JP2016055241A - Manufacturing device of substrate with resin layer, manufacturing method of laminate, and manufacturing method of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing device of a substrate with a resin layer which can suppress adhesion of foreign matters to a curable resin composition layer, and provide a manufacturing method of a laminate, and a manufacturing method of an electronic device.SOLUTION: A manufacturing device 10 includes a coating device 12, a pre-baking device 14, a post-baking device 16, and a robot 18. The robot 18 is arranged in a booth 20 surrounded by the coating device 12, the pre-baking device 14, and the post-baking device 16. The manufacturing device further includes an intake device 32 which sucks air inside the booth 20 and eliminates floating matters 62 inside the booth 20. The air in the booth 20 is forcibly sucked by the intake device 32 and the floating matters 62 are sucked and eliminated from the booth 20. Therefore, adhesion of the foreign matters to a curable resin composition layer 48 can be significantly suppressed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an apparatus for manufacturing a substrate with a resin layer, a method for manufacturing a laminate, and a method for manufacturing an electronic device.

  As electronic devices such as display panels, solar cells, and thin film secondary batteries are made thinner and lighter, glass substrates used in these electronic devices are required to be made thinner.

  However, as the glass substrate becomes thinner, the handling properties of the glass substrate deteriorate, so that functional layers for electronic devices (thin film transistors (TFTs), color filters (CFs)) are formed on the surface of the glass substrate. ) Becomes difficult to form.

  Therefore, Patent Document 1 discloses a glass laminate in which a reinforcing plate is attached to the back surface of a glass substrate and the glass substrate is reinforced by the reinforcing plate. The reinforcing plate includes a substrate and a resin layer provided on the substrate, and the glass substrate is detachably attached to the resin layer.

  A functional layer is formed on the surface of the glass substrate in the state of a glass laminate. According to the method for forming a functional layer using a glass laminate, since the handling properties of the glass substrate are improved, there is an advantage that the functional layer can be favorably formed on the surface of the glass substrate.

  After the formation of the functional layer, the reinforcing plate is peeled from the glass substrate by a peeling device disclosed in Patent Document 2 and the like. The reinforcing plate peeled from the glass substrate is laminated on a new glass substrate and reused as a glass laminate.

[Conventional apparatus for manufacturing a substrate with a resin layer for providing a resin layer on the substrate]
A conventional apparatus for manufacturing a substrate with a resin layer includes a coating apparatus, a first heating furnace, a second heating furnace, a substrate transfer robot, and the like.

  The coating device applies a curable resin composition containing a curable resin and a solvent to one side of a substrate to form a curable resin composition layer on one side of the substrate (application process).

  The first heating furnace heats the substrate on which the curable resin composition layer is formed at a temperature of 150 to 160 degrees for a predetermined time, thereby evaporating the solvent and smoothing the curable resin composition layer. (Pre-baking process).

  The second heating furnace heats and cures the curable resin composition layer by heating the substrate on which the curable resin composition layer is smoothed at a temperature of 210 to 220 degrees for a predetermined time (post-baking). Processing step). The resin layer is provided on the substrate through such a manufacturing process.

  The robot transports the substrate from the coating apparatus to the first heating furnace, and transports the substrate that has been pre-baked in the first heating furnace from the first heating furnace to the second heating furnace. .

  5A is an enlarged cross-sectional view of the reinforcing plate 104 in which the curable resin composition layer 102 is applied to one side of the substrate 100, and FIG. 5B is a diagram in which the curable resin composition layer 102 is heated and cured. It is an expanded sectional view of the glass laminated body 110 by which the glass substrate 108 was affixed on the made resin layer 106. FIG.

  As shown in FIG. 5A, when a minute foreign matter 112 such as dust adheres to the surface of the curable resin composition layer 102, a concave portion 114 is formed on the surface of the curable resin composition layer 102 to which the foreign matter 112 adheres. It is formed. When the glass substrate 108 is attached to the resin layer 106 in this state, the concave portion 114 appears as bubbles. If a large number of such bubbles are present, the glass substrate 108 is distorted by the thermally expanded bubbles in a manufacturing process under a high temperature condition (400 ° C. or more) such as a TFT array, which adversely affects the manufacturing of the TFT array. There is a problem of giving.

