CN114074296A - Grinding body and preparation method thereof, and grinding disc and grinding pad embedded with grinding body - Google Patents
Grinding body and preparation method thereof, and grinding disc and grinding pad embedded with grinding body Download PDFInfo
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- CN114074296A CN114074296A CN202110703471.9A CN202110703471A CN114074296A CN 114074296 A CN114074296 A CN 114074296A CN 202110703471 A CN202110703471 A CN 202110703471A CN 114074296 A CN114074296 A CN 114074296A
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- 238000000227 grinding Methods 0.000 title claims abstract description 193
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 57
- 239000011347 resin Substances 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 56
- -1 alkoxy compound Chemical class 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 27
- 238000002156 mixing Methods 0.000 claims abstract description 22
- 239000002904 solvent Substances 0.000 claims abstract description 14
- 239000000375 suspending agent Substances 0.000 claims abstract description 13
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 12
- 238000005498 polishing Methods 0.000 claims description 75
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 21
- 230000009471 action Effects 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims description 8
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 235000011941 Tilia x europaea Nutrition 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 7
- 150000002576 ketones Chemical class 0.000 claims description 7
- 239000004571 lime Substances 0.000 claims description 7
- 238000009489 vacuum treatment Methods 0.000 claims description 7
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims description 5
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 5
- 239000000440 bentonite Substances 0.000 claims description 5
- 229910000278 bentonite Inorganic materials 0.000 claims description 5
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
- 150000002430 hydrocarbons Chemical class 0.000 claims description 5
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- 229910001610 cryolite Inorganic materials 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 description 16
- 238000012545 processing Methods 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 150000008064 anhydrides Chemical class 0.000 description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- 239000012046 mixed solvent Substances 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000009719 polyimide resin Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 5
- 235000011180 diphosphates Nutrition 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000012467 final product Substances 0.000 description 4
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 150000004982 aromatic amines Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 229910021538 borax Inorganic materials 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 238000006757 chemical reactions by type Methods 0.000 description 3
- IPGANOYOHAODGA-UHFFFAOYSA-N dilithium;dimagnesium;dioxido(oxo)silane Chemical compound [Li+].[Li+].[Mg+2].[Mg+2].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O IPGANOYOHAODGA-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 3
- 229910001950 potassium oxide Inorganic materials 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 235000010339 sodium tetraborate Nutrition 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical group [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000002173 cutting fluid Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- CNZAMPLGEANWCA-UHFFFAOYSA-N [F].[Mg] Chemical compound [F].[Mg] CNZAMPLGEANWCA-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a grinding body which is prepared by dispersing the following components in parts by weight in a solvent, mixing and curing: 85-95 parts of inorganic micro powder grinding material; 3-8 parts of curable resin; 2-6 parts of a suspending agent; 0.1-1 part of defoaming agent; and 1-3 parts of an alkoxy compound. The invention also discloses a preparation method of the grinding body, a grinding disc embedded with the grinding body and a grinding pad. The grinding body of the invention can automatically and evenly fall off during grinding, has very even consumption, can not block a grinding disc and is not easy to scratch a workpiece.
Description
Technical Field
The invention relates to the field of grinding equipment, in particular to a grinding body, a preparation method thereof, a grinding disc embedded with the grinding body and a grinding pad.
Background
The components of the abrasive of the grinding disc or the grinding pad of the traditional grinding equipment are usually the combination of single inorganic micro-powder abrasive and fixed resin, and a layer of grinding body is formed on an action surface by adopting a coating mode, in the grinding process, the technical problems of uneven consumption and easy blockage exist in the grinding body layer, and due to the uneven consumption of the grinding body, the grinding body can easily scratch workpieces and the phenomenon that the grinding scraps and mud block the grinding disc, so that the grinding disc usually needs to be trimmed, the service life of the grinding disc is shortened, the process is complicated, the production efficiency is reduced, and the production cost is increased.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a grinding body, a preparation method thereof, a grinding disc embedded with the grinding body and a grinding pad, which solve the technical problems of easy blockage, easy workpiece scratching and frequent grinding disc trimming caused by uneven consumption of the grinding body in the prior art.
