CN102713760A - Light irradiation device, light irradiation method and liquid crystal panel manufacturing method - Google Patents
Light irradiation device, light irradiation method and liquid crystal panel manufacturing method Download PDFInfo
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- CN102713760A CN102713760A CN2010800613759A CN201080061375A CN102713760A CN 102713760 A CN102713760 A CN 102713760A CN 2010800613759 A CN2010800613759 A CN 2010800613759A CN 201080061375 A CN201080061375 A CN 201080061375A CN 102713760 A CN102713760 A CN 102713760A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/703—Gap setting, e.g. in proximity printer
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Liquid Crystal (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Disclosed is a light irradiation device by which excessive margins between a mask and a stage can be suppressed. The light irradiation device (100) irradiates light through a mask (30) onto a substrate (10), and is provided with suction tubes (40) to hold the mask (30) and a stage (20) on which the substrate (10) is mounted. The suction tubes (40) are arranged in two dimensions against the surface of the mask (30) in rows, and optical displacement sensors (25), which measure the distance between the substrate (10) and the mask (30), are arranged on the stage (20). Further, the optical displacement sensors (25) are located in positions at which said sensors measure at least two points in the central region (31) of the mask (30).
Description
Technical field
The present invention relates to the manufacturing approach of light irradiation device, light illuminating method and liquid crystal panel.The device that particularly relates to the substrate irradiates light of liquid crystal panel being used across mask as female glass.
In addition, the application advocates Japanese patent application 2010-12489 number right of priority based on application on January 22nd, 2010, and the full content of this application is enrolled in this instructions as reference.
Background technology
At the exposure process that is used for making semiconductor device, printed base plate, liquid crystal panel, use the light that comprises ultraviolet ray (exposure light) across the figuratum mask irradiation of formation that mask pattern is transferred to the exposure device on the workpiece.Exposure device has makes mask and workpiece near mask pattern being transferred to proximity printing device on the workpiece (for example, patent documentation 1 etc.).
Such exposure device also is used for the bonding process of 2 substrates of liquid crystal panel, uses large-scale mask in this operation.In the bonding process of liquid crystal panel; To be formed on the transmitance substrate as the encapsulant of ultraviolet curable resin; At the inside dispenser method material that the sealing material is surrounded; On this substrate, place another transmitance substrate then, pass through transmitance substrate ground and will comprise ultraviolet illumination and be mapped to encapsulant.When above-mentioned rayed,, ultraviolet ray has the possibility that causes characteristic variations when shining liquid crystal material, therefore use shadow mask, make beyond the sealer decomposition temperature not irradiation ultraviolet radiation.
Follow maximization, the mass production of liquid crystal panel, the glass substrate that liquid crystal panel is used (female glass) is maximizing year by year, also has 1 limit to surpass the glass substrate (for example, from 1100mm * 1300mm (the 5th generation substrate) to 2880mm * 3130mm (the 10th generation substrate) of 1m).The rayed of such substrate of being used to fit is that substrate integral body is carried out in the lump mostly, and therefore, above-mentioned shadow mask is also maximizing according to substrate.
In this exposure device, can shine the adhesive substrates that is disposed at below the shadow mask across the mask retaining member with in the shadow mask that its lower surface absorption keeps from the light of the light source of the top that is arranged at the mask retaining member.In such mask retaining member, in order to ensure the part of transmission from the light of light source, only the circumference of mask retaining member was put the platform support in masked year.Thus, the lower surface at the mask retaining member can enlarge the maintenance face that keeps shadow mask.
Yet, under the situation of the structure that supports the mask retaining member by circumference, can produce the mask retaining member because own wt and crooked such problem.When the mask retaining member was crooked, its lower surface just was difficult to be close to shadow mask, and therefore, the absorption maintenance can become difficult.In addition, be adsorbed maintenance under the shadow mask state crooked, therefore need the interval between shadow mask and the adhesive substrates (near at interval) be set to consider the bigger numerical of the bending of shadow mask following the mask retaining member.This near the state that has enlarged at interval under, to the sharp keen irradiation of the adhesive substrates difficulty that becomes, consequently, have want shading part also by illumination be mapped to maybe.The problem that such mask retaining member is crooked can manifest along with the maximization of shadow mask especially significantly.
In order to address the above problem; Following technology is disclosed in patent documentation 2: on linking part, link metal wire; Above-mentioned linking part is fixed in the part beyond the circumference of mask retaining member, through the metal wire linking part of slinging, eliminates the crooked problem of mask retaining member thus.The light irradiation device that is disclosed in patent documentation 2 is shown in Fig. 1.
In the light irradiation device shown in Fig. 1 1000, comprise: workpiece carries the platform portion 160 of putting, and it comprises and carries the workpiece put adhesive substrates 110 and carry and put platform main body 162; Shadow mask 120, it approaches adhesive substrates 110 configurations; And mask retaining member 130, it keeps shadow mask 120.Workpiece carries to be put platform portion 160 and has workpiece travel mechanism 164, and, workpiece carry put platform portion 160 around be provided with mask and carry and put platform 166.Mask carries the circumference 132 of the upper support mask retaining member 130 of putting platform 166.
