CN1027352C - 被清洗物的清洗方法及装置 - Google Patents

被清洗物的清洗方法及装置 Download PDF

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Publication number
CN1027352C
CN1027352C CN90103858A CN90103858A CN1027352C CN 1027352 C CN1027352 C CN 1027352C CN 90103858 A CN90103858 A CN 90103858A CN 90103858 A CN90103858 A CN 90103858A CN 1027352 C CN1027352 C CN 1027352C
Authority
CN
China
Prior art keywords
liquid
cleaned thing
solvent
noninflammability
wiper mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN90103858A
Other languages
English (en)
Chinese (zh)
Other versions
CN1048992A (zh
Inventor
内野正英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Harano Co Ltd (jp) Tokyo To Japan
Japan Field Co Ltd
Original Assignee
Japan Harano Co Ltd (jp) Tokyo To Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Harano Co Ltd (jp) Tokyo To Japan filed Critical Japan Harano Co Ltd (jp) Tokyo To Japan
Publication of CN1048992A publication Critical patent/CN1048992A/zh
Application granted granted Critical
Publication of CN1027352C publication Critical patent/CN1027352C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • C23G5/04—Apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Detergent Compositions (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN90103858A 1989-05-29 1990-05-29 被清洗物的清洗方法及装置 Expired - Fee Related CN1027352C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP13546189 1989-05-29
JP135461/89 1989-05-29
JP135461 1989-05-29

Publications (2)

Publication Number Publication Date
CN1048992A CN1048992A (zh) 1991-02-06
CN1027352C true CN1027352C (zh) 1995-01-11

Family

ID=15152256

Family Applications (1)

Application Number Title Priority Date Filing Date
CN90103858A Expired - Fee Related CN1027352C (zh) 1989-05-29 1990-05-29 被清洗物的清洗方法及装置

Country Status (7)

Country Link
US (1) US5067983A (enExample)
EP (1) EP0400873B1 (enExample)
JP (1) JPH0389985A (enExample)
KR (1) KR930001569B1 (enExample)
CN (1) CN1027352C (enExample)
DE (1) DE69013759T2 (enExample)
HK (1) HK89295A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2535466B2 (ja) * 1991-10-17 1996-09-18 ジャパン・フィールド株式会社 可燃性溶剤を用いた被洗浄物の洗浄装置
US5339843A (en) * 1993-04-16 1994-08-23 Martin Marietta Corporation Controlled agitation cleaning system
TW318190B (enExample) * 1993-10-06 1997-10-21 Hitachi Shipbuilding Eng Co
US5402806A (en) * 1993-10-19 1995-04-04 Northrop Grumman Corporation Cleaning apparatus having a partitioned boil sump
JP2996334B2 (ja) * 1994-03-30 1999-12-27 東北日本電気株式会社 超音波脱脂装置
US5928948A (en) * 1997-03-10 1999-07-27 Steris Corporation Method for the assessment and validation of cleaning processes
US6145518A (en) * 1997-12-31 2000-11-14 Crs Holdings, Inc. Bulk ultrasonic degreasing cleaning and drying apparatus and method of using same
US6279584B1 (en) 1998-12-22 2001-08-28 Crs Holdings, Inc. Bulk ultrasonic degreasing, cleaning, and drying method
JP5076033B1 (ja) * 2012-06-08 2012-11-21 ジャパン・フィールド株式会社 被洗浄物の蒸気洗浄方法及びその装置
JP6539251B2 (ja) * 2016-11-10 2019-07-03 上村工業株式会社 超音波処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2828231A (en) * 1954-03-31 1958-03-25 Gen Electric Method and apparatus for ultrasonic cleansing
SE426850B (sv) * 1981-06-24 1983-02-14 Bycosin Ab Apparat for rengoring av foremal medelst losningsmedel
DE3374526D1 (en) * 1983-07-06 1987-12-23 Snef Electro Mecanique Method and apparatus for cleaning big work pieces
EP0235744A1 (en) * 1986-02-28 1987-09-09 Japan Field Company, Ltd. Apparatus for vapour cleaning
US4886082A (en) * 1986-07-02 1989-12-12 Brother Kogyo Kabushiki Kaisha Cleaning apparatus
US4763677A (en) * 1986-11-26 1988-08-16 Techalloy Illinois, Inc. Sonic treatment apparatus
US4865060A (en) * 1989-01-25 1989-09-12 S & C Co., Ltd. Ultrasonic cleaning system
US4909266A (en) * 1989-03-10 1990-03-20 Frank Massa Ultrasonic cleaning system

Also Published As

Publication number Publication date
JPH0543436B2 (enExample) 1993-07-01
KR910014158A (ko) 1991-08-31
DE69013759D1 (de) 1994-12-08
JPH0389985A (ja) 1991-04-15
DE69013759T2 (de) 1995-04-13
US5067983A (en) 1991-11-26
HK89295A (en) 1995-06-16
EP0400873B1 (en) 1994-11-02
EP0400873A1 (en) 1990-12-05
CN1048992A (zh) 1991-02-06
KR930001569B1 (ko) 1993-03-05

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Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C15 Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993)
OR01 Other related matters
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee