TWI759864B - Detection apparatus and light-receiving device thereof - Google Patents

Detection apparatus and light-receiving device thereof Download PDF

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TWI759864B
TWI759864B TW109132074A TW109132074A TWI759864B TW I759864 B TWI759864 B TW I759864B TW 109132074 A TW109132074 A TW 109132074A TW 109132074 A TW109132074 A TW 109132074A TW I759864 B TWI759864 B TW I759864B
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light
emitting
rays
lens group
telecentric lens
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TW109132074A
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TW202212833A (en
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李茂杉
張伯墉
張凱宇
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均豪精密工業股份有限公司
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Abstract

The present invention provides a detection apparatus and a light-receiving device thereof. The light-receiving device includes a telecentric lens assembly, an image processing module, and a calculation module. The telecentric lens assembly has a light entrance end and a light exit end, and is configured to guide a plurality of first light beams, which are emitted from a plurality of lighting chips and travel therein by passing through the light entrance end, to travel out of the light exit end so as to form a plurality of second light beams each having a smaller divergence angle. The image processing module is disposed on the light exit end of the telecentric lens assembly for receiving and processing each of the second light beams to calculate a RGB gray scale value of the corresponding lighting chip. The calculation module is electrically coupled to the image processing module for receiving the RGB gray scale value of each of the lighting chips to calculate a light parameter of each of the lighting chips.

Description

檢測設備及其收光裝置Detection equipment and its light-receiving device

本發明涉及一種檢測設備,尤其涉及一種能夠同時檢測多個發光晶片的檢測設備及其收光裝置。 The present invention relates to a detection device, in particular to a detection device capable of simultaneously detecting a plurality of light-emitting wafers and a light-receiving device thereof.

用來檢測多個發光晶片的現有檢測設備,其是將多個所述發光晶片發出的光線總合當作單個面光源,而後依據所述面光源所推知的光參數總合在除以多個所述發光晶片的數量,以作為每個所述發光晶片的光參數。也就是說,現有檢測設備並無法在多個發光晶片之中,單獨檢測一個所述發光晶片的光參數。 Existing inspection equipment for detecting a plurality of light-emitting chips, which takes the sum of the light emitted by a plurality of the light-emitting chips as a single surface light source, and then divides the sum of the light parameters inferred according to the surface light source by a plurality of The number of the light-emitting wafers is used as the light parameter of each light-emitting wafer. That is to say, the existing detection equipment cannot individually detect the light parameters of one of the light-emitting wafers among the plurality of light-emitting wafers.

於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

本發明實施例在於提供一種檢測設備及其收光裝置,能有效地改善現有檢測設備所可能產生的缺陷。 The embodiments of the present invention provide a detection device and a light-receiving device thereof, which can effectively improve the defects that may occur in the existing detection device.

本發明實施例公開一種檢測設備,其包括:一電性檢測裝置,包含:一探針卡;一光學對位模組,其位置對應於所述探針卡;一透光載盤,其位置與所述探針卡相對應,並且所述透光載盤具有用來承載多個發光晶片 的一承載面與位於所述承載面相反側的一出光面;其中,所述探針卡能通過所述光學對位模組的對位後,而用來同時供電且電性檢測所述透光載盤上的多個所述發光晶片,以使每個所述發光晶片朝向所述出光面發出具有第一發散角度的一第一光線;以及一收光裝置,其鄰近地設置於所述透光載盤的所述出光面,並且所述收光裝置包含有:一遠心透鏡組,其包含有一入光端及一出光端;其中,所述遠心透鏡組用來導引由所述出光面穿出而自所述入光端穿入其內的多個所述第一光線,並使多個所述第一光線自所述出光端穿出且形成多道第二光線;其中,每道所述第二光線的第二發散角度小於相對應所述第一光線的所述第一發散角度;一影像處理模組,其設置於所述遠心透鏡組的所述出光端,用來接收並處理自所述出光端穿出的每道所述第二光線,以計算出相對應的所述發光晶片的RGB灰階值;及一演算模組,其電性耦接於所述影像處理模組,用來接收每個所述發光晶片的所述RGB灰階值並演算出每個所述發光晶片的光參數。 The embodiment of the present invention discloses a detection device, which includes: an electrical detection device, including: a probe card; an optical alignment module, the position of which corresponds to the probe card; Corresponding to the probe card, and the light-transmitting carrier plate is used to carry a plurality of light-emitting wafers A bearing surface and a light emitting surface on the opposite side of the bearing surface; wherein, the probe card can be used to simultaneously supply power and electrically detect the transparent a plurality of the light-emitting chips on the optical carrier, so that each of the light-emitting chips emits a first light beam with a first divergence angle toward the light-emitting surface; and a light-receiving device disposed adjacent to the light-emitting surface The light-emitting surface of the light-transmitting carrier disc, and the light-receiving device includes: a telecentric lens group, which includes a light-incoming end and a light-emitting end; wherein, the telecentric lens group is used to guide the light from the light-emitting a plurality of the first rays of light that pass through the light-incident end and penetrate into it, and make the plurality of first rays pass through the light-emitting end to form a plurality of second rays; wherein, each The second divergence angle of the second light is smaller than the first divergence angle corresponding to the first light; an image processing module is disposed at the light-emitting end of the telecentric lens group for receiving and process each of the second light rays passing through the light-emitting end to calculate the corresponding RGB grayscale value of the light-emitting chip; and an arithmetic module electrically coupled to the image processing The module is used for receiving the RGB grayscale values of each of the light-emitting chips and calculating the light parameters of each of the light-emitting chips.

