CN102738264B - Doping unit, doping wafer, doping method, solar battery and manufacturing method - Google Patents
Doping unit, doping wafer, doping method, solar battery and manufacturing method Download PDFInfo
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Abstract
The invention discloses a doping unit, comprising an N-type substrate, P-type heavy doping regions and N-type heavy doping regions formed on a back side of the N-type substrate, P-type light doping regions formed around the P-type heavy doping regions, and N-type light doping regions formed around the N-type heavy doping regions. The P-type heavy doping regions and the N-type heavy doping regions, the P-type heavy doping regions and the N-type light doping regions, and the N-type heavy doping regions and the P-type light doping regions do not contact with each other, wherein, when the P-type is replaced by the N-type, the N-type is replaced by the P-type. In the doping unit, with an N-type substrate material, the P-type light doping regions, and the N-type light doping regions as buffer layers between the P-type heavy doping regions and N-type heavy doping regions, breakdown of PN junctions caused by too thin depletion layers can be prevented. Thus, the PN junctions having a P+/P-/N/N-/N+ structure make carrier migration more uniform and speed of the migration more stable, so that service life of the doping wafer is increased.
Description
Technical field
The present invention relates to a kind of doping unit, wafers doped, doping method, solar cell and preparation method thereof, particularly relating to a kind of solar energy doping unit for carrying on the back junction battery, wafers doped, doping method and back junction solar battery and preparation method thereof.
Background technology
New forms of energy are that in 21st century development of world economy, most determines one of five large technical fields of power.Solar energy is a kind of clean, efficiently and the new forms of energy of never exhaustion.In the new century, solar energy resources is all utilized the important content as National Sustainable Development Strategies by national governments.And photovoltaic generation have safe and reliable, noiseless, pollution-free, restriction less, the advantage such as failure rate is low, easy maintenance.
In recent years, international photovoltaic generation fast development, supply falls short of demand for solar wafer, so the raising electricity conversion of solar wafer and the production capacity of solar wafer become important problem.Solar cell is by after illumination, and battery absorbs after an energy is greater than the incident photon of band gap width and produces electron-hole pair, and electronics and hole are energized into the upper state of conduction band and valence band respectively.Moment after excitation, the energy of incident photon is depended in the energy position of excitation state in electronics and hole.The very fast and lattice of the photo-generated carrier being in upper state interacts, and give phonon by energy and fall back at the bottom of conduction band and top of valence band, this process is also referred to as thermalization process, and thermalization process makes the energy loss of a high-energy photon part.After thermalization process, in the transport process (barrier region or diffusion region) of photo-generated carrier, recombination losses will be had.Last voltage exports once pressure drop again, and pressure drop derives from the difference with the work function of electrode material.By above-mentioned analysis, solar battery efficiency, by the impact of material, device architecture and preparation technology, comprises the light loss of battery, the limited mobility of material, recombination losses, series resistance and bypass resistance loss etc.For certain material, the improvement of battery structure and preparation technology is important to improving photoelectric conversion efficiency.It is a kind of that feasible to realize low-cost high-efficiency solar cell scheme be concentrator solar cell.Concentrator solar cell can save material cost greatly, significantly improves efficiency of solar cell.Adopting the solar cell of front junction structure, in order to meet the larger feature of concentrator cell current density, must greatly increase front gate line density, this can affect grid line shading rate conversely, reduces short circuit current.A kind of scheme of feasible solution shading loss carries on the back knot back contact structure solar cell exactly.Back of the body knot back contact structure solar cell doped region and golden half contact zone are all integrated in back of solar cell, and it is very most of that backplate occupies back surface, reduce contact resistance loss.In addition, direction of current flow is perpendicular to interface, and this just further obviates Facad structure transverse current and to flow the ohmic loss caused, and will meet the requirement of high-strength focused front light and high-photoelectric transformation efficiency so simultaneously.Back of the body knot back contact battery structure is also conducive to cell package, reduces costs further.
But because the PN junction carrying on the back junction battery is near cell backside, and minority carrier has to diffuse through whole silicon wafer thickness just can reach interface, the back side, so this battery design just needs the silicon chip of especially high minority carrier life time as base material, otherwise few son is not also diffused into interface, the back side and has just been fallen by compound, and the efficiency of such battery will decline greatly.IBC (interdigitated back contact) solar cell is the back of the body junction battery studied the earliest, be mainly used at first in condenser system, structure and the manufacture craft of various back contact silicon solar cell is described in the back contact silicon solar cell progress (material Leader volume the 9th phase September the 22nd in 2008) of Ren Bingyan etc., for IBC solar cell, the most high conversion efficiency of the IBC solar cell that SUNPOWER company makes can reach 24%, then owing to which employs photoetching process, the complex operations brought due to photoetching makes its cost be difficult to decline, difficulty is caused to the commercial applications of civilian or common occasion.In order to reduce costs, also have and utilize mask plate to form P+ district and the N+ district of cross arrangement, but multiple mask plates must be used in manufacturing process, not only increase cost of manufacture, because photoetching technique needs accurate calibration therefore to also create the problem adopting the calibration of different mask plate needs, for manufacturing process brings many difficulty.
Summary of the invention
The technical problem to be solved in the present invention uses the defect that photoetching process cost is higher in the manufacturing process in order to overcome prior art IBC solar cell, provides that a kind of cost is lower, processing step is less and Doped ions concentration is able to the solar energy doping unit, wafers doped, doping method, solar cell and preparation method thereof that accurately control.