  In order to solve the above problem, the robot is installed in a booth (also referred to as a clean room) maintained at a high cleanliness, and the surface of the curable resin composition layer 102 is being transferred while the reinforcing plate 104 is being transported by the robot. This prevents the foreign matter 112 from adhering to the surface.

  On the other hand, Patent Document 3 discloses a drying apparatus for continuously drying a substrate coated with a film material containing a solvent. In this drying apparatus, an exhaust hood is provided at each of a carry-in port for carrying the substrate into the heating unit of the drying device and a carry-out port for carrying out the substrate from the heating unit, and a heating device for heating the inner wall surface of the exhaust hood is provided. It has been. According to this drying device, the solvent vapor that rises from the carry-in port and the carry-out port is guided to the exhaust pipe through the exhaust hood, and the inner wall surface of the exhaust hood is heated by the heating device, whereby the solvent generated on the inner wall surface Prevents condensation.

  That is, Patent Document 3 discloses an invention in which the solvent evaporated from the substrate is exhausted from the drying apparatus, but does not disclose the point of preventing foreign matter from adhering to the surface of the film material.

International Publication No. 2011/024775 International Publication No. 2007/018028 JP 2004-44985 A

  Just like the conventional manufacturing equipment for substrates with resin layers, the measures to make the booth where the robots are installed clean rooms are not enough to prevent the adhesion of foreign substances to the curable resin composition layer. It was.

  The cause was verified. There are two main types of airflow in the booth. The first airflow is a downward flow of clean air that is downflowed from a fan filter unit installed on the ceiling of the booth. The second airflow is an ascending airflow that rises along the hot wall surfaces of the first and second heating furnaces.

  The downdraft is an indispensable airflow for the purpose of improving the cleanliness of the booth, but the updraft is a specific airflow that naturally occurs in the configuration of the apparatus, and the cause of this updraft causing problems It was.

  That is, it is confirmed that the minute dust falling on the floor of the booth is wound up from the floor by the rising air flow, the foreign matter lifted up floats, and the suspended matter adheres to the curable resin composition layer. did.

  The booth is configured to maintain high cleanliness by clean air from the fan filter unit. However, the minute metal powder generated from the sliding part of the robot, the minute metal powder generated from the sliding part of each substrate loading / unloading door (shutter) of the first and second heating furnaces, and the booth are entered. There was a limit to raising the cleanliness of the booth due to dust generated by the operators. Also, the updraft generated in the booth is naturally generated due to the configuration of the apparatus, and it has been difficult to suppress the updraft.

  As described above, in the conventional apparatus, even though the robot is installed in the clean room booth, the booth has a dust generation source and an updraft, so that foreign matter adheres to the curable resin composition layer. Could not be suppressed.

  This invention is made | formed in view of such a situation, and the manufacturing apparatus of the board | substrate with a resin layer which can suppress that a foreign material adheres to a curable resin composition layer, the manufacturing method of a laminated body, and an electronic device It aims at providing the manufacturing method of.

  In one embodiment of the present invention, in order to achieve the above object, a curable resin composition containing a curable resin and a solvent is applied to one side of a substrate, and a curable resin composition layer is formed on one side of the substrate. And heating the substrate on which the curable resin composition layer is formed at a first temperature, thereby evaporating the solvent and smoothing the curable resin composition layer. A furnace and the substrate on which the curable resin composition layer is smoothed are heated at a second temperature higher than the first temperature to cure the curable resin composition layer and obtain a resin layer. A second heating furnace, the coating means, the first heating furnace, a first clean room surrounded by the second heating furnace, and the first clean room; And transporting the substrate to one heating furnace, the first The apparatus comprises: a transport unit that transports the substrate from a heating furnace to the second heating furnace; and an intake unit that sucks air from the first clean room and removes floating substances in the first clean room. An apparatus for manufacturing a substrate with a resin layer is provided.

  The apparatus for manufacturing a substrate with a resin layer of one embodiment of the present invention includes a coating unit, a first heating furnace, a second heating furnace, and a transport unit, a coating unit, a first heating furnace, and a first Intake apparatus that presupposes that transport means is installed in a first clean room surrounded by two heating furnaces, and sucks air from the first clean room to remove floating substances in the first clean room. Means are further provided.

  In the said premise apparatus, it cannot suppress that a foreign material adheres to the curable resin composition layer during conveyance of the board | substrate by a conveyance means. This foreign material is mainly floating substances wound up from the floor surface by the updraft generated in the first clean room. In addition, foreign matter such as metal powder generated from a dust source present in the first clean room is also included.

