CN102655981B - Foreign object removal device - Google Patents

Foreign object removal device Download PDF

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Publication number
CN102655981B
CN102655981B CN201080056374.5A CN201080056374A CN102655981B CN 102655981 B CN102655981 B CN 102655981B CN 201080056374 A CN201080056374 A CN 201080056374A CN 102655981 B CN102655981 B CN 102655981B
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CN
China
Prior art keywords
foreign matter
mentioned
grinding
band
adhesion
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Expired - Fee Related
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CN201080056374.5A
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Chinese (zh)
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CN102655981A (en
Inventor
仲谷知真
藤井茂喜
佐藤仁
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Sharp Corp
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Sharp Corp
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Publication of CN102655981A publication Critical patent/CN102655981A/en
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Expired - Fee Related legal-status Critical Current
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/033Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A device is configured such that a tape which comprises either an abrasive and/or an adhesive on a surface thereof can be run and pressed against a foreign object on the surface of a workpiece, and the state of contact of the tape with a foreign object can be switched between a surface contact state and a point contact state or a line contact state, said surface contact state being a state wherein the foreign object is removed by adhesion, and said point contact state or line contact state being a state wherein the foreign object is removed by abrasion.

Description

Foreign substance removing apparatus
Technical field
The present invention relates to foreign substance removing apparatus, be particularly present in the foreign substance removing apparatus of the foreign matter of surface of the work with the band removing of movement.
Background technology
In the past, in TFT (Thin Film Transistor: the thin film transistor (TFT)) substrate of color liquid crystal display arrangement and the making of CF (Color Filter: colored filter) substrate, form various film on the glass substrate, therefore, when the fragment of the metal powder that the moving part in this process from film formation device produces, filmogen, the various fibers etc. that produce from clothing etc. are attached to substrate surface as foreign matter, there is this foreign matter and become defect, the problem that the displays such as pixel disappearance are bad occurs.
In order to prevent this display bad, in the making of TFT substrate, CF substrate, have employed the correction operation using foreign substance removing apparatus to remove the foreign matter being attached to substrate surface.In this correction operation, from making the damage of substrate surface become minimal viewpoint, being detected size and the position of foreign matter by foreign body detecting device, grinding removing foreign matter with fixing a point according to these.
Known above-mentioned foreign substance removing apparatus is following formation (for example, referring to patent document 1), possesses: extract reel out, its spooling has lapping tape; Winding reel, its winding is from the lapping tape extracting reel extraction out; And hard press head, it is configured between this extraction reel and winding reel, and lapping tape is moved, while lapping tape is pressed on foreign matter with press head, and grinding removing foreign matter thus.
prior art document
patent document
Patent document 1: JP 2008-290166 publication
Summary of the invention
the problem that invention will solve
But when in TFT substrate and CF substrate, the alignment films of the tropism control of liquid crystal molecule is carried out in formation, foreign matter also becomes problem to the attachment of this alignment layer surface, after forming alignment films, his-and-hers watches surface layer brings harmful effect, therefore, cannot implement to scrub, the matting such as Ultrasonic Cleaning.Therefore, need to grind the foreign matter that removing is attached to alignment layer surface with using above-mentioned foreign substance removing apparatus to fix a point.
But, in the foreign matter being attached to alignment layer surface, exist and be firmly fixed at alignment films and the stronger foreign matter of adhesive force and the foreign matter more weak to the adhesive force of alignment films, when using the foreign matter of lapping tape grinding removing alignment layer surface, when the adhesive force of this foreign matter to alignment films is more weak, along with the movement of lapping tape, sometimes foreign matter itself flies to other position, or the polished band of foreign matter pulls and pulls in alignment layer surface formation, therefore, worry to bring obstacle to the tropism control of the liquid crystal molecule in display unit finished product.
Therefore, can consider to make the foreign matter more weak to the adhesive force of alignment films be attached to band and remove this foreign matter, suppress the damage of the alignment films caused by grinding operation thus, but, namely use the hard press head same with grinding operation that adhesion zone is pressed on foreign matter, adhesion zone and foreign matter also can become point cantact state or linear contact lay state, and contact area is less, adhesive strength is lower, and foreign matter is difficult to be attached to adhesion zone.
The present invention completes in view of this point, its object is to reliably remove the foreign matter more weak to the adhesive force of workpiece by adhesion, by the foreign matter that grinding removing is stronger to the adhesive force of workpiece, thus while prevent the foreign matter being present in surface of the work to the damage of this surface of the work, removing is present in the foreign matter of surface of the work.
for the scheme of dealing with problems
In order to achieve the above object, the present invention be when removed by grinding the foreign matter of surface of the work situation and when removing the foreign matter of surface of the work by adhesion, change foreign matter and the contact condition of band pressing on this foreign matter.
Specifically, the present invention is present in the foreign substance removing apparatus of the foreign matter of surface of the work for object with removing, adopts solution below.
Namely, the feature of the 1st invention is, be configured to: the Tape movement that can make to have on surface grinding-material and sticker, pressed on the foreign matter of surface of the work, and the contact condition of above-mentioned band and this foreign matter can be switched to the point cantact state or linear contact lay state of grinding and removing foreign matter and adhere and remove the surface contact state of foreign matter, above-mentioned foreign substance removing apparatus possesses: extract reel out, its spooling has the band on surface with above-mentioned grinding-material and sticker; Winding reel, the band that its winding is extracted out from above-mentioned extraction reel; And press head, it is configured between above-mentioned extraction reel and above-mentioned winding reel, and above-mentioned band is pressed on foreign matter, and above-mentioned press head is configured to the top ends contacted with above-mentioned band to be switched to: the indeformable hard state when above-mentioned band being pressed on foreign matter; With the soft state that elastic deformation occurs according to the shape of this foreign matter when above-mentioned band being pressed on foreign matter.
