CN103884424B - measuring device and measuring method - Google Patents
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- CN103884424B CN103884424B CN201210568682.7A CN201210568682A CN103884424B CN 103884424 B CN103884424 B CN 103884424B CN 201210568682 A CN201210568682 A CN 201210568682A CN 103884424 B CN103884424 B CN 103884424B
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- 238000005259 measurement Methods 0.000 claims description 41
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Abstract
The invention provides a measuring device and a measuring method. The measuring device comprises a conductive probe card, an optical receiving module, a light splitting module and a data processing module. The conductive probe card is arranged on at least one light-emitting device of the wafer to drive the at least one light-emitting device, so that the at least one light-emitting device emits incident light and penetrates through the conductive probe card; an optical receiving module for receiving the incident light passing through the conductive probe card; the light splitting module converts incident light into a spectrum signal; and the data processing module calculates an optical parameter according to the spectrum signal.
Description
Technical field
The invention relates to a kind of optical characteristic measurement method, especially measured the method for the full luminous flux of light emitting diode (LED) about one by conducting probe card.
Background technology
LED (Light emitting diode) has the characteristic that power consumption is little, the life-span is long, reaction velocity is fast, is described as next light fixture from generation to generation.LED industry structure is divided into upper, middle and lower to swim.After raw material is made into epi-wafer by upstream, middle reaches are responsible for being integrated into LED wafer, then will carry out crystal grain and cut into single crystal grain (LED chip die), finally in downstream, die package are become the LED of various different kenel.Therefore, the energy conversion efficiency of optical parametric for assessment light source measuring LED is very important.
At present for LED, the method measuring optical parametric (such as full luminous flux) mainly can be divided into two large classes, is respectively integrating sphere type and solar panel formula (PV cell).With regard to integrating sphere type, due to conventional probe height limitation, therefore this method only can measure the luminous flux of 120 degree of light acceptance angles.The opposing party's rule is solar panel formula, carries out the action of receiving light after using solar panel contraposition.The method is limited to conventional probe height limitation equally, makes light acceptance angle be 128 degree.
In view of this, a kind of new scheme is needed, to solve the problem.
Summary of the invention
The invention provides a kind of measurement mechanism and measuring method, framework based on array-type micro integrating sphere conductive transparent probe card of arranging in pairs or groups, make the light acceptance angle of full luminous flux can reach more than 140 degree, and can reduce contraposition number of times, to reduce the bit errors that its mechanism produces, improve measuring speed.
The invention provides a kind of measurement mechanism, in order to measure the multiple light-emitting devices on a wafer, comprise a conducting probe card, an optical receiver module, a spectral module and a data processing module.Conducting probe card be positioned over wafer at least one light-emitting device on, to drive at least one light-emitting device, make at least one light-emitting device send an incident light and through conducting probe card; Optical receiver module receives the incident light through conducting probe card; Incident light is converted to spectral signal by spectral module; And data processing module calculates an optical parametric according to spectral signal.
The invention provides a kind of measuring method being applied to a measurement mechanism, measurement mechanism comprises a conducting probe card, an optical receiver module, a spectral module and a data processing unit, and measuring method comprises placement conducting probe and is stuck at least one light-emitting device of a wafer; Drive at least one light-emitting device by conducting probe card, make at least one light-emitting device send an incident light and pass conducting probe card; The incident light through conducting probe card is received by optical receiver module; By spectral module, this is penetrated light and be converted to spectral signal; And calculate an optical parametric by data processing module according to spectral signal.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of an embodiment provided by the present invention;
Fig. 2 is the schematic diagram of measuring method provided by the present invention;
Fig. 3 is the schematic diagram of another embodiment provided by the present invention;
Fig. 4 is the schematic diagram of another embodiment provided by the present invention;
Fig. 5 is the schematic diagram of another embodiment provided by the present invention;
Fig. 6 is the schematic diagram of another embodiment provided by the present invention;
Fig. 7 is the operational flowchart of measurement mechanism provided by the present invention.
