CN102675857A - Heat-conducting and insulating thermosetting composition as well as preparation method and application thereof - Google Patents
Heat-conducting and insulating thermosetting composition as well as preparation method and application thereof Download PDFInfo
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Abstract
The invention discloses a heat-conducting and insulating thermosetting composition as well as a preparation method and application thereof. The heat-conducting and insulating thermosetting composition is composed of the following constituents in percentage by weight: 5-30 wt% of thermosetting resin, 5-20 wt% of carbon materials, and 50-90 wt% of inorganic insulating and heat-conducting fillers, wherein the coefficient of heat conductivity of the used carbon materials is greater than 300 W/m.K, and the used carbon materials are fibrous carbon materials. The preparation method of the heat-conducting and insulating thermosetting composition comprises the following step of: mixing the thermosetting resin, the carbon materials and the inorganic insulating and heat-conducting fillers in proportion, thus obtaining the product. The thermosetting composition has the advantages of high heat conductivity, high insulativity, and higher softness (lower hardness), and the thermosetting composition prepared from the thermosetting resin such as rubber further has the advantage of high tearing strength; and the heat-conducting and insulating thermosetting composition can be prepared into a heat-conducting gasket, and has a wide application prospect in the fields of electronic equipment and radiators.
Description
Technical field
The invention belongs to the organic functions field of compound material, be specifically related to a kind of heat conductive insulating thermoset composition.
Background technology
In field of electronics, along with electronics power constantly improves, installing space constantly dwindles, and causes its heat accumulation, and heating is serious.The gathering of heat can cause the problem of plant capacity reduction, reliability decrease, shortening in work-ing life and other aspect of performance.Promptly become under the situation of trend in " high-power, little space ", heat radiation has become the key of electronic device design.The method that solves heat radiation is fast transferred to metal heat sink through heat exchange pattern with the heat that electronics produces normally at electronics surface mounting metal heat sink.Yet there are depression in electronics and metal heat sink surface irregularity, when the two contacts, unavoidably have the space.Because the thermal conductivity of air is merely 0.023W/mK, therefore, the existence in space has had a strong impact on the heat-sinking capability of metal heat sink.For avoiding the space to heat conducting influence, improve the radiating efficiency of metal heat sink, heat-conducting interface material is widely used between electronics and the metal heat sink, and the heat that the rapid absorption electronics produces also passes to metal heat sink.
Heat-conducting interface material comprises heat-conducting silicone grease, heat-conducting glue, heat conduction phase change material and heat conduction pad.The heat-conducting silicone grease cost is low, calking good but its electrical insulation properties is poor, the trickling of being heated be prone to be polluted circuit card and caused short circuit, and is heated repeatedly for a long time and can becomes dry and increase thermal resistance.Heat-conducting glue cohesiveness is good, do not trickle, but glue-applying technique is complicated, and needs to solidify, and thermal conductivity is not high, usually below 1.8W/mK.Heat conduction phase change material heat conductivility is excellent, and calking is effective, and is easy to use, but the heat conduction phase change material costs an arm and a leg, and range of application is wideless.Heat conduction pad thermal conductivity is good, electrical insulation properties is good, and is easy to use, therefore in field widespread uses such as electronics, communication, LED, LCD, automobiles.
The heat conduction pad is with thermosetting resin and the compound preparation of heat conductive filler.Heat conductive filler is generally inorganic insulation fillers such as zinc oxide, Natural manganese dioxide, aluminum oxide, SP 1, aluminium nitride AlN, silicon nitride, silit, inorganic conductive filler such as metallic conduction filler such as copper, aluminium, silver, tin and carbon black, graphite, thomel, Graphene, carbon nanotube.For obtaining good electrical insulation properties, the heat conduction pad adopts the inorganic insulation heat conductive filler usually.Wherein, zinc oxide, Natural manganese dioxide and aluminum oxide have limited the raising of heat conduction pad heat conductivility because moderate cost be widely used, but its heat conductivility is general.SP 1 have higher thermal conductivity (60 ~ 200W/mK), but poor with the consistency of thermosetting resin matrix, cause its addition low, and the mechanical property of heat conduction pad, very low like tear strength, and cost an arm and a leg.Aluminium nitride AlN also has higher thermal conductivity (70 ~ 320 W/mK), but in air, is prone to deliquescence, reliability decrease, and cost an arm and a leg, so limited use.Silicon nitride, silit heat conductivility are good, but poor with the consistency of thermosetting resin matrix, addition is low, and is general by its heat conduction pad thermal conductivity that makes, and tear strength is low, expensive.