The present invention solves above-mentioned technical problem by following technical proposals:
A kind of doping unit, its feature is, this doping unit comprises:
One N-type substrate;
Be formed at the P type heavily doped region in this N-type backside of substrate and N-type heavily doped region;
Be formed at the P type lightly doped region around this P type heavily doped region;
Be formed at the N-type lightly doped region around this N-type heavily doped region;
Wherein, this P type heavily doped region and this N-type heavily doped region are not in contact with each other, and this this N-type lightly doped region of P type heavily doped region is not in contact with each other, and this N-type heavily doped region and this P type lightly doped region are not in contact with each other,
Wherein, when described P type replaces with N-type, N-type replaces with P type simultaneously.
Wherein this P type lightly doped region can contact with this P type heavily doped region, and this N-type lightly doped region can contact with this N-type heavily doped region.
Preferably, this doping unit also comprises the N-type doped layer or P type doped layer that are positioned at this N-type substrate surface.For N-type substrate, if surface is using P type doped layer as front surface field, the solar cell obtained by this doping unit style is exactly double-junction solar battery, can improve its photoelectric conversion efficiency further.
Preferably, the minimum range of this P type heavily doped region and this N-type heavily doped region is at least 10 μm.More preferably, the minimum range of this P type heavily doped region and this N-type heavily doped region is 10-70 μm.
Preferably, the width of this P type heavily doped region is 1000-3000 μm.More preferably, the width of this P type heavily doped region is 1500-2500 μm..
Preferably, the width of N-type heavily doped region is 250-700 μm.More preferably, the width of N-type heavily doped region is 300-600 μm.
Preferably, the width of this P type lightly doped region is 5-50 μm.More preferably, the width of this P type lightly doped region is 10-40 μm.Wherein this P type lightly doped region can contact with this P type heavily doped region.
Preferably, the width of this N-type lightly doped region is 5-50 μm.More preferably, the width of this N-type lightly doped region is 10-40 μm.Wherein this N-type lightly doped region can contact with this N-type heavily doped region.
Preferably, the square resistance of this P type heavily doped region is 10-50 Ω/.Preferably, the square resistance of this P type heavily doped region is 15-45 Ω/, and more preferably, the square resistance of this P type heavily doped region is 20-40 Ω/.
Preferably, the square resistance of this N-type heavily doped region is 10-50 Ω/.Preferably, the square resistance of this N-type heavily doped region is 15-45 Ω/, and more preferably, the square resistance of this N-type heavily doped region is 20-40 Ω/.
Preferably, the square resistance of this P type lightly doped region is 60-120 Ω/.Preferably, the square resistance of this P type lightly doped region is 70-110 Ω/, and more preferably, the square resistance of this P type lightly doped region is 80-100 Ω/.
Preferably, the square resistance of this N-type lightly doped region is 60-120 Ω/.Preferably, the square resistance of this N-type lightly doped region is 70-110 Ω/, and more preferably, the square resistance of this N-type lightly doped region is 80-100 Ω/.
The present invention also provides a kind of wafers doped, and its feature is, it comprises multiple doping unit as above.
The present invention also provides a kind of doping method manufacturing wafers doped as above, and its feature is, it comprises the following steps:
First area for contacting positive electrode in the back side of N-type substrate forms P type heavily doped region;
Second area in the back side of N-type substrate forms this P type lightly doped region, and wherein this second area is the region around this P type heavily doped region;
The 3rd region for contacting negative electrode in the back side of N-type substrate forms N-type heavily doped region;
The 4th region in the back side of N-type substrate forms this N-type lightly doped region, wherein the 4th region is the region around this N-type heavily doped region, wherein this P type heavily doped region and this N-type heavily doped region are not in contact with each other, this this N-type lightly doped region of P type heavily doped region is not in contact with each other, and this N-type heavily doped region and this P type lightly doped region are not in contact with each other, wherein, when described P type replaces with N-type, N-type replaces with P type simultaneously.The sequencing wherein forming P type heavily doped region, P type lightly doped region, N-type heavily doped region and N-type lightly doped region is not limit.Multiple mask plates can be utilized and adopt the mode of ion implantation to form aforementioned p-type heavily doped region, P type lightly doped region, N-type heavily doped region and N-type lightly doped region.Again such as, by be silicon dioxide, the amorphous silicon of 10-50 μm at N-type backside of substrate growth thickness, polysilicon or silicon nitride film be as mask plate.
Preferably, this doping method comprises the following steps:
By the mode of ion implantation by P type ion implantation to the first area of this N-type backside of substrate and second area to form P type heavily doped region in first area and second area, wherein the dosage of P type ion is a;
By the mode of ion implantation by N-type ion implantation to the 3rd region of this N-type backside of substrate and second area to form N-type heavily doped region in the 3rd region and to form P type lightly doped region at second area, wherein the dosage of N-type ion is b, and b is less than a.Specifically, only need use two mask plates, because second area is P type heavily doped region originally, therefore in the process injecting N-type ion, decrease the P type ion concentration of second area, naturally form P type lightly doped region, this approach reduces the usage quantity of processing step and mask plate.
Similarly, the step forming N-type lightly doped region in this doping method is further comprising the steps of: by the mode of ion implantation by P type ion implantation to the 4th region of this N-type backside of substrate to form N-type lightly doped region in the 4th region.
Preferably, this doping method is further comprising the steps of:
Step S
p, form N-type doped layer or P type doped layer on the surface of this N-type substrate.The mode of ion implantation or thermal diffusion can be adopted to form this N-type doped layer or P type doped layer.If adopt the mode of thermal diffusion, thermal diffusion simultaneously also as the annealing steps of ion implantation when formation P type heavily doped region, P type lightly doped region, N-type heavily doped region and N-type lightly doped region before, to activate Doped ions.In addition, if employing is N-type substrate, then N-type substrate surface forms the conversion efficiency of the solar cell that the wafers doped of P type doped layer to doping gained obtains advantageously, this is because double-junction solar battery can improve its photoelectric conversion efficiency further.Otherwise, for the substrate of P type, then beneficially form N-type doped layer on the surface of P type substrate.