According to above-mentioned formation, when grinding removing foreign matter, foreign matter becomes point cantact state or linear contact lay state with the contact condition of the band pressing on this foreign matter, therefore, can grind the foreign matter that removing is stronger to the adhesive force of workpiece with fixing a point.On the other hand, when adhering removing foreign matter, foreign matter becomes surface contact state with the contact condition of the band pressing on foreign matter, therefore, obtain making the foreign matter more weak to the adhesive force of workpiece be attached to the sufficient adhesive strength of band, this foreign matter of removing of can reliably adhering.Therefore, if adhesion removing is to after the foreign matter that the adhesive force of workpiece is more weak, grinding removing remains in the stronger foreign matter of the adhesive force of surface of the work, then the foreign matter being present in surface of the work can be prevented the damage of this surface of the work, and correction is on one side present in the foreign matter of surface of the work.
The feature of the 2nd invention is, in the foreign substance removing apparatus of the 1st invention, possesses: extract reel out, its spooling has the band on surface with above-mentioned grinding-material and sticker; Winding reel, the band that its winding is extracted out from above-mentioned extraction reel; And press head, it is configured between above-mentioned extraction reel and above-mentioned winding reel, and above-mentioned band is pressed on foreign matter, and above-mentioned press head is configured to the top ends contacted with above-mentioned band to be switched to: the indeformable hard state when above-mentioned band being pressed on foreign matter; With the soft state that elastic deformation occurs according to the shape of this foreign matter when above-mentioned band being pressed on foreign matter.
According to above-mentioned formation, when grinding removing foreign matter, the top ends of press head is made to be in hard state, on the other hand, when adhering removing foreign matter, making the top ends of press head be in soft state, the contact condition of foreign matter and band can be switched thus by possessing 1 unit extracting reel, winding reel and press head out, therefore, compact device can be set to form.And, when grinding situation and the adhesion removing foreign matter of removing foreign matter, without the need to being suitably replaced by special cell, therefore, the removing operation of surface of the work foreign matter promptly can be carried out.
And, as in the past, when adhesion zone being pressed on foreign matter with hard press head, when the pressing force of press head is crossed strong, worry to injure surface of the work by foreign matter, to this, according to the formation of above-mentioned 2nd invention, when adhering removing foreign matter, make the top ends of press head be in soft state, thus, the top ends by means of this of foreign matter is relaxed the pressing force of surface of the work, therefore, the damage of surface of the work is prevented well.
The feature of the 3rd invention is, in the foreign substance removing apparatus of the 2nd invention, above-mentioned press head possesses: the head main body of tubular, and it has opening on top, with softer, elastic parts, its top being incorporated in this head main body in the mode of giving prominence to a part from above-mentioned opening is inner, the inside of above-mentioned head main body is connected with the pressure regulating device of adjustment internal pressure, when grinding removing foreign matter, improve the internal pressure of above-mentioned head main body by above-mentioned pressure regulating device and above-mentioned softer, elastic component compresses is hardened, on the other hand, when adhering removing foreign matter, the internal pressure of above-mentioned head main body is reduced by above-mentioned pressure regulating device, when above-mentioned band is pressed on foreign matter, can make above-mentioned softer, elastic parts, according to the shape of this foreign matter, elastic deformation occur.
According to above-mentioned formation, the internal pressure of adjustment head main body, can not press head be moved and make the top ends of press head switch to hard state and soft state simply thus, therefore, can not worry because this top ends state switch and make the position of band from the beginning top ends depart from.Therefore, even if do not arrange the special entity preventing the position of being with from departing from, also can continue and carry out the grinding removing operation of foreign matter and removing operation of adhering well.
The feature of the 4th invention is, in the foreign substance removing apparatus of the 2nd invention, above-mentioned press head possesses: rotary body, and it is supported in revolvable mode; With grinding pressing piece and adhesion pressing piece, it is provided projectingly on the outer peripheral face of this rotary body, above-mentioned grinding pressing piece comprises the indeformable hard part when above-mentioned band being pressed on foreign matter, above-mentioned adhesion pressing piece comprises the softer, elastic parts that elastic deformation occurs according to the shape of this foreign matter when above-mentioned band being pressed on foreign matter, is configured to, by making above-mentioned rotary body rotate, the top ends of above-mentioned press head is switched to above-mentioned grinding pressing piece and above-mentioned adhesion pressing piece.
According to above-mentioned formation, rotary body is rotated, the top ends of press head is switched to and the pressing piece (grinding pressing piece or adhesion pressing piece) grinding the situation that removes foreign matter and the situation that removes foreign matter of adhering is corresponding, this top ends can be switched to hard state and soft state thus, therefore, the grinding that simple formation can be relied on to carry out foreign matter well by 1 unit removes operation and adhesion removing operation.
The feature of the 5th invention is, in any one foreign substance removing apparatus in the 2 to the 4, on the surface of above-mentioned band, grinding-material is fixed to throughout more than 50% of whole belt surface and the area of less than 80% by sticker, be not fixed with the belt surface part of above-mentioned grinding-material, above-mentioned sticker exposes.
The adhesive force of foreign matter to workpiece being carried out adhesion removing by the above-mentioned foreign substance removing apparatus formed is more weak, therefore, the area of the sticker that belt surface has can be less, on the other hand, in order to promptly grind the removing foreign matter stronger to the adhesive force of workpiece, the area of the grinding-material that belt surface has is more large more preferred.Thus, as constituted described above, if grinding-material is fixed to throughout more than 50% of whole belt surface and the area of less than 80% larger, in other belt surface part, sticker exposes, then can not damaging the grinding function brought by slidingly contacting with foreign matter, obtaining the sufficient adhesion function that foreign matter is adhered to, grinding function and these two functions of adhesion function can be realized well with 1 band.