  According to one aspect of the present invention, the air in the first clean room is forcibly taken in by the air intake means, and the suspended matter is sucked and removed from the first clean room, so that foreign matter adheres to the curable resin composition layer. This can be greatly suppressed. That is, the technical idea of the present invention is to forcibly inhale and exhaust the air in the first clean room maintained at a high cleanliness in order to suck and remove the suspended matter.

  In one aspect of the present invention, it is preferable that an intake port of the intake means is provided on a ceiling of the first clean room.

  According to one aspect of the present invention, the updraft generated in the first clean room and containing a large amount of suspended matter is exhausted through the intake port provided in the ceiling of the first clean room. Ascending air current can be efficiently exhausted from the first clean room along the line. As a result, the suspended matter can be efficiently removed by suction.

  In one aspect of the present invention, it is preferable that an intake port of the intake means is disposed above at least one of the first heating furnace and the second heating furnace.

  According to one aspect of the present invention, the updraft generated in the first clean room is generated along the hot wall surfaces of the first and second heating furnaces, respectively. By placing the second heating furnace above at least one of the heating furnaces, the suspended matter can be efficiently removed by suction.

  In one aspect of the present invention, the intake port of the intake means is disposed above a substrate loading / unloading door provided in at least one of the first heating furnace and the second heating furnace. Preferably it is.

  According to one aspect of the present invention, minute metal powder generated from the sliding portion of the substrate loading / unloading door can be sucked and removed from the intake port as it is on the rising airflow. Thereby, the said metal powder can be efficiently suction-removed.

  In one embodiment of the present invention, the coating unit, the first heating furnace, the second heating furnace, and the first clean room are installed in a second clean room, and the first clean room is the first clean room. It is preferable to provide purification means for purifying the clean air in the second clean room and supplying it to the first clean room.

  According to one aspect of the present invention, since the coating means, the first and second heating furnaces, and the first clean room are installed in the second clean room, the curing is performed even when the curable resin composition is applied by the coating means. It is possible to prevent foreign matter from adhering to the curable resin composition, and foreign matter is present in the curable resin composition layer even during the heat treatment of the curable resin composition layer in the first and second heating furnaces. It can suppress adhering. Furthermore, according to one aspect of the present invention, the clean air having high cleanliness in the second clean room is further purified by the purifying means and supplied to the first clean room. Thereby, clean air with high cleanliness can be supplied to the first clean room without increasing the load of the purifying means.

  In one embodiment of the present invention, the apparatus for manufacturing a substrate with a resin layer manufactures a substrate with a resin layer, which is used to manufacture a glass laminate by attaching a glass substrate to the substrate via the resin layer. It is preferable that it is an apparatus.

  One embodiment of the present invention is characterized in that a laminated body is manufactured by attaching a substrate with a resin layer and a glass substrate manufactured by the manufacturing apparatus for a substrate with a resin layer of the present invention via the resin layer. A method for producing a laminate is provided.

  In one embodiment of the present invention, a laminated body is formed by attaching a resin layer-coated substrate and a glass substrate manufactured by the resin layer-coated substrate manufacturing apparatus of the present invention via a resin layer. A method for producing an electronic device, comprising: a functional layer forming step of forming a functional layer on an exposed surface; and a separation step of separating the substrate with the resin layer from the glass substrate on which the functional layer is formed. provide.

  As described above, according to the apparatus for manufacturing a substrate with a resin layer, the method for manufacturing a laminate, and the method for manufacturing an electronic device according to the present invention, it is possible to suppress foreign matter from adhering to the curable resin composition layer.

The top view of the manufacturing apparatus of the board | substrate with a resin layer which concerns on embodiment of this invention The front view of the manufacturing apparatus of the board | substrate with a resin layer seen from the arrow A direction of FIG. The flowchart which showed the manufacturing process of the board | substrate with a resin layer by the manufacturing apparatus of the board | substrate with a resin layer of FIG. Explanatory drawing which showed the process in which the board | substrate with a resin layer is manufactured according to the flowchart of FIG. (A) is an enlarged cross-sectional view of a reinforcing plate in which a curable resin composition layer is applied to one side of the substrate, and (B) is an enlarged cross-sectional view of a glass laminate in which a glass substrate is attached to the resin layer.