[primary clustering symbol description]
100,300,400,500,600 ~ pick-up unit;
101,201,301,401,501,601 ~ conducting probe card;
102 ~ optical receiver module;
103,303,403,503,603 ~ spectral module;
104,304,404,504,604 ~ data processing module;
105,305,405,505,605 ~ light-emitting device;
202 ~ wafer;
205a ~ the first light-emitting device;
205b ~ the second light-emitting device;
206,306,406,506,606 ~ integrating sphere;
207 ~ opening;
308,408,508,608 ~ incident light;
416,516,616 ~ integrating sphere array.
Embodiment
Device and the using method of various embodiments of the invention will be discussed in detail below.But it should be noted that many feasible inventive concepts provided by the present invention may be implemented in various particular range.These specific embodiments are only for illustrating device of the present invention and using method, but non-for limiting scope of the present invention.
Fig. 1 is the schematic diagram of an embodiment of measurement mechanism proposed by the invention.As shown in the figure, measurement mechanism 100 comprises conducting probe card 101, optical receiver module 102, spectral module 103 and a data processing module 104.Measurement mechanism 100 can be applicable to the detection of optical characteristics.For example, measurement mechanism 100 can detect the various optical parametric such as frequency spectrum, wavelength, full luminous flux, brightness and colourity of light-emitting device 105.Light-emitting device 105 can be the light-emitting device that one or more membraneous material, semiconductor material, optical material, organic material or the inorganic material be positioned on wafer or substrate is formed.In preferred embodiment of the present invention, light-emitting device 105 is a light emitting diode (LED).
Conducting probe card 101 is connected to data processing module 104 and a voltage source (not shown), and is electrically connected to light-emitting device 105, to provide voltage and to drive this light-emitting device 105.Carefully, conducting probe card 101 is adhered by the micro-linear array unit of multiple layer metal, be stacked to certain thickness and formed; And this metal micro-linear array unit is made up of the micro-line of multiple metals of insulation film coated individual layer unidirectional array.When conducting probe card 101 to be positioned on light-emitting device 105 and to be electrically connected, the micro-line of metal that this voltage source just can pass through among conducting probe card 101 transmits voltage, to drive light-emitting device 105.In addition, the translational speed of the controlled conducting probe card 101 processed of data processing module 104 and direction, and control the voltage of its reception from voltage source.
Optical receiver module 102 is connected to data processing module 104, in order to receive light-emitting device 105 driven by conducting probe card 102 after the incident light that sends, and be sent to spectral module 103.Optical receiver module 102 can be an integrating sphere, an integrating sphere array, solar panels ... etc. various receipts electro-optical device.In an embodiment of the present invention, integrating sphere array is made up of multiple integrating sphere, and the integrating sphere in integrating sphere array can synchronously move or move independently.In addition, data processing module 104 can control translational speed and the direction of optical receiver module 102.In an embodiment of the present invention, conducting probe card 101 is arranged between light-emitting device 105 on wafer and optical receiver module 102.In other words, light-emitting device 105 by after driving the incident light that sends can pass conducting probe card 101, and receive by optical receiver module 102.
Spectral module 103 is that the incident light in order to be received by optical receiver module 102 is converted to spectral signal.In an embodiment of the present invention, spectral module is a single channel spectrometer or multi-channel optical spectrometer, in order to the light beam of different wave length comprised by incident light, is separated and imaging with different diffraction angle.Carefully, spectral module 103 comprises a smooth detection element, a dispersive elements and multiple lens combination.Incident light becomes collimated optical beam surely by this lens combination, dispersive elements is in order to the light beam by different wave length contained in collimated light beam, with different diffraction angle separately, and then focus on each wavelength light beam through another lens combination and image in light detection element, to detect the energy intensity of each wavelength light beam, obtain the spectral signal of incident light.Generally speaking, the effect of spectral module 103 is the wavelength analyzing incident light, to obtain corresponding spectral signal.
Data processing module 104, according to the spectral signal from spectral module 103, can judge Wavelength distribution situation, to calculate the various optical parametrics such as full luminous flux, brightness and colourity.Data processing module 104 can be a micro processor, chipset or in be built in the software application of spectral module 103.In addition, data processing module 104 can control spectral module 103, the unlatching of optical receiver module 102 and conducting probe card 101 or closedown, and the translational speed of optical receiver module 102 and conducting probe card 101 and direction.