CN101787178A discloses a kind of heat-conduction electric insulation composite material, but the thermal conductivity of its material that obtains is merely greater than 0.5 watt/meter degree centigrade, and surface resistivity is greater than 10
12Ohm-sq centimetre, thermal conductivity is lower, fails to satisfy the needs of practical application.
Summary of the invention
The objective of the invention is to overcome the deficiency of prior art, a kind of heat conductive insulating thermoset composition is provided, this heat conductive insulating thermoset composition has the characteristics of high thermal conductivity and high-insulativity.In addition, for the heat conductive insulating thermoset composition of being made up of the rubber-like thermosetting resin, it can also have high tear strength.
Another object of the present invention is to provide the preparation method of said heat conductive insulating thermoset composition.
Another object of the present invention is to provide the application of said heat conductive insulating thermoset composition.Said heat conductive insulating thermoset composition is owing to have high thermal conductivity and high-insulativity, and the heat conduction pad over-all properties that makes is more balanced, is applied between electronics and the scatterer, can strengthen heat conduction efficiency, reduce interface resistance.
Above-mentioned purpose of the present invention is achieved through following technical scheme:
A kind of heat conductive insulating thermoset composition comprises the component that following percentage ratio by weight calculates:
5 %wt～30 wt% thermosetting resins; 5 wt%～20 wt% carbon materialses; With 50 wt%～90 wt% inorganic insulation heat conductive fillers; Wherein the thermal conductivity of employed carbon materials is more than 300 W/mK, and it is shaped as fibrous.
Thermosetting resin can be the thermosetting resin of rubber-like, can also be the thermosetting resin of non-rubber-like.
As a kind of preferred version, the thermosetting resin of said rubber-like is preferably any one or the two or more blends in tree elastomer, viton, silicone resin, the flexibel polyurethane.
As a kind of preferred version, the thermosetting resin of said nonrubber class be preferably in epoxy resin, resol, hard polyaminoester, polyimide resin, polyester, polymeric amide, vinyl resin, cyanate, bismaleimide-triazine resin or the benzoxazine colophony in any one or two or more blends.
The main effect of carbon materials is to improve the heat-conducting effect of thermoset composition and tear strength, and the scope that need remain on significant quantity could realize above-mentioned functions; Carbon materials has conductivity simultaneously, and its too high levels can be damaged the insulativity of thermoset composition.Find through experiment, the addition of carbon materials is controlled in the scope of thermoset composition 5wt% ~ 20wt%, can improve the heat-conducting effect and the tear strength of thermoset composition and make thermoset composition keep the good insulation performance performance.
The addition of thermosetting resin also need be controlled in the suitable scope, when the addition of thermosetting resin less than 5wt%, the plasticity of thermoset composition is relatively poor, and the product of forming for the rubber-like thermoset composition, tear strength is lower; When the addition of thermosetting resin greater than 30wt%, the heat-conducting effect of thermoset composition is limited.
Similarly, the consumption of inorganic insulation heat conductive filler also need be controlled in the suitable scope, when the addition of inorganic insulation heat conductive filler less than 50wt%, the heat-conducting effect of thermoset composition is relatively poor; When the addition of inorganic insulation heat conductive filler greater than 90wt%, the forming property of thermoset composition is relatively poor, and the product of forming for the rubber-like thermoset composition, tear strength is also relatively poor.
The thermal conductivity of carbon materials is high more, and its heat conductivility is good more, therefore can on lower addition, realize the lifting of matrix material heat conductivility, and reduce the negative impact that it brings the product insulating property to a certain extent.As a kind of preferred version, the thermal conductivity of said carbon materials is preferably more than 400 W/mK.
As a kind of more preferably scheme, the thermal conductivity of said carbon materials is more preferably more than 500 W/mK.