Preferably, forming this P type heavily doped region by accelerating P type ion to 500eV-50keV and by the mode of ion implantation, making the square resistance of this P type heavily doped region be 10-50 Ω/.Preferably, P type ion is accelerated to 1keV-40keV, and more preferably, P type ion is accelerated to 5keV-30keV.
Preferably, forming this N-type heavily doped region by accelerating N-type ion to 500eV-50keV and by the mode of ion implantation, making the square resistance of this N-type heavily doped region be 10-50 Ω/.Preferably, N-type ion is accelerated to 1keV-40keV, and more preferably, N-type ion is accelerated to 5keV-30keV.
Preferably, the minimum range of this P type heavily doped region and this N-type heavily doped region is at least 10 μm.More preferably, the minimum range of this P type heavily doped region and this N-type heavily doped region is 10-70 μm.
The present invention also provides a kind of solar cell, and its feature is, it comprises wafers doped as above, and this solar cell also comprises:
Be formed at the coating on this wafers doped surface, this coating be the first passivation layer and and anti-reflection film;
Be formed at second passivation layer at this wafers doped back side;
Be positioned at the positive electrode at this P type heavily doped region back side; And
Be positioned at the negative electrode at this N-type heavily doped region back side,
Wherein, when described P type replaces with N-type, N-type replaces with P type simultaneously.
Preferably, the minimum range of this P type heavily doped region and this N-type heavily doped region is at least 10 μm.More preferably, the minimum range of this P type heavily doped region and this N-type heavily doped region is 10-70 μm.
Preferably, the width of this P type heavily doped region is 1000-3000 μm.More preferably, the width of this P type heavily doped region is 1500-2500 μm..
Preferably, the width of N-type heavily doped region is 250-700 μm.More preferably, the width of N-type heavily doped region is 300-600 μm.
Preferably, the width of this P type lightly doped region is 5-50 μm.More preferably, the width of this P type lightly doped region is 10-40 μm.Wherein this P type lightly doped region can contact with this P type heavily doped region.
Preferably, the width of this N-type lightly doped region is 5-50 μm.More preferably, the width of this N-type lightly doped region is 10-40 μm.Wherein this N-type lightly doped region can contact with this N-type heavily doped region.
Preferably, the square resistance of this P type heavily doped region is 10-50 Ω/.Preferably, the square resistance of this P type heavily doped region is 15-45 Ω/, and more preferably, the square resistance of this P type heavily doped region is 20-40 Ω/.
Preferably, the square resistance of this N-type heavily doped region is 10-50 Ω/.Preferably, the square resistance of this N-type heavily doped region is 15-45 Ω/, and more preferably, the square resistance of this N-type heavily doped region is 20-40 Ω/.
Preferably, the square resistance of this P type lightly doped region is 60-120 Ω/.Preferably, the square resistance of this P type lightly doped region is 70-110 Ω/, and more preferably, the square resistance of this P type lightly doped region is 80-100 Ω/.
Preferably, the square resistance of this N-type lightly doped region is 60-120 Ω/.Preferably, the square resistance of this N-type lightly doped region is 70-110 Ω/, and more preferably, the square resistance of this N-type lightly doped region is 80-100 Ω/.
Preferably, the square resistance of this P type heavily doped region is 40-120 Ω/.Preferably, the square resistance of this P type heavily doped region is 60-110 Ω/, and more preferably, the square resistance of this P type heavily doped region is 80-100 Ω/.
Preferably, the square resistance of this N-type heavily doped region is 20-100 Ω/.Preferably, the square resistance of this N-type heavily doped region is 30-90 Ω/, and more preferably, the square resistance of this N-type heavily doped region is 40-80 Ω/.
Preferably, the first passivation layer of this coating is one or more the lamination in silica, carborundum, aluminium oxide, silicon nitride or amorphous silicon membrane, and the anti-reflection film of this coating is silicon nitride film.
Preferably, this second passivation layer is one or more the lamination in silica, carborundum, aluminium oxide, silicon nitride or amorphous silicon membrane.Surface passivation can reduce the surface activity of semiconductor, the recombination rate on surface is reduced, its major way is the dangling bonds at saturated semiconductor surface place, reduce surface activity, increase the cleaning procedure on surface, avoid, because impurity forms complex centre in the introducing of superficial layer, reducing the recombination velocity of minority carrier with this.By surface passivation, surface recombination is reduced, thus improve effective minority carrier life time.Anti-reflection film can reduce the reflection of surperficial sunlight, improves the utilance of sunlight, adopts above-mentioned coating to be the effective means improving solar cell photoelectric conversion efficiency.
Preferably, in the second passivation layer corresponding with this P type heavily doped region, there is the first contact hole, in the second passivation layer corresponding with this N-type heavily doped region, there is the second contact hole, wherein, this positive electrode is connected to this P type heavily doped region by this first contact hole, and this negative electrode is connected to this N-type heavily doped region by this second contact hole.Such positive electrode and negative electrode and semi-conducting material just define point cantact, further reduce contact resistance.