In order to achieve the purpose, the invention provides a grinding body which is mainly prepared by dispersing the following components in parts by weight in a solvent, mixing and curing:
as a further development of the invention, the suspending agent is a silicate or a phosphate.
As a further improvement of the invention, the defoaming agent is solid hydrocarbon or solid silica.
As a further improvement of the invention, the alkoxy compound is one or two of methyl alkoxy compound or ethyl alkoxy compound.
As a further improvement of the invention, the dosage of the solvent is 0-20 parts by weight, and the solvent is one or more than two of alcohol, ether, ester, ketone and toluene.
As a further improvement of the invention, the material also comprises 10-30 parts by mass of a filler, wherein the filler is aluminum hydroxide, bentonite, cryolite or lime.
As a further improvement of the invention, the catalyst also comprises 0.5-5 parts by mass of glass surface catalyst or 2-6 parts by mass of metal surface catalyst.
The preparation method based on the grinding body comprises the following steps:
s1, preparing a mixed material of a grinding body: respectively dispersing the curing resin, the alkoxy compound and the defoaming agent in a solvent according to parts by weight, mixing and stirring uniformly, then sequentially adding the suspending agent, the inorganic micro powder abrasive, the filler and the glass surface catalyst or the metal surface catalyst, stirring uniformly again to obtain a grinding body mixed material, and pouring the grinding body mixed material into a mold;
s2, vacuumizing, namely vacuumizing the mould filled with the grinding body mixed material in the step S1 according to the following method: vacuumizing from normal pressure to negative atmospheric pressure, circulating for 3-5 times, and keeping for 1-2 hours under negative atmospheric pressure;
s3, curing, namely placing the mold with the grinding body mixed material subjected to vacuum treatment in the step S2 into an oven for curing and molding under the following conditions: and (3) heating the temperature from room temperature to 40 ℃ within 10min, keeping the temperature constant for 0.5-1 h, heating the temperature from 40 ℃ to 150 ℃ within 15min, keeping the temperature constant for 0.5-3 h, and cooling to finish the solidification.
The polishing pad embedded with the polishing body comprises a polishing disk body and at least one polishing body embedded in the polishing disk body.
As a further improvement of the invention, the grinding body is embedded in the grinding disc body and a convex action part is formed on the action surface of the grinding disc body.
The polishing pad embedded with the polishing body comprises a polishing pad body and at least one polishing body, wherein the polishing body is embedded in the polishing pad body, and a convex action part is formed on the action surface of the polishing pad.
The preparation method of the grinding disc inlaid with the grinding body is that the grinding body is embedded into the grinding disc body and is solidified or sintered with the grinding disc body.
Compared with the prior art, the grinding body provided by the invention has the beneficial effects that:
the grinding body is added with additives on the basis of inorganic micro powder grinding material and curing resin, wherein the additives comprise a suspending agent, a defoaming agent and an alkoxy compound, the grinding body is formed by uniformly mixing the inorganic micro powder grinding material, the curing resin, the suspending agent, the defoaming agent and the alkoxy compound and then curing or sintering the mixture, in the grinding process, the suspending agent can improve the cutting force of the grinding body and solve the problem that grinding chip mud blocks a grinding disc, generated bubbles can be inhibited or defoamed by the defoaming agent, the alkoxy compound can improve the binding force between the inorganic micro powder grinding material and the curing resin and improve the quality of the grinding body, in addition, because the grinding body can be slightly dissolved in cooling liquid and ethylene glycol, the grinding body can automatically and evenly fall off and consume, the grinding disc cannot be blocked and a workpiece cannot be easily scratched, so the grinding disc does not need to be frequently trimmed, the grinding body provided by the invention has the advantages of high cutting and grinding efficiency, excellent surface quality of a machined part and great reduction of production cost.