As a kind of preferred version, said carbon materials is preferably any one or the two or more mixtures in carbon black, graphite, thomel, Graphene, the carbon nanotube.
As a kind of preferred version, the length-to-diameter ratio of said carbon materials is preferably 0.2 ~ 500; When the length-to-diameter ratio of carbon materials greater than 500 the time, carbon materials is prone to make the resistivity of matrix material non-linear reducing to occur, even " diafiltration " phenomenon occurs, electrical insulating property descends; When the length-to-diameter ratio of carbon materials was lower than 0.2, carbon materials improved limited to matrix material heat conductivility and mechanical property.
As a kind of more preferably scheme, the length-to-diameter ratio of said carbon materials is preferably 0.5 ~ 100;
As a kind of more preferably scheme, the length-to-diameter ratio of said carbon materials is preferably 2 ~ 70.
As a kind of preferred version, said inorganic insulation heat conductive filler is preferably in zinc oxide, Natural manganese dioxide, aluminum oxide, SP 1, aluminium nitride AlN, silicon nitride or the silit one or more mixture.
As a kind of most preferably scheme, said inorganic insulation heat conductive filler most preferably is aluminum oxide.Described aluminum oxide can be unformed aluminum oxide, tabular alumina, round alumina or spherical alumina.
As a kind of preferred version, the median size (D of said inorganic insulation heat conductive filler
50) be preferably 0.01 ~ 100 micron.When inorganic insulation heat conductive filler particle diameter was lower than 0.01 micron, filler was prone in resin matrix, reunite, and is difficult for homodisperse, influenced the heat conductivility and the mechanical property of matrix material; Inorganic insulation heat conductive filler particle diameter is during greater than 100 microns, and filler is prone to cause the space in resin matrix, influence heat conductivility, and packing material size is excessive simultaneously, is prone to cause the composite product surface irregularity.
As a kind of more preferably scheme, the median size (D of said inorganic insulation heat conductive filler
50) more preferably 2 ~ 90 microns.
As a kind of more preferably scheme, the median size (D of said inorganic insulation heat conductive filler
50) more preferably 3 ~ 80 microns.
Heat conductive insulating thermoset composition of the present invention, its thermal conductivity is 3 ~ 10W/mK, volume specific resistance is equal to or greater than 10
12Ohmcm;
When described heat conductive insulating thermoset composition is when forming with the thermosetting resin of rubber-like, it also satisfies tear strength and is equal to or greater than 1.0 N/mm except satisfying above-mentioned heat conductivility and electrical insulation capability.
For physical strength and the electrical strength that increases this thermoset composition, can also before the mixing back or curing molding of thermoset composition, add strongthener.
A kind of goods by said heat conductive insulating thermoset composition.
The preparation method of said heat conductive insulating thermoset composition is for carry out mixing obtaining with thermosetting resin, carbon materials and inorganic insulation heat conductive filler in proportion.
Said mixing this area mixing facilities commonly used that can adopt carries out; As a kind of preferred version, said mixing facilities is preferably twin-roll mixing machine, three drum mixers, planetary stirring machine, the airtight mixing machine of vacuum pressure type (Banbury mixer), open kneader (mill).
Said heat conductive insulating thermoset composition has the characteristics of high thermal conductivity and high-insulativity, can be applied to prepare the heat conduction pad.
When needs are prepared into the heat conduction pad, can the thermoset composition that mix be cured moulding through molding device and obtain.
Described molding device can be this area curing molding equipment commonly used; As a kind of preferred version, said molding device is preferably screen process press collocation continous way baking oven, coating machine collocation continous way baking oven, screw-type extruder collocation continous way baking oven, rolling press collocation continous way baking oven, heat pressing forming machines, the framed molding device that leaves standstill.
As a kind of preferred version; The preparation method of said heat conduction pad more preferably with the heat conductive insulating thermoset composition that obtains after the mixing completion and spun glass (glass cloth), polyimide (PI) film, PEN (PEN) film, poly terephthalic acid terepthaloyl moietie (PET) film compound after, curing molding is the heat conduction pad again.