  Hereinafter, preferred embodiments of a manufacturing apparatus for a substrate with a resin layer, a manufacturing method for a laminate, and a manufacturing method for an electronic device according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a plan view of a manufacturing apparatus 10 for a substrate with a resin layer according to an embodiment of the present invention, and FIG. 2 is a front view of the manufacturing apparatus 10 as viewed from the direction of arrow A in FIG.

  FIG. 3 is a flowchart showing a manufacturing process of the substrate with a resin layer by the manufacturing apparatus 10. FIG. 4 is an explanatory view showing the process of manufacturing a substrate with a resin layer according to the flowchart of FIG.

[Production apparatus 10 for substrate with resin layer]
1 and 2 includes a coating device (coating means) 12, a pre-baking device (first heating furnace) 14, a post-baking device (second heating furnace) 16, and a substrate transfer robot ( Conveying means) 18 is provided.

  The manufacturing apparatus 10 includes a booth (first clean room) 20 surrounded by the coating apparatus 12, the pre-bake apparatus 14, and the post-bake apparatus 16, and a robot 18 is installed in the booth 20. The booth 20 has a wall surface and a ceiling surface made of a resin or glass transparent panel, and a fan filter unit (purifying means) 22 is installed on the ceiling surface. The clean air from the fan filter unit 22 is supplied to the entire interior of the booth 20 by the downflow indicated by the arrow B in FIG.

  Furthermore, the coating device 12, the pre-baking device 14, the post-baking device 16, and the booth 20 are installed in a clean room (second clean room) 24, and the entire atmosphere of the manufacturing apparatus 10 is maintained at a predetermined cleanliness.

  Furthermore, as shown in FIG. 1, a plurality of air intakes 26 are provided on the ceiling surface of the booth 20, and these air intakes 26 are connected to the exhaust pipe 28 and the intake pump 30 shown in FIG. . That is, the air in the booth 20 is forcibly taken in by the intake device (suction means) 32 including the intake port 26, the exhaust pipe 28, and the intake pump 30. The function of the intake device 32 will be described later. The configuration of the manufacturing apparatus 10 shown in FIGS. 1 and 2 is an example, and includes, for example, a configuration in which a plurality of coating apparatuses 12, pre-baking apparatuses 14, and post-baking apparatuses 16 are installed.

  On the other hand, as shown in FIG. 3, the manufacturing process of the substrate with a resin layer includes a coating process S102, a carry-out / carry-in process S104, a first heating process S106, a carry-out / carry-in process S108, and a second heating process S110. . Through these steps, the substrate 34 with a resin layer shown in FIG. 4 is manufactured.

[Method for producing laminate]
The substrate 34 with the resin layer is transferred from the manufacturing apparatus 10 to the laminating apparatus 36, and the glass substrate 40 is detachably attached to the resin layer 38 of the substrate 34 with the resin layer by the laminating apparatus 36. Thereby, the glass laminated body (laminated body) 42 is comprised. In the glass laminate 42, the number of bubbles present at the interface between the resin layer 38 and the glass substrate 40 is detected by an inspection device 44 disposed at the subsequent stage of the lamination device 36.

  In the glass laminate 42 whose quality is guaranteed by the inspection apparatus 44, a functional layer is formed on the surface of the glass substrate 40 in a display manufacturing factory which is an electronic device manufacturing factory (functional layer forming step). Thereafter, the substrate 34 with a resin layer is separated from the glass substrate 40 on which the functional layer is formed (separation step). Thereby, only the glass substrate 40 in which the functional layer was formed can be acquired as product glass (electronic device manufacturing method).

  Next, the manufacturing process of each apparatus constituting the manufacturing apparatus 10 will be described in detail.

<Coating process S102 by coating device 12>
In the coating step S102 of FIG. 3 performed by the coating apparatus 12, a curable resin composition containing a curable resin and a solvent is applied to one surface (referred to herein as the upper surface) of the substrate 46 (refer to FIG. 4). This is a step of forming the curable resin composition layer 48 on one side. By passing through application | coating process S102, the board | substrate 46 with the curable resin composition layer 48 in which the curable resin composition layer 48 was formed in the upper surface of the board | substrate 46 is obtained.

