CN102699826A - Soft grinding material sand wheel with bonding agent solidified at normal temperature - Google Patents
Soft grinding material sand wheel with bonding agent solidified at normal temperature Download PDFInfo
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- CN102699826A CN102699826A CN2012101998035A CN201210199803A CN102699826A CN 102699826 A CN102699826 A CN 102699826A CN 2012101998035 A CN2012101998035 A CN 2012101998035A CN 201210199803 A CN201210199803 A CN 201210199803A CN 102699826 A CN102699826 A CN 102699826A
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Abstract
The invention discloses a soft grinding material sand wheel with a bonding agent solidified at normal temperature, belongs to the technical field of silicon slice grinding processing, and relates to a soft grinding material sand wheel for grinding a silicon slice based on a chemical mechanical grinding theory. The bonding agent in a grinding block of the soft grinding material sand wheel is a bonding agent solidified at the normal temperature; furthermore, the grinding block of the soft grinding material sand wheel comprises a grinding material of which the hardness is smaller than that of a processed workpiece, an oxidization agent and an additive which are used for promoting the reaction of the grinding material and the workpiece, and an air hole for preventing plugging and burning; the bonding agent solidified at the normal temperature is a koenenite material; the oxidization agent is one or more of potassium permanganate, sodium hypochlorite, sodium hydroxide and sodium peroxide particles; and the hardness of the grinding material is smaller than that of monocrystalline silicon and that of polycrystalline silicon. When the soft grinding material sand wheel is used for grinding the silicon slice, the grinding performance is stable, and the material removal rate is high; the ground surface of the silicon slice is smooth, and shortcomings of micro scratches, malposition, micro cracks and the like are overcome; and the grinding temperature is mild, so that the surface of the silicon slice cannot be burned by grinding.
Description
Technical field
The invention belongs to silicon chip Grinding Technology field, relate to a kind of soft abrasive grinding wheel based on chemical machinery grinding principle grinding silicon chip.
Background technology
Superfine grinding is one of the important processing method that is used for mill side's processing etc. of silicon chip leveling processing, thinning back side, solar energy polycrystal silicon ingot in the ic manufacturing process.Extensively adopt resinoid bond or vitrified bond fine-granularity diamond micro mist wheel grinding silicon chip at present, remove material with adamantine high-speed cutting effect in the grinding process.Because diamond abrasive grain hardness ratio silicon chip is high, can form the grinding damage layer at silicon chip surface in the process.In order to remove the grinding damage layer, to improve the grinding skin integrality, proposed to adopt the chemical machinery method for grinding of soft abrasive grinding wheel.This method is taken into account the advantage of superfine grinding and chemical Mechanical Polishing Technique, can the undamaged silicon chip finished surface of high efficiency acquisition.Soft abrasive grinding wheel is the key that realizes the grinding of silicon chip chemical machinery.The softer reaction film of the grinding face of the silicon sheet material of grinding area and emery wheel generation chemical reaction generation is the requirement to soft abrasive grinding wheel in the grinding process, and this reaction film is removed under the friction/stroke wiping effect of abrading block matrix or buffing material.If chemical reaction can not take place or reaction speed is slow excessively, the speed that produces softer reaction film is low, and the ability of emery wheel removal material will be very low, can cause the grinding force of grinding process and grinding heat to increase, the burn silicon chip surface.In order to guarantee that grinding area produces chemical action; Feasible method be in Grinder, be added under the effect of grinding pressure and temperature can be in the Grinding Contact zone directly with the high reactant/oxidant of selecting the generation chemical reaction of silicon chip surface microcosmic, maybe can promote the additive that abrasive material and silicon chip react." soft abrasive grinding wheel of ultra-precise low-damage grinding silicon chip " number of patent application of applications such as Kang Renke is that CN201010128957 discloses a kind of soft abrasive grinding wheel that is used for the silicon chip grinding.As the buffing material, additive is CaO, Na to the abrading block of this emery wheel with MgO
2CO
3And NaHCO
3, as bond, adopt hot pressing mode to form through hot setting with thermosetting resin." a kind of superfine grinding wheel for hard and crisp crystal substrate " number of patent application of applications such as Kang Renke is that CN200610134248 discloses a kind of superfine grinding wheel for hard and crisp crystal substrate, and the wheel grinding layer is made up of abrasive material, bonding agent, inserts and pore.Inserts by pH value conditioning agent, oxidant, help and throw agent and form.The wheel grinding layer as bond, adopts hot pressing mode to form through hot setting with resin.More than in two patents, owing to need heating, additive component in the Grinder such as Na at solidification process
2CO
3And NaHCO
3May under hot conditions, decompose, lose the effect that promotes the grinding process chemical reaction.By the same token, the oxidant in the above-mentioned emery wheel also can lose efficacy because of pyrolytic.