Due to the adoption of the grinding body of the technical scheme, the grinding body is embedded into the grinding disc and the grinding pad, so that the cutting grinding efficiency is high, the surface quality of a machined part is excellent, frequent dressing is not needed, and the production cost is greatly reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a polishing disk with an embedded polishing body according to the present invention and an internal structure of the polishing disk;
FIG. 2 is a schematic structural view of an abrasive disk having a convex action portion on an action surface of the abrasive disk according to the present invention;
FIG. 3 is a comparison of the abrasive disk of the present invention before and after grinding;
FIG. 4 is a comparison of a conventional abrasive disk before and after grinding;
FIG. 5 is a schematic view of a polishing pad having a convex active portion on an active surface according to an embodiment of the present invention;
FIG. 6 is a schematic view of a polishing apparatus using a polishing disk with embedded polishing bodies according to an embodiment of the present invention;
FIG. 7 shows another polishing apparatus using a polishing disk with embedded polishing bodies according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a grinding body which is mainly prepared by dispersing the following components in parts by weight in a solvent, mixing and solidifying:
specifically, the inorganic fine powder abrasive of the present invention is made of a high hardness material including diamond (polycrystal, one-to-three type single crystal), boron carbide, silicon carbide, alumina, silicon oxide, cerium oxide, and one or more of them may be added and mixed according to a processing process and a material of a grinding workpiece, and the particle size of the inorganic fine powder abrasive is 0.5 to 200 μm, and is related to a processing precision of the workpiece, and an inorganic fine powder abrasive having a particle size with an upper limit in rough processing may be selected, and an inorganic fine powder abrasive having a particle size with a lower limit in finish processing may be preferably selected.
The grinding body of the invention is added with additives on the basis of inorganic micro powder grinding material and curing resin, wherein the additives comprise a suspending agent, a defoaming agent and an alkoxy organic compound, wherein the suspending agent is silicate or phosphate, preferably lithium magnesium silicate, pyrophosphate or fluorine magnesium silicate, and experiments show that the suspending agent silicate can ensure that the specific gravity is 5g/cm3The powder (2) is left to stand and suspended for more than 6 hours. In the grinding process, the suspending agent can improve the cutting force of the grinding body and solve the problem that grinding chip mud blocks the grinding disc; bubbles generated in the grinding process can be inhibited or defoamed by a defoaming agent, wherein the defoaming agent is preferably solid hydrocarbon or solid silicon dioxide; the alkoxy compound can increase the binding force between the inorganic micro-powder abrasive and the curing resin and improve the quality of the abrasive body, wherein the alkoxy compound is preferably one or two of methyl alkoxy compound or ethyl alkoxy compound. The grinding body can slightly dissolve in cooling liquid water and glycol due to the addition of the additive, so that the grinding body can automatically and averagely fall down and is very even in consumption, a grinding disc cannot be blocked, a workpiece is not easy to scratch, and the ceramic grinding disc does not need to be frequently trimmed.
Specifically, the curable resin of the present invention includes a reactive resin and a resin curing agent, wherein the reactive resin is selected from one or more of aromatic Epoxy resin, Bisphenol F type Epoxy, PU modified Epoxy resin, phenolic resin, acryl resin and polyimide resin, and the resin curing agent is selected from one or more of phenolic resin, polyamide, polyamine polyamide, cycloaliphatic amine, aromatic amine and anhydride resin, and it is known to those skilled in the art that the reactive resin has reactive functional groups capable of participating in the reaction, and the curing agent can initiate or participate in the reaction of the reactive functional groups, and after the reactive resin is mixed with the resin curing agent according to a certain proportion, the reactive resin is solidified into a solid from a liquid state when all the reactive functional groups capable of reacting are completely reacted under curing conditions, so that the curable resin can be used as a binder to disperse inorganic fine powder abrasive, and/or polyimide resin And a filler, and these powders are bonded together and then cured to obtain an abrasive body.
In contrast, in the embodiment of the invention, 10-30 parts by weight of filler with soft hardness is added, the filler can be aluminum hydroxide, or bentonite, cryolite or lime subjected to oil-based or water-based artificial organic chemical treatment, and the soft filler is easily worn in the grinding or polishing process, so that when a workpiece with high hardness is ground, the filler is worn away firstly, then the high-hardness inorganic micro powder grinding material is gradually exposed, the cutting force is linearly increased, the grinding body is ensured to fall off more easily and evenly, and the processing quality of the surface of the workpiece is improved.
In order to facilitate processing, 0-20 parts by weight of solvent can be added on the basis, the solvent is one or more than two of alcohol, ether, ester, ketone and toluene, the solvent can dissolve the curable resin and the additive, and has the effect of adjusting viscosity to obtain better fluidity, so that subsequent processing is facilitated, and the film thickness of the curable resin can be indirectly adjusted.