Be formed with into the adsorption tank 134 of frame shape at the lower surface of mask retaining member 130, and, be adsorbed maintenance to cover the decompression through this adsorption tank 134 of tabular shadow mask 120 that adsorption tank 134 whole modes dispose.In addition, be adhesively fixed with linking part 136 at the upper surface of mask retaining member 130, linking part 136 is sling by metal wire 140 through annulus 142.In addition, above mask retaining member 130, be provided with lamp 150, it sends the ultraviolet ray of the encapsulant that shines adhesive substrates 110.
According to this light irradiation device 1000, in the mask retaining member 130 that keeps shadow mask 120, its circumference was put platform 166 in 132 masked years and is supported, and linking part 136 is endowed the tractive force to the top through metal wire 140.Thus, the part beyond the circumference 132 can be not crooked downwards owing to own wt, 130 planarizations of mask retaining member.Therefore, in light irradiation device 1000, can eliminate the problem of mask retaining member 130 bendings.
The prior art document
Patent documentation
Patent documentation 1: the spy opens the 2006-66585 communique
Patent documentation 2: the spy opens the 2009-58630 communique
Summary of the invention
The problem that invention will solve
The application inventor has studied the action of light irradiation device as shown in Figure 2 2000, has found following problem.
Fig. 2 is the schematic cross-section of a part that the light irradiation device 2000 of the application inventor research is shown.Light irradiation device 2000 shown in Fig. 2 comprises to carry puts the mask (shadow mask) 230 that carrying of substrate 210 put platform 220 and approached substrate 210 configurations.Mask 230 is kept by a plurality of adsorption tubes 240.In addition, in the light irradiation device shown in Fig. 2 2000, the mask retaining member 130 of the structure shown in Fig. 1 is not set.
Substrate 210 is substrates that female glass that liquid crystal panel is used is sticked together, and mask 230 is the shadow mask when making the encapsulant curing between adhesive substrates 210 through ultraviolet ray.
At this, the interval between mask 230 and the substrate 210 (near at interval) is preferably as far as possible little.Yet in the formation shown in Fig. 2, mask 230 is adsorbed maintenance through the decompression of a plurality of adsorption tubes 240, therefore adsorbs the mask 230 meeting generation bendings of maintenance through adsorption tube 240.
In addition; Except the height tolerance (235) that the bending of mask 230 causes, each adsorption tube 240 of absorption mask 230 also has height tolerance (that is the deviation of the bottom surface height of each adsorption tube 240); And, also exist to carry the equal thickness deviation of degree and substrate 210 together of face of putting platform 220.
Therefore; Minimum interval G1 between mask 230 and the substrate 210 can't be only decides through the bottom surface height of the adsorption tube 240 of the thickness that comprises mask 230 and the distance of putting between the platform 220 of carrying that comprises the thickness of substrate 210, and can decide with the form that comprises various deviations.And these deviations can be according to substrate 210 and/or masks 230 and are changed.
So, make under the approaching situation of mask 230 and substrate 210, must estimate that too much surplus decides the height of year putting platform 220.When having too much surplus, the interval between mask 230 and the substrate 210 (near at interval) becomes big, and therefore the precision of exposure can descend.
The present invention puts in view of the above problems and accomplishes, and its main order is, provides and can suppress mask and carry to put the light irradiation device that has too much surplus between the platform.
The scheme that is used to deal with problems
Light irradiation device of the present invention is across the light irradiation device of mask to the substrate irradiates light, possesses: adsorption tube, and it keeps aforementioned mask; And carry and to put platform; Put aforesaid substrate its year; Above-mentioned adsorption tube is arranged with respect to the planar ground of aforementioned mask; Put the optical profile type extensometer that disposes the distance between mensuration aforesaid substrate and the mask on the platform at above-mentioned year, above-mentioned optical profile type extensometer is disposed at least 2 position in the middle section of measuring aforementioned mask.
In certain preferred implementation, aforesaid substrate comprises the light-transmitting substrate of device used for image display, is the size more than 1 meter Yi Bian aforementioned mask has.
In certain preferred implementation, above-mentioned adsorption tube in the vertical direction extends, and the front end of above-mentioned adsorption tube carries out vacuum draw to aforementioned mask, and thus, aforementioned mask is kept by above-mentioned adsorption tube, and the front-end configuration of above-mentioned adsorption tube is rectangular.
In certain preferred implementation, further be provided with the mask periphery maintaining part of the circumference that keeps aforementioned mask.
In certain preferred implementation, above-mentioned optical profile type extensometer is disposed at 5 position in the middle section of measuring aforementioned mask.
In certain preferred implementation, above-mentioned optical profile type extensometer is disposed at 9 position in the middle section of measuring aforementioned mask.
In certain preferred implementation; Putting platform in above-mentioned year is connected in to move up at upper and lower and put the jacking gear of platform in above-mentioned year; Above-mentioned optical profile type extensometer is connected in the control device of the above-mentioned jacking gear of control; Above-mentioned control device is calculated the interval between aforesaid substrate and the aforementioned mask based on the minor increment in the distance of measuring through above-mentioned optical profile type extensometer, with the mode that becomes above-mentioned interval above-mentioned jacking gear is moved.
