CN102645276A - Spectral sensing device, system and method - Google Patents

Abstract

A spectral sensing device, system and method. The spectral sensing device includes N light receiving modules, a fixing element and N spectral sensing modules. The N light receiving modules are used to receive light outputted by N parts to be tested of a group to be tested, wherein N is a positive integer greater than 1. The fixing element is used to fix the light receiving modules and maintain a fixed relative distance between the light receiving modules so that the N parts to be tested fall within the light receiving range of the N light receiving modules. The N spectral sensing modules are respectively coupled to the N light receiving modules, and are used to receive light outputted by the N parts to be tested through the N light receiving modules, and separate the light outputted by each part to be tested into a plurality of spectral components, so as to obtain a spectral signal corresponding to the spectral components. The present invention can effectively shorten the sensing time of a large number of light sources such as LED chips, which is a great help to improve production capacity.

Description

Spectral sensing device, system and method

technical field

The invention relates to a spectrum sensing device, system and method, in particular to a spectrum sensing technology capable of sensing multiple parts to be measured.

Background technique

Traditional light emitting diodes (Light Emitting Diode, referred to as LED) in the manufacturing and packaging stages, need to go through multiple tests of spectrum and electrical characteristics to ensure the quality of the manufactured LED is good, or as a basis for product quality classification. If it is found that the yield rate of the LED grains on the entire chip is not high during the manufacturing process, the entire chip must be scrapped, or other screenings are performed to find usable particles, so as not to waste other costs in the subsequent manufacturing process and subsequent packaging superior. If it is found that the spectral characteristics of the LED die are not good, the LED die must be discarded or sold at a lower price.

Figure 1 shows the state of application of the traditional integrating sphere. As shown in FIG. 1 , an integrating sphere 1110 is coupled to a spectrometer 1100 . Because the directivity of the LED die is very strong, in the known technology, the integrating sphere 1110 is mainly used together with the spectrometer 1100 to sense the spectral characteristics of the light source (LED die) 1120 on the semiconductor chip 1130 . One of the LED crystal grains 1120 emits light by means of laser excitation or energization, and the emitted light enters the integrating sphere 1110 to be homogenized, and is finally output to the spectrometer 1100 . However, this configuration can only sense the spectral characteristics of one LED die at a time. Taking a four-inch chip as an example, the number of LED grains grown on it is about 8* ¹⁰³ . In practice, the test time for the spectral characteristics of each chip is about 70 milliseconds (ms). Therefore, on a four-inch chip The sensing time of all LED dies is 70ms*8*10 ³ =560 seconds, which is about 10 minutes.

As the demand for LEDs is getting higher and higher, the current mainstream manufacturing process of producing LEDs with 4-inch chips has gradually become insufficient. Therefore, the technology of manufacturing LEDs with 8-inch chips is being intensively researched and developed in various countries around the world. It is currently estimated that with the progress of the manufacturing process, the number of LED grains grown on an 8-inch chip will reach 2* ¹⁰⁵ . The sensing time of all the LED dies is about 70ms*2*10 ⁵ =14,000 seconds, which is nearly four hours. Multiple spectral sensing is required for multiple steps in the manufacturing process of LED grains from growing crystals, adding electrodes, cutting, to packaging, etc. Therefore, conventional sensing devices are not suitable for sensing a large number of LED dies in the future.

Contents of the invention

An object of the embodiments of the present invention is to provide a spectrum sensing device, system and method that can effectively shorten the sensing time.

An embodiment of the present invention provides a spectrum sensing device, including N light receiving modules, a fixing element, and N spectrum sensing modules. The N light receiving modules are respectively used to receive the light outputted by the N test parts of a test group, wherein N is a positive integer greater than 1. The fixing element is used to fix the light-receiving modules and maintain a fixed relative distance between the light-receiving modules, so that the N parts to be measured fall within the light-receiving ranges of the N light-receiving modules. The N spectrum sensing modules are respectively coupled to the N light receiving modules, and are used to respectively receive the light output from the N parts to be measured through the N light receiving modules, and separate the light output from each part to be measured into multiple spectral components to obtain a spectral signal corresponding to the spectral components.

In one embodiment, the part to be measured is a light source. In another embodiment, the portion under test is an LED die.

An embodiment of the present invention further provides a spectrum sensing system for sensing a plurality of parts to be tested in a group to be tested. The spectrum sensing system includes a lighting device, multiple spectrum sensing modules, a fixing device and a positioning device. The lighting device is used for lighting the waiting part to make the waiting part output light. A plurality of spectral sensing modules are used to respectively receive the light outputted by the parts under test, and separate the light outputted by each part under test into a plurality of spectral components, so as to obtain a spectral signal corresponding to these spectral components. The fixing device is used to fix the spectrum sensing modules and keep the relative distance between the spectrum sensing modules fixed. The positioning device is coupled to the fixing device or the group to be measured, and is used to position the spectral sensing modules or the group to be measured, so that the parts to be measured fall within the light-receiving range of the spectral sensing modules, so that The spectrum sensing modules can respectively receive the light outputted by the waiting-to-be-measured part.

An embodiment of the present invention further provides a spectrum sensing method, including: positioning the relative positions of a plurality of light-receiving modules and a plurality of first parts to be measured in a group to be measured, so that the first parts to be measured are respectively fall within the light-receiving range of the light-receiving modules, wherein the relative distance between the light-receiving modules is kept fixed; the first parts to be measured are lighted to output light; and a plurality of spectral sensing modules respectively pass through The light receiving modules receive the light output by the first parts under test to perform spectrum sensing.

Based on the above, the sensing time of many light sources such as LED grains can be effectively shortened, which is of great help to the improvement of production capacity.

In order to make the above-mentioned content of the present invention more comprehensible, a few preferred embodiments are specifically cited below, together with the accompanying drawings, which are described in detail as follows.

Description of drawings

Figure 1 shows the state of application of the traditional integrating sphere.

FIG. 2 shows an exploded perspective view of a spectral sensing module applied to an embodiment of the present invention.