When the workpiece is made of materials such as glass, ceramics or sapphire, the workpiece further comprises 0.5-5 parts by weight of a glass surface catalyst, the glass surface catalyst is preferably sodium borate, boron oxide, sodium oxide or potassium oxide, and the materials can be slightly dissolved in aqueous and glycol cutting fluid and are suitable for processing operation in the field.
When the workpiece is made of a metal material, the workpiece further comprises 2-6 parts by weight of a metal surface catalyst, and the metal surface catalyst is preferably a halide salt, such as ferric chloride or ammonium chloride solid micro powder which can be slightly dissolved in aqueous and glycol cutting fluid.
In addition, the shape of the grinding body provided by the invention is a cylinder, a cone or a table body; specifically, such as a cylinder, an elliptic cylinder, a triangular pyramid, a quadrangular prism, a pentagonal prism, a hexagonal prism, a polygonal cylinder, or the like; more specifically, as shown in FIGS. 2, 5, 6 and 7, the polishing body has a 3D cylindrical X-Y-Z axis (e.g., a cylinder, a trochoid, a trigonal pyramid, a tetragonal body, a pentagonal body, a hexagonal body, a polygonal body), is embedded in a resin polishing pad, and has an active surface area of 0.1 to 1000mm2The area of the action surface of the grinding body is determined according to the number of the grinding bodies, the processing precision and other specific requirements, so that different processing requirements can be met, and the application range is wide.
The preparation method based on the grinding body comprises the following steps:
s1, preparing a mixed material: dispersing the curing resin, the alkoxy compound and the defoaming agent in a solvent according to the parts by weight, mixing and stirring uniformly, then adding the suspending agent, the inorganic micro powder abrasive, the filler and the glass surface catalyst or the metal surface catalyst in sequence, stirring uniformly again to obtain a mixed material, and pouring the mixed material into a mold;
s2, vacuumizing, namely vacuumizing the mould filled with the mixed material in the step S1 according to the following method: vacuumizing from normal pressure to negative atmospheric pressure, circulating for 3-5 times, and keeping for 1-2 hours under negative atmospheric pressure;
s3, curing, namely putting the mold with the mixed material subjected to vacuum treatment in the step S2 into an oven for curing and forming under the following conditions: and (3) heating the temperature from room temperature to 40 ℃ within 10min, keeping the temperature constant for 0.5-1 h, heating the temperature from 40 ℃ to 150 ℃ within 15min, keeping the temperature constant for 0.5-3 h, and cooling to finish the solidification.
In the preparation method of the grinding body, when mixing, the addition sequence of the components is controlled, so that the inorganic grinding micro powder and the filler are uniformly dispersed in the curing resin, and a homogeneous grinding body mixed material is obtained; air in the grinding body mixture is removed by vacuumizing, so that the components are combined more tightly, and the defects of the grinding body after molding are reduced; by controlling the curing temperature and time, the full reaction of the curing resin is ensured to have excellent performance, and finally the finished product of the grinding body with excellent performance is obtained.
Based on the above principle, the present invention provides a specific embodiment for illustration:
example 1
The grinding body of the embodiment 1 of the invention is mainly used for processing glass, ceramic or sapphire pieces, and is mainly prepared by curing the following components in parts by weight: 85 parts of inorganic micro powder abrasive material formed by mixing diamond, boron carbide and silicon carbide, 30 parts of aluminum hydroxide, 3 parts of curing resin, 6 parts of lithium magnesium silicate, 1 part of solid silicon dioxide, 1 part of methyl alkoxy compound and 0.5 part of sodium borate, wherein the curing resin in the embodiment comprises reaction resin formed by mixing aromatic Epoxy resin, Bisphenol F type Epoxy resin and PU modified Epoxy resin and resin curing agent formed by mixing cycloaliphatic amine and aromatic amine.