The feature of the 6th invention is, possess grinding unit and adhesion unit, above-mentioned grinding unit has: reel is extracted in grinding out, and its spooling has the lapping tape on surface with grinding-material; Grinding winding reel, its winding is from this grinding lapping tape extracting reel extraction out; And grinding press head, it is configured in above-mentioned grinding and extracts out between reel and above-mentioned grinding winding reel, above-mentioned lapping tape is pressed on the foreign matter of surface of the work, above-mentioned adhesion unit has: reel is extracted in adhesion out, and its spooling has the adhesion zone on surface with sticker; Adhesion winding reel, its winding is from this adhesion adhesion zone extracting reel extraction out; And adhesion press head, it is configured in above-mentioned adhesion and extracts out between reel and above-mentioned adhesion winding reel, above-mentioned adhesion zone is pressed on the foreign matter of surface of the work, the top ends contacted with lapping tape of above-mentioned grinding press head comprises the indeformable hard part when lapping tape being pressed on foreign matter, and the top ends contacted with adhesion zone of above-mentioned adhesion press head comprises the softer, elastic parts that elastic deformation occurs according to the shape of this foreign matter when adhesion zone being pressed on foreign matter.
According to above-mentioned formation, grinding unit can be utilized, adhesion unit carries out the grinding removing of foreign matter respectively, the adhesion of foreign matter removes.Like this, when grinding situation and the adhesion removing foreign matter of removing foreign matter, with the band special removing foreign matter of separate unit, this improves the removing performance of foreign matter.Namely, grinding unit, adhesion unit are used in surface respectively fully to be had the lapping tape of grinding agent, has the adhesion zone of sticker on whole surface, when relying on the situation and adhesion removing foreign matter that are simply formed in grinding removing foreign matter thus, ad hoc improve the removing performance of foreign matter respectively.Therefore, grinding removing and the adhesion removing of foreign matter can be carried out well.
invention effect
According to the present invention, when grinding removing foreign matter, when band is pressed on foreign matter, this band and foreign matter become mutual point cantact state or linear contact lay state, when adhering removing foreign matter, when band is pressed on foreign matter, this band and foreign matter become mutual surface contact state, the foreign matter more weak to the adhesive force of workpiece can be removed more reliably thus by adhesion, and the foreign matter stronger to the adhesive force of workpiece can be removed with fixing a point by grinding, therefore, can while prevent the foreign matter being present in surface of the work to the damage of this surface of the work, while removing is present in the foreign matter of surface of the work.Consequently, can prevent in display unit finished product, produce pixel disappearance etc. and show bad, can display quality be improved.
Accompanying drawing explanation
Fig. 1 is the stereogram of the foreign substance removing apparatus that embodiment 1 is summarily shown.
Fig. 2 is the pie graph of the amending unit that embodiment 1 is summarily shown.
Fig. 3 is the adhesion removal step figure of embodiment 1.
Fig. 4 is the grinding removal step figure of embodiment 1.
Fig. 5 is the pie graph of the amending unit that embodiment 2 is summarily shown.
Fig. 6 is the adhesion removal step figure of embodiment 2.
Fig. 7 is the grinding removal step figure of embodiment 2.
Fig. 8 is the stereogram of the foreign substance removing apparatus that embodiment 3 is summarily shown.
Fig. 9 is the pie graph of the grinding unit that embodiment 3 is summarily shown.
Figure 10 is the pie graph of the adhesion unit that embodiment 3 is summarily shown.
Figure 11 is the adhesion removal step figure of embodiment 3.
Figure 12 is the grinding removal step figure of embodiment 3.
Detailed description of the invention
Below, embodiments of the present invention are explained with reference to the accompanying drawings.In addition, the invention is not restricted to each embodiment below.
" working of an invention mode 1 "
Fig. 1 is the summary stereogram of the foreign substance removing apparatus S of present embodiment.
Base station 1 based on this foreign substance removing apparatus S possesses into and the work stage 3 be fixedly arranged on base station 1, this work stage 3 is placed with the workpiece W as revising object.The workpiece W of present embodiment is such as the TFT substrate after surface forms alignment films forming liquid crystal indicator.On work stage 3, be formed with multiple adsorption hole, this each adsorption hole is connected with vacuum suction unit such as vavuum pumps.Further, work stage 3 is configured to by driving vacuum suction unit to adsorb workpiece W placed by maintenance.
Base station 1 is also provided with travel mechanism 4, and the amending unit 10 of the defect caused by foreign matter revising surface of the work is supported for by above-mentioned travel mechanism 4 can be upper mobile at left and right directions (being X-direction in FIG), fore-and-aft direction (being Y-direction in FIG) and above-below direction (being Z-direction in FIG).This travel mechanism 4 possesses: a pair guide rail 5, and it configures in the mode clipping work stage 3, extends in the longitudinal direction; With gantry portion 7 of gantry (gantry) structure, it is supported for and can moves in the longitudinal direction on this pair guide rail 5.
Gantry portion 7 relies on the movable mechanism such as feed screw mechanism, linear electric machine (not shown) of action because of the rotation of drive motors and moves in the longitudinal direction along a pair guide rail 5.In the front face side in this gantry portion 7, be provided with a pair guide rail 7a extended in the lateral direction and the ball screw 7b extended between this pair guide rail 7a, probe 8 is supported for and can moves in the lateral direction on guide rail 7a.This probe 8 has vernier 8a, above-mentioned vernier 8a overleaf side is provided with the ball nut (not shown) screwed togather with ball screw 7b, ball screw 7b rotates by means of the drive motors 7c of the end being arranged on ball screw 7b, moves in the lateral direction thus along guide rail 7a.
Probe 8 is provided with the height measuring mechanism 9 of measuring workpieces apparent height and the amending unit 10 near the side of height measuring mechanism 9.Height measuring mechanism 9 such as possesses known digital micromirror device (Digital Micromirror Device).This digital micromirror device is the one of the display element of the multiple small minute surface (micro mirror) not shown at surface alignment, is configured to use so-called photon excited to grasp the height distribution of surface of the work.
In addition, height measuring mechanism 9 possesses digital micromirror device, but also can replace digital micromirror device and use known other optical pickocff, air borne sensor etc.
Amending unit 10 is linked with the elevating mechanism (not shown) forming above-mentioned travel mechanism 4.This elevating mechanism is configured to make amending unit 10 lifting moving at above-below direction.This amending unit 10 is loaded into probe 8 in removably mode.Therefore, when aftermentioned be finished band T, change whole amending unit 10, new band T can be provided without delay thus, the efficient removing operation of foreign matter can be carried out.