FIG. 3 shows a schematic diagram of a spectrum sensing device according to a first embodiment of the present invention.

FIG. 4 shows a flowchart of a spectrum sensing method according to a first embodiment of the present invention.

5A to 5D respectively show four examples of light receiving modules.

6A to 6C are schematic diagrams showing three examples of the operation of the spectrum sensing device according to the second embodiment of the present invention.

FIG. 7A shows a schematic diagram of a spectrum sensing device according to a first example of the third embodiment of the present invention.

Figure 7B shows a cross-sectional view along line 7B-7B of Figure 7A.

Figure 7C shows a partially enlarged view of Figure 7A.

FIG. 7D shows a schematic diagram of a spectrum sensing device according to a second example of the third embodiment of the present invention.

Figure 7E shows a cross-sectional view along line 7E-7E of Figure 7D.

8A and 8B are schematic diagrams showing a partial structure of a spectrum sensing device according to a fourth embodiment of the present invention.

FIG. 8C shows a top view of an LED die according to a fourth embodiment of the present invention.

FIG. 9 shows a schematic diagram of a spectrum sensing device according to a fifth embodiment of the present invention.

FIG. 10 shows a schematic diagram of a spectrum sensing system according to a seventh embodiment of the present invention.

FIG. 11 shows a schematic diagram of a spectrum sensing system according to an eighth embodiment of the present invention.

Attached icon:

AC: light-receiving cone

NL: normal line

OS: light

p, P: pitch

S1: spectral signal

S111～S114: steps

SC: spectral component

X, Y, Z: coordinate axes

1, 101, 200, 201A, 201B, 301A, 301B, 401, 501, 601: spectral sensing equipment

10, 10M2, 10M3, 10M4, 110, 210, 310A, 310B, 410, 510: receiving module

10F, 410F, 510F, 610F: Fixed elements

11: Sleeve

1100: spectrometer

11A: light absorbing material

12: Through hole

13A: Fixing seat

13M2: Lens

13M3: Collimating mirror

13M4: Cosine corrector

2, 2', 2a, 2b, 2c, 102, 300, 1120: light source/LED grain/part to be tested

20, 420, 520: optical transmission medium / optical fiber

21, 421, 521: Light receiving ports

22, 422, 522: light output ports

23, 414, 514: Core

24, 330, 350, 415, 515: cladding layer

25, 416: protective layer

26, 426: light receiving port

3, 103, 1130: chips/groups to be tested

30: Spectral sensing module

30F: Fixtures

31: Ontology

310: anti-reflection layer

32: Input part

320: Substrate

33: Diffraction grating

34: Sensor

340, 370: electrodes

35: Stray light filtering structure

36: waveguide

360: thin metal layer

380: active layer

40: drive mechanism

4A, 4B: section

50: probe set

51, 52: probe

517: spacer

55: Lighting device

60: Power supply

610, 1110: integrating sphere

701, 801: Spectral sensing system

770: Locator

Detailed ways

first embodiment

FIG. 2 shows an exploded perspective view of a spectral sensing module applied to an embodiment of the present invention. FIG. 3 shows a schematic diagram of a spectrum sensing device according to a first embodiment of the present invention. As shown in FIG. 2 and FIG. 3 , the spectrum sensing device 1 of the embodiment of the present invention includes N light receiving modules 10, a fixing element 10F, N optical transmission media 20, N spectrum sensing modules 30 and a point Bright device 55.

The N light receiving modules 10 can be used to respectively receive the light OS output by one light source 2 each time, wherein N is a positive integer greater than 1, and in the first example of this embodiment, N is equal to 8. In addition, in this embodiment, the plurality of light sources 2 are described by taking the LED die on the LED chip 3 as an example, wherein the LED chip 3 is defined as the group to be tested, and the LED dies 2 and 2' are defined as DUT. In this embodiment, the LED die must cooperate with each light-receiving module 10 to emit light, that is, the LED die to be sensed by the light-receiving module 10 can emit light; other LED dies that are not to be sensed by the light-receiving module 10 No need to shine. In this way, the interference caused by the light emission of adjacent LED chips can be avoided, which will affect the sensing result.

There are many ways to light up the LED crystal grains. You can use the probe integrated with the light receiving module 10 to light up many LED grains at one time, or you can use the probe independent of the light receiving module 10 to light up many LED grains at one time. One LED die can also be used to light up multiple LED dies by using laser light to excite the LED die to light up. These devices for lighting the light source may be referred to as the lighting device 55 , and the location of the lighting device 55 corresponds to the location of the light source 2 , which will be described in more detail below.

In this embodiment, a plurality of probe groups independent of the light-receiving module 10 are used as an example for illustration, wherein at least two probes of each probe group are used to contact the cathode and anode of the corresponding LED crystal grain, so as to The LED die is powered to cause the LED die to emit light. Therefore, many LED dies can be lit at one time. The number of probes in a single probe group is greater than 2, which can contact many LED dies at one time, and use multiple probes to contact multiple LED dies of the chip, and control whether the probes are energized or not by a controller (not shown). Light up the corresponding LED dies in batches. Therefore, each time these probes are moved and positioned, the sensing process of multiple LED dies can be performed in batches. In this way, the probe does not need to be moved all the time, and the sensing speed is also improved. The implementation of the probe set is further described in the fourth embodiment.

The fixing element 10F is used to fix the light-receiving modules 10 and keep the relative distance between the light-receiving modules 10 fixed, so that the N LED crystal grains 2 fall on the light-receiving modules 10 respectively. within range. In this way, after the fixing element 10F and the LED chip 3 are positioned relative to each other, each light receiving module 10 can receive the light output by the corresponding LED chip.