Compared with prior art, the present invention has following beneficial effect:
The present invention screens and compatibility through the prescription to thermoset composition in a large number; Make the thermoset composition that obtains have the characteristics of high thermal conductivity, high-insulativity and higher pliability (lower hardness); The thermal conductivity of said thermoset composition is 3 ~ 10W/mK, and volume specific resistance is equal to or greater than 10
12Ohmcm, the thermoset composition for the thermosetting resin by rubber-like prepares also has the characteristics of high-tear strength, and its tear strength is equal to or greater than 1.0 N/mm;
Thermoset composition of the present invention can be prepared into the heat conduction pad, in electronics and scatterer field, has wide practical use.
Embodiment
Below in conjunction with specific embodiment further explain the present invention.Unless stated otherwise, the reagent that the embodiment of the invention is addressed is the conventional reagent that uses in present technique field, all can from market, directly buy acquisition.
TSE3063 among the embodiment (A) and TSE3062 (B) are the liquid silicone resin, available from Momentive company; R-A201 is the thomel available from Teijin Kabushiki-gaisha company, and its length-to-diameter ratio is 6.25, and mean length is 50 microns, and mean diameter is 8 microns, thermal conductivity 550 W/mK; The length-to-diameter ratio of expanded graphite is 0.72, median size D
50Be 36 microns, thermal conductivity is 200 ~ 300 W/mK; CB-A70 and CB-P10 are the aluminum oxide (median size of CB-A70 is 75 microns, and the median size of CB-P10 is 7 microns) available from Showa Denko K.K. Corp.; Among the embodiment, the used Natural manganese dioxide and the median size D of zinc oxide
50It is 70 microns.
According to employed proportion of raw materials (wt%) in each embodiment and the comparative example in the table 1, use vacuum seal formula kneader according to ratio is mixing evenly separately.With above-mentioned mixing uniform material, quantitatively put into heat pressing forming machines then, at 150 ℃, under the 10min cure conditions, curing molding is the pad of 1.0mm.
Example has gone out the thermal conductivity value of different thermoset compositions, tear strength values, hardness value and volume specific resistance value in the table 1.All test results are all measured on the pad (1.0mm is thick) of curing molding.
Thermal conductivity value uses the auspicious neck LW9091IR of Science and Technology Co., Ltd. heat radiation module thermal resistance measuring equipment to test according to ASTM D5470 method, and specimen size is 1inch * 1inch (long * wide).
Tear strength values uses Instron 5569 electronic universal material testing machines to test according to ASTM D624 method, and test specimens is the T-shape test piece.
Hardness value uses Shao Shi digital display sclerometer to test according to ASTM D624 method.
Volume specific resistance carries out the volume specific resistance test according to ASTM D257, and pilot diameter is 50mm.The test before with sample 23 ℃ with 50% relative humidity under the processing 40 hours.
Embodiment 1 ~ 4 and Comparative Examples 1 ~ 3
Table 1
Can find out that from embodiment 4 and Comparative Examples 3 adopt the inorganic insulation heat conductive filler of the carbon materials replacement same components of 20wt%, the thermal conductivity of thermoset composition is increased to 6.7 W/mK by 3.7 W/mK;
Can find out from embodiment 1 ~ 4 and Comparative Examples 3; Add the inorganic insulation heat conductive filler that fibrous carbon materials replaces same components, can significantly improve the tear strength of thermoset composition, the replacement amount of 5wt%; The tear strength of product is increased to 1.1N/mm by 0.5N/mm, increases 120%; When the carbon materials addition increased to 20wt%, tear strength increased 260%.It can also be seen that, the increase of carbon materials, the decrease of hardness of thermoset composition, its flexibility obviously improves.
It can also be seen that from table 1, when the content of carbon materials when 20wt% is following, thermoset composition is an insulating, its volume specific resistance is greater than 10
12Ohmcm, when the content of carbon materials was higher than 20wt%, insulating property significantly suffered damage, and volume specific resistance is reduced to 10
6Ohmcm shows static resistance.
