CN102724821A - Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera - Google Patents
Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera Download PDFInfo
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- CN102724821A CN102724821A CN2012101965370A CN201210196537A CN102724821A CN 102724821 A CN102724821 A CN 102724821A CN 2012101965370 A CN2012101965370 A CN 2012101965370A CN 201210196537 A CN201210196537 A CN 201210196537A CN 102724821 A CN102724821 A CN 102724821A
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- lead
- wiring board
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Abstract
The invention discloses a stamping process of a halogen-free and lead-free multi-layer precise circuit board for a digital camera. The method comprises the following steps of a pre-fishing process before a stamping process, a die-building process, a punch depth adjusting process and a stamping process. While the requirement on the quality of the halogen-free and lead-free environment-friendly multi-layer precise circuit board for the digital camera is met, the production efficiency is improved, and the production and processing cost is effectively reduced. Compared with the method in the prior art, the method has the advantages that the fishing time is reduced and the production cost is reduced.
Description
Technical field
The invention discloses the stamp processing technology of a kind of digital camera, belong to printed circuit board (PCB) stamp plate manufacture field with the accurate wiring board of halogen-free and lead-free multilayer.
Background technology
Along with the development of global environmental protection cause, the human earth and the life of more and more treasuring oneself.Humanly in recent years further recognize influence and the harm of metallic lead, so that human use to metallic lead limits progressively and in addition legalization to the mankind.Comply with epoch trend, in line with the theory of " protection environment, cherish life ", Green Product-unleaded, Halogen step material are used and are gone up printed circuit board (PCB).And along with the continuous development and the raising of scientific and technological level, consumption electronic product presents multifunction, miniaturization and light-weighted development trend, impels printed circuit board to develop towards high accuracy, high density, high-performance, microporeization, slimming and high stratification direction.
The method for processing forming that digital camera uses the accurate wiring board of halogen-free and lead-free multilayer generally to adopt at present is: use make-up machine to process; Bakelite plate at the make-up machine work top gets out the shop bolt hole earlier; Strike shop bolt; Be enclosed within on the shop bolt by design lamination number, access cut type program to be processed, carry out cut type processing.
The defective that this kind processing method exists:
1, the processing and forming time is longer;
2, lack the waste milling cutter useful life in milling cutter life-span.
Summary of the invention
The objective of the invention is to overcome the deficiency that exists in the prior art, a kind of production efficiency is high, simple to operate, processing cost the is low digital camera stamp processing technology with the accurate wiring board of halogen-free and lead-free multilayer is provided.
According to technical scheme provided by the invention, said digital camera comprises the steps: with the stamp processing technology of the accurate wiring board of halogen-free and lead-free multilayer
(1) drags in advance before the stamp: use earlier and drag for the groove operation in the plate of make-up machine to the accurate wiring board of halogen-free and lead-free multilayer; The position of the groove that drags for is that the inside and outside layer line road of the accurate wiring board of halogen-free and lead-free multilayer is less than the 0.38mm place from the spacing of edges of boards; Drag for behind the type and the accurate wiring board of halogen-free and lead-free multilayer is cut along separately line of demarcation, obtain the accurate wiring board veneer of halogen-free and lead-free multilayer;
(2) shut die: be placed on the particular manufacturing craft of digital camera on the punch press work top with the accurate wiring board stamp of halogen-free and lead-free multilayer; Digital camera is pushed to the middle position of punch press work top with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press; The drift of punch press descends; Using the spacing between the patrix top of particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer until drift and digital camera is 8 ~ 10mm, and the drift of punch press stops to descend, and guarantees that digital camera aligns with clamping screw mouth on the punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp; Continue to make the drift of punch press to descend; Using the spacing at patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer until drift and digital camera is 2 ~ 3mm; The drift of punch press stops to descend; The drift of regulating punch press makes that the spacing of drift and work top is 320 ~ 330mm, the locking digital camera with the patrix bolt of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp and counterdie bolt with fixed mould;
(3) the debugging drift degree of depth: the drift of fine setting punch press, make that the drift of punch press and the spacing of work top are 310 ~ 320mm, employing thickness is that the brown paper of 0.15 ~ 0.2mm tries to dash, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of digital camera with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; The startup punch press carries out stamp, and (this action is that mold is flushed on the bed die earlier; Mold is just got back to original position moment under the effect of taking off the material system then), just accomplish a veneer stamp action.Said platen pressure is 4 ~ 5kg/cm
2, the punch press motor rotary speed is 35 ~ 65 rev/mins, takes off the material mode in the use during stamp and takes off material, takes off material pressure and is controlled at 2 ~ 2.5kg/cm
2
The present invention effectively reduces the production and processing cost guaranteeing to have promoted production efficiency in the requirement of digital camera with the accurate wiring board quality of halogen-free and lead-free environment friendly multi-layer.Method of the present invention is compared with the method for prior art to have reduced and is dragged for type process time, has reduced production cost.