The invention provides a kind of manufacture method of solar cell as above, its feature is, it comprises the following steps:
Step S
1, first area for contacting positive electrode in the back side of N-type substrate forms P type heavily doped region; Second area in the back side of N-type substrate forms this P type lightly doped region, and wherein this second area is the region around this P type heavily doped region; The 3rd region for contacting negative electrode in the back side of N-type substrate forms N-type heavily doped region; The 4th region in the back side of N-type substrate forms this N-type lightly doped region, wherein the 4th region is the region around this N-type heavily doped region, wherein this P type heavily doped region and this N-type heavily doped region are not in contact with each other, this this N-type lightly doped region of P type heavily doped region is not in contact with each other, and this N-type heavily doped region and this P type lightly doped region are not in contact with each other; The sequencing wherein forming P type heavily doped region, P type lightly doped region, N-type heavily doped region and N-type lightly doped region is not limit.Multiple mask plates can be utilized and adopt the mode of ion implantation to form aforementioned p-type heavily doped region, P type lightly doped region and N-type heavily doped region.Again such as, by be silicon dioxide, the amorphous silicon of 10-50 μm at N-type backside of substrate growth thickness, polysilicon or silicon nitride film be as mask plate;
Step S
2, the surface of this wafers doped formed coating, this coating be the first passivation layer and and anti-reflection film;
Step S
3, form the second passivation layer at the back side of this wafers doped;
Step S
4, form positive electrode and negative electrode at the back side of this wafers doped, wherein, this positive electrode is formed on this P type heavily doped region, and this negative electrode is formed on this N-type heavily doped region;
Step S
5, sinter this wafers doped, make metallic element and the wafers doped eutectic compound of positive electrode and negative electrode,
Wherein, when described P type replaces with N-type, N-type replaces with P type simultaneously.
Preferably, step S
1further comprising the steps of:
By the mode of ion implantation by P type ion implantation to the first area of this N-type backside of substrate and second area to form P type heavily doped region in first area and second area, wherein the dosage of P type ion is a;
By the mode of ion implantation by N-type ion implantation to the 3rd region of this N-type backside of substrate and second area to form N-type heavily doped region in the 3rd region and to form P type lightly doped region at second area, wherein the dosage of N-type ion is b, and b is less than a.Specifically, only need use two mask plates, because second area is P type heavily doped region originally, therefore in the process injecting N-type ion, decrease the P type ion concentration of second area, naturally form P type lightly doped region, this approach reduces the usage quantity of processing step and mask plate.
Equally preferably, step S
1the step of middle formation N-type lightly doped region is further comprising the steps of:
By the mode of ion implantation by P type ion implantation to the 4th region of this N-type backside of substrate to form N-type lightly doped region in the 4th region.
Preferably, step S
1in obtain wafers doped before further comprising the steps of:
Step S
p, form N-type doped layer or P type doped layer on the surface of this N-type substrate.Formation N-type doped layer or P type doped layer can before or after P type heavily doped region, P type lightly doped region, N-type heavily doped region and N-type lightly doped region be formed, preferably, after P type heavily doped region, P type lightly doped region, N-type heavily doped region and N-type lightly doped region are formed, adopt the mode of thermal diffusion to form this N-type doped layer or P type doped layer, like this, thermal diffusion step can also as the annealing steps of ion implantation before.
Preferably, step S
1in form this P type heavily doped region by accelerating P type ion to 500eV-50keV and by the mode of ion implantation, make the square resistance of this P type heavily doped region be 10-50 Ω/.Preferably, P type ion is accelerated to 1keV-40keV, and more preferably, P type ion is accelerated to 5keV-30keV.
Preferably, step S
1forming this N-type heavily doped region by accelerating N-type ion to 500eV-50keV and by the mode of ion implantation, making the square resistance of this N-type heavily doped region be 10-50 Ω/.Preferably, N-type ion is accelerated to 1keV-40keV, and more preferably, N-type ion is accelerated to 5keV-30keV.
Preferably, step S
2in form coating by PECVD (plasma enhanced chemical vapor deposition method), first passivation layer of this coating is one or more the lamination in silica, carborundum, aluminium oxide, silicon nitride or amorphous silicon membrane, and the anti-reflection film of this coating is silicon nitride film.
Preferably, step S
3in form the second passivation layer by PECVD, this second passivation layer is one or more the lamination in silica, carborundum, aluminium oxide, silicon nitride or amorphous silicon membrane.
Preferably, step S
4middle employing silver slurry or silver-colored aluminium paste are also by silk screen printing method for producing positive electrode and/or negative electrode.Certainly, the method making electrode is not limited to silk screen printing.
Preferably, step S
4further comprising the steps of:
Step S
41, in second passivation layer corresponding with this P type heavily doped region, form the first contact hole, and form the second contact hole in the second passivation layer corresponding with this N-type heavily doped region;
Step 8
42, form positive electrode and negative electrode at the back side of this wafers doped, wherein, this positive electrode is connected to this P type heavily doped region by this first contact hole, and this negative electrode is connected to this N-type heavily doped region by this second contact hole.Such positive electrode and negative electrode and semi-conducting material just define point cantact, further reduce contact resistance.
Preferably, the minimum range of this P type heavily doped region and this N-type heavily doped region is at least 10 μm.More preferably, the minimum range of this P type heavily doped region and this N-type heavily doped region is 10-70 μm.
Only need in above process, the impurity material that the mode of exchanging base material and ion implantation or diffusion growth is adulterated, then the method is equally applicable to the making of P type solar energy wafers doped and P type solar cell, and when namely described N-type replaces with P type, P type replaces with N-type simultaneously.
Positive progressive effect of the present invention is:
1, there is N-type base material as resilient coating in the present invention between P type heavily doped region and N-type heavily doped region, make to cause breakdown because depletion layer is too thin between PN junction, which thereby enhance the useful life of this wafers doped, simultaneously owing to being also provided with P type lightly doped region and N-type lightly doped region between P type heavily doped region and N-type base material, the PN junction of the P+/P-/N/N-/N+ structure formed thus make charge carrier migration evenly, speed is more stable, and the performance of solar cell obtained is thus more stable.
2, make back of the body junction battery compared with employing photoetching process, this invention simplifies processing step, without the need to buying mask aligner, cost reduces greatly.
3, adopt ion implantation to carry out doping and form P type heavily doped region, P type lightly doped region and N-type heavily doped region, N-type lightly doped region, the concentration of Doped ions obtains accurate control, and the doping compared with thermal diffusion process is more favourable to the efficiency improving opto-electronic conversion.
Accompanying drawing explanation
The decomposition step schematic diagram that Fig. 1 a-Fig. 4 a is the doping method described in embodiments of the invention 1-4.
The decomposition step schematic diagram that Fig. 1 a-Fig. 6 a is the manufacture method of the solar cell described in embodiments of the invention 5-6.
Fig. 1 a-Fig. 4 a and Fig. 5 b is the decomposition step schematic diagram of the doping method described in embodiments of the invention 7-9.
Fig. 1 a-Fig. 4 a and Fig. 5 b-7b is the decomposition step schematic diagram of the manufacture method of the solar cell described in embodiments of the invention 10.
The decomposition step schematic diagram that Fig. 1 c-Fig. 3 c is the doping method described in embodiments of the invention 11.
The decomposition step schematic diagram that Fig. 1 c-Fig. 5 c is the manufacture method of the solar cell described in embodiments of the invention 12.
Fig. 1 c-Fig. 3 c and Fig. 4 d is the decomposition step schematic diagram of the doping method described in embodiments of the invention 13.
The decomposition step schematic diagram that Fig. 1 c-Fig. 3 c and Fig. 4 d-Fig. 6 d is the manufacture method of the solar cell described in embodiments of the invention 14.
Embodiment
Present pre-ferred embodiments is provided, to describe technical scheme of the present invention in detail below in conjunction with accompanying drawing.
Embodiment 1
With reference to figure 1a, the first area for contacting positive electrode in the back side of N-type substrate 1 forms P type heavily doped region 21.Specifically, this first mask plate 10 is placed in the back side of N-type substrate 1, accelerating boron ion and by region that first mask plate 10 cover be not injected into the back side of this N-type substrate 1 to form P type heavily doped region 21 that square resistance be 10 Ω/ s by the mode of ion implantation from the back side of this N-type substrate 1 to 500eV, not wherein being the first area for contacting positive electrode by the region that the first mask plate 10 covers.In figure, arrow is depicted as the direction of ion implantation, only in order to make those skilled in the art understand the present invention, should not be construed as limitation of the present invention.
With reference to figure 2a, the 3rd region for contacting negative electrode in the back side of N-type substrate 1 forms N-type heavily doped region 31, and wherein this N-type heavily doped region 31 is not in contact with each other with this P type heavily doped region 21.Specifically, this second mask plate 11 is placed in the back side of N-type substrate 1, accelerating phosphonium ion is not injected into form the N-type heavily doped region 31 that square resistance is 10 Ω/ the back side of this N-type substrate 1 by the region that the second mask plate 11 covers to 500eV and by the mode of ion implantation from the back side of this N-type substrate 1, is not wherein the 3rd region for contacting negative electrode by the region that the second mask plate 11 covers.In the present embodiment, this P type heavily doped region 21 is 20 μm with the minimum range of this N-type heavily doped region 31.
With reference to figure 3a, the second area in the back side of N-type substrate 1 forms this P type lightly doped region 22, and wherein this second area is the region around this P type heavily doped region 21.Specifically, 3rd mask plate 12 is placed in the back side of N-type substrate 1, accelerates boron ion and be not injected into the back side of this N-type substrate 1 to form the P type lightly doped region 22 that square resistance is 60 Ω/ by the region that the 3rd mask plate 12 covers from the back side of this N-type substrate 1 to 500eV and by the mode of ion implantation.
With reference to figure 4a, the 4th region in the back side of N-type substrate 1 forms this N-type lightly doped region 32, and wherein the 4th region is the region around this N-type heavily doped region 31.Specifically, 4th mask plate 13 is placed in the back side of N-type substrate 1, accelerates boron ion and be not injected into the back side of this N-type substrate 1 to form the N-type lightly doped region 32 that square resistance is 60 Ω/ by the region that the 4th mask plate 12 covers from the back side of this N-type substrate 1 to 500eV and by the mode of ion implantation.In the present embodiment, the width of this P type heavily doped region is 1000 μm, and the width of N-type heavily doped region is 250 μm, and the width of this P type lightly doped region and this N-type lightly doped region is 5 μm.Remove the 4th mask plate 13, and annealing is to activate Doped ions to obtain the wafers doped of P+/P-/N/N+ structure.Annealing conditions is conventional selection.
Embodiment 2
The principle of embodiment 2 is identical with embodiment 1, and its main technological steps is also identical, and difference is only the selection of following technique and parameter:
With reference to figure 1a, accelerate boron ion and be not injected into the back side of this N-type substrate 1 to form the P type heavily doped region 21 that square resistance is 50 Ω/ by the region that the first mask plate 10 covers from the back side of this N-type substrate 1 to 50keV and by the mode of ion implantation.
With reference to figure 2a, accelerate phosphonium ion and be not injected into the back side of this N-type substrate 1 to form the N-type heavily doped region 31 that square resistance is 50 Ω/ by the region that the second mask plate 11 covers from the back side of this N-type substrate 1 to 50keV and by the mode of ion implantation.In the present embodiment, this P type heavily doped region 21 is 70 μm with the minimum range of this N-type heavily doped region 31.
With reference to figure 3a, accelerate boron ion and be not injected into the back side of this N-type substrate 1 to form the P type lightly doped region 22 that square resistance is 120 Ω/ by the region that the 3rd mask plate 12 covers from the back side of this N-type substrate 1 to 50keV and by the mode of ion implantation.