N optical transmission media 20 are respectively connected to N light receiving modules 10 . Each optical transmission medium 20 may be an optical fiber or other medium capable of transmitting light, and in this embodiment, an optical fiber is used as an example for illustration. The optical transmission medium 20 has two ends, one end is a light receiving port 21 coupled to the light receiving module 10 , and the other end is a light output port 22 coupled to the spectrum sensing module 30 . The light transmission medium 20 is flexible. When the light receiving module 10 is moved, the light transmission medium 20 will be pulled and moved, but the spectrum sensing module 30 will not be moved. In this way, the energy and cost of moving the spectrum sensing module 30 can be saved. In addition, due to the flexibility of the optical transmission medium 20, the pattern arranged by the spectral sensing module 30 may be the same as the pattern arranged by the light receiving module 10, or different from the pattern arranged by the light receiving module 10. It depends on space configuration and design requirements, and is not specifically limited here. In this embodiment, an example is taken in which the light receiving module 10 and the spectrum sensing module 30 are arranged in the same pattern for illustration.

The N spectrum sensing modules 30 are respectively coupled to the N light receiving modules 10 through the N optical transmission media 20, and are used to respectively receive the output from the N light sources 2 through the N optical transmission media 20 and the N light receiving modules 10. Light OS. Then, the spectral sensing module 30 performs a process of analyzing the light, respectively separating the light OS output by the light source 2 into a plurality of spectral components SC according to the wavelength, so as to obtain a spectral signal S1 corresponding to the spectral components SC. After the light OS output by each light source 2 is respectively converted into a spectral signal S1, it can be transmitted to a computer or an independent analysis system (not shown), so that the analysis system can detect and judge the characteristics of the light source according to the spectral signal S1. Let the analysis system decide whether to reject light source 2, confirm its quality level, or make other decisions.

A micro-chip micro-spectrometer or other conventional spectrometers can be used as the spectrum sensing module 30 . In this embodiment, a micro-chip micro-spectrometer is taken as an example for illustration.

Referring to FIG. 2 again, each spectrum sensing module 30 includes a body 31 , an input portion 32 , a diffraction grating 33 and a sensor 34 . The input part 32 is disposed in the body 31 and coupled to the light output port 22 (see FIG. 3 ) of the optical transmission medium 20 and the light receiving module 10 to receive the light OS output by a part under test. The diffraction grating 33 is disposed in the main body 31 for separating the light OS output by the light source into these spectral components SC. The sensor 34 is disposed in the body 31 for sensing the spectral components SC to obtain the spectral signal S1. In addition, each spectrum sensing module 30 further includes a sawtooth stray light filtering structure 35 and upper and lower waveguide plates 36 . The stray light filtering structure 35 is used to filter out stray light and prevent the stray light from reaching the diffraction grating 33 and the sensor 34 . The waveguide plates 36 are used to avoid light loss, so that the light can reflect and travel between the two waveguide plates 36 . In this embodiment, the diffraction structure of the diffraction grating 33 is formed by semiconductor material through semiconductor etching manufacturing process. But it is only an optional embodiment. In other embodiments, the diffraction structure of the diffraction grating 33 can be formed by reactive ion etching, laser processing, ion beam processing, electron beam processing, X-ray etching, injection molding, embossing or electroforming.

As shown in FIG. 3 , the spectrum sensing device 1 further includes a driving mechanism 40 . The driving mechanism 40 is coupled to the fixed element 10F and these light receiving modules 10, and can be used to move these light receiving modules 10, so that the spectrum sensing device 1 can sense multiple parts to be measured on the LED chip 3 in batches (LED crystal grain) 2. In this embodiment, the driving mechanism 40 is described by taking a robot arm as an example, which can perform stepwise movement or continuous movement, but it is only an optional embodiment. The directions in which the driving mechanism 40 drives the light receiving modules 10 to move include horizontal directions (X, Y directions) and vertical directions (Z directions). The movement in the horizontal direction can align the light-receiving module 10 with different groups of N LED dies 2 in stages. The movement in the vertical direction can adjust the distance between the light receiving module 10 and the LED die 2, so as to allow the light output by a single LED die 2 to be transmitted in a single light receiving module 10, and prevent the light from other light sources from being transmitted in a single light receiving module. 10 in transmission.

In other embodiments, the driving mechanism 40 can also be coupled to the LED chip 3 for driving the movement of the LED chip 3 instead of driving the fixed element 10F to move, so that the relative movement of the LED chip 3 and the light-receiving module 10 can also be achieved. Effect.

Therefore, in the first example of the first embodiment, the spectrum sensing device 1 can sense M LED dies 2 through multiple movements and multiple measurements, where M is a positive integer greater than or equal to N. N light-receiving modules 10 are arranged in a figure, and this embodiment is described by taking a straight line figure as an example, but it is only an optional embodiment. The chip 3 includes N first LED dies 2 and N second LED dies 2', and the N first LED dies 2 and N second LED dies 2' are respectively arranged in the same pattern as above. The driving mechanism 40 drives the light-receiving modules 10 to move so that the light-receiving ranges of the N light-receiving modules 10 are respectively located on the N first LED dies 2 to perform a first spectrum sensing to obtain a first spectrum signal. Then, the driving mechanism 40 drives the light-receiving modules 10 to move so that the light-receiving ranges of the N light-receiving modules 10 are respectively located on the N second LED dies 2', so as to perform a second spectrum sensing to obtain the second spectrum Signal.

During the sensing process, the driving mechanism 40 moves the light receiving module 10 along the Z axis to a certain height, and then moves the light receiving module 10 along the XY plane to align with the LED die 2 , and then the sensing process can be performed. Assume that the distance (pitch) between the center points of two adjacent LED crystal grains (2, 2′) to be tested is p, and the distance (pitch) between the center points of two adjacent light-receiving modules 10 is p. The pitch P between two adjacent light receiving modules 10 may be equal to L*p, where L is a positive integer greater than or equal to 1. In this embodiment, L is equal to 2, so P=2p. In a segment 4A, the driving mechanism 40 drives the N light-receiving modules 10 to move a distance equal to the pitch p of the LED dies 2 and 2' after the N spectral sensing modules 30 complete one sensing. After the light receiving module 10 is driven (L−1) times to complete L times of sensing, the driving mechanism 40 continues to drive the light receiving module 10 to jump to another section 4B for sensing. The advantage of this design is that the pitch of the light-receiving module 10 does not need to be too small, but the LED die 2 with a small pitch can still be sensed in a stepwise manner.

