CN112708360B - High-temperature-resistant back protection film for CPI touch conductive film manufacturing process and preparation method and application thereof - Google Patents
High-temperature-resistant back protection film for CPI touch conductive film manufacturing process and preparation method and application thereof Download PDFInfo
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- CN112708360B CN112708360B CN202011538049.4A CN202011538049A CN112708360B CN 112708360 B CN112708360 B CN 112708360B CN 202011538049 A CN202011538049 A CN 202011538049A CN 112708360 B CN112708360 B CN 112708360B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2433/00—Presence of (meth)acrylic polymer
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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Abstract
The application belongs to the field of high-temperature-resistant protective films, and particularly relates to a high-temperature-resistant back protective film for a CPI touch conductive film manufacturing process, and a preparation method and application thereof. A high-temperature-resistant back protection film for a CPI touch conductive film manufacturing process is composed of a base material layer, a high-temperature-resistant pressure-sensitive adhesive layer and a release film layer from bottom to top in sequence, wherein the base material layer is a yellow polyimide film, and the high-temperature-resistant pressure-sensitive adhesive layer is a high-temperature-resistant acrylic adhesive; the thickness of the base material layer is 20-80 μm, the thickness of the high-temperature-resistant pressure-sensitive adhesive layer is 20-60 μm, the coefficient of thermal expansion (50-250 ℃) of the base material layer is 20-30 ppm/DEG C, and the transverse and longitudinal thermal shrinkage rates under the condition of 200 ℃/120min are less than 0.1%; the peeling force of the high-temperature-resistant pressure-sensitive adhesive layer after high-temperature heat treatment at 150 ℃/30min is 2.5-10g. The problem of warping and deformation of traditional PET protection film in CPI nanometer silver line touch-control conducting film high temperature processing procedure can be well solved in this application.
Description
Technical Field
The application belongs to the field of high-temperature-resistant protective films, and particularly relates to a high-temperature-resistant back protective film for a CPI touch conductive film manufacturing process, and a preparation method and application thereof.
Background
In recent years, in the field of terminal display, flexible OLED display technology is rapidly developing from a curved screen to a foldable screen and a rollable screen. The advent of foldable and rollable screens requires not only the display unit to be flexible, but also other functional layers including TFT substrates, touch units and cover plates to be flexible. Therefore, in the touch module, the conventional ITO conductive glass and PET conductive film is replaced by the CPI conductive film with more excellent flexible foldability. Conductive films based on nano-silver wires will be the main development route for future flexible foldable/rollable touch modules due to their more mature manufacturing technology compared to metal meshes.
The CPI conductive film coated with the nano silver wires is required to be manufactured into a conductive film with a touch control function, and a yellow light process is also required to be performed, and the yellow light process mainly comprises dry film pressing, exposure, development, chemical etching, film stripping, screen printing of protective glue, drying and curing and the like. In order to improve the yield of the manufacturing process, a back protection film needs to be attached to the CPI base film, so that firstly, the stiffness of the CPI base film is improved, the manufacturing process is convenient to operate, and secondly, the CPI base film is protected by a yellow light manufacturing process. At present, the back protection film used in the CPI conductive film yellow light process is mainly a PET film matched with a high-temperature-resistant pressure-sensitive adhesive. However, due to the large difference between the thermal expansion coefficient and the thermal shrinkage rate between the PET film and the CPI film, the CPI conductive film is easily warped and deformed during the high-temperature treatment process of the yellow light process, so that the yield of the product is seriously affected, and large economic loss is brought. Therefore, in order to better develop the CPI-based touch conductive film, it is very urgent and necessary to overcome the above problems and increase the yield of the product process.
Disclosure of Invention
In order to solve the technical problem, the application provides a high-temperature-resistant back protection film for a CPI touch conductive film manufacturing process, wherein a yellow polyimide film is adopted as a protection film base material layer, a high-temperature-resistant acrylic adhesive is adopted as a high-temperature-resistant pressure-sensitive adhesive layer, the CPI touch conductive film can be protected in the yellow light manufacturing process in the whole process, and meanwhile, the high-temperature-resistant acrylic adhesive is adopted to avoid the separation phenomenon from the CPI film or the residual adhesive phenomenon after stripping in the manufacturing process due to the fact that the transverse and longitudinal heat shrinkage rates of the high-temperature-resistant acrylic adhesive are well matched with the heat shrinkage rate of the CPI film.