In certain preferred implementation, further above aforementioned mask, be provided with the light source of irradiation ultraviolet radiation.
Light illuminating method of the present invention is across the light illuminating method of mask to the substrate irradiates light, comprises: operation (a), with the top of mask configuration in aforesaid substrate; Operation (b), mobile aforesaid substrate make aforesaid substrate and aforementioned mask approaching; And operation (c); To the aforesaid substrate irradiates light, in above-mentioned operation (a), aforementioned mask is kept by the adsorption tube of arranging with respect to the planar ground of aforementioned mask across aforementioned mask; Aforesaid substrate carries to place to carry to be put on the platform; Put the optical profile type extensometer that disposes the distance between mensuration aforesaid substrate and the mask on the platform at above-mentioned year, above-mentioned optical profile type extensometer is disposed at least 2 position in the middle section of measuring aforementioned mask, in above-mentioned operation (b); Carry out: the minor increment based in the distance of measuring through above-mentioned optical profile type extensometer makes aforesaid substrate and aforementioned mask approaching.
In certain preferred implementation, above-mentioned optical profile type extensometer is disposed at 5 position in the middle section of measuring aforementioned mask, in above-mentioned operation (b), carries out: the minor increment based in above-mentioned 5 the mensuration distance makes aforesaid substrate and aforementioned mask approaching.
In certain preferred implementation, above-mentioned optical profile type extensometer is disposed at 9 position in the middle section of measuring aforementioned mask, in above-mentioned operation (b), carries out: the minor increment based in above-mentioned 9 the mensuration distance makes aforesaid substrate and aforementioned mask approaching.
In certain preferred implementation, aforesaid substrate comprises the light-transmitting substrate of device used for image display, is the size more than 1 meter Yi Bian aforementioned mask has.
In certain preferred implementation, in above-mentioned operation (c), the light-cured resin that is formed at aforesaid substrate is solidified.
In certain preferred implementation, in above-mentioned operation (c), the photoreceptor layers that is formed at aforesaid substrate is made public, form pattern thus.
The manufacturing approach of liquid crystal panel of the present invention is between a pair of substrate, to dispose the manufacturing approach of the liquid crystal panel of liquid crystal layer, comprises: operation (a), with the top of mask configuration in the substrate that constitutes liquid crystal panel; Operation (b), mobile aforesaid substrate make aforesaid substrate and aforementioned mask approaching; And operation (c); To the aforesaid substrate irradiates light, in above-mentioned operation (a), aforementioned mask is kept by the adsorption tube of arranging with respect to the planar ground of aforementioned mask across aforementioned mask; Aforesaid substrate carries to place to carry to be put on the platform; Put the optical profile type extensometer that disposes the distance between mensuration aforesaid substrate and the mask on the platform at above-mentioned year, above-mentioned optical profile type extensometer is disposed at least 2 position in the middle section of measuring aforementioned mask, in above-mentioned operation (b); Carry out: the minor increment based in the distance of measuring through above-mentioned optical profile type extensometer makes aforesaid substrate and aforementioned mask approaching.
In certain preferred implementation, aforesaid substrate is that liquid crystal panel is used female glass, is the size more than 1 meter Yi Bian aforementioned mask has.
In certain preferred implementation, in above-mentioned operation (c), the encapsulant that is disposed between the above-mentioned a pair of substrate is solidified.
In certain preferred implementation, in above-mentioned operation (c), the photoreceptor layers that is formed at aforesaid substrate is made public, form pattern thus.
In certain preferred implementation, above-mentioned optical profile type extensometer is disposed at 9 position in the middle section of measuring aforementioned mask, in above-mentioned operation (b), carries out: the minor increment based in above-mentioned 9 the mensuration distance makes aforesaid substrate and aforementioned mask approaching.
The invention effect
According to light irradiation device of the present invention, the adsorption tube that mask is arranged two-dimentionally keeps, and the optical profile type extensometer of measuring the distance between substrate and the mask is disposed at least 2 position in the middle section of measuring mask.Therefore, guarantee that the mask of holding has produced crooked or the height tolerance of adsorption tube occurred, also can suppress mask and carry to put to have too much surplus between the platform, consequently, can set more proper spacing (near at interval) even be adsorbed.
Description of drawings
Fig. 1 is the sectional view that the formation of existing light irradiation device 1000 is shown.
Fig. 2 is the sectional view that the formation of light irradiation device 2000 is shown.
Fig. 3 is the sectional view of formation that the light irradiation device 100 of embodiment of the present invention is shown.
Fig. 4 is the vertical view that is used to explain the middle section 31 of mask 30.
Fig. 5 is the sectional view that is used to explain the operation that will solidify at the encapsulant between a pair of substrate 10a, the 10b 12.
Fig. 6 (a) to (c) is the operation sectional view that is used to explain the light illuminating method of embodiment of the present invention.