FIG. 4 shows a flowchart of a spectrum sensing method according to a first embodiment of the present invention. As shown in FIG. 4 , the spectral sensing method of this embodiment includes the following steps S111 to S114 .

In step S111, the relative positions of multiple light-receiving modules 10 and a plurality of first parts-to-be-tested 2 of a group 3 to be tested are positioned, so that the first parts-to-be-tested 2 respectively fall on the light-receiving modules 10 within the light receiving range. In step S112, the first parts to be tested 2 are turned on to output light. Next, in step S113 , the plurality of spectrum sensing modules 30 respectively receive the light output by the first parts to be measured 2 through the light receiving modules 10 to perform spectrum sensing.

After the first spectral sensing procedure in steps S111 to S113 is completed, it may be determined in step S114 whether all the parts to be tested have been sensed. If so, the method ends. If not, skip to step S111, and perform steps S111 to S113 for the undetected detection parts until all the detection parts have been sensed. Please note that in other embodiments, step S114 can also be adjusted according to the situation, for example, different groups of parts to be tested can also be tested sequentially according to a predetermined process.

Based on the above, when there are still parts to be tested that have not been detected, it is possible to return to step S111, and move the light receiving modules 10 to align with the plurality of second parts to be tested 2' that have not been detected, so that the second The parts 2' to be measured fall within the light receiving ranges of the light receiving modules 10 respectively. In step S112, the second parts under test 2' are turned on to output light. In step S113, the spectrum sensing modules 30 respectively receive the light output by the second parts to be measured 2' through the light receiving modules 10 to perform spectrum sensing.

Therefore, by means of batch sensing, the spectral sensing of all the parts to be tested in the group 3 to be tested can be completed.

5A to 5D respectively show four examples of light receiving modules. As shown in FIG. 5A , the light receiving module 10 includes a sleeve 11 , one end of the sleeve 11 is coupled to the light receiving port 21 of the optical transmission medium 20 , and the other end of the sleeve 11 is a free end. The sleeve 11 has a through hole 12 , wherein the light OS output by the LED die 2 can enter the light receiving module 10 through the through hole 12 . In the first example, the optical transmission medium 20 includes an optical fiber, the diameter of the core 23 of the optical fiber is about 600 microns, and the diameter of the LED die 2 is about 200 microns. In the first example of FIG. 5A , surrounding the core 23 is a cladding layer (cladding) 24 , and the refractive index of the cladding layer 24 is lower than that of the core 23 . The protection layer 25 covers the coating layer 24 for protection. In addition, the light-absorbing material 11A can be coated on the inner wall of the sleeve 11 if necessary, so as to prevent light or other stray light from other nearby LED dies 2 from being reflected into the light transmission medium 20 through the inner wall of the sleeve 11 . An advantage of the example of FIG. 5A is that the materials used are compact, helping to reduce costs.

As shown in the second example of FIG. 5B , the light receiving module 10M2 is similar to the light receiving module 10 of FIG. 5A , except that the light receiving module 10M2 further includes a lens 13M2 . The lens 13M2 is disposed in the through hole 12 of the sleeve 11 for focusing the light OS output by the LED chip 2 to the light receiving port 26 of the optical transmission medium 20 or near the center of the light receiving port 26 . In this way, the light can be collected at a larger angle to avoid light loss, or reduce the influence of the directivity of the LED die 2 on the measurement. The type and arrangement position of the lens 13M2 are not particularly limited to those shown in the accompanying drawings. The advantage of the second example in FIG. 5B is that the lens 13M2 is used for focusing, which helps to increase the amount of light received, and the lens 13M2 can be used to prevent dust from entering the through hole 12 .

As shown in the third example of FIG. 5C, the light receiving module 10M3 is similar to the light receiving module 10 in FIG. Installed in the sleeve 11. Or, in another example, the fixing seat 13A can be integrally formed with the sleeve 11 . In this way, after passing through the collimating mirror 13M3 , the light OS output by the LED crystal grain 2 becomes substantially parallel light and enters into the core 23 of the optical fiber for transmission. In this example, the diameter of the through hole 12 is designed to be approximately equal to the diameter of the core 23 . The advantage of the third example in FIG. 5C is that the collimating mirror 13M3 is used to generate parallel light, which is helpful to increase the amount of light received, and can effectively shorten the length of the light receiving module 10 .

As shown in FIG. 5D , the light receiving module 10M4 of the fourth example is similar to the light receiving module 10 of FIG. 5A , the difference is that the light receiving module 10M4 further includes a cosine corrector disposed in the through hole 12 of the sleeve 11 (Cosine corrector) 13M4. The cosine corrector 13M4 is a diffuser with Lambertian diffusion characteristics, which can improve the problem of slight errors between the light receiving module 10M4 and the LED die 2 .

More specifically, the light receiving module 10M4 of the fourth example uses a penetrating cosine corrector 13M4, no matter whether the light source 2 is on the left or the right of Figure 5D, the cosine corrector 13M4 has an area hit by the light OS All will be scattered in the way of Lambertian light sources and enter the light transmission medium 20 . In this way, the effects of light received by the optical transmission medium 20 are similar, so the light receiving module 10M4 of the fourth example has a greater tolerance for alignment errors, which reduces the cost of alignment. In particular, larger alignment errors can be tolerated by increasing the size of the cosine corrector.

