CN103077899A - Complex method for chip support plate and chip support plate prepared thereby - Google Patents
Complex method for chip support plate and chip support plate prepared thereby Download PDFInfo
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- CN103077899A CN103077899A CN201310022541XA CN201310022541A CN103077899A CN 103077899 A CN103077899 A CN 103077899A CN 201310022541X A CN201310022541X A CN 201310022541XA CN 201310022541 A CN201310022541 A CN 201310022541A CN 103077899 A CN103077899 A CN 103077899A
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- support plate
- chip support
- conducting glue
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Abstract
The invention discloses a complex method for a chip support plate and a chip support plate prepared thereby. The traditional subtraction processing mode is abandoned; an incremental method process characterized in that compounding is carried out after punching is adopted, so that the structure precision of the chip support plate is higher, and the cost is simultaneously lowered; solid heat-conducting glue is applied to a photoelectric cooling support plate, the cooling effect of the photoelectric cooling support plate is better, and the new solid heat-conducting glue application field is created by aiming at chip packaging.
Description
Technical field
The present invention relates to a kind of complex method of chip support plate and the chip support plate that makes according to the method.
Background technology
Along with chip (Ban Daoti ﹠amp; LED) development trend of the increasing of power and the lightening miniaturization of chip, the thermal diffusivity of chip are more aobvious important, also higher to the required precision of its structure simultaneously.
Now in the encapsulation field of chip, the support plate of chip need to process the recessed cup of carries chips, traditional recessed cup is mostly processed in the mode of subtraction, be about to each layer of support plate compound good after, dig out a recessed cup with physical means thereon again, but this processing mode is so that the smooth not screw thread that is covered with of loading end of recessed cup bottom, recessed cup is difficult to square up with the position that loading end joins, so that chip contraposition difficulty when installing, having affected follow-up installation cooperates, also can cause higher fraction defective, increase cost.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of complex method of chip support plate, solid-state heat-conducting glue is applied to photoelectricity heat radiation support plate, adopt simultaneously and increase the recessed cup that method technique is processed chip support plate, so that support plate has good heat dispersion, structure precision is higher in the time of cost, and the present invention also provides a kind of chip support plate that makes according to the method simultaneously.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of complex method of chip support plate may further comprise the steps:
A., solid-state heat-conducting glue and metal substrate I and metal substrate II are provided, and the metal substrate II is used as loading plate;
B. metal substrate I and solid-state heat-conducting glue are carried out Combined Processing;
C. punching on the composite plate after metal substrate I and the solid-state heat-conducting glue Combined Processing, the recessed cup of a carries chips of formation;
D. the one side that the composite plate after the punching is had solid-state heat-conducting glue is carried out vacuum pressing-combining with the metal substrate II.
For metal substrate I and/or metal substrate II are cleaned, and in the certain roughness of its surface formation, make things convenient for each layer compound, can also before step a, carry out alligatoring, cleaning, passivation, oxidation and dry the processing to metal substrate I and/or metal substrate II.
In order to embody outward appearance, can also after steps d, carry out painted processing to metal substrate I, metal substrate II and solid-state heat-conducting glue.
When carrying out the vacuum pressing-combining of steps d, temperature is 160～190 ℃, and vacuum degree is 400～760mm Hg, and pressing time is 50～80 minutes.
Described metal substrate I, metal substrate II are aluminium base, copper base, iron substrate or copper alloy substrate.
Further, described solid-state heat-conducting glue comprises resin and filler, the mass percent of its constituent, and modification high temperature phenolic resins, epoxy resin, acrylic resin and polyimide resin account for 20～30%, aluminium oxide AL
2O
3Account for 50～60%, boron nitride BN accounts for 5～10%.
Further, described metal substrate I and metal substrate II are measure-alike.
Complex method according to the said chip support plate is processed the chip support plate that obtains, comprise the metal substrate II as loading plate, and the compound composite plate that is installed on the metal substrate II, described composite plate comprises the solid-state heat-conducting glue that fits in loading plate and the metal substrate I that is arranged on the solid-state heat-conducting glue, is provided with on the described composite plate be used to the recessed cup of laying chip.
The invention has the beneficial effects as follows: abandon the subtraction mode of the compound again punching of elder generation in the past, adopt the again compound method that increases technique of first punching, so that the structure precision of chip support plate is higher, reduced simultaneously cost; Solid-state heat-conducting glue is applied to make its heat dispersion better on the photoelectricity heat radiation support plate, has started the frontier that solid-state heat-conducting glue is used for chip package.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the mounting structure schematic diagram of chip support plate of the present invention and chip;
Fig. 2 is the structural representation of chip support plate of the present invention.
