, Ethyl, Butyl, Ethyl Hexyl, Glycidyl, Stearyl, Alkoxylated Lauryl, Tetrahydrofurfuryl, 2-Phenoxy Ethyl, Isodecyl, Octyl, Sulfhydryl Decyl) and isobornyl (Isobornyl); x=0~5; y=5~25; z=10. 10. The adhesive according to claim 9, wherein the composition has a temperature-increasing curing to make the adhesive dry film have an adhesive property, and the cooling property causes the 14/15 201249272 adhesive dry film to lose the adhesive property. . 15/15