It is worth noting that although the above-mentioned part to be tested is described by taking the LED die that can emit light itself as an example, it is only an optional embodiment. In other embodiments, those skilled in the art can apply the embodiments of the present invention to sense other parts under test according to their needs. For example, in other embodiments, the part to be tested can be a component that cannot emit light itself, but can reflect or transmit light, such as a display pixel of a reflective, transmissive or transflective liquid crystal display; it can also be It is a neatly arranged sample, such as blood sample, cell sample, urine sample, chemical reagent sample, water quality sample, etc., as long as it is arranged in a preset pattern and can output light after being lit by the lighting device 55, it is suitable for this application. Embodiment of the invention. It should be noted that, for different applications, the lighting device 55 can adopt different types of lighting devices according to its requirements, for example, a light source with a specific wavelength band can also be used. In this case, the lighting device 55 outputs light beams to the waiting section 2 respectively falling within the light-receiving range of the N light-receiving modules 10, so that the waiting section 2 outputs the sensing light required by the spectrum sensing module 30. Light, such as reflected light, transmitted light or other mixed light.

second embodiment

In the first embodiment, it is also feasible to use a one-dimensional spectral sensing device to sense LED dies arranged in a two-dimensional pattern, which is only an optional embodiment. In other embodiments, those skilled in the art can arrange the light-receiving modules in two-dimensional patterns, such as squares or other figures, to sense the LED dies arranged in two-dimensional patterns. For example, FIG. 6A to FIG. 6C show three operational diagrams of the spectrum sensing device according to the second embodiment of the present invention. As shown in FIG. 6A, the spectrum sensing device 101 of the first example of the second embodiment can also be used to sense M*K LED dies 102 on a semiconductor chip 103 arranged in a two-dimensional pattern, N*Q The light receiving module 110 can move along the X-axis and the Y-axis in sequence, wherein K and Q are both positive integers greater than 1. In this example, 12 light-receiving modules 110 are arranged in a 3*4 pattern, and each light-receiving module 110 can be aligned with one LED die 102. After the sensing of the LED die 102 in the axial direction, translate to the LED die 102 in the next column in the Y-axis direction, sense the LED die 102 in the next row, and repeat this along the X-axis and the Y-axis Translation, that is, the characteristics of all LED dies 102 can be sensed sequentially. This can be easily understood by those skilled in the art, so its detailed description is omitted here. However, it needs to be specified that the one-dimensional spectrum sensing device in the embodiment of FIG. 3 is also applicable to the sensing of M*K LED crystal grains 102 arranged in a two-dimensional pattern, as long as the above-mentioned N*Q light-receiving The action of the module 110 "translate to the next row of LED die 102 in the Y-axis direction" is simply regarded as the N light-receiving modules 10 in the embodiment of Fig. 3 "jump to another section 4B to continue sensing" action.

The spectrum sensing device of the second embodiment can also sense LED dies arranged in a two-dimensional pattern through multiple movements and multiple measurements. The advantage is that the number of spectral sensing devices can be increased and the sensing time can be shortened by adaptively arranging the spectral sensing devices in a two-dimensional pattern according to the type of the portion to be measured in the group to be measured.

The second example of the two-dimensional pattern can also be selected as shown in FIG. 6B in terms of design options. The light receiving modules 210A and 210B of two sets of spectral sensing devices 201A and 201B are used to simultaneously sense from different positions. The implementation of FIG. 6B In the example, each group of spectral sensing devices 201A/201B has four light-receiving modules 210A/210B, and their moving directions are the same, and their moving timing can be synchronous or independent for each group. The advantage of this design is that the sensing time can be shortened by increasing the number of spectral sensing devices. It should be noted that in other examples, three or more sets of spectral sensing devices can also be used to shorten the sensing time.

In the third example of FIG. 6C , the light receiving modules 310A and 310B of two groups of spectral sensing devices 301A and 301B are used to perform sensing simultaneously from different positions, and the moving directions of the light receiving modules 310A and 310B are different. The timing can be either synchronous or independent for each group. The advantage of this design is that the sensing time can be shortened by increasing the number of spectral sensing devices. It should be noted that the spectral sensing method of the above-mentioned first embodiment is also applicable to the second embodiment.

Although in the second embodiment, the distance between the X and Y axes of the light receiving module is the same, in other embodiments, the distance between the X and Y axes of the light receiving module can also be different from each other, and the X axis of the light receiving module The spacing does not have to be fixed, and the Y-axis spacing of the light receiving modules does not have to be kept fixed.

third embodiment

In the first embodiment, although the optical receiving module used is a module spliced with an optical fiber, it is only an optional embodiment. In other embodiments, those skilled in the art can use the end of the optical fiber as a light receiving module to sense the light of the LED die according to their needs. For example, FIG. 7A shows a schematic diagram of a spectrum sensing device according to a first example of the third embodiment of the present invention. Figure 7B shows a cross-sectional view along line 7B-7B of Figure 7A. Figure 7C shows a partially enlarged view of Figure 7A. Regarding the design of the receiving module, after careful fabrication, the receiving ports of multiple optical fibers can also be fixed together by using the characteristics of the acceptance cone of the optical fiber, and directly aligned with the receiving ports of each optical fiber. The LED die collects light without the need for additional sleeve lenses or collimating mirrors. As shown in FIGS. 7A to 7C , the spectrum sensing device 401 of the first example of the third embodiment is similar to the first embodiment, except that all optical transmission media 420 (including optical fibers in this embodiment) are collected The light port ends 421 are fixed together to form a plurality of light receiving modules 410 , and the light receiving ports 426 of the optical fibers 420 are directly aligned with the LED die 2 to receive light. The optical fiber 420 has a core 414 , a cladding 415 surrounding the core 414 and a protective layer 416 surrounding the cladding 415 . In order to enable light to pass through the core 414, the refractive index of the core 414 must be greater than that of the cladding 415 to cause total reflection. The angle of the light-receiving cone of each optical fiber 420 is, for example, 24 degrees. The light-receiving port ends 421 of all optical fibers 420 are fixed together by the fixing element 410F, so that each light-receiving port end 421 is located in the corresponding light-receiving module 410 . The material of the fixing element 410F is plastic, for example, and the optical fiber 420 can be fixed together at one time by injection molding, and at the same time, the rigidity of the light receiving module is improved, so that the robot arm can accurately grasp the light receiving module and move it. The advantage of the first example of the second embodiment is that the optical fiber is used as the light receiving module, which can simplify the manufacturing process and reduce the cost compared with the first embodiment.