Fig. 7 (a) to (c) is the operation sectional view that is used to explain the light illuminating method of embodiment of the present invention.
Fig. 8 is the front view of formation that the light irradiation device 100 of embodiment of the present invention is shown.
Fig. 9 is the side view of formation that the light irradiation device 100 of embodiment of the present invention is shown.
Figure 10 is the vertical view of formation that the light irradiation device 100 of embodiment of the present invention is shown.
Figure 11 is the vertical view that the formation of substrate (female glass) 10 is shown.
Figure 12 is the vertical view that is used to explain the allocation position of optical profile type extensometer 25.
Figure 13 is the vertical view that is used to explain the allocation position of optical profile type extensometer 25.
Figure 14 is the vertical view that is used to explain the allocation position of optical profile type extensometer 25.
Figure 15 is the vertical view that is used to explain the allocation position of optical profile type extensometer 25.
Figure 16 is the vertical view that is used to explain the allocation position of optical profile type extensometer 25.
Embodiment
Embodiment of the present invention is described with reference to the accompanying drawings.In following accompanying drawing, for the simplicity of explaining, the inscape that has identical functions is in fact illustrated by identical Reference numeral.In addition, the invention is not restricted to following embodiment.
Fig. 3 schematically illustrates the formation of the light irradiation device 100 of embodiment of the present invention.The light irradiation device 100 of this embodiment is the device across 30 pairs of substrate irradiates lights of mask, for example is the UV irradiation unit.Light irradiation device 100 comprises: the adsorption tube that keeps mask 30 is put carrying of substrate 10 and is put platform 20 with carrying.
Dispose the optical profile type extensometer 25 of measuring the distance between substrate 10 and the mask 30 on the platform 20 carrying to put.Optical profile type extensometer 25 is to use up the optical sensor that (for example, laser) measured distance, can when original position moves to other place, measure, calculate its amount of movement at object.The optical profile type extensometer 25 of this embodiment is the laser extensometer.Laser extensometer 25 is contactless, can carry out the mensuration of large-scale material.In this embodiment, use range of triangle formula extensometer (for example, CCD laser extensometer) as laser extensometer 25, but also can use the laser focusing type extensometer.In addition, so long as can be suitable for the device of this embodiment, also can use the optical profile type extensometer beyond the laser extensometer 25.
In the formation of this embodiment, laser extensometer 25 is disposed at least 2 position in the middle section 31 of measuring mask 30., be why, and this bending cause mask 30 to be present in middle section 31 near the position 30a of substrate 10 because because the mask 30 that influences of gravity can be crooked at the position configuration laser extensometer 25 corresponding with the middle section of mask 30 31.
Fig. 4 is the figure that is used to explain the middle section 31 of mask 30.The middle section 31 of the mask 30 of so-called this embodiment, the meaning be meant from above when seeing mask 30 mask 30 central point C around the zone 31 of (35).Specifically, as shown in Figure 4, the middle section 31 of mask 30 is the zones in the border 35, and above-mentioned border 35 is the borders that become half from the central point C of mask 30 to the distance of one side 37a (perhaps 37b) of mask 30.At this, from central point C to the border 35 distance L 1 with from the border 35 to the limit distance L 2 of 37a is identical, in addition, from central point C to the border 35 distance L 3 with from the border 35 to the limit distance L 4 of 37b is identical.
With reference to Fig. 3, light source 50 is arranged at the top of mask 30 once more.The light source 50 of this embodiment is the light source (UV light source) that irradiation comprises ultraviolet light.Substrate 10 comprises the light-transmitting substrate of device used for image display.The substrate 10 of this embodiment is the glass substrate used of liquid crystal panel (for example, the 8th generation～female glass in the 10th generation).Substrate 10 is 2 substrates that female glass sticks together that liquid crystal panel is used in this example.In addition, Yi Bian the mask 30 of this embodiment has is the size more than 1 meter.Specifically, the mask 30 of this embodiment has the size corresponding with substrate (female glass) 10.
In the light irradiation device 100 of this embodiment, keep mask 30 through the adsorption tube of arranging 40 two-dimentionally, therefore compare with the device of the end that only keeps mask 30, can reduce the central portion of mask 30 and the range difference between the end.In addition, even the bending between the adsorption tube 40 (39) causes producing the deviation of the height of mask 30, also can be corresponding well to this.That is, in the formation of this embodiment, the laser extensometer 25 of measuring the distance between substrate 10 and the mask 30 is arranged to carry and puts on the platform 20, and laser extensometer 25 is disposed at least 2 position in the middle section 31 of measuring mask 30.Therefore, can measure distance (interval that essence the is minimum) G between mask 30 and the substrate 10 with non-contacting mode.Therefore, even be adsorbed the height tolerance that the mask 30 of pipe 40 maintenances has produced bending or adsorption tube 40 occurred, also can suppress mask 30 and carry to put to have too much surplus between the platform 20.Consequently, can set more proper spacing (near at interval).