With reference to figure 4a, accelerate boron ion and be not injected into the back side of this N-type substrate 1 to form the N-type lightly doped region 32 that square resistance is 120 Ω/ by the region that the 4th mask plate 13 covers from the back side of this N-type substrate 1 to 50keV and by the mode of ion implantation.In the present embodiment, the width of this P type heavily doped region is 3000 μm, and the width of N-type heavily doped region is 700 μm, and the width of this P type lightly doped region and this N-type lightly doped region is 35 μm.
All the other NM processing steps are identical with embodiment 1 with parameter.
Embodiment 3
The principle of embodiment 3 is identical with embodiment 1, and its main technological steps is also identical, and difference is only the selection of following technique and parameter:
With reference to figure 1a, accelerate boron ion and be not injected into the back side of this N-type substrate 1 to form the P type heavily doped region 21 that square resistance is 30 Ω/ by the region that the first mask plate 10 covers from the back side of this N-type substrate 1 to 30keV and by the mode of ion implantation.
With reference to figure 2a, accelerate phosphonium ion and be not injected into the back side of this N-type substrate 1 to form the N-type heavily doped region 31 that square resistance is 40 Ω/ by the region that the second mask plate 11 covers from the back side of this N-type substrate 1 to 30keV and by the mode of ion implantation.In the present embodiment, this P type heavily doped region 21 is 50 μm with the minimum range of this N-type heavily doped region 31.
With reference to figure 3a, accelerate boron ion and be not injected into the back side of this N-type substrate 1 to form the P type lightly doped region 22 that square resistance is 100 Ω/ by the region that the 3rd mask plate 12 covers from the back side of this N-type substrate 1 to 30keV and by the mode of ion implantation.
With reference to figure 4a, accelerate boron ion and be not injected into the back side of this N-type substrate 1 to form the N-type lightly doped region 32 that square resistance is 100 Ω/ by the region that the 4th mask plate 13 covers from the back side of this N-type substrate 1 to 50keV and by the mode of ion implantation.In the present embodiment, the width of this P type heavily doped region is 2000 μm, and the width of N-type heavily doped region is 500 μm, and the width of this P type lightly doped region is 30 μm, and the width of this N-type lightly doped region is 20 μm.
All the other NM processing steps are identical with embodiment 1 with parameter.
Embodiment 4
With reference to figure 1a-Fig. 4 a, the principle of embodiment 4 is identical with embodiment 1, its main technological steps is also identical, difference is only the order forming P type heavily doped region 21, N-type heavily doped region 31, P type lightly doped region 22 and N-type lightly doped region 32, in the present embodiment, first form N-type heavily doped region 31, then form P type heavily doped region 21, P type lightly doped region 22 and N-type lightly doped region 32, concrete generation type is identical with embodiment 1 with technological parameter.
Embodiment 5
After obtaining wafers doped as shown in fig. 4 a according to the doping method described in embodiment 1, make solar cell in accordance with the following steps:
With reference to figure 5a, the surface of this wafers doped formed coating 5, this coating 5 be the first passivation layer and and anti-reflection film, adopt in the present embodiment PECVD method formed coating 5, wherein this first passivation layer is silicon oxide film, and this anti-reflection film is silicon nitride film.Form the second passivation layer 51 at the back side of this wafers doped, adopt silicon oxide film in the present embodiment and form this second passivation layer 51 by the method for PECVD.
With reference to figure 6a, positive electrode 61 and negative electrode 62 is formed at the back side of this wafers doped, wherein, this positive electrode 61 is formed on this P type heavily doped region 21, this negative electrode 62 is formed on this N-type heavily doped region 31, specifically, positive electrode and negative electrode described in silver slurry and silk screen printing method for producing is adopted.Sinter this wafers doped, make metallic element and the wafers doped eutectic compound of positive electrode and negative electrode, such as, sinter 10 minutes at 850 DEG C, obtain solar cell as shown in Figure 6 a.
Embodiment 6
The principle of embodiment 6 is identical with embodiment 5, and its main technological steps is also identical, and difference is only the selection of following technique and parameter:
Described first passivation layer and anti-reflection film are silicon nitride film.
With reference to figure 6a, the step making electrode is further comprising the steps of:
In second passivation layer corresponding with this P type heavily doped region 21, form the first contact hole, and form the second contact hole in the second passivation layer corresponding with this N-type heavily doped region 31;
Form positive electrode 61 and negative electrode 62 at the back side of this wafers doped, wherein, this positive electrode 61 is connected to this P type heavily doped region 21 by this first contact hole, and this negative electrode 31 is connected to this N-type heavily doped region 31 by this second contact hole.
All the other NM processing steps, parameter are identical with embodiment 5.
Embodiment 7
With reference to figure 1a-Fig. 4 a, after obtaining structure as shown in fig. 4 a according to the doping method described in embodiment 1, further comprising the steps of:
With reference to figure 5b, after removing the 4th mask plate 13, accelerate phosphonium ion, to 500eV and by the mode of ion implantation, phosphonium ion is injected into the surface of this N-type substrate to form the N-type doped layer 41 as front surface field, afterwards, structure is as shown in Figure 5 b heat-treated, obtain wafers doped to activate Doped ions, heat-treat condition is conventional selection.
All the other NM processing steps, parameter are identical with embodiment 1.
Embodiment 8
With reference to figure 1a-Fig. 4 a, after obtaining structure as shown in fig. 4 a according to the doping method described in embodiment 1, further comprising the steps of:
With reference to figure 5b, after removing the 4th mask plate 13, the N-type doped layer 41 as front surface field is formed on the surface of this N-type substrate by the method for thermal diffusion, this thermal diffusion is also as the annealing steps of ion implantation before, activate Doped ions thus and obtain wafers doped, heat-treat condition is conventional selection.
All the other NM processing steps, parameter are identical with embodiment 1.