Further analysis, in FIG. 7C , the middle core 414 is aligned with an LED die 2b. In this case, the LED die 2b is the portion to be tested. The light sources located in the light-receiving cone AC are totally reflected at the core 414 and finally output to the spectrum sensing module 30 . The light source located outside the light-receiving cone AC will be refracted from the core 414 into the cladding layer 415, and cannot return to the core 414, so it cannot be output from the light exit port 422 of the optical fiber. Therefore, only the light from one LED die 2 b is totally reflected in the core 414 , while the light from the adjacent LED dies 2 a and 2 c cannot be totally reflected in the core 414 . In this way, the sensing work can be performed by adjusting the distance between the light-receiving module 410 and the LED die according to the characteristics of the light-receiving cone of the optical fiber and the arrangement of the light-emitting diodes. It is worth noting that, as can be seen from the configuration in FIG. 7C , the alignment between the light-receiving module 410 and the LED die can also allow a certain degree of error range, as long as the light-receiving range of the light-receiving cone AC can cover the LED die 2b However, it is sufficient not to cover the adjacent LED dies 2a and 2c. In this example, since the light from the adjacent LED dies 2a and 2c will not interfere with the light from the LED die 2b, a lighting device that lights up all the LED dies at once can be used according to the designer's requirements.

In the first example of the third embodiment, although the optical receiving module used is an optical fiber with a protective layer, it is only an optional embodiment. In other examples, those skilled in the art can use an optical fiber without a protective layer as a light receiving module to sense the light of the LED die according to their needs. For example, FIG. 7D shows a schematic diagram of a spectrum sensing device according to a second example of the third embodiment of the present invention. Figure 7E shows a cross-sectional view along line 7E-7E of Figure 7D. As shown in FIG. 7D and FIG. 7E , the optical fiber 520 of the spectrum sensing device 501 includes a core 514 and a cladding 515 . The light output end 522 of the optical fiber 520 is connected to the spectrum sensing module 30 , and the light receiving module 510 includes a combination of the spacer 517 and the light receiving end 521 of the optical fiber 520 . The spacer 517 fixes the receiving port ends 521 of all the optical fibers 520 together. Therefore, the spacer 517 belongs to the additional fixing mechanism in addition to the optical fiber 520 . The optical fiber 520 of the second example is different from the optical fiber 420 of the first example in that the optical fiber 520 only has a core 514 and a cladding layer 515 but no protective layer, while the optical fiber 420 has a protective layer 416 . Therefore, the optical fiber 520 of FIG. 7D appears thinner than the optical fiber 420 of FIG. 7A. Finally, a fixing element 510F is added outside the spacer 517 for fixing the light receiving modules. The material of the fixing element 510F is metal, which can further improve the rigidity of the light receiving module, so that the robot arm can grasp the light receiving module more accurately and move, achieving the effect of the embodiment of the present invention.

According to the two examples of the third embodiment, it can be known that no matter how the optical fiber is fixed, it is sufficient to fix the light-receiving port end of each optical fiber so that the light-receiving port aligns with the LED die for light-receiving. At this time, the light receiving port end of each optical fiber forms a light receiving module having the same function as the light receiving module in FIGS. 5A to 5D .

Fourth embodiment

In the first to third embodiments, although the light-receiving module has a simple light-receiving function as an example for illustration, the light emitting of the light source can be controlled by another module (not shown), but there are only three options Example. In other embodiments, those skilled in the art can add other functions according to their requirements. For example, the lighting device can be integrated into the spectrum sensing device. FIG. 8A and FIG. 8B show a schematic diagram of a partial structure of the spectrum sensing device according to the fourth embodiment of the present invention. FIG. 8C shows a top view of an LED die according to a fourth embodiment of the present invention. As shown in FIG. 8A , the fourth embodiment is similar to the example of FIG. 5C of the first embodiment, except that the lighting device 55 of the spectrum sensing device 200 includes a plurality of probe sets 50 (only drawn for clarity. A probe set 50) and a power supply 60 are provided. The probe sets 50 must be able to contact the light source, so the positions of the probe sets 50 must correspond to the positions of the light sources, that is, the relative distance between the probe sets 50 is kept constant to perform the lighting procedure. Each probe set 50 includes two probes 51 and 52 . The two probes 51 and 52 are fixed in the light receiving module 10, but this is only an optional embodiment, as long as the probes 51 and 52 can supply power to the light source. The probes 51 and 52 are respectively in contact with the cathode 340 and the anode 370 of one of the light sources (such as LED dies) 300 . The power supply 60 provides power to the light sources 300 through the probe sets 50 respectively contacting the light sources, so as to respectively light the light sources 300 and make the light sources 300 output light. The advantage of this embodiment is that before the light source is manufactured or packaged and the power supply lead cannot be pulled out, the probe set 50 can still provide power to the light source 300 to achieve the function of luminescence sensing, so that the embodiment of the present invention The application level is wider, and the characteristics of the light source under various voltage states can be realized by adjusting the voltage of the power supply 60 .

As shown in FIG. 8B , a light emitting diode is used as an example of the light source 300 for illustration. The light emitting diode 300 includes an anti-reflection layer 310, a substrate 320, an N-type cladding layer 330, a first electrode (cathode) 340, a P-type cladding layer 350, a thin metal layer 360, a second electrode ( anode) 370 and an active layer 380 disposed between the N-type cladding layer 330 and the P-type cladding layer 350 . When the first electrode 340 and the second electrode 370 are contacted and energized by the probes 51 and 52 respectively, the active layer 380 emits light. The probes 51 and 52 have the property of elastically touching the electrodes to avoid poor contact or damage to the electrodes.

As shown in FIG. 8C , the first electrode 340 and the second electrode 370 of this embodiment are respectively designed to have two different patterns. The allowable error of the region where the probes 52/51 can contact the electrodes 340/370 is large, which can reduce the influence of manufacturing tolerances.