Summary of the invention
The objective of the invention is to overcome the deficiency of prior art,, greatly limited the selection and the use of reactant/oxidant and additive because of the abrading block of the soft abrasive grinding wheel that adopts at present all adopts resinoid bond at high temperature to solidify to form.The present invention adopts the normal temperature cure bond, comprises the soft abrasive grinding wheel of multiple reactant/oxidant, additive, solves problems such as chemical reaction deficiency in the silicon chip grinding process, unstable, the easy burn surfaces of grinding process, grinding efficiency are low.
Technical scheme of the present invention is a kind of normal temperature cure bond soft abrasive grinding wheel, it is characterized in that, the bond in the soft abrasive grinding wheel abrading block is to adopt the normal temperature cure bond; In addition, the soft abrasive grinding wheel abrading block comprises that also hardness is lower than the abrasive material of workpiece to be machined, can promotes oxidant, the additive of abrasive material and workpiece chemical reaction, prevents the pore that stops up and burn; The shared percent by volume of each composition is: bond 40 ~ 55%, abrasive material 30 ~ 45%, oxidant 0 ~ 7%; Additive 10 ~ 25%, pore 5 ~ 15%;
Said normal temperature cure bond is a magnesium oxychloride material, is that 30 ~ 50% MgO, mass percent are 10 ~ 30% MgCl by mass percent
2With mass percent be 30 ~ 60% H
2Solidify to form at normal temperatures after the O mixing and stirring; Said oxidant is one or more in potassium permanganate, clorox, NaOH, the sodium peroxide particle, and oxidant can decomposition failure in the normal temperature cure process; Said additive is CaO, CaCO
3, Na
2CO
3, NaHCO
3, in the phosphoric acid, citric acid one or more; The hardness ratio monocrystalline silicon of said abrasive material and the hardness of polysilicon are low, and it consists of MgO abrasive material, Fe
2O
3Abrasive material, CeO
2Abrasive material or SiO
2In the abrasive material one or more, size distribution are 20 ~ 100 μ m.
A kind of normal temperature cure chlorine oxygen binding agent for magnesium Grinder is characterized in that, cylindrical, cup-shaped, polyhedron cylindricality difformity that the soft abrasive grinding wheel abrading block is made as required.
Effect of the present invention and benefit are: when coming the grinding silicon chip with the emery wheel of manufacturing of the present invention, the chemical reaction between emery wheel and the workpiece is in time abundant, and the mechanism with grinding process reaches balance easily, and grinding performance is stable, the material removing rate height; The silicon chip grinding skin is smooth, does not have defectives such as little cut, dislocation, micro-crack; Grinding temperature is moderate, and silicon chip surface the grinding burn phenomenon can not occur.
Description of drawings
Accompanying drawing 1 is cup-shaped soft abrasive grinding wheel structure chart, wherein: 1-grinding wheel base body, 2-buffing material abrading block.
Accompanying drawing 2 is silicon chip surface pattern and the surface roughness after the grinding that detects of NewView 5022 type three-dimensional surface profile appearance.
The grinding silicon chip sub-surface damage that accompanying drawing 3 detects for transmission electron microscope, wherein: 1-non-crystalline silicon, 2-monocrystalline silicon.
The specific embodiment
Specify embodiment of the present invention in conjunction with accompanying drawing and technical scheme.