Embodiment 9
The principle of embodiment 9 is identical with embodiment 7, its main technological steps is also identical, difference is only to form P type doped layer as front surface field on the surface of this N-type substrate by the ion implantation of boron ion, after-baking to obtain wafers doped, heat-treat condition be conventional selection.
All the other NM processing steps, parameter are identical with embodiment 7.
Embodiment 10
With reference to figure 1a-4a and Fig. 5 b, after obtaining wafers doped as shown in Figure 5 b according to the processing step of embodiment 7, with reference to figure 6b and Fig. 7 b, according to the processing step acquisition solar cell as shown in Figure 7b described in embodiment 5, the coating now comprising the first passivation layer and anti-reflection film is positioned at the surface of this N-type doped layer 41.
Embodiment 11
With reference to figure 1c, accelerate boron ion not to be injected into form P type heavily doped region 21 back side of this N-type substrate 1 by the region that the 3rd mask plate 12 covers to 50keV and by the mode of ion implantation from the back side of this N-type substrate 1, wherein the dopant dose of boron ion is a.
With reference to figure 2c, one the 5th mask plate 14 is placed in the back side of this N-type substrate 1, accelerate phosphonium ion not to be injected into the back side of this N-type substrate 1 by the region that the 5th mask plate 14 covers to form N-type heavily doped region 31 in the 3rd region and to form P type lightly doped region 22 at second area to 50keV and by the mode of ion implantation from the back side of this N-type substrate 1, wherein the dopant dose of phosphonium ion is b, and b < a.
With reference to figure 3c, the 4th mask plate 13 is placed in the back side of this N-type substrate 1, accelerates boron ion and boron ion is injected into the 4th region to form N-type lightly doped region 32 by the mode of ion implantation, obtain wafers doped as shown in Figure 3 c thus.
All the other NM technological parameters are identical with embodiment 1.
Embodiment 12
With reference to figure 1c-3c, after obtaining wafers doped according to the method step described in embodiment 11, with reference to figure 4c-5c, according to the processing step acquisition solar cell as shown in Figure 5 c described in embodiment 5.
Embodiment 13
With reference to figure 1c-3c, after obtaining structure as shown in Figure 3 c according to the method step described in embodiment 11, with reference to figure 4d, by the mode of ion implantation at the surface of N-type substrate 1 formation N-type doped layer 41, after-baking to obtain wafers doped as shown in figure 4d.
Embodiment 14
With reference to figure 1c-3c, Fig. 4 d-6d, after the wafers doped obtained described in embodiment 13 as shown in figure 4d, according to the processing step acquisition solar cell as shown in fig 6d described in embodiment 5, the coating now comprising the first passivation layer and anti-reflection film is positioned at the surface of this N-type doped layer 41.
Only need in above process, the impurity material that the mode of exchanging base material and ion implantation or diffusion growth is adulterated, then the method is equally applicable to the making of P type solar energy wafers doped, and when namely described N-type replaces with P type, P type replaces with N-type simultaneously.
In order to clearly illustrate each doped region, in accompanying drawing, the size of each doped region is not described in proportion, and those skilled in the art are to be understood that the ratio in accompanying drawing is not limitation of the present invention.
Although the foregoing describe the specific embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is defined by the appended claims.Those skilled in the art, under the prerequisite not deviating from principle of the present invention and essence, can make various changes or modifications to these execution modes, but these change and amendment all falls into protection scope of the present invention.
Claims (14)
1. manufacture a doping method for wafers doped, this wafers doped comprises multiple doping unit, and this doping unit comprises:
One N-type substrate;
Be formed at the P type heavily doped region in this N-type backside of substrate and N-type heavily doped region;
Be formed at the P type lightly doped region around this P type heavily doped region;
Be formed at the N-type lightly doped region around this N-type heavily doped region;
Wherein, this P type heavily doped region and this N-type heavily doped region are not in contact with each other, and this this N-type lightly doped region of P type heavily doped region is not in contact with each other, and this N-type heavily doped region and this P type lightly doped region are not in contact with each other,
It is characterized in that, this doping method comprises the following steps:
First area for contacting positive electrode in the back side of N-type substrate forms P type heavily doped region;
Second area in the back side of N-type substrate forms this P type lightly doped region, and wherein this second area is the region around this P type heavily doped region;
The 3rd region for contacting negative electrode in the back side of N-type substrate forms N-type heavily doped region;
The 4th region in the back side of N-type substrate forms this N-type lightly doped region, wherein the 4th region is the region around this N-type heavily doped region, wherein this P type heavily doped region and this N-type heavily doped region are not in contact with each other, this this N-type lightly doped region of P type heavily doped region is not in contact with each other, and this N-type heavily doped region and this P type lightly doped region are not in contact with each other
Wherein, when described P type replaces with N-type, N-type replaces with P type simultaneously, and negative electrode replaces with positive electrode, and positive electrode replaces with negative electrode simultaneously,
The step forming P type heavily doped region, P type lightly doped region and N-type heavily doped region in this doping method is further comprising the steps of:
By the mode of ion implantation by P type ion implantation to the first area of this N-type backside of substrate and second area to form P type heavily doped region in first area and second area, wherein the dosage of P type ion is a;
By the mode of ion implantation by N-type ion implantation to the 3rd region of this N-type backside of substrate and second area to form N-type heavily doped region in the 3rd region and to form P type lightly doped region at second area, wherein the dosage of N-type ion is b, and b is less than a.
2. doping method as claimed in claim 1, it is characterized in that, the step forming N-type lightly doped region in this doping method is further comprising the steps of:
By the mode of ion implantation by P type ion implantation to the 4th region of this N-type backside of substrate to form N-type lightly doped region in the 4th region.
3. doping method as claimed in claim 1, it is characterized in that, this doping method is further comprising the steps of:
Step S
p, form N-type doped layer or P type doped layer at the front surface of this N-type substrate.