Since multiple crystal grains of the LED are grown on the chip according to a preset pattern, the distance between the multiple crystal grains can be precisely controlled before the cutting process, so the technology of the embodiment of the present invention can be used to implement sensing. Measurement. But after the cutting process, the LED die will be displaced. If the position of each LED die after dicing can be well controlled, of course, the technique of the embodiment of the present invention can also be used to perform sensing. Alternatively, each LED die after dicing can be placed on a packaging substrate according to a preset pattern, of course, the position of each LED die can be well controlled, and the technology of the embodiment of the present invention can also be used to implement Sensing.

fifth embodiment

In the first embodiment, although the sleeve-type light receiving module is used as an example for illustration, it is only an optional embodiment. In other embodiments, those skilled in the art can use an integrating sphere as the light receiving module according to their needs. For example, FIG. 9 shows a schematic diagram of a spectrum sensing device according to a fifth embodiment of the present invention. As shown in FIG. 9 , the light receiving module of the spectrum sensing device 601 of this embodiment includes a plurality of integrating spheres 610 and a fixing element 610F. The fixing element 610F fixes the integrating spheres 610 and keeps the relative distance between the integrating spheres 610 fixed.

In this embodiment, the driving mechanism 40 is coupled to the chip 3 for moving the chip 3 for positioning and batch sensing. This driving method is also applicable to other embodiments. A single integrating sphere 610 covers multiple light sources 2 on the chip 3 at the same time, so that the light receiving range of the light receiving module can cover multiple light sources 2 at a time. The number of light sources 2 covered by the integrating sphere 610 depends on the size of the integrating sphere and the size and spacing of the light sources 2 , and is not particularly limited here. For example, multiple 1-inch integrating spheres can be used on an 8-inch chip, and the integrating sphere 610 is coupled to the spectrum sensing module 30 through the optical fiber 20, and the effect similar to that of the first embodiment can still be achieved. It should be noted that one of the plurality of light sources 2 covered by the integrating sphere 610 can be turned on while the others are not turned on. Since the relative movement and positioning of the integrating sphere 610 and the chip 3 is time-consuming, the time required for lighting the light source is relatively short, so the chip 3 can be moved once to light up different light sources 2 covered by the integrating sphere 610 in batches. To save more sensing time.

Sixth embodiment

In the fourth embodiment, although the lighting device is described with a probe as an example, it is only an optional embodiment. In other embodiments, those skilled in the art can use other lighting devices according to their requirements. For example, the lighting device used in the sixth embodiment includes a laser lighting device, which is used to output laser beams to the LED dies that fall within the light-receiving range of the light-receiving modules respectively. The way to make these LED grains output light. Even if the laser light is received into the spectrum sensing device, the laser light and the light output by the LED die can be easily distinguished through spectral analysis, so the laser light will not affect the spectrum sensing of the LED die.

Seventh embodiment

In the first embodiment, although the spectrum sensing module is described as an example of performing the sensing process through the optical fiber and the light receiving module, it is only an optional embodiment. In other embodiments, those skilled in the art can make changes according to their needs. For example, FIG. 10 shows a schematic diagram of a spectrum sensing system according to a seventh embodiment of the present invention. As shown in FIG. 10 , the spectral sensing system 701 includes a positioning device 770 , a lighting device 55 , a plurality of spectral sensing modules 30 and a fixing device 30F. The fixing device 30F is used to fix the spectrum sensing modules 30 and keep the relative distance between the spectrum sensing modules 30 fixed. The positioning device 770 coupled to the chip 3 is, for example, a six-axis positioning device, capable of moving and positioning the chip 3 along six axes. Six-axis movement is achieved by translation along three axes and rotation around three axes. It should be noted that in other embodiments, three-axis, four-axis and five-axis positioning devices can also be used. The lighting device 55 is used to light the light source 2 on the chip 3 . The functions of the spectral sensing module 30 are as described above. Therefore, the positioning device 770 moves and positions the chip 3 along multiple axes, so that the light sources 2 respectively fall within the light-receiving ranges of the spectral sensing modules 30, so that the spectral sensing modules 30 respectively receive the light Light output by light source 2. The advantage of this embodiment is that the use of optical fibers and light receiving modules can be omitted, reducing sensing costs.

Eighth embodiment

In the seventh embodiment, although the positioning device is described by taking the moving and positioning chip as an example, it is only an optional embodiment. In other embodiments, those skilled in the art can make changes according to their needs. For example, FIG. 11 shows a schematic diagram of a spectrum sensing system according to an eighth embodiment of the present invention. As shown in FIG. 11 , the spectral sensing system 801 of this embodiment includes a lighting device 55 , multiple spectral sensing modules 30 , a positioning device 770 and a fixing device 30F. The lighting device 55 is used for lighting the multiple light sources 2 on the chip 3 . The functions of the spectral sensing module 30 are as described above. The positioning device 770 coupled to the fixing device 30F is used to move and position the spectral sensing modules 30 along multiple axes, so that the light sources 2 respectively fall within the light-receiving ranges of the spectral sensing modules 30, The spectrum sensing modules 30 can respectively receive the light outputted by the light sources 2 . The advantage of this embodiment is that the use of optical fibers and light receiving modules can be omitted, the cost of sensing can be reduced, and the damage caused by moving chips can be reduced.

Through the spectral sensing device, system and method of the embodiments of the present invention, the sensing time of many light sources such as LED grains can be effectively shortened, which is of great benefit to the improvement of production capacity. For the sensing of the above-mentioned 8-inch chip, if N is equal to 8, the required sensing time is 14000/8=1750 seconds, and the overall time is shortened to 1/8. The embodiment of the present invention adopts a method of collecting light at a larger angle, and even uses a lens, a collimator, and a cosine corrector to collect light into an optical fiber, which can shorten the sensing time and achieve a good sensing effect. In addition, using the probe set to energize the light source to make the light source emit light can make the spectral sensing device of the embodiment of the present invention have wider application levels.