本發明實施例也公開一種檢測設備的收光裝置,其包括:一遠心透鏡組,其包含有一入光端及一出光端;其中,所述遠心透鏡組用來導引多個發光晶片所發出且自所述入光端穿入其內的多道第一光線,並使多個所述第一光線自所述出光端穿出且形成彼此不重疊的多道第二光線;其中,每道所述第二光線的第二發散角度小於相對應所述第一光線的第一發散角度;一影像處理模組,其設置於所述遠心透鏡組的所述出光端,用來接收並處理自所述出光端穿出的每道所述第二光線,以計算出相對應的所述發光晶片的RGB灰階值;以及一演算模組,其電性耦接於所述影像處理模組,用來接收每個所述發光晶片的所述RGB灰階值並演算出每個所述發光晶片的光參數。 The embodiment of the present invention also discloses a light receiving device of a detection device, which includes: a telecentric lens group, which includes a light entrance end and a light output end; wherein, the telecentric lens group is used to guide the light emitted by a plurality of light-emitting chips And a plurality of first rays penetrate into it from the light entrance end, and make a plurality of the first rays pass through the light exit end and form a plurality of second rays that do not overlap each other; wherein, each The second divergence angle of the second light is smaller than the first divergence angle corresponding to the first light; an image processing module, which is arranged at the light output end of the telecentric lens group, is used to receive and process the self Each of the second rays of light emitted from the light-emitting end is used to calculate the corresponding RGB grayscale value of the light-emitting chip; and an arithmetic module is electrically coupled to the image processing module, It is used to receive the RGB grayscale values of each of the light-emitting chips and calculate the light parameters of each of the light-emitting chips.

綜上所述,本發明實施例所公開的檢測設備及其收光裝置,通過在多個所述發光晶片的光線進入所述影像處理模組之前設置有所述遠心 透鏡組,以通過所述遠心透鏡組來區隔多個所述發光晶片的光線,每個所述發光晶片的光線能夠單獨地被所述影像處理模組與所述演算模組所檢測,進而得知每個所述發光晶片的光參數。 To sum up, in the detection device and the light receiving device disclosed in the embodiments of the present invention, the telecentricity is disposed before the light of the plurality of light-emitting chips enters the image processing module. a lens group to separate the light of a plurality of the light-emitting chips through the telecentric lens group, and the light of each light-emitting chip can be independently detected by the image processing module and the calculation module, and then Know the light parameters of each of the light-emitting wafers.

為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

100:檢測設備 100: Testing equipment

1:電性檢測裝置 1: Electrical testing device

11:探針卡 11: Probe card

12:光學對位模組 12: Optical alignment module

13:透光載盤 13: Translucent carrier disc

131:承載面 131: Bearing surface

132:出光面 132: light-emitting surface

14:移載模組 14: Transfer module

2:收光裝置 2: Light receiving device

21:遠心透鏡組 21: Telecentric lens group

211:入光端 211: Lighting end

212:出光端 212: light output end

22:影像處理模組 22: Image processing module

221:影像接收器 221: Image receiver

222:信號處理單元 222: Signal processing unit

23:演算模組 23: Calculation module

24:減光鏡 24: ND filter

25:分光鏡 25: Beamsplitter

26:光譜儀 26: Spectrometer

200:發光晶片 200: Luminous Chip

300:載體 300: Carrier

L1:第一光線 L1: first ray

σ1:第一發散角度 σ1: first divergence angle

L2:第二光線 L2: second ray

σ2:第二發散角度 σ2: Second divergence angle

圖1為本發明實施例一的檢測設備的示意圖。 FIG. 1 is a schematic diagram of a detection device according to Embodiment 1 of the present invention.