Fig. 2 is the summary pie graph of amending unit 10.
Amending unit 10 is formed as the card casket shape same with common audiotape, extraction reel 12 and winding reel 13 are set to can rotate relative to main part 11, above-mentioned extraction reel 12 is wound with band T, and above-mentioned winding reel 13 is vacated interval in the side of extracting reel 12 out and configures and reel from the band T extracting reel 12 extraction out.This extraction reel 12 and winding reel 13 are driven by the drive motors (not shown) being located at main part 11.In main part 11, extracting a pair guide reel 14 being also configured with pilot tape T between reel 12 and winding reel 13 out, between this pair guide reel 14, possess the cylinder 20 as pressure regulating device respectively, possess the press head 15 band T being pressed on surface of the work on the top of this cylinder 20.
On the base material comprising terylene etc., be provided with adherence top layer with T to form, add chromium oxide (Cr to this top layer 2o 3), iron oxide (Fe 2o 3), cerium oxide (CeO 2) or silica (SiO 2) etc. grinding-material.Grinding-material is fixed to more than 50% of this belt surface whole and the area of less than 80% by sticker, and be not fixed with the belt surface part of grinding-material, sticker exposes.Thus, band T can not damage the grinding function brought by slidingly contacting with foreign matter, has the sufficient adhesion function made the more weak foreign matter attachment of the adhesive force of workpiece W, possesses grinding function and these two functions of adhesion function.
Press head 15 possesses: head main body 16, the tubular that its top being formed as having opening in top (in figure downside) and rear end (in figure upside) attenuates; With softer, elastic parts 17, it is inner with the be fixed top that is accommodated in this head main body 16 of the mode of giving prominence to a part from top end opening.Softer, elastic parts 17 are soft elastomeric elements that the fluorubber etc. of mar proof and excellent heat resistance is easy to occur elastic deformation.The top ends 15a contacted with band T of this press head 15 comprises from the outstanding softer, elastic element portion of top end opening.
Cylinder 20 is connected via the inside of open rearward end with head main body 16.This cylinder 20 is such as single-lift cylinder, possesses: tubular cylinder main body 21; Piston 22, it is set to separate up and down in cylinder main body 21 and can come and go action in cylinder main body 21; And piston rod 23, it is fixed on piston 22.The air hose 24 declined for making piston 22 is connected with the top sidepiece of cylinder main body 21.In addition, in the inside of cylinder main body 21, be provided with and piston 22 spring etc. of energizing upward declined is energized parts (not shown).And, in cylinder 20, by providing air from air hose 24, piston 22 is declined, improve the internal pressure of head main body 16 and become pressurized state, and by stopping providing air from air hose 24 and making piston 22 increase with the active force of parts of energizing, reducing the internal pressure of head main body 16 and becoming low-pressure state.
In addition, cylinder 20 is herein single-lift, but is not limited thereto, and also can be all by providing air to carry out the decline of piston and the double acting cylinder of rising in cylinder main body.In addition, the main part 11 of amending unit 10 possesses cylinder 20 and press head 15, but is not limited thereto, and cylinder 20 and press head 15 also can be arranged on the downside of the main body of probe 8, makes the top ends 15a that the band T of amending unit 10 can be set up press head 15.
In addition, though the diagram of omission, foreign substance removing apparatus S possesses the control device for controlling each mechanism on base station 1, and this control device is connected with master computer.The foreign substance information such as surface of the work foreign matter position and size that the inspection by being undertaken by the foreign body detecting device independent of foreign substance removing apparatus S detects preserved by master computer.The formation of foreign body detecting device is not particularly limited, if be configured to by the scanning of surface of the work to detect foreign matter.
In the foreign substance removing apparatus S of above-mentioned formation, when being placed with workpiece W in work stage 3, control device drives travel mechanism 4 according to the foreign substance information that master computer is preserved, probe 8 is moved to target location, in above-mentioned target location, height measuring mechanism 9 or press head 15 are positioned at the top of foreign matter.When height measuring mechanism 9 is positioned at the top of foreign matter, drives height measuring mechanism 9 by control device, make it measure the height of this foreign matter.In amending unit 10, when press head 15 is positioned at the top of foreign matter, drive elevating mechanism by control device, thus according to the measurement result of height measuring mechanism 9, amending unit 10 drops to till by press head 15, with the pressing force of regulation, by band, T presses on the position of foreign matter.And, control device is when grinding removing foreign matter, before band T is pressed on foreign matter, in the mode of the internal pressure improving head main body 16, cylinder 20 is driven, make softer, elastic parts 17 compression set thus, meanwhile, make extraction reel 12 and winding reel 13 rotary actuation and band T is moved with the speed of regulation.In addition, control device, when adhering removing foreign matter, before band T is pressed on foreign matter, makes cylinder 20 drive in the mode of the internal pressure reducing head main body 16, thus when band T is pressed on foreign matter, can make softer, elastic parts 17, according to the shape of this foreign matter, elastic deformation occur.
-foreign matter removing method-
Below, with reference to Fig. 3 and Fig. 4, while give an example the method using above-mentioned foreign substance removing apparatus S to remove the foreign matter A being present in surface of the work is described.Fig. 3 is the process chart of the foreign matter A of adhesion removing surface of the work.Fig. 4 is the process chart of the foreign matter A of grinding removing surface of the work.In addition, the solid arrow in Fig. 3 and Fig. 4 illustrates the moving direction of press head 15.Dotted arrow in (c) of Fig. 4 illustrates the moving direction of band T.Also be same in Fig. 6, Fig. 7 and Figure 11 of the reference below of this content, Figure 12.
First, get out the TFT substrate after becoming the formation alignment films revising object as workpiece W, implement the inspection operation being present in the foreign matter of this surface of the work by foreign body detecting device inspection.Thus, when surface of the work exists foreign matter, the foreign substance information such as the position of this foreign matter and size are preserved by master computer.