The specific embodiments proposed in the detailed description of the preferred embodiments are only used to facilitate the description of the technical content of the present invention, rather than restricting the present invention to the above-mentioned embodiments in a narrow sense, without departing from the spirit of the present invention and applying for a patent below The circumstances of the range, the implementation of various changes, all belong to the scope of the present invention.

Claims (14)

1. A spectral sensing device, characterized in that, said spectral sensing device comprises: N light-receiving modules are used to respectively receive the light output by N parts to be tested in a group to be tested, wherein N is a positive integer greater than 1; a fixing element, used to fix the plurality of light receiving modules, and maintain a fixed relative distance between the plurality of light receiving modules, so that the N parts to be measured fall on the N within the light-receiving range of a light-receiving module; and N spectral sensing modules are respectively coupled to the N light-receiving modules, and are used to receive the light output by the N parts-to-be-measured through the N light-receiving modules, and transmit each of the light-receiving modules The light output by the part is separated into a plurality of spectral components to obtain a spectral signal corresponding to the plurality of spectral components. 2. The spectral sensing device according to claim 1, wherein said spectral sensing device further comprises: N optical transmission media respectively couple the N light receiving modules to the N light receiving modules. 3. The spectrum sensing device according to claim 2, wherein each of the light receiving modules comprises: A sleeve is coupled to the light transmission medium and has a through hole, wherein the light output by the part to be tested can enter the light receiving module through the through hole. 4. The spectrum sensing device according to claim 3, wherein each of the light receiving modules further comprises a focusing lens, a collimating mirror or a cosine corrector installed in the through hole. 5. The spectrum sensing device according to claim 2, wherein each of the optical transmission media comprises an optical fiber, and a light-receiving port end of each of the optical fibers is located in each of the corresponding light-receiving modules, The fixing element fixes the plurality of light-receiving ports of the plurality of optical fibers together. 6. The spectrum sensing device according to claim 1, wherein the spectrum sensing device further comprises: A driving mechanism, coupled to the fixing element or the group under test, is used to drive the plurality of light receiving modules or the group under test to move. 7. The spectrum sensing device according to claim 6, wherein the N light-receiving modules are arranged in a pattern, and the group to be tested includes N first parts to be tested and N second parts to be tested parts, the N first parts to be tested and the N second parts to be tested are respectively arranged in the pattern; the driving mechanism drives the plurality of light-receiving modules or the group to be tested to move The light-receiving ranges of the N light-receiving modules are respectively located on the N first parts to be measured to perform a first spectrum sensing; the driving mechanism drives the plurality of light-receiving modules or the to-be-measured parts The measurement group is moved so that the light-receiving ranges of the N light-receiving modules are respectively located on the N second parts to be measured, so as to perform a second spectrum sensing. 8. The spectral sensing device as claimed in claim 1, wherein each said spectral sensing module comprises: a body; an input part, configured in the body, and coupled to the light receiving module to receive the light output by the part to be tested; a diffraction grating, configured in the body, for separating the light output by the part to be measured into the plurality of spectral components; and A sensor, configured in the body, is used to sense the plurality of spectral components to obtain the spectral signal. 9. The spectral sensing device according to claim 1, wherein the spectral sensing device further comprises: N probe sets are used to respectively contact the N parts to be tested, wherein the relative distance between the N probe sets is kept constant; and A power supply, coupled to the N probe sets, is used to respectively provide power to the N units under test through the N probe sets, so as to light up the N units under test respectively. 10. The spectral sensing device according to claim 1, wherein the spectral sensing device further comprises: A lighting device for outputting light beams to the plurality of parts-to-be-measured that fall within the light-receiving ranges of the N light-receiving modules, so that the plurality of parts-to-be-tested output light. 11. The spectrum sensing device according to claim 1, wherein the light receiving module comprises an integrating sphere, which is used to make the light receiving range of the light receiving module cover the group to be measured at one time. Multiple parts to be tested. 12. A spectral sensing system for sensing a plurality of parts to be tested in a group to be measured, characterized in that the spectral sensing system comprises: a lighting device, used to light the plurality of parts to be tested, so that the plurality of parts to be tested output light; A plurality of spectral sensing modules are used to respectively receive the light outputted by the plurality of parts to be measured, and separate the light outputted by each of the parts to be measured into a plurality of spectral components, so as to obtain the light corresponding to the a spectral signal of a plurality of spectral components; A fixing device for fixing the plurality of spectral sensing modules and maintaining a fixed relative distance between the plurality of spectral sensing modules; and A positioning device, coupled to the fixing device or the group to be measured, for positioning the plurality of spectral sensing modules or the group to be measured, so that the plurality of parts to be measured are respectively Falling within the light-receiving range of the plurality of spectral sensing modules, the plurality of spectral sensing modules can respectively receive the light outputted by the plurality of parts to be measured. 13. A spectral sensing method, characterized in that, the spectral sensing method comprises: positioning the relative positions of the multiple light receiving modules and the multiple first parts to be measured in a group to be tested, so that the multiple first parts to be measured fall on the light receiving modules of the multiple light receiving modules respectively; Within the range, the relative distance between the plurality of light-receiving modules is kept fixed; Lighting the plurality of first parts to be measured to output light; and The plurality of spectrum sensing modules respectively receive the light output by the plurality of first parts to be measured through the plurality of light receiving modules to perform spectrum sensing. 14. The spectral sensing method according to claim 13, characterized in that, the spectral sensing method further comprises: positioning the relative positions of the plurality of light-receiving modules and the plurality of second parts-to-be-tested in the group-to-be-measured, so that the plurality of second parts-to-be-measured respectively fall on the plurality of light-receiving modules; within the light-receiving range of the module, wherein the plurality of second parts-to-be-tested is different from the plurality of first parts-to-be-tested; Lighting the plurality of second DUTs to output light; and The plurality of spectrum sensing modules respectively receive the light outputted by the plurality of second parts to be measured through the plurality of light receiving modules to perform spectrum sensing.

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