CN102665374A - 印刷电路板组装方法 - Google Patents
印刷电路板组装方法 Download PDFInfo
- Publication number
- CN102665374A CN102665374A CN2012101195385A CN201210119538A CN102665374A CN 102665374 A CN102665374 A CN 102665374A CN 2012101195385 A CN2012101195385 A CN 2012101195385A CN 201210119538 A CN201210119538 A CN 201210119538A CN 102665374 A CN102665374 A CN 102665374A
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- metal substrate
- power amplifier
- motherboard
- printing
- printed circuit
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 60
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000009434 installation Methods 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 230000013011 mating Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 9
- 230000001680 brushing effect Effects 0.000 abstract 1
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 2
- 229910007637 SnAg Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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- Mounting Of Printed Circuit Boards And The Like (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210119538.5A CN102665374B (zh) | 2012-04-20 | 2012-04-20 | 印刷电路板组装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210119538.5A CN102665374B (zh) | 2012-04-20 | 2012-04-20 | 印刷电路板组装方法 |
Publications (2)
Publication Number | Publication Date |
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CN102665374A true CN102665374A (zh) | 2012-09-12 |
CN102665374B CN102665374B (zh) | 2014-10-29 |
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CN201210119538.5A Expired - Fee Related CN102665374B (zh) | 2012-04-20 | 2012-04-20 | 印刷电路板组装方法 |
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CN (1) | CN102665374B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106298688A (zh) * | 2015-05-28 | 2017-01-04 | 台达电子工业股份有限公司 | 封装型功率电路模块 |
CN107592726A (zh) * | 2017-09-18 | 2018-01-16 | 景旺电子科技(龙川)有限公司 | 一种金属高效散热板制作方法 |
CN107971602A (zh) * | 2017-12-28 | 2018-05-01 | 北京北广科技股份有限公司 | 一种金属基板电路板焊接工装及其使用方法 |
CN113798617A (zh) * | 2021-09-08 | 2021-12-17 | 苏州华太电子技术有限公司 | 焊接方法、电子组件及夹具 |
CN115334774A (zh) * | 2022-10-13 | 2022-11-11 | 深圳市首航新能源股份有限公司 | 逆变器的制造方法以及逆变器 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050205990A1 (en) * | 2004-03-18 | 2005-09-22 | Wang C F | Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier |
US20070209828A1 (en) * | 2006-03-08 | 2007-09-13 | Maxtor Corporation | Small Form Factor PCBA Process Carrier |
CN201393361Y (zh) * | 2009-03-05 | 2010-01-27 | 苏州宇达电通有限公司 | 球栅阵列封装元件更换载具 |
-
2012
- 2012-04-20 CN CN201210119538.5A patent/CN102665374B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050205990A1 (en) * | 2004-03-18 | 2005-09-22 | Wang C F | Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier |
US20070209828A1 (en) * | 2006-03-08 | 2007-09-13 | Maxtor Corporation | Small Form Factor PCBA Process Carrier |
CN201393361Y (zh) * | 2009-03-05 | 2010-01-27 | 苏州宇达电通有限公司 | 球栅阵列封装元件更换载具 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106298688A (zh) * | 2015-05-28 | 2017-01-04 | 台达电子工业股份有限公司 | 封装型功率电路模块 |
US10104813B2 (en) | 2015-05-28 | 2018-10-16 | Delta Electronics, Inc. | Power circuit module |
CN106298688B (zh) * | 2015-05-28 | 2018-11-06 | 台达电子工业股份有限公司 | 封装型功率电路模块 |
CN107592726A (zh) * | 2017-09-18 | 2018-01-16 | 景旺电子科技(龙川)有限公司 | 一种金属高效散热板制作方法 |
CN107971602A (zh) * | 2017-12-28 | 2018-05-01 | 北京北广科技股份有限公司 | 一种金属基板电路板焊接工装及其使用方法 |
CN107971602B (zh) * | 2017-12-28 | 2023-09-12 | 北京北广科技股份有限公司 | 一种金属基板电路板焊接工装及其使用方法 |
CN113798617A (zh) * | 2021-09-08 | 2021-12-17 | 苏州华太电子技术有限公司 | 焊接方法、电子组件及夹具 |
CN115334774A (zh) * | 2022-10-13 | 2022-11-11 | 深圳市首航新能源股份有限公司 | 逆变器的制造方法以及逆变器 |
CN115334774B (zh) * | 2022-10-13 | 2023-03-24 | 深圳市首航新能源股份有限公司 | 逆变器的制造方法以及逆变器 |
Also Published As
Publication number | Publication date |
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CN102665374B (zh) | 2014-10-29 |
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Owner name: JINGXIN COMMUNICATION SYSTEM CO LTD (GUANGZHOU) Free format text: FORMER OWNER: COMBA TELECOM SYSTEMS (CHINA) CO., LTD. Effective date: 20150821 |
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Effective date of registration: 20200115 Address after: 510663 Guangzhou Science City, Guangdong Shenzhou Road, No. 10 Patentee after: COMBA TELECOM SYSTEMS (CHINA) Ltd. Address before: 510663, No. 6, Jin Lu, Guangzhou economic and Technological Development Zone, Guangdong, Guangzhou Patentee before: COMBA TELECOM SYSTEMS (GUANGZHOU) Ltd. |
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Address after: 510663 Shenzhou Road 10, Science City, Guangdong, Guangzhou Patentee after: Jingxin Network System Co.,Ltd. Address before: 510663 Shenzhou Road 10, Science City, Guangdong, Guangzhou Patentee before: COMBA TELECOM SYSTEMS (CHINA) Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20141029 |