In embodiment 1 of the present invention, the method for preparing the abrasive body includes the following steps:
s1, preparing a mixed material of a grinding body: respectively mixing and uniformly stirring reaction type resin formed by mixing aromatic Epoxy resin, Bisphenol F type Epoxy resin and PU improved Epoxy resin, resin curing agent formed by mixing cyclic aliphatic amine and aromatic amine, methyl alkoxy compound and solid silicon dioxide according to the mass parts, then sequentially adding lithium magnesium silicate, inorganic micro powder abrasive, aluminum hydroxide and sodium borate, uniformly stirring again to obtain a grinding body mixed material, and pouring the grinding body mixed material into a mold;
s2, vacuumizing, namely vacuumizing the mould filled with the grinding body mixed material in the step S1 according to the following method: vacuumizing from normal pressure to negative atmospheric pressure, circulating for 3 times, and keeping for 2 hours under negative atmospheric pressure;
s3, curing, namely placing the mold with the grinding body mixed material subjected to vacuum treatment in the step S2 into an oven for curing and molding under the following conditions: heating from room temperature to 40 deg.C within 10min, holding the temperature for 0.5h, heating from 40 deg.C to 150 deg.C within 15min, holding the temperature for 3h, and cooling to obtain the final product.
Example 2
The grinding body in embodiment 2 of the invention is mainly used for processing glass, ceramic or sapphire pieces, and is mainly prepared by curing the following components in parts by weight: 95 parts of inorganic micro powder abrasive material formed by mixing alumina, silica and cerium oxide, 10 parts of bentonite, 8 parts of curing resin, 5 parts of magnesium fluoride silicate, 0.5 part of solid hydrocarbon, 2 parts of ethyl alkoxy compound, 5 parts of potassium oxide and 20 parts of mixed solvent of ketone and toluene, wherein the curing resin in the embodiment is mainly a mixture of acrylic resin and anhydride resin.
In embodiment 2 of the present invention, the method for preparing the abrasive body includes the following steps:
s1, preparing a mixed material of a grinding body: respectively dispersing a mixture of acrylic resin and anhydride resin, an ethyl alkoxide compound and a solid hydrocarbon in a mixed solvent of ketone and toluene according to parts by weight, mixing and uniformly stirring, then sequentially adding magnesium fluoride silicate, an inorganic micro powder abrasive formed by mixing alumina, silica and cerium oxide, bentonite and potassium oxide, uniformly stirring again to obtain a grinding body mixed material, and pouring the grinding body mixed material into a mold;
s2, vacuumizing, namely vacuumizing the mould filled with the grinding body mixed material in the step S1 according to the following method: vacuumizing from normal pressure to negative atmospheric pressure, circulating for 5 times, and keeping for 1h under negative atmospheric pressure;
s3, curing, namely placing the mold with the grinding body mixed material subjected to vacuum treatment in the step S2 into an oven for curing and molding under the following conditions: heating from room temperature to 40 deg.C within 10min, holding the temperature for 1h, heating from 40 deg.C to 150 deg.C within 15min, holding the temperature for 0.5h, and cooling to obtain the final product.
Example 3
The grinding body of the embodiment 3 of the invention is mainly used for processing metal parts, and is mainly prepared by curing the following components in parts by weight: 90 parts of polycrystalline diamond, 20 parts of lime, 6 parts of curable resin, 2 parts of pyrophosphate, 0.1 part of solid silicon dioxide, 3 parts of a mixture of a methyl alkoxy compound and an ethyl alkoxy compound, 2 parts of ferric chloride and 15 parts of a mixed solvent of alcohol, ether and ester, wherein the curable resin of the embodiment is a mixture mainly prepared by mixing phenolic resin and polyimide resin and taking anhydride resin as a resin curing agent.
In embodiment 3 of the present invention, the method for preparing the abrasive body includes the following steps:
s1, preparing a mixed material of a grinding body: respectively dispersing reaction type resin mixed by phenolic resin and polyimide resin and curing type resin mixture mixed by using anhydride resin as a resin curing agent, a mixture of methyl alkoxy compound and ethyl alkoxy compound and solid silicon dioxide in a mixed solvent of alcohol, ether and ester according to the mass parts, mixing and uniformly stirring, then sequentially adding pyrophosphate, polycrystalline diamond inorganic micro powder abrasive, lime and ferric chloride, uniformly stirring again to obtain a grinding body mixed material, and pouring the grinding body mixed material into a mold;
s2, vacuumizing, namely vacuumizing the mould filled with the grinding body mixed material in the step S1 according to the following method: vacuumizing from normal pressure to negative atmospheric pressure, circulating for 4 times, and keeping for 1.5 hours under negative atmospheric pressure;
s3, curing, namely placing the mold with the grinding body mixed material subjected to vacuum treatment in the step S2 into an oven for curing and molding under the following conditions: heating from room temperature to 40 deg.C within 10min, holding the temperature for 1h, heating from 40 deg.C to 150 deg.C within 15min, holding the temperature for 2h, and cooling to obtain the final product.