圖2為圖1的局部示意圖。 FIG. 2 is a partial schematic view of FIG. 1 .

圖3為圖2的局部示意圖。 FIG. 3 is a partial schematic view of FIG. 2 .

圖4為本發明實施例二的檢測設備的局部示意圖。 FIG. 4 is a partial schematic diagram of a detection device according to Embodiment 2 of the present invention.

圖5為圖4的局部示意圖。 FIG. 5 is a partial schematic view of FIG. 4 .

以下是通過特定的具體實施例來說明本發明所公開有關“檢測設備及其收光裝置”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。 The following are specific embodiments to illustrate the embodiments of the “detection device and its light-receiving device” disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應 受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。 It should be understood that although terms such as "first", "second", "third" and the like may be used herein to describe various elements or signals, these elements or signals should not be subject to these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[實施例一] [Example 1]

請參閱圖1至圖3所示,其為本發明的實施例一。本實施例公開一種檢測設備100,其能同時對多個發光晶片200(如:發光二極體晶片)進行電性與光參數的檢測。其中,所述檢測設備100包含有一電性檢測裝置1及鄰近地設置於所述電性檢測裝置1的一收光裝置2。 Please refer to FIG. 1 to FIG. 3 , which are Embodiment 1 of the present invention. This embodiment discloses a detection apparatus 100, which can simultaneously detect electrical properties and optical parameters of a plurality of light-emitting wafers 200 (eg, light-emitting diode wafers). The detection apparatus 100 includes an electrical detection device 1 and a light receiving device 2 disposed adjacent to the electrical detection device 1 .

需先說明的是,所述收光裝置2於本實施例中是以搭配於所述電性檢測裝置1來說明,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述收光裝置2也可以是單獨地應用(如:販賣)或搭配其他裝置使用(如:不同於本實施例電性檢測裝置1的其他檢測裝置)。 It should be noted that the light receiving device 2 is described as being matched with the electrical detection device 1 in this embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the light receiving device 2 can also be used alone (eg, sold) or used in conjunction with other devices (eg, different from the electrical detection device in this embodiment). 1 of other detection devices).

所述電性檢測裝置1包含一探針卡11、位置對應於所述探針卡11的一光學對位模組12(如:感光耦合元件,CCD)、位置與所述探針卡11相對應的一透光載盤13、及一移載模組14。其中,所述探針卡11、所述光學對位模組12、及所述透光載盤13可以是安裝於所述移載模組14上,據以能夠通過所述移載模組14而進行多軸向位移。 The electrical detection device 1 includes a probe card 11 , an optical alignment module 12 (eg, a photosensitive coupling element, CCD) whose position corresponds to the probe card 11 , and the position is the same as that of the probe card 11 . Correspondingly, a transparent carrier plate 13 and a transfer module 14 are provided. The probe card 11 , the optical alignment module 12 , and the transparent carrier plate 13 may be installed on the transfer module 14 , so that the probe card 11 can pass through the transfer module 14 and multi-axial displacement.

再者,所述探針卡11的類型可以依據設計需求而加以調整變化,例如:所述探針卡11可以是懸臂式探針卡、垂直式探針卡、或微機電探針卡,本發明在此不加以限制。所述光學對位模組12與所述透光載盤13分別位於所述探針卡11的相反兩側,以利於所述光學對位模組12偵測所述探針卡11與所述透光載盤13的相對位置。 Furthermore, the type of the probe card 11 can be adjusted and changed according to the design requirements. For example, the probe card 11 can be a cantilever probe card, a vertical probe card, or a MEMS probe card. The invention is not limited herein. The optical alignment module 12 and the transparent carrier plate 13 are respectively located on opposite sides of the probe card 11, so that the optical alignment module 12 can detect the probe card 11 and the probe card 11. The relative position of the light-transmitting carrier disc 13 .