Embodiment 5 ~ 8 and Comparative Examples 4
Can find out from embodiment 5 and embodiment 6; Adopt Natural manganese dioxide or zinc oxide to replace the aluminum oxide of embodiment 4; The thermal conductivity of products obtained therefrom descends slightly, but because the existence of the thomel of high heat conduction, even the content of all fillers only accounts for the 70wt% of formulation weight; The thermal conductivity of embodiment 5 and embodiment 6 has still surpassed 5.6 W/mK, and has higher tear strength and electrical insulating property.
Can find out that from embodiment 7 and 8 employing epoxy resin or vinyl resin as the thermosetting resin matrix, still can obtain the compsn of thermal conductivity on 5.5 W/mK, and said composition have the excellent electric insulating ability.And, just need not consider tear strength didn't change because it is a nonrubber class thermosetting resin.
Can find out that from Comparative Examples 4 adopt the expanded graphite of thermal conductivity lower slightly (200 ~ 300 W/mK) to replace thomel, the heat conductivility of products obtained therefrom descends more obvious, is lower than 3 W/mK.
Can know from the foregoing description; In formula range of the present invention, when the content of thermosetting resin during at 30wt%, product can obtain higher thermal conductivity; Along with the consumption minimizing of resin and the consumption of filler increase, the thermal conductivity of product can be further improved.
Claims (10)
1. a heat conductive insulating thermoset composition is characterized in that, comprises the component that following percentage ratio by weight calculates:
5 %wt～30 wt% thermosetting resins; 5 wt%～20 wt% carbon materialses; With 50 wt%～90 wt% inorganic insulation heat conductive fillers; Wherein the thermal conductivity of employed carbon materials is more than 300 W/mK, and it is shaped as fibrous.
2. heat conductive insulating thermoset composition according to claim 1; It is characterized in that said thermosetting resin is any one or the two or more blend in urethane, tree elastomer, viton, epoxy resin, resol, polyimide resin, polyester, silicone resin, polymeric amide, vinyl resin, cyanate, bismaleimide-triazine resin or the benzoxazine colophony.
3. heat conductive insulating thermoset composition according to claim 1 is characterized in that the thermal conductivity of said carbon materials is more than 400 W/mK.
4. heat conductive insulating thermoset composition according to claim 1 is characterized in that the length-to-diameter ratio of said carbon materials is 0.2 ~ 500.
5. heat conductive insulating thermoset composition according to claim 1 is characterized in that, said inorganic insulation heat conductive filler is one or more a mixture in zinc oxide, Natural manganese dioxide, aluminum oxide, SP 1, aluminium nitride AlN, silicon nitride or the silit.
6. heat conductive insulating thermoset composition according to claim 1 is characterized in that the median size of said inorganic insulation heat conductive filler is 0.01 ~ 100 micron.
7. the goods of any said heat conductive insulating thermoset composition of claim of claim 1 ~ 6.
8. the preparation method of any said heat conductive insulating thermoset composition of claim in the claim 1 ~ 6 is characterized in that, comprises the steps: in proportion thermosetting resin, carbon materials and inorganic insulation heat conductive filler to be carried out mixing obtaining.
9. the application of the said heat conductive insulating thermoset composition of claim 1 ~ 6 in preparation heat conduction pad.
10. application as claimed in claim 9; It is characterized in that; The preparation method of said heat conduction pad is for after compound with the heat conductive insulating thermoset composition that obtains after the mixing completion and spun glass, Kapton, polyethylene naphthalate film or poly terephthalic acid terepthaloyl moietie film, and curing molding is the heat conduction pad again.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1352922A2 (en) * | 2002-04-10 | 2003-10-15 | Polymatech Co., Ltd. | Thermally conductive formed article and method of manufacturing the same |
| CN1617662A (en) * | 2003-11-12 | 2005-05-18 | 保力马科技株式会社 | Thermally conductive body and method of manufacturing the same |
-
2012
- 2012-06-11 CN CN201210190287XA patent/CN102675857A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1352922A2 (en) * | 2002-04-10 | 2003-10-15 | Polymatech Co., Ltd. | Thermally conductive formed article and method of manufacturing the same |
| CN1617662A (en) * | 2003-11-12 | 2005-05-18 | 保力马科技株式会社 | Thermally conductive body and method of manufacturing the same |
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