Then, judging whether to detect foreign matter, when detecting foreign matter, judging whether to need to remove this foreign matter from positional information etc.At foreign or be only foreign matter without the need to removing, workpiece W to be accommodated in certified products card casket and on common production line with CF baseplate-laminating.On the other hand, when there is the foreign matter needing removing, workpiece W being accommodated in and revising in object product card casket and carry to the foreign substance removing apparatus S implementing to revise operation.
In correction operation, work stage 3 loads workpiece W, then, control device controls foreign substance removing apparatus S according to the order of automatic mode.First, foreign substance removing apparatus S obtains foreign substance information from master computer.Further, based on foreign substance information, the foreign matter needing removing is selected.
Below, according to the positional information of the foreign matter A selected, movable scan head 8, makes height measuring mechanism 9 be positioned at the top of this foreign matter A.Further, the height of the foreign matter A below press head 15 is measured exactly by height measuring mechanism 9.
Below, as shown in (a) of Fig. 3, movable scan head 8, makes press head 15 be positioned at the top of the foreign matter A of selection.In this stage, do not provide air from air hose 24 to cylinder main body 21, the internal pressure of head main body 16 becomes low-pressure state.
Then, from the result measured by height measuring mechanism 9, infer from the distance of press head 15 to foreign matter A, according to this deduction distance, amending unit 10 is declined.Thus, as shown in (b) of Fig. 3, make press head 15 to move close to the mode of foreign matter A, by press head 15, band T is pressed on foreign matter A.Now, the top ends 15a of press head 15 is in soft state, therefore, according to the shape of foreign matter A, elastic deformation occurs, and the contact condition of band T and foreign matter A becomes surface contact state.Thus, obtain making foreign matter A be attached to the sufficient adhesive strength of band T.In addition, when adhesion zone being pressed on foreign matter with hard press head as in the past, when the pressing force of press head is crossed strong, worry by foreign object damage surface of the work, by contrast, the top ends 15a of press head 15 is soft states, therefore, this top ends 15a can be relied on to relax foreign matter A to the pressing force of surface of the work, the damage of surface of the work can be prevented well.
Afterwards, as shown in (c) of Fig. 3, make amending unit 10 increase, press head 15 is moved in the mode left from surface of the work.Now, when the adhesive force of foreign matter A to workpiece W is more weak, this foreign matter A rises under the state of belt surface being attached to surface contact state together with band T.Consequently, can reliably adhere removing foreign matter A.
On the other hand, when foreign matter A is firmly fixed at surface of the work and is stronger to the adhesive force of workpiece W, even if move press head 15 in the mode left from surface of the work, also as shown in (a) of Fig. 4, foreign matter A remains in surface of the work.Therefore, again measure the height of the surface of the work of the position in the adhesion removing operation having carried out foreign matter A by height measuring mechanism 9, judge whether remaining foreign matter A from this measurement result.
Further, be judged as, when the remaining foreign matter A of surface of the work, as shown in (b) of Fig. 4, making softer, elastic parts 17 compression set with cylinder 20, making the top ends 15a of press head 15 be in hard state thus.Then, as shown in (c) of Fig. 4, band T moved and amending unit 10 is declined, to move press head 15 close to the mode of foreign matter A, by press head 15, band T being pressed on foreign matter A.Now, the top ends 15a of press head 15 is hard states, therefore indeformable, and the contact condition of band T and foreign matter A becomes point cantact state or linear contact lay state.Thus, can grind with concomitantly fixing a point with Tape movement and remove the foreign matter A stronger to the adhesive force of workpiece W.
And, after the grinding removing operation of foreign matter A carrying out surface of the work, the height of the surface of the work in the position of having carried out this grinding removing operation is again measured by height measuring mechanism 9, judge whether to need to add grinding removing operation according to the presence or absence of the remnant of foreign matter A, if needed, then again carry out the grinding removing operation of foreign matter A.
For the foreign matter removing operation being judged as by foreign body detecting device needing whole foreign matters of removing to carry out utilization adhesion above or grind.Thus, this surface of the work of foreign object damage being present in surface of the work can be prevented, while removing is present in the foreign matter of surface of the work.Finally, unload workpiece W from work stage 3, the defect correction of surface of the work terminates.The workpiece W finishing defect correction to be accommodated in correction product card casket and on common production line with CF baseplate-laminating.
According to the foreign substance removing apparatus S of this embodiment 1, switch foreign matter and the contact condition of band T by 1 amending unit 10, therefore, probe 8 can be set to compact device and form.And, when grinding situation and the adhesion removing foreign matter of removing foreign matter, without the need to being suitably replaced by special cell, therefore, the removing operation of surface of the work foreign matter promptly can be carried out.
In addition, by adjusting the internal pressure of head main body 16, do not make press head 15 move and just the top ends 15a of press head 15 can be switched to hard state and soft state simply, therefore, do not worry because the state of this end, crown 15a switches, the position of band T being departed from relative to end, crown 15a.Therefore, even if do not arrange the special entity preventing from being with the position of T to depart from, also can continue and carry out the adhesion removing operation of foreign matter well and grind removing operation.
" working of an invention mode 2 "
Fig. 5 is the summary pie graph of the amending unit 10 of embodiment 2.Preferably in 2, except the formation of amending unit 10 is different from embodiment 1, form in the same manner as embodiment 1.In addition, in each embodiment below, the different parts of formation is only described, to the explanation of same constituting parts with reference to the embodiment 1 based on Fig. 1 to Fig. 4, description is omitted.
The press head 25 of the amending unit 10 of embodiment 2 possesses: rotary body 26, and it is supported for by the support component 29 of the downside being fixedly arranged on main part 11 and rotating shaft 26 can be relied on to rotate; With grinding pressing piece 27 and adhesion pressing piece 28, it is provided projectingly on the outer peripheral face of this rotary body 26.Roughly triangular shape is formed as when rotary body 26 is viewed from rotating shaft direction.Grinding pressing piece 27 is configured in one side of rotary body 26, comprises the hard part that metal, rigid plastics etc. are difficult to occur elastic deformation.In addition, adhesion pressing piece 28 is configured in the another side of rotary body 26, comprises the soft softer, elastic parts that fluorubber etc. is easy to occur elastic deformation.Further, amending unit 10 is configured to: rotary body 26 is rotated, and the top ends 25a of press head 25 can be made thus to switch to grinding pressing piece 27 and adhesion pressing piece 28.