One embodiment of the present invention, i.e. circular arc buffing material abrading block are bonded in the formation of alloy matrix aluminum end face, and it is following that buffing material abrading block prepares process:
By certain stoichiometric proportion weighing magnesia and magnesium chloride; It is 20% ~ 35% the aqueous solution that magnesium chloride is mixed with mass fraction, adds an amount of citric acid and phosphoric acid in the solution; With abrasive material, oxidant, additive mixing and ball milling 15 minutes; Above two step gained solution and also abundant stirring of powder mixes are processed slurry in 5 minutes, import in the circular arc shaping dies, catch up with most bubble, solidify shaping in 24 hours; The demoulding, abrading block normal temperature cure 20 days.The buffing material abrading block that solidifies that is shaped in the circular arc mould is adhered to aluminium alloy grinding wheel base body end face, can be made into cup type soft abrasive grinding wheel as shown in Figure 1.This emery wheel can be installed on Wafer Grinders, is used for the leveling processing and the processing of chip back attenuate of silicon chip.
Specific embodiment: make soft abrasive grinding wheel with embodiment shown in Figure 1,1 is the arc abrading block, is bonded on the matrix 2 by a determining deviation and processes cup emery wheel.Abrading block external diameter Φ 350 mm, the facewidth 7.5 mm, tooth depth 10 mm.Diameter of phi 200 mm of grinding silicon chip; Thickness 650 mm adopt the soft abrasive grinding wheel grinding preceding with 2000# diamond wheel grinding surface, silicon chip surface roughness PV 27.5 nm after detecting diamond wheel grinding; Ra 7.6 nm, the inferior crizzle degree of depth 4.65 μ m.Above-mentioned silicon chip is held on Wafer Grinders with vacuum cup, and with soft abrasive grinding wheel of the present invention it is carried out grinding.Machined parameters: the speed of mainshaft 1200 r/min, rotating speed of table 80 r/min, grinding times 15 min.Utilize the silicon chip surface result after metallographic microscope and the scanning electron microscopic observation grinding to show that smooth surface is complete, does not have cut, fragmentation and pit equivalent damage.The NewView 5022 type three-dimensional surface profile appearance that utilize Zygo company to produce detect silicon chip surface pattern and the surface roughness after the grinding, and area of detection is 53 * 71 μ m.The result shows, the silicon chip surface roughness PV 4.14nm after the grinding, and Ra 0.44 nm, as shown in Figure 2.The sub-surface damage of silicon chip is not found dislocation and micro-crack after the transmission electron microscope detection grinding of employing cross section, and amorphous layer is only arranged.
Claims (2)
1. a normal temperature cure bond soft abrasive grinding wheel is characterized in that, the bond in the soft abrasive grinding wheel abrading block is to adopt the normal temperature cure bond; In addition, the soft abrasive grinding wheel abrading block comprises that also hardness is lower than oxidant, the additive of the abrasive material of workpiece to be machined, promotion abrasive material and workpiece chemical reaction, prevents the pore that stops up and burn; The shared percent by volume of each composition is: bond 40 ~ 55%, abrasive material 30 ~ 45%, oxidant 0 ~ 7%; Additive 10 ~ 25%, pore 5 ~ 15%;
Said normal temperature cure bond is a magnesium oxychloride material, is that 30 ~ 50% MgO, mass percent are 10 ~ 30% MgCl by mass percent
2With mass percent be 30 ~ 60% H
2Solidify to form at normal temperatures after the O mixing and stirring; Said oxidant is one or more in potassium permanganate, clorox, NaOH, the sodium peroxide particle, and oxidant can decomposition failure in the normal temperature cure process; Said additive is CaO, CaCO
3, Na
2CO
3, NaHCO
3, in the phosphoric acid, citric acid one or more; The hardness ratio monocrystalline silicon of said abrasive material and the hardness of polysilicon are low, and it consists of MgO abrasive material, Fe
2O
3Abrasive material, CeO
2Abrasive material or SiO
2In the abrasive material one or more, size distribution are 20 ~ 100 μ m.