In order to achieve the above object, the present application adopts the following technical solutions:
a high-temperature-resistant back protection film for a CPI touch conductive film manufacturing process is composed of a base material layer, a high-temperature-resistant pressure-sensitive adhesive layer and a release film layer from bottom to top in sequence, wherein the base material layer is a yellow polyimide film, and the high-temperature-resistant pressure-sensitive adhesive layer is a high-temperature-resistant acrylic adhesive; the thickness of the base material layer is 20-80 μm, the thickness of the high-temperature-resistant pressure-sensitive adhesive layer is 20-60 μm, the coefficient of thermal expansion (50-250 ℃) of the base material layer is 20-30 ppm/DEG C, and the transverse and longitudinal thermal shrinkage rates under the condition of 200 ℃/120min are less than 0.1%; the peeling force of the high-temperature-resistant pressure-sensitive adhesive layer after high-temperature heat treatment at 150 ℃/30min is 2.5-10g.
Preferably, the thickness of the substrate layer is 20 to 60 μm.
Preferably, the peeling force of the high-temperature-resistant pressure-sensitive adhesive layer after high-temperature heat treatment at 150 ℃/30min is 5.0-7.5g.
Preferably, the release layer is a silicon-coated PET release film or a non-silicon PET release film.
Preferably, the transverse and longitudinal heat shrinkage rates of the high-temperature-resistant back protection film under the condition of 150 ℃/30min are both less than 0.1%.
Further, the application also discloses a preparation method of the high-temperature-resistant back protection film, which comprises the following steps: and coating the high-temperature-resistant pressure-sensitive glue on the yellow polyimide film through the slit coating head, drying the yellow polyimide film in an oven, cooling the yellow polyimide film, attaching the yellow polyimide film to a release layer, and rolling to obtain the final high-temperature-resistant back protective film.
Furthermore, the application also discloses that the high-temperature-resistant back protection film is used for the CPI touch control conductive film manufacture procedure protection after the release film layer is removed.
The technical scheme that this application provided has following beneficial effect: the application discloses high temperature resistant PI base protection film can carry out whole journey protection to CPI touch-control conducting film in the yellow light processing procedure, simultaneously because its horizontal and vertical heat shrinkage percentage has good matching with CPI membrane heat shrinkage percentage, consequently compares in used protection film among the prior art can effectively prevent warpage and the deformation of CPI conducting film behind the high temperature treatment for the angularity is less than 3mm. In addition, the proper high-temperature-resistant glue formula can regulate and control the stripping force of the protective film after high-temperature heat treatment (150 ℃/30 min) to be 5.0-7.5g, so that the phenomenon of separation from the CPI film or glue residue after stripping in the manufacturing process is avoided.
Drawings
Fig. 1 is a schematic structural diagram of the high temperature resistant protective film for CPI touch conductive film manufacturing process described in the present application.
The specific implementation mode is as follows:
the following detailed description is provided to enable one of ordinary skill in the art to better understand the advantages and features of the present application and to enable a person of ordinary skill in the art to more clearly and distinctly define the scope of the present application.
Example (b):
the application be applicable to high temperature resistant back protection film of CPI touch-control conducting film processing protection, its structure is including the substrate layer 1, high temperature resistant pressure sensitive adhesive layer 2 that stack gradually and from type rete 3. The specific preparation process of the protective film comprises the following steps: coating a certain amount of high-temperature-resistant acrylic pressure-sensitive glue on a yellow PI film with a certain specification through a slit type coating head, then putting the yellow PI film into an oven for drying treatment, and after cooling, closely adhering the yellow PI film to a silicon-coated PET release film with the thickness of 50 mu m to obtain the final high-temperature-resistant protective film. The protective film was baked at a high temperature of 150 c/30 min and then tested for transverse/longitudinal thermal shrinkage and peel force with steel plates. Further, after the release film is torn off from the protective film, the protective film is tightly attached to the CPI film with the thickness of 13 mu m, and then the film is subjected to heat treatment in an oven at the temperature of 150 ℃/30min, and the film warping and the residual glue condition are observed.
The same materials as in examples 1-7, but different thicknesses of the substrate layer and the bondline, and the substrate used in comparative example 1, as compared to example 1, are shown in table 1.