Embodiment
See figures.1.and.2, the complex method of a kind of chip support plate of the present invention may further comprise the steps:
A., solid-state heat-conducting glue 3 and metal substrate I 1 and metal substrate II 2 are provided, and described metal substrate I 1 and metal substrate II 2 are measure-alike, and metal substrate II 2 is used as loading plate;
B. metal substrate I 1 and solid-state heat-conducting glue 3 are carried out Combined Processing, recombination process only need to heat the one side that solid-state heat-conducting glue 3 and metal substrate I 1 are fitted again to press close to a little, just can rely on the adhesive force of solid-state heat-conducting glue 3 crosslinking curings to make both compound;
C. punching on the composite plate after metal substrate I 1 and solid-state heat-conducting glue 3 Combined Processing, the recessed cup 4 of a carries chips 5 of formation;
D. the one side that the composite plate after the punching is had solid-state heat-conducting glue 3 is carried out vacuum pressing-combining with metal substrate II 2, and in this embodiment, temperature is controlled at 160～190 ℃, and vacuum degree is 400～760mm Hg, and pressing time is 50～80 minutes.
For metal substrate I 1 and/or metal substrate II 2 are cleaned, and form certain roughness on its surface, make things convenient for each layer compound, before step a, metal substrate I 1 and metal substrate II 2 are carried out alligatoring, cleaning, passivation, oxidation and dry the processing.
In order to embody outward appearance, can also after steps d, carry out painted processing to metal substrate I 1, metal substrate II 2 and solid-state heat-conducting glue 3.Painted can be the colors such as black, gold, silver gray, green.
Described metal substrate I 1, metal substrate II 2 are aluminium base, copper base, iron substrate or copper alloy substrate.
Described solid-state heat-conducting glue 3 uses immobilising solid-state heat conduction PP, guarantee that its compound recurve cup 4 of finishing can not have excessive glue all around, described solid-state heat-conducting glue 3 comprises resin and filler, the mass percent of its constituent, modification high temperature phenolic resins, epoxy resin, acrylic resin and polyimide resin account for 20～30%, aluminium oxide AL
2O
3Account for 50～60%, boron nitride BN accounts for 5～10%, also comprises in addition a certain amount of plasticizer and curing agent.In the mixed process of solid-state heat-conducting glue 3 production and processings, fully stir, making filler form tiny powder is suspended in the resin, form metastable liquid, stirring frequency is higher, and mixed effect is better, and solid-state heat-conducting glue 3 performances that obtain are better, the present invention adopts ultrasonic transducer generation high frequency sound wave to mix, so that its good heat conductivity, the ceiling temperature of thermal stress can reach 288 ℃, and thickness is 0.1～0.4mm only.
Complex method according to the said chip support plate is processed the chip support plate that obtains, comprise the metal substrate II 2 as loading plate, and the compound composite plate that is installed on the metal substrate II 2, described composite plate comprises the solid-state heat-conducting glue 3 that fits in loading plate and the metal substrate I 1 that is arranged on the solid-state heat-conducting glue 3, is provided with on the described composite plate be used to the recessed cup 4 of laying chip 5.
In this chip support plate during packaged chip 5, chip 5 is placed in the recessed cup 4, and chip 5 contacts with metal substrate II 2, and places among metal substrate I 1 and the solid-state heat-conducting glue 3, be conducive to heat radiation, chip support plate top is equipped with a Flexible Printed Circuit 6 that is connected with chip 5.
Certainly, the present invention can also have other structural distortion except above-mentioned execution mode, and these equivalent technical solutions also should be within its protection range.
Claims (10)
1. the complex method of a chip support plate is characterized in that, may further comprise the steps:
Solid-state heat-conducting glue and metal substrate I and metal substrate II are provided, and the metal substrate II is used as loading plate;
Metal substrate I and solid-state heat-conducting glue are carried out Combined Processing;
Punching on the composite plate after metal substrate I and the solid-state heat-conducting glue Combined Processing, the recessed cup of a carries chips of formation;
The one side that composite plate after the punching is had solid-state heat-conducting glue is carried out vacuum pressing-combining with the metal substrate II.
2. the complex method of a kind of chip support plate according to claim 1 is characterized in that: before step a the metal substrate I is carried out alligatoring, cleaning, passivation, oxidation and dry the processing.
3. the complex method of a kind of chip support plate according to claim 1 is characterized in that: before step a the metal substrate II is carried out alligatoring, cleaning, passivation, oxidation and dry the processing.
4. the complex method of a kind of chip support plate according to claim 1 is characterized in that: after steps d metal substrate I, metal substrate II and solid-state heat-conducting glue are carried out painted processing.