Fig. 5 illustrates the operation that mask 30 is made public near substrate 10.In the example shown in Fig. 5, substrate 10 comprises infrabasal plate 10a and upper substrate 10b.Between infrabasal plate 10a and upper substrate 10b, be provided with the encapsulant 12 that engages both.Encapsulant 12 for example comprises ultraviolet curable resin, can solidify through the light (for example, ultraviolet ray) 55 from light source.
In addition, approach substrate 10 and dispose mask 30.This routine mask 30 is shadow mask, is formed with light-shielding pattern 32 at the lower surface of mask 30.It is fixing that mask 30 is adsorbed front end 42 absorption of pipe 40.
The light 55 that sends from the light source 50 of light irradiation device 100 arrives encapsulants 12 across the mask with light-shielding pattern 32 30.Light 55 has the light 55a that on vertical direction roughly, advances, and has the light 55b that tilts to advance, the light 55b shading effectively that need advance to inclination especially.That is, G is narrow more at interval, just can the light 55b that inclination is advanced be specified in the existence zone of encapsulant 12 more.
, also can be shone beyond the existence zone of encapsulant 12, so preferred interval G is as far as possible little when wide than predetermined as G at interval at this by light 55b.In the light irradiation device 100 of this embodiment, can suppress to have too much surplus between mask 30 and the platform 20, can set more proper spacing (near at interval) G, therefore can carry out excellent exposure operation (encapsulant curing process).
Below, the light illuminating method of the light irradiation device 100 that has used this embodiment is described to Fig. 7 (c) with reference to Fig. 6 (a).Fig. 6 (a) is respectively the operation sectional view that is used to explain the light illuminating method of this embodiment to Fig. 7 (c).
The light illuminating method of this embodiment is the method across 30 pairs of substrate 10 irradiates lights of mask.At first, configuration mask 30 above substrate 10, it is approaching that moving substrate 10 makes substrate 10 and mask 30 then.Thereafter, across 30 pairs of substrate 10 irradiates lights of mask.At this, make substrate 10 and mask 30 near the time, measure at least 2 points in the middle section 31 of masks 30 through laser extensometer 25.Minor increment based in the distance of measuring through this laser extensometer 25 makes substrate 10 and mask 30 approaching.Therefore under this state,, can carry out exposure process with proper spacing (near at interval) more across 30 pairs of substrate 10 irradiates lights of mask.Each figure of following reference illustrates in greater detail.
At first, shown in Fig. 6 (a), put placement substrate 10 on the platform 20 carrying.Substrate 10 moves as arrow 91 from substrate transfer apparatus (for example, mechanical arm etc.), is carried to place to carry to put on the maintenance pin 22 of platform 20.
Then, shown in Fig. 6 (b), drop-down maintenance pin 22 is disposed at substrate 10 and carries the surface put platform 20, makes then to carry to put platform 20 and as arrow 92, rise, and makes substrate 10 and mask 30 approaching.Carry and to put platform 20 and 92 can utilize to carry and put platform jacking gear (not shown) and carry out to moving of top.At this, laser extensometer 25 is connected in the control device (not shown) that the platform jacking gear is put in control this year.And this control device can be calculated the interval between substrate 10 and the mask 30 based on the minor increment in the distance of measuring through laser extensometer 25, with the mode that becomes this interval above-mentioned jacking gear is moved.
In addition, put the distance between platform 20 and the mask 30, therefore also can fix to carry and put platform 20 and let mask 30 near year putting platform 20 as long as dwindle to carry.But it is fixing that mask 30 is adsorbed pipe 40 absorption, therefore with make mask 30 mobile phases ratio, make carry put platform 20 move more convenient.
Then, shown in Fig. 6 (c), let substrate 10 and mask 30 with to a certain degree near, at this moment, the aligning of both (10,30) is carried out in alignment marks (not shown) coincidence that the alignment mark (not shown) that substrate 10 is subsidiary and mask 30 are subsidiary.Let substrate 10 and mask 30 near the time, measure the distance between substrate 10 and the mask 30 through laser extensometer 25 as stated, so that both do not contact.
Then, shown in Fig. 7 (a), based on the mensuration of laser extensometer 25, the interval G of regulation substrate 10 and mask 30, G carries out rayed with this interval.At this, the distance between substrate 10 and the mask 30 can be stipulated based on the mensuration of laser extensometer 25, therefore can suppress to have too much surplus between substrate 10 and the mask 30.That is, more proper spacing (near at interval) G can be set, therefore excellent exposure operation (for example, encapsulant curing process) can be carried out.
Then, shown in Fig. 7 (b), after irradiation process finishes, will carry and put platform 20 and move to below (arrow 93).Carry and to put platform 20 moving downwards and 93 can utilize to carry and put table transferring mechanism (not shown) and carry out.
, as Fig. 7 (c) shown in, make carry put platform 20 move down and from mask 30 break away from after, pull out carry the maintenance pin 22 of putting platform 20, then, to make substrate 10 mobile as arrow 94 thereafter.Moving of substrate 10 can be used substrate transfer apparatus (for example, mechanical arm etc.), also can convey to keep pin 22 suitable members to have roller function or substrate lifting function, through this member substrate 10 moved.