Example 4
The grinding body of the embodiment 4 of the invention is mainly used for processing metal parts, and is mainly prepared by curing the following components in parts by weight: 90 parts of one-third type single crystal, 20 parts of lime, 6 parts of curing resin, 2 parts of pyrophosphate, 0.1 part of solid silicon dioxide, 3 parts of a mixture of a methyl alkoxy compound and an ethyl alkoxy compound, 6 parts of ammonium chloride and 5 parts of a mixed solvent of alcohol, ether, ester, ketone and toluene, wherein the curing resin in the embodiment is a mixture mainly prepared by mixing phenolic resin and polyimide resin and taking anhydride resin as a resin curing agent.
In embodiment 4 of the present invention, the method for preparing the abrasive body includes the following steps:
s1, preparing a mixed material of a grinding body: respectively dispersing reaction type resin mixed by phenolic resin and polyimide resin and curing type resin mixture mixed by using anhydride resin as a resin curing agent, a mixture of methyl alkoxy compound and ethyl alkoxy compound and solid silicon dioxide in a mixed solvent of alcohol, ether, ester, ketone and toluene according to the parts by mass, mixing and uniformly stirring, then sequentially adding pyrophosphate, polycrystalline diamond inorganic micro powder abrasive, lime and ferric chloride, uniformly stirring again to obtain a grinding body mixed material, and pouring the grinding body mixed material into a mold;
s2, vacuumizing, namely vacuumizing the mould filled with the grinding body mixed material in the step S1 according to the following method: vacuumizing from normal pressure to negative atmospheric pressure, circulating for 4 times, and keeping for 1.5 hours under negative atmospheric pressure;
s3, curing, namely placing the mold with the grinding body mixed material subjected to vacuum treatment in the step S2 into an oven for curing and molding under the following conditions: heating from room temperature to 40 deg.C within 10min, holding the temperature for 1h, heating from 40 deg.C to 150 deg.C within 15min, holding the temperature for 2h, and cooling to obtain the final product.
Referring to fig. 1 to 4, the present invention further discloses a polishing pad embedded with the polishing bodies of embodiments 1 to 4, including a polishing pad body 1 and at least one polishing body 2, wherein the polishing body 1 is embedded in the polishing pad body 1.
The grinding body 2 is embedded in the grinding disc body 1 and a convex action part 21 is formed on the action surface of the grinding disc body 1.
The invention also discloses a polishing pad embedded with the polishing bodies of the embodiments 1 to 4, which comprises a polishing pad body and at least one polishing body, wherein the polishing body is embedded in the polishing pad body, and a convex action part is formed on the action surface of the polishing pad.
The method for manufacturing the grinding disc embedded with the grinding bodies according to the above embodiment of the present invention is to embed the grinding bodies 2 into the grinding disc body 1, and to solidify or sinter the grinding bodies 2 and the grinding disc body 1, and specifically, as shown in fig. 2, 6 and 7, the grinding bodies 2 are mixed and sintered into the grinding disc body 1 in a 2D planar layer X-Y axis manner, and the grinding bodies 2 are unevenly distributed in the grinding layer. Or the grinding materials with different high hardness are mixed with resin materials and are solidified into the grinding disc body 1 in a 2D plane layer X-Y axis mode, and the grinding bodies are distributed in the grinding layer of the whole grinding body 2 particles in an uneven mode.