Table 1:
as can be seen from table 1, the PI-based high temperature resistant protective films provided in examples 1 to 7 have a smaller heat shrinkage rate of 0.1% in both the transverse direction and the longitudinal direction after baking at 150 ℃/30min, which is matched with the heat shrinkage rate of less than 0.1% in the commercially available CPI films under the same conditions. In addition, after high-temperature heat treatment, the peeling force of the PI-based protective film in the embodiment is 5-7.5g, the warping degree after the PI-based protective film is attached to the CPI film is less than 3mm, and no adhesive residue phenomenon exists. Therefore, the PI-based high-temperature-resistant protective film can effectively protect the CPI touch conductive process, the stripping force is appropriate, the warping degree is low, and adhesive residues do not occur.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
Claims (5)
1. The high-temperature-resistant back protective film for the CPI touch conductive film manufacturing process is characterized by sequentially consisting of a substrate layer (1), a high-temperature-resistant pressure-sensitive adhesive layer (2) and a release film layer (3) from bottom to top, wherein the substrate layer (1) is a yellow polyimide film, and the high-temperature-resistant pressure-sensitive adhesive layer (2) is a high-temperature-resistant acrylic adhesive; the thickness of the base material layer (1) is 20-80 μm, the adhesive thickness of the high-temperature-resistant pressure-sensitive adhesive layer (2) is 20-60 μm, the thermal expansion coefficient of the base material layer (1) is 20-30 ppm/DEG C at 50-250 ℃, and the transverse and longitudinal thermal shrinkage rates under the condition of 200 ℃/120min are less than 0.1%; the peeling force of the high-temperature resistant pressure-sensitive adhesive layer (2) after high-temperature heat treatment at 150 ℃/30min is 5.0-7.5g; the transverse and longitudinal heat shrinkage rates of the high-temperature-resistant back protection film are less than 0.1% under the condition of 150 ℃/30 min.
2. The heat-resistant back protection film for the CPI touch conductive film manufacturing process as claimed in claim 1, wherein the thickness of the substrate layer (1) is 20-60 μm.
3. The CPI touch conductive film manufacturing process high-temperature-resistant back protection film as claimed in claim 1, wherein the release layer is a silicon-coated PET release film or a non-silicon PET release film.
4. The method for preparing the high-temperature-resistant back protection film for the CPI touch conductive film manufacturing process as claimed in any one of claims 1 to 3, wherein the preparation method comprises the following steps: and coating the high-temperature-resistant pressure-sensitive glue on the yellow polyimide film through the slit coating head, drying the yellow polyimide film in an oven, cooling the yellow polyimide film, attaching the yellow polyimide film to a release layer, and rolling to obtain the final high-temperature-resistant back protective film.
5. The high temperature resistant back protection film of any one of claims 1-3 is used for CPI touch conductive film process protection after the release film layer (3) is removed.
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| CN202011538049.4A CN112708360B (en) | 2020-12-23 | 2020-12-23 | High-temperature-resistant back protection film for CPI touch conductive film manufacturing process and preparation method and application thereof |
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| CN202011538049.4A CN112708360B (en) | 2020-12-23 | 2020-12-23 | High-temperature-resistant back protection film for CPI touch conductive film manufacturing process and preparation method and application thereof |
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| CN113930178A (en) * | 2021-12-08 | 2022-01-14 | 太仓金煜电子材料有限公司 | High-temperature-resistant silicon-free transfer process protective adhesive tape and preparation method and application thereof |
| CN114539940B (en) * | 2022-01-27 | 2022-11-22 | 广东顶峰精密技术有限公司 | Preparation method of high-temperature-resistant adhesive tape for lithium battery |
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| CN201756528U (en) * | 2010-07-21 | 2011-03-09 | 株洲市绝缘材料有限责任公司 | Polyimide film pressure sensitive adhesive tape |
| US8506741B2 (en) * | 2011-03-29 | 2013-08-13 | Nexolve Corporation | Protective film |
| CN106905878A (en) * | 2017-04-10 | 2017-06-30 | 东莞市纳利光学材料有限公司 | A kind of high temperature resistant diaphragm and preparation method thereof |
| CN209778722U (en) * | 2019-03-22 | 2019-12-13 | 广东莱尔新材料科技股份有限公司 | protective film for high-temperature laminating process of flexible circuit board and base material using same |
| CN111500214A (en) * | 2020-05-22 | 2020-08-07 | 广东弘擎电子材料科技有限公司 | Pressure-sensitive adhesive, preparation method of pressure-sensitive adhesive and high-temperature-resistant protective film |
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