更詳細地說,所述透光載盤13於本實施例中呈透明狀,並且所述透光載盤13具有用來承載多個發光晶片200的一承載面131與位於所述承載 面131相反側的一出光面132。其中,所述透光載盤13所能用來承載的多個所述發光晶片200的數量較佳是100顆以上且設置於一載體300(如:藍色黏貼膜),但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述透光載盤13也能用來承載的未設置在任何載體上的多個發光晶片200;或者,所述透光載盤13所能用來承載的多個所述發光晶片200的數量也可以是少於100顆。 In more detail, the light-transmitting carrier 13 is transparent in this embodiment, and the light-transmitting carrier 13 has a carrier surface 131 for carrying a plurality of light-emitting chips 200 and a carrier surface 131 located on the carrier. A light emitting surface 132 on the opposite side of the surface 131 . Wherein, the number of the light-emitting chips 200 that can be carried by the light-transmitting carrier 13 is preferably more than 100 and disposed on a carrier 300 (eg, a blue adhesive film), but the present invention is not limited to limited to this. For example, in other embodiments not shown in the present invention, the light-transmitting carrier 13 can also be used to carry a plurality of light-emitting chips 200 that are not arranged on any carrier; alternatively, the light-transmitting carrier 13 The number of the plurality of light-emitting chips 200 that can be used to carry the light-emitting chips 200 may also be less than 100.

依上所述,所述探針卡11能通過所述光學對位模組12的對位後,而用來同時供電且電性檢測(如:電壓、電流、及功率)所述透光載盤13上的多個所述發光晶片200,以使每個所述發光晶片200朝向所述出光面132發出具有第一發散角度σ 1的一第一光線L1。其中,每道所述第一光線L1的所述第一發散角度σ 1於本實施例是以110度~130度來說明,但本發明不以此為限。 According to the above, the probe card 11 can be used for power supply and electrical detection (such as voltage, current, and power) of the light-transmitting carrier at the same time after being aligned by the optical alignment module 12 . The plurality of light-emitting chips 200 on the disk 13 make each of the light-emitting chips 200 emit a first light beam L1 with a first divergence angle σ 1 toward the light-emitting surface 132 . Wherein, the first divergence angle σ 1 of each of the first light rays L1 is described in this embodiment as 110 degrees to 130 degrees, but the present invention is not limited to this.

所述收光裝置2鄰近地設置於所述透光載盤13的所述出光面132;也就是說,所述收光裝置2是位於每個所述發光晶片200的出光路徑上。進一步地說,相鄰的任兩個所述發光晶片200所發出的兩道所述第一光線L1於本實施例中在抵達所述收光裝置2的時候,是以局部彼此重疊來說明,但本創作不受限於此。舉例來說,在本發明未繪示的其他實施例中,相鄰的任兩個所述發光晶片200所發出的兩道所述第一光線L1在抵達所述收光裝置2的時候,也可以是彼此未重疊。 The light-receiving device 2 is disposed adjacent to the light-emitting surface 132 of the light-transmitting carrier 13 ; that is, the light-receiving device 2 is located on the light-emitting path of each of the light-emitting chips 200 . Further, when the two first light rays L1 emitted by any two adjacent light-emitting chips 200 reach the light-receiving device 2 in this embodiment, it is illustrated that they partially overlap each other. But this creation is not limited to this. For example, in other embodiments not shown in the present invention, when the two first rays L1 emitted by any two adjacent light-emitting chips 200 reach the light-receiving device 2 , the can be non-overlapping with each other.

所述收光裝置2於本實施例中包含有一遠心透鏡組21、位於所述遠心透鏡組21一側的一影像處理模組22、及電性耦接於所述影像處理模組22的一演算模組23。 In this embodiment, the light receiving device 2 includes a telecentric lens group 21 , an image processing module 22 located on one side of the telecentric lens group 21 , and an image processing module 22 electrically coupled to the image processing module 22 . Calculation module 23.

需額外說明的是,所述收光裝置2與所述透光載盤13之間的最短距離(如:所述入光端211相較於所述出光面132的距離)可以是介於80公厘 (mm)~150公厘,但此數值可以依據設計需求而加以調整變化,並不以本實施例為限。 It should be noted that the shortest distance between the light-receiving device 2 and the light-transmitting carrier plate 13 (eg, the distance between the light-incident end 211 and the light-emitting surface 132 ) may be between 80 mm (mm)~150 mm, but this value can be adjusted and changed according to design requirements, and is not limited to this embodiment.

所述遠心透鏡組21可以是由多個透鏡相互搭配所構成,並且所述遠心透鏡組21包含有鄰近於所述出光面132的一入光端211及遠離所述入光端211的一出光端212;也就是說,所述入光端211位於每個所述發光晶片200的出光路徑上。 The telecentric lens group 21 may be composed of a plurality of lenses matched with each other, and the telecentric lens group 21 includes a light entrance end 211 adjacent to the light exit surface 132 and a light exit end 211 away from the light entrance end 211 . end 212 ; that is, the light incident end 211 is located on the light exit path of each of the light-emitting chips 200 .