In addition, press head 25 is supported by the support component 29 on the downside of the main part 11 being fixedly arranged on amending unit 10, but is not limited thereto, and press head 25 also can be arranged on the downside of the main body of probe 8, makes the band T of amending unit 10 to be set up top ends 25a.
-foreign matter removing method-
While with reference to Fig. 6 and Fig. 7, give an example the method using above-mentioned foreign substance removing apparatus S to remove the foreign matter A being present in surface of the work is described.Fig. 6 is the process chart of the foreign matter A of adhesion removing surface of the work.Fig. 7 is the process chart of the foreign matter A of grinding removing surface of the work.In addition, the blank arrowhead in (b) of Fig. 7 illustrates the direction of rotation of rotary body 26.
In correction operation, as shown in (a) of Fig. 6, rotary body 26 is rotated, adhesion pressing piece 28 is made to be positioned at workpiece W side, using the top ends 25a of press head 25 as adhesion pressing piece 28, according to the positional information of the foreign matter A obtained from master computer, movable scan head 8, makes press head 15 be positioned at the top of the foreign matter A of selection.
Then, according to the result measured by height measuring mechanism 9, amending unit 10 is declined, as shown in (b) of Fig. 6, by press head 25, band T is pressed on foreign matter A.Now, the top ends 25a (adhesion pressing piece 28) of press head 25 is softer, elastic parts, therefore, according to the shape of foreign matter A, elastic deformation occurs, and the contact condition of band T and foreign matter A becomes surface contact state.Thus, obtain making foreign matter A be attached to the sufficient adhesive strength of band T.
Afterwards, as shown in (c) of Fig. 6, make amending unit 10 increase, move press head 25 in the mode left from surface of the work.Now, when the adhesive force of foreign matter A to workpiece W is more weak, this foreign matter A rises under the state of belt surface being attached to surface contact state together with band T.Consequently, can reliably adhere removing foreign matter A.On the other hand, when foreign matter A is firmly fixed at surface of the work and is stronger to the adhesive force of workpiece W, even if move press head 25 in the mode left from surface of the work, foreign matter A also remains in surface of the work as shown in (a) of Fig. 7.
Then, again measure the height of the surface of the work of the position of the adhesion removing operation having carried out foreign matter A by height measuring mechanism 9, judge whether remaining foreign matter A from this measurement result.Now, be judged as, when the remaining foreign matter A of surface of the work, as shown in (b) of Fig. 7, rotary body 26 being rotated, making grinding pressing piece 27 be positioned at workpiece W side, the top ends 25a of press head 25 is switched to grinding pressing piece 27.
Further, as shown in (c) of Fig. 7, band T is moved, and amending unit 10 is declined, with press head 25, band T is pressed on foreign matter A.Now, the top ends 25a (grinding pressing piece 27) of press head 25 is hard parts, therefore indeformable, and the contact condition of band T and foreign matter A becomes point cantact state or linear contact lay state.Thus, the removing foreign matter A stronger to the adhesive force of workpiece W can be ground with fixing a point along with Tape movement.Afterwards, in the same manner as above-mentioned embodiment 1, again measure the height of the surface of the work of the position of having carried out grinding removing operation by height measuring mechanism 9, again carry out grinding removing operation as required.
For the foreign matter removing operation being judged as by foreign body detecting device needing whole foreign matters of removing to carry out utilization adhesion above or grind, even if thus according to this embodiment 2, also can while prevent this surface of the work of foreign object damage being present in surface of the work, removing is present in the foreign matter of surface of the work.
In addition, according to the formation of this embodiment 2, can to be switched to by the top ends 25a of press head 25 and the pressing piece (grinding pressing piece 27 or adhesion pressing piece 28) grinding the situation that removes foreign matter and the situation that remove foreign matter of adhere is corresponding with the simple formation making rotary body 26 rotate, the grinding can carrying out foreign matter well by means of 1 amending unit 10 removes operation and removes operation with adhering.Other side can obtain the action effect same with above-mentioned embodiment 1.
" working of an invention mode 3 "
Fig. 8 is the summary stereogram of the foreign substance removing apparatus S of embodiment 3.
In the respective embodiments described above, describe the grinding removing that possesses and carry out the foreign matter being present in surface of the work and the formation of amending unit 10 both adhesion removing, but the foreign substance removing apparatus S of present embodiment possesses the grinding unit 30 of the grinding removing carrying out foreign matter and carries out the adhesion unit 40 of adhesion removing of foreign matter.
Grinding unit 30 and adhesion unit 40 are releasably loaded into probe 8 in mutually adjacent mode, when described later be finished band T1, T2, change whole unit 30,40, new band T1, T2 can be provided without delay thus, the efficient removing operation of foreign matter can be carried out.This grinding unit 30 and adhesion unit 40 are linked with elevating mechanism (not shown) respectively, and this each unit 30,40 can independently in above-below direction lifting moving.
Fig. 9 is the summary pie graph of grinding unit 30.
Grinding unit 30 is formed as card casket shape in the same manner as the amending unit 10 of above-mentioned embodiment 1, possess respectively with the main part 11 of above-mentioned embodiment 1, extract reel 12, winding reel 13 out, guide Kun 14 and main part 31 corresponding to press head 15 for a pair, grinding extracts reel 32, grinding winding reel 33 out, guides Kun 34 and grinding press head 35 for a pair.
Grinding is extracted reel 32 out and is wound with the lapping tape T1 on surface with grinding-material.This lapping tape T1 is provided with adherence top layer and forms in the same manner as the band T of above-mentioned embodiment 1 on base material, adds grinding-material to this top layer.On the surface of this lapping tape T1, grinding-material is fixed on overall more than 80% and the area of less than 100% by sticker.Like this, lapping tape T1 has to slidingly contact the band special of the sufficient grinding function brought by with foreign matter.