Fig. 2 is the schematic diagram of measuring method provided by the present invention.Conducting probe card 201 be placed at least there is the first light-emitting device 205a and the second light-emitting device 205b a wafer on.Now, conducting probe card 201 has electrical contact to the first light-emitting device 205a and the second light-emitting device 205b, and the first light-emitting device 205a put on bright crystal wafer 202 and the second light-emitting device 205b.It should be noted that, conducting probe card 201 can be a transparent conducting probe card 201, the incident light that first light-emitting device 205a and the second light-emitting device 205b is sent can penetrate conducting probe card 201 and by the opening 207 of integrating sphere 206, and is integrated ball 206 and receives.In addition, conducting probe card 201 can be subject to the control of data processing module 104, and drives all or part of light-emitting device.
It should be noted that conducting probe card 201 used in the present invention, once can carry out contraposition to whole light-emitting devices, and light all or part of light-emitting device.But, in general measurement mechanism, owing to using the probe amount of giving me a little light-emitting device, when measuring each time before light-emitting device, all must carry out contraposition to probe and light-emitting device.Therefore, the measurement mechanism in the present invention can reduce contraposition number of times, and the error that during minimizing contraposition, mechanism produces, thus improves measuring speed.
Generally speaking, integrating sphere 206 comprises light detecting meter (photo meter) and a plate washer, and the interior surface of integrating sphere 206 can be coated with the reflectance coating (such as barium sulphate) of high scattering properties.When incident light is by after opening 207, scattering can be carried out in the inside of integrating sphere 206, then absorb by light detecting meter.Therefore, integrating sphere can collect the incident light that light emitting module 205a or 205b sends, and the object of plate washer is to stop that incident light directly enters quantometer.In general measurement mechanism, owing to using probe to light light-emitting device, in order to the space of reserved probe, what make between integrating sphere 206 and light-emitting device 205 is distant, causes to receive angular and only have 120 degree.Because the present invention uses conducting probe card 201, therefore do not need headspace between integrating sphere 206 and light-emitting device 205, significantly reduce distance between the two, make to receive angular and rise to 140 degree.In one embodiment of this invention, the thickness of conductive transparent probe card is about 0.5mm, and the diameter of opening 207 is 3.75mm, and integrating sphere aperture area accounts for 8% of total surface area, and integrating sphere internal diameter at least needs 6.6mm, and its external diameter size is about 7.6mm, but is not limited to this.
Fig. 3 is another embodiment of measurement mechanism provided by the present invention.Measurement mechanism 300 comprises data processing module 304, spectral module 303, integrating sphere 306 and conducting probe card 301.First, data processing module 304 controls conducting probe card 301 and carries out contraposition, then is placed on light-emitting device 305 by conducting probe card 301, and light-emitting device 305 is lighted by conducting probe card 301.Then, data processing module 304 controls integrating sphere 306 to carry out contraposition.That is, integrating sphere 306 is placed in directly over light-emitting device 305 by data processing module 304, and as best one can close to light-emitting device 305, to receive the incident light 307 that light-emitting device 305 sends as far as possible.In one embodiment, integrating sphere 306 is placed in directly over light-emitting device 305, and its openings contact is to conducting probe card 301.After contraposition completes, integrating sphere 306 collects incident light 308, and then the incident light 308 collected by integrating sphere 306 is converted to spectral signal by spectral module 303, and is sent to data processing module 304, and final data processing module 304 calculates optical parametric.
It should be noted that in general measurement mechanism, owing to using the probe amount of giving me a little light-emitting device, when measuring each time before light-emitting device 305, all must carry out contraposition to probe and light-emitting device 305.Because the present invention uses conducting probe card 301, once conducting probe card 301 and light-emitting device 305 complete contraposition and after being electrically connected to light-emitting device 305, just can light all or part of light-emitting device 305.In other words, embodiments of the invention only need contraposition conducting probe card 301 and light-emitting device 305 once, first will carry out contraposition before not needing to measure each light-emitting device 305 to conducting probe card 301 and light-emitting device 305.Therefore, the measurement mechanism in the present invention can reduce contraposition number of times, and the error that during minimizing contraposition, mechanism produces, thus improves measuring speed.