4. as the doping method in claim 1-3 as described in any one, it is characterized in that, forming this P type heavily doped region by accelerating P type ion to 500eV-50keV and by the mode of ion implantation, making the square resistance of this P type heavily doped region be 10-50 Ω/.
5. as the doping method in claim 1-3 as described in any one, it is characterized in that, forming this N-type heavily doped region by accelerating N-type ion to 500eV-50keV and by the mode of ion implantation, making the square resistance of this N-type heavily doped region be 10-50 Ω/.
6. a manufacture method for solar cell, this solar cell comprises the wafers doped described in claim 1, and this solar cell also comprises:
Be formed at the coating on this wafers doped surface, this coating is the first passivation layer and anti-reflection film;
Be formed at second passivation layer at this wafers doped back side;
Be positioned at the positive electrode at this P type heavily doped region back side; And
Be positioned at the negative electrode at this N-type heavily doped region back side,
It is characterized in that, this manufacture method comprises the following steps:
Step S
1, first area for contacting positive electrode in the back side of N-type substrate forms P type heavily doped region; Second area in the back side of N-type substrate forms this P type lightly doped region, and wherein this second area is the region around this P type heavily doped region; The 3rd region for contacting negative electrode in the back side of N-type substrate forms N-type heavily doped region; The 4th region in the back side of N-type substrate forms this N-type lightly doped region, wherein the 4th region is the region around this N-type heavily doped region, wherein this P type heavily doped region and this N-type heavily doped region are not in contact with each other, this this N-type lightly doped region of P type heavily doped region is not in contact with each other, and this N-type heavily doped region and this P type lightly doped region are not in contact with each other;
Step S
2, the surface of this wafers doped formed coating, this coating is the first passivation layer and anti-reflection film;
Step S
3, form the second passivation layer at the back side of this wafers doped;
Step S
4, form positive electrode and negative electrode at the back side of this wafers doped, wherein, this positive electrode is formed on this P type heavily doped region, and this negative electrode is formed on this N-type heavily doped region;
Step S
5, sinter this wafers doped, make metallic element and the wafers doped eutectic compound of positive electrode and negative electrode,
Wherein, when described P type replaces with N-type, N-type replaces with P type simultaneously, and negative electrode replaces with positive electrode, and positive electrode replaces with negative electrode simultaneously,
Step S
1the step of middle formation P type heavily doped region, P type lightly doped region and N-type heavily doped region is further comprising the steps of:
By the mode of ion implantation by P type ion implantation to the first area of this N-type backside of substrate and second area to form P type heavily doped region in first area and second area, wherein the dosage of P type ion is a;
By the mode of ion implantation by N-type ion implantation to the 3rd region of this N-type backside of substrate and second area to form N-type heavily doped region in the 3rd region and to form P type lightly doped region at second area, wherein the dosage of N-type ion is b, and b is less than a.
7. manufacture method as claimed in claim 6, is characterized in that, step S
1the step of middle formation N-type lightly doped region is further comprising the steps of:
By the mode of ion implantation by P type ion implantation to the 4th region of this N-type backside of substrate to form N-type lightly doped region in the 4th region.
8. manufacture method as claimed in claim 6, is characterized in that, step S
1in obtain wafers doped before further comprising the steps of:
Step S
p, form N-type doped layer or P type doped layer at the front surface of this N-type substrate.
9. the manufacture method as described in claim 6-8 any one, is characterized in that, step S
1in form this P type heavily doped region by accelerating P type ion to 500eV-50keV and by the mode of ion implantation, make the square resistance of this P type heavily doped region be 10-50 Ω/.
10. the manufacture method as described in claim 6-8 any one, is characterized in that, step S
1forming this N-type heavily doped region by accelerating N-type ion to 500eV-50keV and by the mode of ion implantation, making the square resistance of this N-type heavily doped region be 10-50 Ω/.
11. manufacture methods as described in claim 6-8 any one, is characterized in that, step S
2in form coating by PECVD, the first passivation layer of this coating is one or more the lamination in silica, carborundum, aluminium oxide, silicon nitride or amorphous silicon membrane, and the anti-reflection film of this coating is silicon nitride film.
12. manufacture methods as described in claim 6-8 any one, is characterized in that, step S
3in form the second passivation layer by PECVD, this second passivation layer is one or more the lamination in silica, carborundum, aluminium oxide, silicon nitride or amorphous silicon membrane.
13. manufacture methods as described in claim 6-8 any one, is characterized in that, step S
4middle employing silver slurry or silver-colored aluminium paste are also by silk screen printing method for producing positive electrode and/or negative electrode.
14. manufacture methods as described in claim 6-8 any one, is characterized in that, step S
4further comprising the steps of:
Step S
41, in second passivation layer corresponding with this P type heavily doped region, form the first contact hole, and form the second contact hole in the second passivation layer corresponding with this N-type heavily doped region;
Step S
42, form positive electrode and negative electrode at the back side of this wafers doped, wherein, this positive electrode is connected to this P type heavily doped region by this first contact hole, and this negative electrode is connected to this N-type heavily doped region by this second contact hole.
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| US5369291A (en) * | 1993-03-29 | 1994-11-29 | Sunpower Corporation | Voltage controlled thyristor |
| US6998288B1 (en) * | 2003-10-03 | 2006-02-14 | Sunpower Corporation | Use of doped silicon dioxide in the fabrication of solar cells |
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| US5369291A (en) * | 1993-03-29 | 1994-11-29 | Sunpower Corporation | Voltage controlled thyristor |
| US6998288B1 (en) * | 2003-10-03 | 2006-02-14 | Sunpower Corporation | Use of doped silicon dioxide in the fabrication of solar cells |
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