2. a kind of normal temperature cure bond soft abrasive grinding wheel as claimed in claim 1 is characterized in that, cylindrical, cup-shaped, polyhedron cylindricality difformity that the soft abrasive grinding wheel abrading block is made as required.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101998035A CN102699826A (en) | 2012-06-16 | 2012-06-16 | Soft grinding material sand wheel with bonding agent solidified at normal temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101998035A CN102699826A (en) | 2012-06-16 | 2012-06-16 | Soft grinding material sand wheel with bonding agent solidified at normal temperature |
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| Publication Number | Publication Date |
|---|---|
| CN102699826A true CN102699826A (en) | 2012-10-03 |
Family
ID=46893033
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101998035A Pending CN102699826A (en) | 2012-06-16 | 2012-06-16 | Soft grinding material sand wheel with bonding agent solidified at normal temperature |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639887A (en) * | 2013-10-28 | 2014-03-19 | 中国计量学院 | Flexible pneumatic polishing disk for crystal substrate surface machining |
| CN106607774A (en) * | 2015-10-22 | 2017-05-03 | 中国砂轮企业股份有限公司 | Grinding wheel with internal fluid supply structure |
| CN112548883A (en) * | 2020-12-02 | 2021-03-26 | 西安奕斯伟硅片技术有限公司 | Grinding wheel and grinding equipment |
| CN112706085A (en) * | 2020-12-24 | 2021-04-27 | 湖南三安半导体有限责任公司 | Thinned grinding wheel and assembly thereof, thinned silicon carbide substrate, thinning method and application |
| CN114074296A (en) * | 2021-06-24 | 2022-02-22 | 东莞市华冠新材料科技有限公司 | Grinding body and preparation method thereof, and grinding disc and grinding pad embedded with grinding body |
| CN115446742A (en) * | 2022-09-14 | 2022-12-09 | 无锡市锡山区半导体先进制造创新中心 | Composite abrasive grinding wheel and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0114280A2 (en) * | 1983-01-21 | 1984-08-01 | Carborundum Schleifmittelwerke GmbH | Method of manufacturing abrasive bodies |
| US4761163A (en) * | 1987-09-14 | 1988-08-02 | Ida Messere | Method for making quick ageing abrasive slurries for the construction of grinding wheels, and the abrasive slurries made thereby |
| EP0381662A2 (en) * | 1989-01-30 | 1990-08-08 | MAGINDAG Steirische Magnesit-Industrie Aktiengesellschaft | Process for the manufacture of abrasive bodies |
| CN1951635A (en) * | 2006-11-08 | 2007-04-25 | 大连理工大学 | Superfine grinding wheel for hard and crisp crystal substrate |
-
2012
- 2012-06-16 CN CN2012101998035A patent/CN102699826A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0114280A2 (en) * | 1983-01-21 | 1984-08-01 | Carborundum Schleifmittelwerke GmbH | Method of manufacturing abrasive bodies |
| US4761163A (en) * | 1987-09-14 | 1988-08-02 | Ida Messere | Method for making quick ageing abrasive slurries for the construction of grinding wheels, and the abrasive slurries made thereby |
| EP0381662A2 (en) * | 1989-01-30 | 1990-08-08 | MAGINDAG Steirische Magnesit-Industrie Aktiengesellschaft | Process for the manufacture of abrasive bodies |
| CN1951635A (en) * | 2006-11-08 | 2007-04-25 | 大连理工大学 | Superfine grinding wheel for hard and crisp crystal substrate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639887A (en) * | 2013-10-28 | 2014-03-19 | 中国计量学院 | Flexible pneumatic polishing disk for crystal substrate surface machining |
| CN106607774A (en) * | 2015-10-22 | 2017-05-03 | 中国砂轮企业股份有限公司 | Grinding wheel with internal fluid supply structure |
| CN112548883A (en) * | 2020-12-02 | 2021-03-26 | 西安奕斯伟硅片技术有限公司 | Grinding wheel and grinding equipment |
| CN112706085A (en) * | 2020-12-24 | 2021-04-27 | 湖南三安半导体有限责任公司 | Thinned grinding wheel and assembly thereof, thinned silicon carbide substrate, thinning method and application |
| CN114074296A (en) * | 2021-06-24 | 2022-02-22 | 东莞市华冠新材料科技有限公司 | Grinding body and preparation method thereof, and grinding disc and grinding pad embedded with grinding body |
| CN115446742A (en) * | 2022-09-14 | 2022-12-09 | 无锡市锡山区半导体先进制造创新中心 | Composite abrasive grinding wheel and preparation method and application thereof |
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Application publication date: 20121003 |