An example of the light irradiation device 100 of this embodiment is described to Figure 10 with reference to Fig. 8 below.Fig. 8 and Fig. 9 are respectively the front view and the side views of the light irradiation device 100 of this embodiment.In addition, Figure 10 is the vertical view of the light irradiation device 100 of this embodiment.
This routine light irradiation device 100 comprises to carry puts platform 20 and the adsorption tube 40 that keeps being disposed at the mask 30 that carries the top of putting platform 20.Adsorption section 42 absorption that mask 30 is positioned at the front end of adsorption tube 40 keep.In addition, in this formation example, be provided with the mask periphery maintaining part 45 of the circumference that keeps mask 30.The circumference of mask periphery maintaining part 45 absorption masks 30, the circumference that suppresses mask 30 thus is crooked downwards.
As stated, dispose laser extensometer (not shown) on the platform 20 carrying to put.It is corresponding with the size of substrate that in light irradiation device 100, uses 10 or mask 30 with W2 to carry the width W 1 of putting platform 20.In addition, in this example, light source 50 is arranged at the top of the upper end of adsorption tube 40, but so long as can carry out rayed well and get final product, can be disposed at suitably preferred place.In addition, in this formation example, be provided with beam 46 and 47, the allocation position of beam is as long as the light irradiation device that uses according to reality is suitable.In addition, also can suitably adopt the reinforcement members of the device beyond the beam.
Shown in figure 10, adsorption tube 40 becomes two-dimensional arrangement with respect to the plane of mask 30.In this example, have a pair of adsorption tube 40 is configured to rectangular formation, but be not limited thereto, also can adopt other formation.For example, can an adsorption tube 40 be configured to rectangularly, also can each adsorption tube 40 be configured to triangle.In addition, also can carry out becoming the particular arrangement (for example, the configuration of concentric circles, random arrangement) of suitable manner decision with the flatness of mask 30.
Figure 11 representes an example as female glass of substrate 10.This routine substrate 10 is female glass in the 10th generation.In addition, each panel zone 15 in the substrate 10 is zones suitable with 40 inches liquid crystal panel, and the center C of substrate 10 also is shown.
Figure 12 schematically representes the substrate 10 pairing masks 30 shown in Figure 11.The middle section 31 of mask 30 is scopes that border 35 is surrounded.And laser extensometer 25 is disposed at least 2 position measuring middle section 31 carrying to put in the platform 20.For example, shown in figure 12, laser extensometer 25 is disposed at some 25A and the pairing position of 25B in the middle section 31.At this, some 25A and 25B are center and locating symmetrically with center C and dummy line 70A.
The situation of the example shown in Figure 12 effect when becoming big around some 25A and the 25B of the bending of rule of thumb distinguishing mask 30 in middle section 31 is big especially.In addition, be the center with dummy line 70A, under the situation that half part (upper portion) of the some 25A side in mask 30 weighs, come predetermined distance G based on the distance of a 25A mostly.On the other hand, be the center with dummy line 70A, under the situation that half part (lower portion) of the some 25B side in mask 30 weighs, come predetermined distance G based on the distance of a 25B mostly.
Figure 13 illustrates other configuration example of laser extensometer 25.In this example, laser extensometer 25 with respect to center C and point symmetry be disposed at some 25A and the pairing position of 25B in the middle section 31.The situation of the example shown in Figure 13 is big especially in the bending of rule of thumb distinguishing mask 30 effect when becoming big around a 25A and the 25B.In addition, be the center with dummy line 70B, under the situation that half part (upper left) of the some 25A side in mask 30 weighs, come predetermined distance G based on the distance of a 25A mostly.On the other hand, under the situation that half part (lower right-most portion) of the some 25B side in mask 30 weighs, come predetermined distance G based on the distance of a 25B mostly.
And, according to the configuration pattern of adsorption tube 40, the place of the center C in the mask 30 sometimes also can be easily and substrate 10 approaching.In this case, shown in figure 14, can be at a 25A and 25B together with the pairing position configuration laser of 25C extensometer 25.In addition; In this example, be the center with dummy line 70C, under the situation that half part (left part) of the some 25A side in mask 30 weighs; Come predetermined distance G based on the distance of a 25A mostly; On the other hand, under the situation that half part (right portions) of the some 25B side in mask 30 weighs, come predetermined distance G based on the distance of a 25B mostly.In addition, with dummy line 70A or 70B be the center situation explanation basically as stated.
In addition, the some 25A～25C shown in Figure 14 is the form of some 25C of having appended to some 25A, 25B shown in Figure 13, but also can be to the some 25A shown in Figure 12, form that 25B has appended 25C.And some 25A and 25B are not limited to the position of symmetric figure, also can be configured in asymmetrical position.