Fig. 4 is another embodiment of measurement mechanism provided by the present invention.Measurement mechanism 400 comprises data processing module 404, spectral module 403, integrating sphere array 416 and conducting probe card 401.Integrating sphere array 416 is made up of with the arrangement mode of one dimension or two-dimensional array multiple integrating sphere 406.In one embodiment, integrating sphere array 416 is the array of a 4x4, is namely made up of 16 integrating spheres 406.Measurement mechanism 400 is lighted with positioning luminous device 405, is collected the method for incident light 408 and calculating optical parameter as previously mentioned, repeats no more herein.It should be noted that spectral module 403 can be a multi-channel spectrometer based, receive the incident light 408 of multiple integrating sphere 406 simultaneously, and be converted to multiple spectral signal, be then sent to data processing module 404.
In addition, integrating sphere array 416 can be subject to the control of data processing module 404, coordinates other mechanical hook-up, mechanism or equipment, moves in a two-dimensional manner, so that the incident light 408 that the light-emitting device 405 receiving diverse location sends.It should be noted that data processing module 404 can control the movement of an integrating sphere among integrating sphere array 416, multiple integrating sphere or whole integrating spheres.In other words, each integrating sphere 406 among integrating sphere array 416 can move independently of one another, and Partial synchronization moves or whole synchronizing moving.
Fig. 5 is another embodiment of measurement mechanism provided by the present invention.Measurement mechanism 500 comprises data processing module 504, spectral module 503, integrating sphere 506 and conducting probe card 501.Measurement mechanism 500 collects the method for incident light 508 and calculating optical parameter as previously mentioned, repeats no more herein.It should be noted that in this embodiment, multiple integrating sphere 506 is integrated on conducting probe card 501.In other words, multiple integrating sphere 506 is synchronization-moving with conducting probe card 501.In other embodiment, measurement procedure contains the step of twice contraposition, i.e. the contraposition of the contraposition of conducting probe card 501 and light-emitting device 505, and integrating sphere 506 and light-emitting device 505.But, in the present embodiment, because integrating sphere 506 is integrated on conducting probe card 501, therefore only need a contraposition, just can by integrating sphere 506 with the while of conducting probe card 501 with light-emitting device 505 contraposition.Therefore, the measurement mechanism in the present embodiment can reduce contraposition number of times further, and the error that during minimizing contraposition, mechanism produces, thus improves measuring speed.
Fig. 6 is another embodiment of measurement mechanism provided by the present invention.Measurement mechanism 600 comprises data processing module 604, spectral module 603, integrating sphere 606 and conducting probe card 601.Measurement mechanism 600 collects the method for incident light 608 and calculating optical parameter as previously mentioned, repeats no more herein.It should be noted that in this embodiment, conducting probe card group comprises multiple conducting probe card 601, integrates an integrating sphere 606 on each conducting probe card 601 respectively.Because each conducting probe card 601 is integrated on integrating sphere 606 respectively, each integrating sphere therefore among integrating sphere array 616 can move independently.Similarly, because integrating sphere 606 is integrated on conducting probe card 601, therefore only need a contraposition, just can by integrating sphere 606 with the while of conducting probe card 601 with light-emitting device 605 contraposition.Therefore, the measurement mechanism in the present embodiment can reduce contraposition number of times further, and the error that during minimizing contraposition, mechanism produces, thus improves measuring speed.
Fig. 7 is the operational flowchart of measurement mechanism 400 provided by the present invention.First, in step S71, conducting probe card 401 is positioned at least one light-emitting device 405, and is driven by light-emitting device 405, makes light-emitting device 405 send an incident light 408 respectively and passes conducting probe card 401.Then, in step S72, optical receiver module receives the incident light 408 through conducting probe card 401.For example, optical receiver module is an integrating sphere 406 or an integrating sphere array 416, and integrating sphere array 416 is made up of multiple integrating sphere 406.It should be noted that integrating sphere 406 can be integrated on conducting probe card 401 further.In step S73, incident light 408 is converted to spectral signal by spectral module 403, and spectral module 406 is single channel spectrometer or multi-channel optical spectrometer.Finally, in step S74, data processing module 404 is according to spectral signal calculating optical parameter.For example, optical parametric comprises the parameters such as full luminous flux, colourity and brightness.The thin portion content of abovementioned steps S71 ~ S74 is as described in the embodiment of Fig. 1 to Fig. 6, therefore is not repeated in this.