Embodiment
Below in conjunction with specific embodiment the present invention is described further.
Embodiment 1
A kind of digital camera comprises following processing step with the stamp processing technology of the accurate wiring board of halogen-free and lead-free environment friendly multi-layer:
(1) drags in advance before the stamp: use earlier to be equipped with in the plate of make-up machine to the accurate wiring board of 4 layers of halogen-free and lead-free multilayer of diameter as the 0.8mm milling cutter and drag for the groove operation; The position of the groove that drags for is that the inside and outside layer line road of the accurate wiring board of halogen-free and lead-free multilayer is less than the 0.38mm place from the spacing of edges of boards; The thickness of the accurate wiring board of said halogen-free and lead-free multilayer is 0.8mm; Veneer and the spacing between the veneer on the accurate wiring board of halogen-free and lead-free multilayer are 1.6mm; Drag for behind the type the accurate wiring board of halogen-free and lead-free multilayer is cut along separately line of demarcation, obtain the accurate wiring board veneers of 5 halogen-free and lead-free multilayers;
(2) shut die: be placed on the particular manufacturing craft of digital camera on the punch press work top with the accurate wiring board stamp of halogen-free and lead-free multilayer; Digital camera is pushed to the middle position of punch press work top with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press; The drift of punch press descends; Use the spacing between the patrix top of particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer to be 80mm until drift and digital camera, the drift of punch press stops to descend, and guarantees that digital camera aligns with clamping screw mouth on the punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp; Continue to make the drift of punch press to descend; Use the spacing at patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer to be 2mm until drift and digital camera; The drift of punch press stops to descend; The drift of regulating punch press makes that the spacing of drift and work top is 320mm, the locking digital camera with the patrix bolt of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp and counterdie bolt with fixed mould;
(3) the debugging drift degree of depth: the drift of fine setting punch press, make that the drift of punch press and the spacing of work top are 310mm, employing thickness is that the brown paper of 0.15mm tries to dash, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of digital camera with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press and carry out stamp, just accomplish a veneer stamp action; Said platen pressure is 4kg/cm
2, the punch press motor rotary speed is 65 rev/mins, takes off the material mode in the use during stamp and takes off material, takes off material pressure and is controlled at 2kg/cm
2
Embodiment 2
A kind of digital camera comprises following processing step with the stamp processing technology of the accurate wiring board of halogen-free and lead-free environment friendly multi-layer:
(1) drags in advance before the stamp: use earlier to be equipped with in the plate of make-up machine to the accurate wiring board of 8 layers of halogen-free and lead-free multilayer of diameter as the 1.0mm milling cutter and drag for the groove operation; The position of the groove that drags for is that the inside and outside layer line road of the accurate wiring board of halogen-free and lead-free multilayer is less than the 0.38mm place from the spacing of edges of boards; The thickness of the accurate wiring board of said halogen-free and lead-free multilayer is 1.0mm; Veneer and the spacing between the veneer on the accurate wiring board of halogen-free and lead-free multilayer are 1.6mm; Drag for behind the type the accurate wiring board of halogen-free and lead-free multilayer is cut along separately line of demarcation, obtain the accurate wiring board veneers of 5 halogen-free and lead-free multilayers;