The invention provides a preparation method of a grinding disc inlaid with a grinding body, which comprises the following steps:
s1, pressing and combining the curing resin or the mixture of the curing resin and the ceramic powder through a hot press under the following conditions to form the grinding disc body 1: the temperature is 20-250 ℃, and the pressure is 5-150 Kg/cm2Adjusting temperature and pressure according to the characteristics of various liquid and solid resins and the processing conditions; after molding, utilizing a CNC engraving to engrave at least more than one hole on the action surface of the grinding disc body according to the shape requirement of the grinding body 2, wherein the number of the holes depends on the specification requirement of the grinding disc, then preparing a grinding body mixed material according to the preparation method of the grinding body 2, and injecting the grinding body mixed material into the holes, so that a part of the grinding body mixed material can be embedded into the holes of the grinding disc body to form a semi-finished product;
s2, placing the semi-finished product in the step S1 into an oven to be baked and cured, wherein the curing conditions are carried out according to the curing conditions in the preparation method of the grinding body, and a finished grinding disc is formed.
S3, because in the manufacturing process of the finished product, the problem of unevenness can be presented, the disc surface can be preliminarily trimmed by utilizing the grinding wheel, so that the end surfaces of the grinding body and the grinding disc body are flush with each other, thereby obtaining better flatness and obtaining the grinding disc inlaid with the grinding body.
In step S1, a mold is disposed on the active surface of the polishing body along the edge of the hole, and the mixture of the polishing body is injected into the hole, so that a portion of the mixture of the polishing body can be embedded into the hole of the polishing disc body, and another portion of the mixture of the polishing body is injected into the mold cavity surrounding the hole, and finally, the product with the polishing body embedded into the polishing disc body and the protrusion 21 formed on the active surface of the polishing disc body is obtained by trimming.
The invention provides another preparation method of the grinding disc inlaid with the grinding body, which comprises the following steps: fixing at least one grinding body 2 in a mould, injecting a grinding disc mixed material for preparing a grinding disc body 1 into the mould, wherein the injection amount of the grinding disc mixed material is such that at least one part of the grinding body is embedded into the grinding disc mixed material, then pressing the grinding disc mixed material in the mould according to a production process, sintering and forming, and obtaining a finished grinding disc embedded with the grinding body after polishing treatment.
The method for manufacturing the polishing pad inlaid with the polishing body according to the present invention may be manufactured according to any method for manufacturing the polishing pad inlaid with the polishing body.
As shown in fig. 3, the abrasive disk with embedded abrasive bodies according to the present invention consumes the abrasive bodies 2 very uniformly before and after polishing, and is not easily clogged and also does not easily scratch a workpiece during polishing.
As shown in fig. 4, the conventional polishing disk has uneven consumption of the inorganic polishing particles 4 in the polishing layer 3 during the polishing process, and the polishing disk is easily clogged and easily scratches the workpiece.
In summary, due to the adoption of the grinding body of the embodiment of the invention, the grinding disc and the grinding pad are not blocked, the disc does not need to be repaired frequently, and the grinding disc has the advantages of high cutting and grinding efficiency, excellent surface quality of a machined part, high grinding yield, saving of working procedures and working hours of post-processing and great reduction of production cost.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (10)
1. The grinding body is characterized by being prepared by dispersing the following components in parts by weight in a solvent, mixing and curing:
2. a grinding body according to claim 1, characterized in that the suspending agent is a silicate or a phosphate; the defoaming agent is solid hydrocarbon or solid silicon dioxide; the alkoxy compound is one or two of methyl alkoxy compound or ethyl alkoxy compound; the amount of the solvent is 0-20 parts by weight, and the solvent is one or more than two of alcohol, ether, ester, ketone and toluene.
3. The grinding body according to claim 1, further comprising 10 to 30 parts by mass of a filler, wherein the filler is aluminum hydroxide, bentonite, cryolite or lime.
4. The abrasive body according to claim 1, further comprising 0.5 to 5 parts by mass of a glass surface catalyst or 2 to 6 parts by mass of a metal surface catalyst.