But as described above, be only preferred embodiment of the present invention, when not limiting scope of the invention process with this, the simple equivalence namely generally done according to claims of the present invention and invention description content changes and modifies, and all still remains within the scope of the patent.In addition, any embodiment of the present invention or claims must not reach whole object disclosed by the present invention or advantage or feature.In addition, summary part and title are only used to the use of auxiliary patent document search, are not used for limiting interest field of the present invention.
Claims (18)
1. a measurement mechanism, is characterized in that, in order to measure the multiple light-emitting devices on a wafer, comprising:
One conducting probe card, on at least one light-emitting device being positioned over this wafer, to drive this at least one light-emitting device, make this at least one light-emitting device send an incident light and pass this conducting probe card, wherein this conducting probe card comprises the micro-linear array unit of multiple layer metal, in order to be electrically connected this light-emitting device, and every layer of metal micro-linear array unit is made up of the micro-line of multiple metals of an insulation film coated individual layer unidirectional array;
One optical receiver module, in order to receive this incident light through this conducting probe card;
One spectral module, is converted to a spectral signal by this incident light; And
One data processing module, calculates an optical parametric according to this spectral signal.
2. measurement mechanism according to claim 1, is characterized in that, this spectral module is a spectrometer, and in order to basis with multiple different diffraction angle, the light beam of the different wave length comprised by this incident light is separated and imaging.
3. measurement mechanism according to claim 1, is characterized in that, this conducting probe card is a transparent conducting probe card.
4. measurement mechanism according to claim 1, is characterized in that, this optical parametric comprises one of them or its combination of full luminous flux, colourity or brightness.
5. measurement mechanism according to claim 1, is characterized in that, this optical receiver module is an integrating sphere.
6. measurement mechanism according to claim 1, it is characterized in that, this conducting probe card drives one first light-emitting device on this wafer and one second light-emitting device, this optical receiver module comprises a first integral ball and a second integral ball, with receive respectively this first light-emitting device and this second light-emitting device send and pass the incident light of this conducting probe card.
7. the measurement mechanism according to claim 5 or 6, is characterized in that, this integrating sphere is integrated on this conducting probe card.
8. measurement mechanism according to claim 6, it is characterized in that, also comprise this data processing module in order to control this first integral ball and this second integral ball, this first integral ball and this second integral ball are synchronously moved, to aim at this first light-emitting device and this second light-emitting device respectively.
9. measurement mechanism according to claim 6, it is characterized in that, also comprise this data processing module in order to control this first integral ball and this second integral ball, this first integral ball and this second integral ball are moved independently, to aim at this first light-emitting device and this second light-emitting device respectively.
10. a measuring method, is characterized in that, is applied to a measurement mechanism, and this measurement mechanism comprises a conducting probe card, an optical receiver module, a spectral module and a data processing unit, and this measuring method comprises:
Placing this conducting probe is stuck at least one light-emitting device of a wafer, wherein this conducting probe card comprises the micro-linear array unit of multiple layer metal, in order to be electrically connected this light-emitting device, and every layer of metal micro-linear array unit is made up of the micro-line of multiple metals of an insulation film coated individual layer unidirectional array;
Drive this at least one light-emitting device by this conducting probe card, make this at least one light-emitting device send an incident light and pass this conducting probe card;
This incident light through this conducting probe card is received by this optical receiver module;
This incident light is changed into spectral signal by this spectral module; And
An optical parametric is calculated according to this spectral signal by this data processing unit.
11. measuring methods according to claim 10, is characterized in that, changing the step that this incident light is spectral signal is by a spectrometer, and according to multiple different diffraction angle, the light beam of the different wave length comprised by this incident light is separated and imaging.
12. measuring methods according to claim 10, is characterized in that, drive the step of this at least one light-emitting device to be drive this at least one light-emitting device by a transparent conducting probe card.