  The method in particular of apply | coating curable resin composition to the upper surface of the board | substrate 46 is not restrict | limited, A well-known method is employable. Examples thereof include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. Although the thickness of the curable resin composition layer 48 is not particularly limited, it is applied with a thickness of about 20 μm as an example.

  Next, the board | substrate 46 used in the manufacturing apparatus 10, the said curable resin, and the said solvent are demonstrated.

<< Substrate 46 >>
The substrate 46 has two main surfaces, a front surface and a back surface, and cooperates with the resin layer 38 to support and reinforce the glass substrate 40. When the functional layer is formed in the functional layer forming process for the electronic device, In addition, the glass substrate 40 is prevented from being deformed, scratched or broken.

  As the substrate 46, for example, a glass plate, a plastic plate, a SUS plate, a metal plate such as a ceramic plate, or the like is used. When the functional layer forming step involves heat treatment, the substrate 46 is preferably formed of a material having a small difference in linear expansion coefficient from the glass substrate 40, and more preferably formed of the same material as the glass substrate 40. Therefore, the substrate 46 is preferably a glass plate.

  The thickness of the substrate 46 may be thicker or thinner than the glass substrate 40. Preferably, the thickness of the substrate 46 is selected based on the thickness of the glass substrate 40, the thickness of the resin layer 38, and the thickness of the glass laminate 42. For example, the current functional layer forming process is designed to process a glass laminate having a thickness of 0.5 mm, and the sum of the thickness of the glass substrate 40 and the thickness of the resin layer 38 is 0.1 mm. In this case, the thickness of the substrate 46 is 0.4 mm. In general, the thickness of the substrate 46 is preferably 0.2 to 5.0 mm.

  When the board | substrate 46 is a glass plate, it is preferable that the thickness of a glass plate is 0.08 mm or more from the reasons of being easy to handle and being hard to break. Moreover, it is preferable that the thickness of a glass plate is 1.0 mm or less from the reason for request | requiring the rigidity which bends moderately, without cracking, when peeling after functional layer formation.

《Curable resin》
Examples of the curable resin include a silicone resin, a polyimide resin, and a silicone sol gel. Hereinafter, their compositions will be described.

(Silicone resin)
Hardened | cured material of the curable silicone resin composition containing the following linear organopolysiloxane (a) and the following linear organopolysiloxane (b).

  Linear organopolysiloxane (a): A linear organopolysiloxane having at least two alkenyl groups per molecule.

  Linear organopolysiloxane (b): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. A linear organopolysiloxane present in the silicon atom.

(Polyimide resin)
The total number of residues (X) of the tetracarboxylic acids, comprising a repeating unit having the residue (X) of tetracarboxylic acids and the residue (A) of diamines represented by the following formula (1) Of at least one group selected from the group consisting of groups represented by the following formulas (X1) to (X4), and 50 mol% or more of the total number of residues (A) of the diamines Is a polyimide resin comprising at least one group selected from the group consisting of groups represented by the following formulas (A1) to (A7).

  (In formula (1), X represents a tetravalent group obtained by removing a carboxy group from tetracarboxylic acids, and A represents a divalent group obtained by removing an amino group from diamines.)

(Silicone sol gel)
Organosiloxane having an organosiloxy unit represented by the following T3, the total proportion of the organosiloxy unit represented by the following T3 with respect to all the organosiloxy units being 80 to 100 mol%, and R in the following T3 being a phenyl group The molar ratio ((A-1) / (B-1)) between the siloxy unit (A-1) and the organosiloxy unit (B-1) in which R in the following T3 is a methyl group is 80/20 to 20 / 80 silicone resin.

T3: R—SiO _3/2 (wherein R represents a phenyl group or a methyl group)
"solvent"
The solvent is preferably a solvent that can easily dissolve various components and can be easily volatilized and removed. Specifically, butyl acetate, heptane, 2-heptanone, 1-methoxy-2-propanol acetate, toluene, xylene, THF, chloroform and the like can be exemplified. Of these, saturated hydrocarbons are preferable, and various types of hydrocarbons substantially composed of one or more of various saturated hydrocarbons (linear saturated hydrocarbons, branched saturated hydrocarbons, alicyclic saturated hydrocarbons). Saturated hydrocarbon solvents are used.