Grinding press head 35 is kept by the holding member 36 of the downside being fixedly arranged on main part 31.Further, the top ends 35a contacted with lapping tape T1 of this grinding press head 35 comprises the hard part being difficult to elastic deformation occurs, and this hard part comprises metal, rigid plastics etc.
Figure 10 is the summary pie graph of adhesion unit 40.
Adhesion unit 40 is also formed as card casket shape, possess respectively with the main part 11 of above-mentioned embodiment 1, extract reel 12, winding reel 13 out, guide Kun 14 and main part 41 corresponding to press head 15 for a pair, adhesion extracts reel 42, adhesion winding reel 43 out, guides Kun 44 and adhesion press head 45 for a pair.
Adhesion is extracted reel 42 out and is wound with the adhesion zone T2 on surface with sticker.This adhesion zone T2 is the band special being provided with sticker in whole on base material, having the sufficient adhesion function that foreign matter is adhered to.
Adhesion press head 45 is kept by the holding member 46 of the downside being fixedly arranged on main part 41.Further, the top ends 45a contacted with adhesion zone T2 of adhesion press head 45 comprises the soft softer, elastic parts being easy to occur elastic deformation, and these softer, elastic parts comprise fluorubber etc.
In addition, be set to grinding press head 35 to be kept by the holding member 36 on the downside of the main part 31 being fixedly arranged on grinding unit 30, adhesion press head 45 by be fixedly arranged on adhesion unit 40 main part 41 on the downside of holding member 46 keep, but be not limited thereto, grinding press head 35 also can be arranged on the downside of the main body of probe 8, makes the lapping tape T1 of grinding unit 30 to be set up top ends 35a.In addition, adhesion press head 45 also can be arranged on the downside of the main body of probe 8, makes the adhesion zone T2 of adhesion unit 40 to be set up top ends 45a.
-foreign matter removing method-
While with reference to Figure 11 and Figure 12, give an example the method using above-mentioned foreign substance removing apparatus S to remove the foreign matter A being present in surface of the work is described.Figure 11 is the process chart of the foreign matter A of adhesion removing surface of the work.Figure 12 is the process chart of the foreign matter A of grinding removing surface of the work.
In correction operation, as shown in (a) of Figure 11, according to the positional information of the foreign matter A obtained from master computer, movable scan head 8, makes adhesion press head 45 be positioned at the top of the foreign matter A of selection.Then, according to the result measured by height measuring mechanism 9, adhesion unit 40 is declined, as shown in (b) of Figure 11, by adhesion press head 45, adhesion zone T2 is pressed on foreign matter A.Now, the top ends 45a of adhesion press head 45 is soft softer, elastic parts, and therefore, according to the shape of foreign matter A, elastic deformation occurs, the contact condition of adhesion zone T2 and foreign matter A becomes surface contact state.Thus, obtain making foreign matter A be attached to the sufficient adhesive strength of adhesion zone T2.
Afterwards, as shown in (c) of Figure 11, make adhesion unit 40 increase, move adhesion press head 45 in the mode left from surface of the work.Now, when the adhesive force of foreign matter A to workpiece W is more weak, this foreign matter A rises under the state of belt surface being attached to surface contact state together with adhesion zone T2.Consequently, can reliably adhere removing foreign matter A.
Then, again measure the height of the surface of the work of the position of the adhesion removing operation having carried out foreign matter A by height measuring mechanism 9, judge whether remaining foreign matter A from this measurement result.Now, be judged as that, when the remaining foreign matter A of surface of the work, as shown in (a) of Figure 12, movable scan head 8, makes grinding press head 35 be positioned at the top of foreign matter A.
Further, as shown in (b) of Figure 12, lapping tape T1 is moved, and grinding unit 30 is declined, by grinding press head 35, lapping tape T1 is pressed on foreign matter A.Now, the top ends 35a of grinding press head 35 is hard parts, therefore indeformable, and the contact condition of lapping tape T1 and foreign matter A becomes point cantact state or point cantact state.Thus, the removing foreign matter A stronger to the adhesive force of workpiece W can be ground with fixing a point along with Tape movement.
Afterwards, in the same manner as above-mentioned embodiment 1, again measure the height of the surface of the work of the position of having carried out grinding removing operation by height measuring mechanism 9, again carry out grinding removing operation as required.
For the foreign matter removing operation being judged as by foreign body detecting device needing whole foreign matters of removing to carry out utilization adhesion above or grind, even if thus according to this embodiment 3, also can while prevent this surface of the work of foreign object damage being present in surface of the work, removing is present in the foreign matter of surface of the work.
In addition, according to the formation of this embodiment 3, the grinding removing of foreign matter can be carried out respectively with grinding unit 30, the adhesion removing of foreign matter is carried out with adhesion unit 40, therefore, can simply to be formed the foreign matter removing performance ad hoc improved respectively in the situation of grinding removing foreign matter and the situation of adhesion removing foreign matter.Therefore, grinding removing and the adhesion removing of foreign matter can be carried out well.
" other embodiment "
In the respective embodiments described above, be set to and check with the foreign body detecting device independent of foreign substance removing apparatus S the foreign matter being present in surface of the work, but also can be, foreign substance removing apparatus S moves in the mode making probe 8 and scan whole of workpiece, is present in the foreign matter of surface of the work by height measuring mechanism 9 inspection.
In addition, in the respective embodiments described above, be set to each foreign matter that should remove surface of the work as required and carry out adhesion removing operation and grinding removing operation in order, but the present invention is not limited thereto, also can be, after whole foreign matters that should remove surface of the work carry out adhesion removing operation, grinding removing operation is carried out to each foreign matter not removed with adhesion removing operation.
In addition, in the respective embodiments described above, workpiece W is set to the TFT substrate after the formation alignment films forming liquid crystal indicator, but also can be TFT substrate, the CF substrate before forming alignment films.And, also the substrate, silicon wafer etc. of organic EL (Electro Luminescence: electroluminescent) other display unit such as display unit, plasma display system formed beyond liquid crystal indicator can be set to workpiece W.