Figure 15 is illustrated in the configuration example of laser extensometer 25 that middle section 31 is provided with the mode of 5 points (25A is to 25E).Be provided with at middle section 31 under the situation of 5 points (25A is to 25E), the height tolerance of bending and adsorption tube 40 that can corresponding comprise mask 30 is in interior most of situation.Consequently, can suppress to have too much surplus between substrate 10 and the mask 30.In addition, for 5 points (25A is to 25E), also can adopt the outer suitably preferred configuration that is configured to shown in Figure 15.For example, can change into: with a 25C is the center, and some 25A, 25B, 25D, 25E arrive the position with the summit of the same rectangular shape in border 35.
And, shown in figure 16, when 9 points (25A is to 25I) being set at middle section 31, in fact can corresponding all situation.Therefore; As long as use appropriate mask 30; Suitably keep this mask 30 through adsorption tube 40; Even then change mask 30 or change substrate 10 even wait the place of the minimum interval of measuring mask 30 and substrate 10 without vernier caliper, also can be provided with proper spacing G based on the mensuration of laser extensometer 25.
In addition, for 9 points (25A is to 25I), also can adopt the outer suitably preferred configuration that is configured to shown in Figure 16.For example, also can 9 points (25A is to 25I) unequal interval ground be arranged, or change into: with a 25C is the center, and other point arrives the position of circular or substantially elliptical.
In above-mentioned embodiment, as shown in Figure 5, mainly show the example that makes encapsulant 12 curing that are disposed between a pair of substrate 10a, the 10b, but be not limited thereto.The technology of embodiment of the present invention gets final product the ability widespread use so long as carry out rayed across 30 pairs of substrates of mask 10.The technology of this embodiment for example can be used in: form pattern through the photoreceptor layers that is formed at substrate 10 is made public.In addition; In above-mentioned embodiment, as substrate 10, female glass of using with liquid crystal panel (for example; The 8th the generation～female glass in the 10th generation) be illustrated for example; But also can use than its bigger light-transmitting substrate (for example, glass substrate) or than its littler light-transmitting substrate (for example, glass substrate)
In addition, the technology of embodiment of the present invention is not limited to the manufacturing approach of liquid crystal panel, can be applied to comprise the method for carrying out light-struck operation.Therefore, the substrate 10 of this embodiment is not limited to the substrate that liquid crystal panel is used, and also can use the substrate of other device used for image display, the substrate that also can use flat-panel monitors such as PDP (plasma display) or organic EL to use.In addition, the technology of embodiment of the present invention also can be used at the exposure process that is used for making semiconductor device.
Through preferred implementation the present invention has been described above, but above-mentioned record is not to limit item, sure have various changes.
Utilizability in the industry
According to the present invention, can provide and suppress mask and carry to put the light irradiation device that has too much surplus between the platform.
Description of reference numerals
10 substrates
The 10a infrabasal plate
The 10b upper substrate
12 encapsulants
15 panel zones
Put platform in 20 years
22 keep pin
25 optical profile type extensometers (laser extensometer)
30 masks
31 middle sections
32 light-shielding patterns
35 borders
40 adsorption tubes
42 adsorption sections
45 mask periphery maintaining parts
46,47 beams
50 light sources
55 light
90 vertical directions
100 light irradiation devices
1000 light irradiation devices
Claims (19)
1. light irradiation device,
Across mask to the substrate irradiates light,
Possess:
Adsorption tube, it keeps aforementioned mask; And
Carry and put platform, put aforesaid substrate its year,
Above-mentioned adsorption tube is arranged with respect to the planar ground of aforementioned mask,
Put the optical profile type extensometer that disposes the distance between mensuration aforesaid substrate and the mask on the platform at above-mentioned year,
Above-mentioned optical profile type extensometer is disposed at least 2 position in the middle section of measuring aforementioned mask.
2. light irradiation device according to claim 1,
Aforesaid substrate comprises the light-transmitting substrate of device used for image display,
It is the size more than 1 meter that aforementioned mask has on one side.
3. light irradiation device according to claim 1 and 2,
Above-mentioned adsorption tube in the vertical direction extends,
The front end of above-mentioned adsorption tube carries out vacuum draw to aforementioned mask, and thus, aforementioned mask is kept by above-mentioned adsorption tube,
The front-end configuration of above-mentioned adsorption tube is rectangular.
4. light irradiation device according to claim 3,
Further be provided with the mask periphery maintaining part of the circumference that keeps aforementioned mask.
5. light irradiation device according to claim 4,
Above-mentioned optical profile type extensometer is disposed at 5 position in the middle section of measuring aforementioned mask.
6. light irradiation device according to claim 4,
Above-mentioned optical profile type extensometer is disposed at 9 position in the middle section of measuring aforementioned mask.
7. according to each the described light irradiation device in the claim 1 to 6, it is characterized in that,
Put platform in above-mentioned year and be connected in to move up and put the jacking gear of platform in above-mentioned year at upper and lower,
Above-mentioned optical profile type extensometer is connected in the control device of the above-mentioned jacking gear of control,
Above-mentioned control device is calculated the interval between aforesaid substrate and the aforementioned mask based on the minor increment in the distance of measuring through above-mentioned optical profile type extensometer, with the mode that becomes above-mentioned interval above-mentioned jacking gear is moved.