5. the complex method of a kind of chip support plate according to claim 1, it is characterized in that: when carrying out the vacuum pressing-combining of steps d, temperature is 160～190 ℃, and vacuum degree is 400～760mm Hg, and pressing time is 50～80 minutes.
6. the complex method of a kind of chip support plate according to claim 1, it is characterized in that: described metal substrate I, metal substrate II are aluminium base, copper base, iron substrate or copper alloy substrate.
7. the complex method of a kind of chip support plate according to claim 1, it is characterized in that: described solid-state heat-conducting glue comprises resin and filler, the mass percent of its constituent, modification high temperature phenolic resins, epoxy resin, acrylic resin and polyimide resin account for 20～30%, aluminium oxide AL
2O
3Account for 50～60%, boron nitride BN accounts for 5～10%.
8. the complex method of a kind of chip support plate according to claim 7 is characterized in that: also comprise plasticizer and curing agent in the described solid-state heat-conducting glue.
9. the complex method of a kind of chip support plate according to claim 1, it is characterized in that: described metal substrate I and metal substrate II are measure-alike.
One kind according to claim 1-9 in the chip support plate that makes of each complex method, it is characterized in that: comprise the metal substrate II as loading plate, and the compound composite plate that is installed on the metal substrate II, described composite plate comprises the solid-state heat-conducting glue that fits in loading plate and the metal substrate I that is arranged on the solid-state heat-conducting glue, is provided with on the described composite plate be used to the recessed cup of laying chip.
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| CN201310022541XA CN103077899A (en) | 2013-01-21 | 2013-01-21 | Complex method for chip support plate and chip support plate prepared thereby |
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| CN201310022541XA CN103077899A (en) | 2013-01-21 | 2013-01-21 | Complex method for chip support plate and chip support plate prepared thereby |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114430627A (en) * | 2022-04-02 | 2022-05-03 | 东莞市春瑞电子科技有限公司 | Manufacturing method of composite sensor packaging support plate and laser radar sensor |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1240566A (en) * | 1996-10-21 | 2000-01-05 | 艾利森电话股份有限公司 | Means and method for mounting electronic device |
| CN201478296U (en) * | 2009-05-05 | 2010-05-19 | 新利虹科技股份有限公司 | High-power radiating substrate |
| CN101974208A (en) * | 2010-08-20 | 2011-02-16 | 广东生益科技股份有限公司 | High thermal conductivity resin composition and high thermal conductivity coated metal foil board manufactured by using same |
| CN202084524U (en) * | 2010-10-19 | 2011-12-21 | 联京光电股份有限公司 | Packaging plate |
| WO2012063935A1 (en) * | 2010-11-13 | 2012-05-18 | 日東電工株式会社 | Bubble-containing thermally-conductive resin-composition layer, manufacturing method therefor, and pressure-sensitive adhesive sheet using said resin-composition layer |
| CN102675857A (en) * | 2012-06-11 | 2012-09-19 | 佛山市南海区研益机电有限公司 | Heat-conducting and insulating thermosetting composition as well as preparation method and application thereof |
| CN102883524A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method |
-
2013
- 2013-01-21 CN CN201310022541XA patent/CN103077899A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1240566A (en) * | 1996-10-21 | 2000-01-05 | 艾利森电话股份有限公司 | Means and method for mounting electronic device |
| CN201478296U (en) * | 2009-05-05 | 2010-05-19 | 新利虹科技股份有限公司 | High-power radiating substrate |
| CN101974208A (en) * | 2010-08-20 | 2011-02-16 | 广东生益科技股份有限公司 | High thermal conductivity resin composition and high thermal conductivity coated metal foil board manufactured by using same |
| CN202084524U (en) * | 2010-10-19 | 2011-12-21 | 联京光电股份有限公司 | Packaging plate |
| WO2012063935A1 (en) * | 2010-11-13 | 2012-05-18 | 日東電工株式会社 | Bubble-containing thermally-conductive resin-composition layer, manufacturing method therefor, and pressure-sensitive adhesive sheet using said resin-composition layer |
| CN102883524A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Interconnection conducting and heat-conducting method of double-faced circuit board and double-faced circuit board based on method |
| CN102675857A (en) * | 2012-06-11 | 2012-09-19 | 佛山市南海区研益机电有限公司 | Heat-conducting and insulating thermosetting composition as well as preparation method and application thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114430627A (en) * | 2022-04-02 | 2022-05-03 | 东莞市春瑞电子科技有限公司 | Manufacturing method of composite sensor packaging support plate and laser radar sensor |
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Application publication date: 20130501 |