5. A grinding body as defined in claim 1, wherein the grinding body has an outer shape of a cylinder, a cone or a table.
6. A method for producing an abrasive body as claimed in any one of claims 1 to 5, comprising the steps of:
s1, preparing a mixed material of a grinding body: respectively dispersing the curing resin, the alkoxy compound and the defoaming agent in a solvent according to parts by weight, mixing and stirring uniformly, then sequentially adding the suspending agent, the inorganic micro powder abrasive, the filler and the glass surface catalyst or the metal surface catalyst, stirring uniformly again to obtain a grinding body mixed material, and pouring the grinding body mixed material into a mold;
s2, vacuumizing, namely vacuumizing the mould filled with the grinding body mixed material in the step S1 according to the following method: vacuumizing from normal pressure to negative atmospheric pressure, circulating for 3-5 times, and keeping for 1-2 hours under negative atmospheric pressure;
s3, curing, namely placing the mold with the grinding body mixed material subjected to vacuum treatment in the step S2 into an oven for curing and molding under the following conditions: and (3) heating the temperature from room temperature to 40 ℃ within 10min, keeping the temperature constant for 0.5-1 h, heating the temperature from 40 ℃ to 150 ℃ within 15min, keeping the temperature constant for 0.5-3 h, cooling, and curing to obtain the grinding body.
7. A polishing pad embedded with the polishing body of any one of claims 1 to 5, comprising a polishing pad body, and at least one polishing body disposed on the polishing pad body, wherein the polishing body is embedded in the polishing pad body.
8. The polishing pad with embedded polishing bodies of claim 7, wherein the polishing bodies are embedded in the polishing pad body and have convex action portions formed on the action surface of the polishing pad body.
9. A polishing pad embedded with the polishing body of any one of claims 1 to 5, comprising a polishing pad body, and at least one polishing body embedded in the polishing pad body, wherein the polishing body has a convex action portion formed on an action surface of the polishing pad.
10. The method for manufacturing an abrasive disk with embedded abrasive bodies according to claim 8, wherein the abrasive bodies are embedded in the abrasive disk body and cured or sintered with the abrasive disk body.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141016A (en) * | 1993-09-13 | 1997-01-22 | 美国3M公司 | Abrasive article, method of manufacture of same, method of using same for finishing, and a production tool |
| CN102699826A (en) * | 2012-06-16 | 2012-10-03 | 大连理工大学 | Soft grinding material sand wheel with bonding agent solidified at normal temperature |
| CN103495938A (en) * | 2013-10-16 | 2014-01-08 | 广东奔朗新材料股份有限公司 | Resin-metal composite type elastic grinding block and manufacturing mold and manufacturing method thereof |
| CN104999385A (en) * | 2015-06-30 | 2015-10-28 | 郑州磨料磨具磨削研究所有限公司 | Ceramic bond grinding tool for oriented arrangement of abrasives and preparation method thereof |
| CN105856089A (en) * | 2016-06-01 | 2016-08-17 | 东莞市中微纳米科技有限公司 | Grinding composite body and preparation method thereof |
| CN109531444A (en) * | 2018-12-13 | 2019-03-29 | 东莞市圣高机械科技有限公司 | A kind of resins synthesis abrasive disk and preparation method |
| CN111843817A (en) * | 2020-07-30 | 2020-10-30 | 东莞市华冠新材料科技有限公司 | Grinding body of ceramic grinding disc and ceramic grinding disc |
-
2021
- 2021-06-24 CN CN202110703471.9A patent/CN114074296A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141016A (en) * | 1993-09-13 | 1997-01-22 | 美国3M公司 | Abrasive article, method of manufacture of same, method of using same for finishing, and a production tool |
| CN102699826A (en) * | 2012-06-16 | 2012-10-03 | 大连理工大学 | Soft grinding material sand wheel with bonding agent solidified at normal temperature |
| CN103495938A (en) * | 2013-10-16 | 2014-01-08 | 广东奔朗新材料股份有限公司 | Resin-metal composite type elastic grinding block and manufacturing mold and manufacturing method thereof |
| CN104999385A (en) * | 2015-06-30 | 2015-10-28 | 郑州磨料磨具磨削研究所有限公司 | Ceramic bond grinding tool for oriented arrangement of abrasives and preparation method thereof |
| CN105856089A (en) * | 2016-06-01 | 2016-08-17 | 东莞市中微纳米科技有限公司 | Grinding composite body and preparation method thereof |
| CN109531444A (en) * | 2018-12-13 | 2019-03-29 | 东莞市圣高机械科技有限公司 | A kind of resins synthesis abrasive disk and preparation method |
| CN111843817A (en) * | 2020-07-30 | 2020-10-30 | 东莞市华冠新材料科技有限公司 | Grinding body of ceramic grinding disc and ceramic grinding disc |
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