8. according to each the described light irradiation device in the claim 1 to 7,
Further above aforementioned mask, be provided with the light source of irradiation ultraviolet radiation.
9. light illuminating method,
Across mask to the substrate irradiates light,
Comprise:
Operation (a) is with the top of mask configuration in aforesaid substrate;
Operation (b), mobile aforesaid substrate make aforesaid substrate and aforementioned mask approaching; And
Operation (c), across aforementioned mask to the aforesaid substrate irradiates light,
In above-mentioned operation (a),
Aforementioned mask is kept by the adsorption tube of arranging with respect to the planar ground of aforementioned mask,
Aforesaid substrate carries to place to carry to be put on the platform,
Put the optical profile type extensometer that disposes the distance between mensuration aforesaid substrate and the mask on the platform at above-mentioned year,
Above-mentioned optical profile type extensometer is disposed at least 2 position in the middle section of measuring aforementioned mask,
In above-mentioned operation (b),
Carry out: the minor increment based in the distance of measuring through above-mentioned optical profile type extensometer makes aforesaid substrate and aforementioned mask approaching.
10. light illuminating method according to claim 9,
Above-mentioned optical profile type extensometer is disposed at 5 position in the middle section of measuring aforementioned mask,
In above-mentioned operation (b),
Carry out: the minor increment based in above-mentioned 5 the mensuration distance makes aforesaid substrate and aforementioned mask approaching.
11. light illuminating method according to claim 9,
Above-mentioned optical profile type extensometer is disposed at 9 position in the middle section of measuring aforementioned mask,
In above-mentioned operation (b),
Carry out: the minor increment based in above-mentioned 9 the mensuration distance makes aforesaid substrate and aforementioned mask approaching.
12. light illuminating method according to claim 9,
Aforesaid substrate comprises the light-transmitting substrate of device used for image display,
It is the size more than 1 meter that aforementioned mask has on one side.
13. each the described light illuminating method according in the claim 9 to 12 is characterized in that,
In above-mentioned operation (c), the light-cured resin that is formed at aforesaid substrate is solidified.
14. each the described light illuminating method according in the claim 9 to 12 is characterized in that,
In above-mentioned operation (c), the photoreceptor layers that is formed at aforesaid substrate is made public, form pattern thus.
15. the manufacturing approach of a liquid crystal panel,
Be the manufacturing approach that between a pair of substrate, disposes the liquid crystal panel of liquid crystal layer,
Comprise:
Operation (a) is with the top of mask configuration in the substrate that constitutes liquid crystal panel;
Operation (b), mobile aforesaid substrate make aforesaid substrate and aforementioned mask approaching; And
Operation (c), across aforementioned mask to the aforesaid substrate irradiates light,
In above-mentioned operation (a),
Aforementioned mask is kept by the adsorption tube of arranging with respect to the planar ground of aforementioned mask,
Aforesaid substrate carries to place to carry to be put on the platform,
Put the optical profile type extensometer that disposes the distance between mensuration aforesaid substrate and the mask on the platform at above-mentioned year,
Above-mentioned optical profile type extensometer is disposed at least 2 position in the middle section of measuring aforementioned mask,
In above-mentioned operation (b),
Carry out: the minor increment based in the distance of measuring through above-mentioned optical profile type extensometer makes aforesaid substrate and aforementioned mask approaching.
16. the manufacturing approach of liquid crystal panel according to claim 15,
Aforesaid substrate is that liquid crystal panel is used female glass,
It is the size more than 1 meter that aforementioned mask has on one side.
17. the manufacturing approach according to claim 15 or 16 described liquid crystal panels is characterized in that,
In above-mentioned operation (c), the encapsulant that is disposed between the above-mentioned a pair of substrate is solidified.
18. the manufacturing approach according to claim 15 or 16 described liquid crystal panels is characterized in that,
In above-mentioned operation (c), the photoreceptor layers that is formed at aforesaid substrate is made public, form pattern thus.
19. according to the manufacturing approach of each the described liquid crystal panel in the claim 15 to 18,
Above-mentioned optical profile type extensometer is disposed at 9 position in the middle section of measuring aforementioned mask,
In above-mentioned operation (b),
Carry out: the minor increment based in above-mentioned 9 the mensuration distance makes aforesaid substrate and aforementioned mask approaching.
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| JP2010-012489 | 2010-01-22 | ||
| JP2010012489 | 2010-01-22 | ||
| PCT/JP2010/073548 WO2011089828A1 (en) | 2010-01-22 | 2010-12-27 | Light irradiation device, light irradiation method and liquid crystal panel manufacturing method |
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| CN102713760A true CN102713760A (en) | 2012-10-03 |
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| JP (1) | JPWO2011089828A1 (en) |
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| JP6314604B2 (en) * | 2014-03-31 | 2018-04-25 | 岩崎電気株式会社 | Irradiation device |
| JP7030581B2 (en) * | 2018-03-19 | 2022-03-07 | 新電元工業株式会社 | Manufacturing method of semiconductor device and light-shielding adsorption jig |
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| JPWO2011089828A1 (en) | 2013-05-23 |
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