13. measuring methods according to claim 10, is characterized in that, this optical parametric comprises one of them or its combination of full luminous flux, colourity or brightness.
14. measuring methods according to claim 10, is characterized in that, the step receiving this incident light comprises by this incident light through this conducting probe card of the integrating sphere reception in this optical receiver module.
15. measuring methods according to claim 10, it is characterized in that, this conducting probe card drives one first light-emitting device of this wafer and one second light-emitting device, and the step receiving this incident light comprise by the first integral ball in this optical receiver module and a second integral ball measure respectively this first light-emitting device and this second light-emitting device send and pass the incident light of this conducting probe card.
16. measuring methods according to claims 14 or 15, it is characterized in that, this integrating sphere is integrated on this conducting probe card.
17. measuring methods according to claim 15, it is characterized in that, the step receiving this incident light also comprises by this data processing module in order to control this first integral ball and this second integral ball, this first integral ball and this second integral ball are moved independently, to aim at this first light-emitting device and this second light-emitting device respectively.
18. measuring methods according to claim 15, it is characterized in that, the step receiving this incident light also comprises by this data processing module in order to control this first integral ball and this second integral ball, this first integral ball and this second integral ball are synchronously moved, to aim at this first light-emitting device and this second light-emitting device respectively.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101148229A TWI467141B (en) | 2012-12-19 | 2012-12-19 | Measurement device and measurement method |
| TW101148229 | 2012-12-19 |
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| CN103884424A CN103884424A (en) | 2014-06-25 |
| CN103884424B true CN103884424B (en) | 2015-11-04 |
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| CN201210568682.7A Active CN103884424B (en) | 2012-12-19 | 2012-12-25 | measuring device and measuring method |
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| US10761146B2 (en) | 2017-05-29 | 2020-09-01 | Samsung Electronics Co., Ltd. | Wafer probe card for evaluating micro light emitting diodes, analysis apparatus including the same, and method of fabricating the wafer probe card |
| CN108548796A (en) * | 2018-04-17 | 2018-09-18 | 李傲兰 | Portable laser measuring apparatus for reflection index |
| TWI759864B (en) * | 2020-09-17 | 2022-04-01 | 均豪精密工業股份有限公司 | Detection apparatus and light-receiving device thereof |
| CN114112031A (en) * | 2022-01-24 | 2022-03-01 | 鲁欧智造(山东)高端装备科技有限公司 | Laser energy intensity measuring method of high-power laser chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3133938B2 (en) * | 1996-03-08 | 2001-02-13 | シャープ株式会社 | Apparatus for measuring electro-optical characteristics of semiconductor devices |
| TW201038928A (en) * | 2009-04-24 | 2010-11-01 | Epistar Corp | Measurement apparatus for light-emitting diode |
| CN102445668A (en) * | 2010-10-11 | 2012-05-09 | 财团法人工业技术研究院 | Wafer-level light-emitting diode chip detection method, detection device and transparent probe card |
| CN102645276A (en) * | 2011-02-16 | 2012-08-22 | 台湾超微光学股份有限公司 | Spectrum sensing equipment, system and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012109789A1 (en) * | 2011-02-16 | 2012-08-23 | 台湾超微光学股份有限公司 | Array-type spectrum detecting device |
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- 2012-12-19 TW TW101148229A patent/TWI467141B/en active
- 2012-12-25 CN CN201210568682.7A patent/CN103884424B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3133938B2 (en) * | 1996-03-08 | 2001-02-13 | シャープ株式会社 | Apparatus for measuring electro-optical characteristics of semiconductor devices |
| TW201038928A (en) * | 2009-04-24 | 2010-11-01 | Epistar Corp | Measurement apparatus for light-emitting diode |
| CN102445668A (en) * | 2010-10-11 | 2012-05-09 | 财团法人工业技术研究院 | Wafer-level light-emitting diode chip detection method, detection device and transparent probe card |
| CN102645276A (en) * | 2011-02-16 | 2012-08-22 | 台湾超微光学股份有限公司 | Spectrum sensing equipment, system and method |
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| TW201425886A (en) | 2014-07-01 |
| CN103884424A (en) | 2014-06-25 |
| TWI467141B (en) | 2015-01-01 |
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