(2) shut die: be placed on the particular manufacturing craft of digital camera on the punch press work top with the accurate wiring board stamp of halogen-free and lead-free multilayer; Digital camera is pushed to the middle position of punch press work top with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press; The drift of punch press descends; Use the spacing between the patrix top of particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer to be 10mm until drift and digital camera, the drift of punch press stops to descend, and guarantees that digital camera aligns with clamping screw mouth on the punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp; Continue to make the drift of punch press to descend; Use the spacing at patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer to be 3mm until drift and digital camera; The drift of punch press stops to descend; The drift of regulating punch press makes that the spacing of drift and work top is 330mm, the locking digital camera with the patrix bolt of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp and counterdie bolt with fixed mould;
(3) the debugging drift degree of depth: the drift of fine setting punch press, make that the drift of punch press and the spacing of work top are 320mm, employing thickness is that the brown paper of 0.15mm tries to dash, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of digital camera with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press and carry out stamp, just accomplish a veneer stamp action; Said platen pressure is 4.2kg/cm
2, the punch press motor rotary speed is 60 rev/mins, takes off the material mode in the use during stamp and takes off material, takes off material pressure and is controlled at 2.2kg/cm
2
Embodiment 3
A kind of digital camera comprises following processing step with the stamp processing technology of the accurate wiring board of halogen-free and lead-free environment friendly multi-layer:
(1) drags in advance before the stamp: use earlier to be equipped with in the plate of make-up machine to the accurate wiring board of 6 layers of halogen-free and lead-free multilayer of diameter as the 1.2mm milling cutter and drag for the groove operation; The position of the groove that drags for is that the inside and outside layer line road of the accurate wiring board of halogen-free and lead-free multilayer is less than the 0.38mm place from the spacing of edges of boards; The thickness of the accurate wiring board of said halogen-free and lead-free multilayer is 0.8mm; Spacing on the accurate wiring board of halogen-free and lead-free multilayer between veneer and the veneer is 1.6mm; Drag for behind the type the accurate wiring board of halogen-free and lead-free multilayer is cut along separately line of demarcation, obtain the accurate wiring board veneers of 5 halogen-free and lead-free multilayers;
(2) shut die: be placed on the particular manufacturing craft of digital camera on the punch press work top with the accurate wiring board stamp of halogen-free and lead-free multilayer; Digital camera is pushed to the middle position of punch press work top with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press; The drift of punch press descends; Use the spacing between the patrix top of particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer to be 9mm until drift and digital camera, the drift of punch press stops to descend, and guarantees that digital camera aligns with clamping screw mouth on the punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp; Continue to make the drift of punch press to descend; Use the spacing at patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer to be 2.5mm until drift and digital camera; The drift of punch press stops to descend; The drift of regulating punch press makes that the spacing of drift and work top is 325mm, the locking digital camera with the patrix bolt of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp and counterdie bolt with fixed mould;
(3) the debugging drift degree of depth: the drift of fine setting punch press, make that the drift of punch press and the spacing of work top are 315mm, employing thickness is that the brown paper of 0.15mm tries to dash, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of digital camera with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press and carry out stamp, just accomplish a veneer stamp action; Said platen pressure is 4.5kg/cm
2, the punch press motor rotary speed is 55 rev/mins, takes off the material mode in the use during stamp and takes off material, takes off material pressure and is controlled at 2.5kg/cm
2
Claims (1)
1. a digital camera is with the stamp processing technology of the accurate wiring board of halogen-free and lead-free multilayer, and it is characterized in that: this technology comprises the steps:
(1) drags in advance before the stamp: use earlier and drag for the groove operation in the plate of make-up machine to the accurate wiring board of halogen-free and lead-free multilayer; The position of the groove that drags for is that the inside and outside layer line road of the accurate wiring board of halogen-free and lead-free multilayer is less than the 0.38mm place from the spacing of edges of boards; Drag for behind the type and the accurate wiring board of halogen-free and lead-free multilayer is cut along separately line of demarcation, obtain the accurate wiring board veneer of halogen-free and lead-free multilayer;
(2) shut die: be placed on the particular manufacturing craft of digital camera on the punch press work top with the accurate wiring board stamp of halogen-free and lead-free multilayer; Digital camera is pushed to the middle position of punch press work top with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press; The drift of punch press descends; Using the spacing between the patrix top of particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer until drift and digital camera is 8 ~ 10mm, and the drift of punch press stops to descend, and guarantees that digital camera aligns with clamping screw mouth on the punch press drift with the bolt mouth on the patrix of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp; Continue to make the drift of punch press to descend; Using the spacing at patrix top of the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer until drift and digital camera is 2 ~ 3mm; The drift of punch press stops to descend; The drift of regulating punch press makes that the spacing of drift and work top is 320 ~ 330mm, the locking digital camera with the patrix bolt of the particular manufacturing craft of halogen-free and lead-free multilayer precision wiring board stamp and counterdie bolt with fixed mould;
(3) the debugging drift degree of depth: the drift of fine setting punch press, make that the drift of punch press and the spacing of work top are 310 ~ 320mm, employing thickness is that the brown paper of 0.15 ~ 0.2mm tries to dash, the degree of depth that makes the drift of punch press just in time can thrust brown paper is as the criterion;
(4) stamp: the accurate wiring board veneer of halogen-free and lead-free multilayer that step (1) is obtained is enclosed within on the counterdie shop bolt of digital camera with the particular manufacturing craft of the accurate wiring board stamp of halogen-free and lead-free multilayer; Start punch press and carry out stamp, just accomplish a veneer stamp action; Said platen pressure is 4 ~ 5kg/cm
2, the punch press motor rotary speed is 35 ~ 65 rev/mins, takes off the material mode in the use during stamp and takes off material, takes off material pressure and is controlled at 2 ~ 2.5kg/cm
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210196537.0A CN102724821B (en) | 2012-06-15 | 2012-06-15 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210196537.0A CN102724821B (en) | 2012-06-15 | 2012-06-15 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102724821A true CN102724821A (en) | 2012-10-10 |
| CN102724821B CN102724821B (en) | 2014-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210196537.0A Active CN102724821B (en) | 2012-06-15 | 2012-06-15 | Stamping process of halogen-free and lead-free multi-layer precise circuit board for digital camera |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1958249A (en) * | 2005-11-02 | 2007-05-09 | 上海华仕德电路技术有限公司 | Method for die cutting flexible circuit board |
| CN101618413A (en) * | 2009-07-27 | 2010-01-06 | 江苏银河电子股份有限公司 | Raising method for thin metal sheet |
| CN101618555A (en) * | 2008-07-02 | 2010-01-06 | 富葵精密组件(深圳)有限公司 | Punching mould |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
-
2012
- 2012-06-15 CN CN201210196537.0A patent/CN102724821B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1958249A (en) * | 2005-11-02 | 2007-05-09 | 上海华仕德电路技术有限公司 | Method for die cutting flexible circuit board |
| CN101618555A (en) * | 2008-07-02 | 2010-01-06 | 富葵精密组件(深圳)有限公司 | Punching mould |
| CN101618413A (en) * | 2009-07-27 | 2010-01-06 | 江苏银河电子股份有限公司 | Raising method for thin metal sheet |
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
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| Publication number | Publication date |
|---|---|
| CN102724821B (en) | 2014-10-01 |
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