<Unloading and loading process S104 by robot 18>
The carry-out / carry-in step S104 shown in FIG. 3 is a step in which the substrate 46 with the curable resin composition layer 48 is carried out from the coating device 12 and carried into the prebaking device 14. In this case, first, the shutter 50 of the coating apparatus 12 shown in FIG. 2 is raised in the direction of arrow C in FIG. 2 to open the carry-in / out port 52 of the coating apparatus 12. Next, after the suction pad 53 of the robot 18 is inserted into the coating apparatus 12 from the carry-in / out port 52 and the substrate 46 with the curable resin composition layer 48 is held by the suction pad 53, the booth is moved from the carry-in / out port 52. It is carried out in the direction of arrow D in FIG. Next, the shutter (substrate loading / unloading door) 54 of the prebaking device 14 is raised in the direction of arrow E in FIG. 2 to open the loading / unloading port 56 of the prebaking device 14. Thereafter, the robot 18 carries the substrate 46 with the curable resin composition layer 48 into the prebaking apparatus 14 in the direction of arrow F in FIG.

  The shutter 50 is closed when the next substrate 46 is transported into the coating apparatus 12, and the shutter 54 is closed when the suction pad 53 of the robot 18 is retracted from the prebaking apparatus 14 in the arrow G direction. It is done. Moreover, the wall surface of the booth 20 facing the loading / unloading exits 52 and 56 is provided with an opening for allowing the suction pad 53 of the robot 18 to pass therethrough.

<First heating step S106 by the pre-baking device 14>
In the first heating step S106, a heating plate (not shown) is disposed above the substrate 46 with the curable resin composition layer 48, heat treatment is performed while exhausting, and the curable resin composition layer 48 is formed. This is a step of removing the contained solvent. By passing through the first heating step, the solvent remaining in the curable resin composition layer 48 is removed, and the surface of the curable resin composition layer 48 is heated at an appropriate temperature, so that the surface of FIG. It is smoothed as follows.

  When the composition of the curable resin composition layer 48 is curable silicone, 150 to 170 ° C. is preferable in that the cohesive failure can be further suppressed. The heating time is not particularly limited, and optimum conditions are appropriately selected depending on the type of the solvent and curable silicone used, but 2 to 3 minutes are preferable from the viewpoints of removability of residual solvent and productivity.

<Unloading and loading process S108 by robot 18>
The unloading / loading step S108 shown in FIG. 3 is a step of unloading the substrate 46 with the curable resin composition layer 48 pre-baked by the pre-baking device 14 and loading it into the post-baking device 16. In this case, first, the shutter 54 of the prebaking device 14 is raised in the direction of arrow E in FIG. 2 to open the loading / unloading port 56 of the prebaking device 14. Next, the suction pad 53 of the robot 18 is inserted into the prebaking device 14 from the carry-in / out port 56, and the substrate 46 with the curable resin composition layer 48 is held by the suction pad 53, and then the booth is loaded from the carry-in / out port 56. It is carried out in the direction of arrow G in FIG. Next, the shutter (substrate loading / unloading door) 58 of the post-baking device 16 is opened, and the loading / unloading port 60 of the post-baking device 16 is opened. Thereafter, the robot 18 carries the substrate 46 with the curable resin composition layer 48 into the post-baking apparatus 16 in the direction of arrow H in FIG.

  The shutter 54 is closed immediately after the substrate 46 with the curable resin composition layer 48 is carried out, and the shutter 58 is moved away from the post-bake device 16 in the direction of arrow I when the suction pad 53 of the robot 18 is retracted. Closed immediately. Further, an opening for allowing the suction pad 53 of the robot 18 to pass through is provided on the wall surface of the booth 20 facing the carry-in / out port 60.

<Second Heating Step S110 by Post Bake Device 16>
The second heating step S110 is a step in which the substrate 46 with the curable resin composition layer 48 is subjected to heat treatment at a temperature higher than that of the prebaking device 14 to obtain the resin layer 38. By passing through the second heating step, the solvent remaining in the curable resin composition layer 48 is further removed, whereby the curing of the curable resin proceeds, and the resin layer 38 shown in FIG. 4 is obtained. . That is, the substrate 34 with a resin layer is obtained.

  Thus, after performing the pre-baking process by the pre-baking apparatus 14, the solvent remaining in the resin layer 38 to be formed can be further removed by performing the post-baking process by the post-baking apparatus 16, so that the resin layer 38 The surface shape of the substrate becomes flatter and the adhesion to the glass substrate 40 is further improved.