, describe embodiment preferred for this invention above, but technical scope of the present invention is not limited to the scope described in above-mentioned embodiment.It is example that those skilled in the art understands above-mentioned embodiment, also can obtain various variation by the combination of this each inscape, each processing step, and in addition, such variation also within the scope of the invention.
Such as, suitably can change as required and load the grinding unit same with embodiment 3 and unit of adhering to probe.That is, when grinding removing foreign matter, loading grinding unit to probe, when adhering removing foreign matter, replacing grinding unit and loading adhesion unit to probe, can be configured to thus change foreign matter and the contact condition of band pressing on this foreign matter.
industrial utilizability
As explained above, the foreign substance removing apparatus that the present invention is present in the foreign matter of surface of the work to removing is useful, is specially adapted to require to prevent the damage of surface of the work from removing the foreign substance removing apparatus of foreign matter.
description of reference numerals
A foreign matter
S foreign substance removing apparatus
T is with
T1 lapping tape
T2 adhesion zone
W workpiece
12 extract reel out
13 winding reels
15,25 press heads
15a, 25a, 35a, 45a top ends
16 head main bodies
17 softer, elastic parts
20 cylinders (pressure regulating device)
26 rotary bodies
27 grinding pressing pieces
28 adhesion pressing pieces
30 grinding units
32 grindings are with extracting reel out
33 grinding winding reels
35 grinding press heads
40 adhesion unit
42 adhesions are with extracting reel out
43 adhesion winding reels
45 adhesion press heads

Claims (4)

1. a foreign substance removing apparatus, is characterized in that,
Be configured to the Tape movement that can make there is on surface grinding-material and sticker, pressed on the foreign matter of surface of the work, and the contact condition of above-mentioned band and this foreign matter can be switched to the point cantact state or linear contact lay state of grinding and removing foreign matter and adhere and remove the surface contact state of foreign matter
Above-mentioned foreign substance removing apparatus possesses:
Extract reel out, its spooling has the band on surface with above-mentioned grinding-material and sticker;
Winding reel, the band that its winding is extracted out from above-mentioned extraction reel; And
Press head, it is configured between above-mentioned extraction reel and above-mentioned winding reel, and above-mentioned band is pressed on foreign matter,
Above-mentioned press head is configured to the top ends contacted with above-mentioned band to be switched to: the indeformable hard state when above-mentioned band being pressed on foreign matter; With the soft state that elastic deformation occurs according to the shape of this foreign matter when above-mentioned band being pressed on foreign matter.
2. foreign substance removing apparatus according to claim 1, is characterized in that,
Above-mentioned press head possesses: the head main body of tubular, and it has opening on top; With softer, elastic parts, its top being incorporated in this head main body in the mode of giving prominence to a part from above-mentioned opening is inner,
The inside of above-mentioned head main body is connected with the pressure regulating device of adjustment internal pressure,
When grinding removing foreign matter, improve the internal pressure of above-mentioned head main body by above-mentioned pressure regulating device and above-mentioned softer, elastic component compresses is hardened, on the other hand, when adhering removing foreign matter, the internal pressure of above-mentioned head main body is reduced by above-mentioned pressure regulating device, when above-mentioned band is pressed on foreign matter, can make above-mentioned softer, elastic parts, according to the shape of this foreign matter, elastic deformation occur.
3. foreign substance removing apparatus according to claim 1, is characterized in that,
Above-mentioned press head possesses: rotary body, and it is supported in revolvable mode; With grinding pressing piece and adhesion pressing piece, it is provided projectingly on the outer peripheral face of this rotary body,
Above-mentioned grinding pressing piece comprises the indeformable hard part when above-mentioned band being pressed on foreign matter,
Above-mentioned adhesion pressing piece comprises the softer, elastic parts that elastic deformation occurs according to the shape of this foreign matter when above-mentioned band being pressed on foreign matter,
Be configured to, by making above-mentioned rotary body rotate, the top ends of above-mentioned press head is switched to above-mentioned grinding pressing piece and above-mentioned adhesion pressing piece.
4. the foreign substance removing apparatus according to any one in claims 1 to 3, is characterized in that,
On the surface of above-mentioned band, grinding-material is fixed to throughout more than 50% of whole belt surface and the area of less than 80% by sticker,
Be not fixed with the belt surface part of above-mentioned grinding-material, above-mentioned sticker exposes.
CN201080056374.5A 2009-12-11 2010-11-10 Foreign object removal device Expired - Fee Related CN102655981B (en)

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JP2009-281733 2009-12-11
PCT/JP2010/006591 WO2011070723A1 (en) 2009-12-11 2010-11-10 Foreign object removal device

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CN111618710B (en) * 2020-05-21 2021-07-23 武汉华星光电半导体显示技术有限公司 Mask repair equipment
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101391504A (en) * 2008-09-12 2009-03-25 友达光电(厦门)有限公司 Dyestripping mechanism and dyestripping method
JP4306923B2 (en) * 2000-04-21 2009-08-05 株式会社河合楽器製作所 Belt sander hanging method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634253Y2 (en) * 1980-04-09 1988-02-03
JPH0572821A (en) * 1991-05-29 1993-03-26 Fuji Photo Film Co Ltd Electrophotographic engraving device
JP2534602B2 (en) * 1992-08-31 1996-09-18 上野鋼業株式会社 Belt sander for metal processing
JPH09141545A (en) * 1995-11-22 1997-06-03 Kyodo Printing Co Ltd Foreign matter eliminator for filter base
JP2000263005A (en) * 1999-03-19 2000-09-26 Toshiba Corp Cleaning apparatus
JP2007050616A (en) * 2005-08-18 2007-03-01 Seiko Epson Corp Method and cartridge for maintenance of inkjet recording apparatus
JP2008290166A (en) * 2007-05-23 2008-12-04 Lasertec Corp Tape grinding device and guide tool

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4306923B2 (en) * 2000-04-21 2009-08-05 株式会社河合楽器製作所 Belt sander hanging method
CN101391504A (en) * 2008-09-12 2009-03-25 友达光电(厦门)有限公司 Dyestripping mechanism and dyestripping method

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