  In the second heating step, the heat treatment is performed at a temperature higher than the temperature of the first heating step S106, but the difference between the two temperatures is not particularly limited, and is appropriately determined depending on the type of curable resin and solvent used. Optimal conditions are selected. For example, in the case of a curable silicone resin layer, 10 to 100 ° C is preferable and 30 to 70 ° C is more preferable based on the fact that cohesive failure is further suppressed.

  Especially, it is preferable that it is more than 210 degreeC as temperature of a 2nd heating process. From the viewpoint that the solvent removal and the curing reaction in the silicone resin layer are more excellent, the temperature is more than 210 ° C. and not more than 250 ° C. The heating time is appropriately selected depending on the material used, but is preferably about 20 minutes from the viewpoint of productivity and solvent removability.

[Features of Manufacturing Apparatus 10 of Embodiment]
<First feature>
As shown in FIG. 1, the manufacturing apparatus 10 of the embodiment includes a coating device 12, a pre-baking device 14, a post-baking device 16, and a robot 18, and is surrounded by the coating device 12, the pre-baking device 14, and the post-baking device 16. Assuming that the robot 18 is installed in the room of the booth 20, as shown in FIG. 2, the apparatus further includes an air intake device 32 that draws in air in the room of the booth 20 and removes suspended matter 62 in the room of the booth 20. There is.

  In the premise apparatus, it is difficult to prevent foreign matter from adhering to the curable resin composition layer 48 during the transfer of the substrate 46 by the robot 18. The foreign matter mainly includes the suspended matter 62 generated from the floor surface by the updraft generated by the booth 20 and indicated by the arrow J in FIG. Further, foreign matter such as metal powder generated from a dust generation source (shutters 50, 54, and 58) existing in the booth 20 and dust generation from an operator who entered the booth 20 are also included.

  According to the manufacturing apparatus 10 of the embodiment, the air in the booth 20 is forcibly sucked by the air intake device 32 and the suspended matter 62 is sucked and removed from the booth 20, so that foreign matter adheres to the curable resin composition layer 48. Can be greatly suppressed. In other words, the manufacturing apparatus 10 according to the embodiment is characterized in that the air in the booth 20 maintained at a high cleanness is forcibly sucked and exhausted in order to suck and remove the suspended matter 62. The intake air amount by the intake device 32 is set according to the air supply amount supplied from the fan filter unit 22 into the booth 20.

<Second feature>
The suction port 26 of the suction device 32 is provided in the ceiling of the booth 20.

  Ascending airflow generated by the booth 20 and containing a large amount of suspended matter 62 and exhausted by the arrow J is exhausted through the air intake 26 provided on the ceiling of the booth 20, so that the ascending airflow is boothed along the upward airflow. 20 can be efficiently exhausted. Thereby, the suspended | floating matter 62 can be efficiently suction-removed.

<Third feature>
As shown in FIG. 1 and FIG. 2, the intake port 26 of the intake device 32 is disposed above at least one of the pre-baking device 14 and the post-baking device 16.

  Since the upward air flow indicated by the arrow J generated in the booth 20 is generated along the hot wall surfaces of the pre-baking device 14 and the post-baking device 16, the intake port 26 of the intake device 32 is connected to the pre-baking device 14 or the post-baking device 16. By disposing them above at least one of the heating furnaces, the suspended matter 62 can be efficiently removed by suction. In addition, in FIG. 1, since the several inlet 26 is arrange | positioned above the prebaking apparatus 14 and the post-baking apparatus 16, adhesion of the floating substance 62 can further be suppressed.

<Fourth feature>
One aspect of the present invention is that the intake port 26 of the intake device 32 is disposed above the shutters 54 and 58 provided in at least one of the pre-baking device 14 and the post-baking device 16.

  The minute metal powder generated from the sliding portions of the shutters 54 and 58 can be sucked and removed from the intake port 26 as it is on the ascending current of the arrow J. Thereby, metal powder can be efficiently removed by suction. In FIGS. 1 and 2, since the plurality of air inlets 26 are disposed above the shutters 54 and 58, the attachment of the suspended matter 62 can be further suppressed.

<Fifth feature>
The coating device 12, the pre-baking device 14, the post-baking device 16, and the booth 20 are installed in a clean room 24, and the booth 20 includes a fan filter unit 22 that purifies clean air in the clean room 24 and supplies it to the booth. It is in.

  Since the coating device 12, the pre-baking device 14, the post-baking device 16, and the booth 20 are installed in the clean room 24, foreign matter adheres to the curable resin composition even when the coating device 12 applies the curable resin composition. In addition, even during the heat treatment of the curable resin composition layer by the pre-baking device 14 and the post-baking device 16, it is possible to suppress foreign matter from adhering to the curable resin composition layer.

  Furthermore, since the clean air having a high cleanliness in the clean room 24 is further purified by the fan filter unit 22 and supplied to the booth 20, the clean air having a high cleanness is supplied to the booth 20 without increasing the load of the fan filter unit 22. Can be supplied.

  DESCRIPTION OF SYMBOLS 10 ... Manufacturing apparatus of the board | substrate with a resin layer, 12 ... Coating apparatus, 14 ... Prebaking apparatus, 16 ... Post-baking apparatus, 18 ... Robot, 20 ... Booth, 22 ... Fan filter unit, 24 ... Clean room, 26 ... Intake port, 28 DESCRIPTION OF SYMBOLS ... Exhaust pipe, 30 ... Intake pump, 32 ... Intake device, 34 ... Substrate with resin layer, 36 ... Laminate device, 38 ... Resin layer, 40 ... Glass substrate, 42 ... Glass laminate, 44 ... Inspection device, 46 ... Substrate, 48 ... curable resin composition layer, 50 ... shutter, 52 ... loading / unloading port, 53 ... suction pad, 54 ... shutter, 56 ... loading / unloading port, 58 ... shutter, 60 ... loading / unloading port, 62 ... floating material

Claims (8)

An application means for applying a curable resin composition containing a curable resin and a solvent to one side of the substrate, and forming a curable resin composition layer on one side of the substrate;
A first heating furnace for smoothing the curable resin composition layer by evaporating the solvent by heating the substrate on which the curable resin composition layer is formed at a first temperature;
A second resin layer is obtained by curing the curable resin composition layer by heating the substrate on which the curable resin composition layer has been smoothed at a second temperature higher than the first temperature. A heating furnace;
A first clean room surrounded by the coating means, the first heating furnace, and the second heating furnace;
A transport unit installed in the first clean room, transporting the substrate from the coating unit to the first heating furnace, and transporting the substrate from the first heating furnace to the second heating furnace;
A suction means for sucking in air in the first clean room and removing floating substances in the first clean room;
An apparatus for producing a substrate with a resin layer, comprising:   The apparatus for manufacturing a substrate with a resin layer according to claim 1, wherein an intake port of the intake means is provided on a ceiling of the first clean room.   The apparatus for manufacturing a substrate with a resin layer according to claim 1 or 2, wherein an intake port of the intake means is disposed above at least one of the first heating furnace and the second heating furnace. .   The air intake port of the air intake means is disposed above a substrate loading / unloading door provided in at least one of the first heating furnace and the second heating furnace. 3. The apparatus for producing a substrate with a resin layer according to 3.   The coating means, the first heating furnace, the second heating furnace, and the first clean room are installed in a second clean room, and the first clean room uses the clean air of the second clean room. The manufacturing apparatus of the board | substrate with a resin layer in any one of Claim 1 to 4 provided with the purification | cleaning means to purify and supply to a 1st clean room.   The apparatus for producing a substrate with a resin layer is an apparatus for producing a substrate with a resin layer, which is used for producing a glass laminate by attaching a glass substrate to the substrate via the resin layer. The manufacturing apparatus of the board | substrate with a resin layer in any one of 5-5.   A laminated body is manufactured by adhering the substrate with a resin layer and the glass substrate manufactured by the apparatus for manufacturing a substrate with a resin layer according to any one of claims 1 to 6 through the resin layer. The manufacturing method of the laminated body characterized by the above-mentioned. A laminate is formed by attaching the resin layer-coated substrate and the glass substrate manufactured by the resin layer-coated substrate manufacturing apparatus according to any one of claims 1 to 6 via the resin layer,
An electronic device comprising: a functional layer forming step of forming a functional layer on an exposed surface of the glass substrate; and a separation step of separating the substrate with the resin layer from the glass substrate on which the functional layer is formed. Manufacturing method.