再者,所述遠心透鏡組21用來導引由所述出光面132穿出而自所述入光端211穿入其內的多道所述第一光線L1,並使多道所述第一光線L1自所述出光端212穿出且形成多道第二光線L2。其中,每道所述第二光線L2的第二發散角度σ 2小於相對應所述第一光線L1的所述第一發散角度σ 1。 Furthermore, the telecentric lens group 21 is used to guide a plurality of the first light beams L1 passing through the light exit surface 132 and entering from the light incident end 211 , and make the plurality of first light beams L1 . A light L1 exits from the light-emitting end 212 to form a plurality of second lights L2. Wherein, the second divergence angle σ 2 of each second light ray L2 is smaller than the first divergence angle σ 1 corresponding to the first light ray L1 .

進一步地說,所述第二發散角度σ 2於本實施例中是在10度以內(如:1度~3度),據以使多道所述第二光線L2能夠彼此不重疊,據以有效地避免多道所述第二光線L2之間的相互干擾。例如:所述收光裝置2的所述遠心透鏡組21於本實施例中能用來同時導引(位於所述透光載盤13的)100顆以上的多個所述發光晶片200所發出的多道所述第一光線L1,以形成100道以上彼此不重疊的多道所述第二光線L2,但本發明不以此為限。舉例來說,在本發明未繪示的其他實施例中,所述遠心透鏡組21可以是能夠用來導引彼此重疊的多道所述第一光線L1,以使其形成重疊程度較低的多道所述第二光線L2,據以降低多道所述第二光線L2之間的相互干擾。 Further, the second divergence angle σ 2 in this embodiment is within 10 degrees (eg, 1 to 3 degrees), so that the plurality of second light rays L2 can not overlap each other, so that Mutual interference between multiple second light beams L2 is effectively avoided. For example, in this embodiment, the telecentric lens group 21 of the light receiving device 2 can be used to simultaneously guide more than 100 light-emitting chips 200 (located on the light-transmitting carrier plate 13 ) to emit light. to form more than 100 non-overlapping second light rays L2, but the invention is not limited to this. For example, in other embodiments not shown in the present invention, the telecentric lens group 21 can be used to guide a plurality of the first light beams L1 overlapping each other, so as to form a light beam with a lower degree of overlap. A plurality of the second light beams L2 are used to reduce mutual interference between the plurality of the second light beams L2.

所述影像處理模組22設置於所述遠心透鏡組21的所述出光端212,用來接收並處理自所述出光端212穿出的每道所述第二光線L2,以計算出相對應的所述發光晶片200的RGB灰階值。再者,所述演算模組23電性耦接於所述影像處理模組22,用來接收每個所述發光晶片200的所述RGB灰階值並演算出每個所述發光晶片200的光參數。 The image processing module 22 is disposed at the light-emitting end 212 of the telecentric lens group 21, and is used for receiving and processing each of the second light rays L2 passing through the light-emitting end 212, so as to calculate the corresponding RGB grayscale values of the light-emitting chip 200. Furthermore, the calculation module 23 is electrically coupled to the image processing module 22 for receiving the RGB grayscale values of each of the light-emitting chips 200 and calculating the value of each of the light-emitting chips 200 . light parameters.

更詳細地說,所述影像處理模組22於本實施例中包含有鄰接於所述出光端212的一影像接收器221(如:彩色感光耦合元件)及電性耦接所述影像接收器221與所述演算模組23的一信號處理單元222,但本發明不以此為限。其中,所述影像接收器221能以其多個像素(pixel)接收任一道所述第二光線L2而對應產生一發光晶片影像,所述信號處理單元222能用來對每個所述發光晶片影像進行影像處理,以計算出相對應的所述RGB灰階值(0~65536種顏色)。 More specifically, the image processing module 22 in this embodiment includes an image receiver 221 (eg, a color photosensitive coupling element) adjacent to the light output end 212 and electrically coupled to the image receiver 221 and a signal processing unit 222 of the calculation module 23, but the present invention is not limited to this. Wherein, the image receiver 221 can receive any one of the second light rays L2 with its multiple pixels (pixels) to generate a light-emitting chip image correspondingly, and the signal processing unit 222 can be used for each light-emitting chip. The image is subjected to image processing to calculate the corresponding RGB grayscale values (0~65536 colors).

其中,所述信號處理單元222於本實施例中是同步處理所有發光晶片200所對應的發光晶片影像,但每個所述發光晶片200的所述發光晶片影像是通過所述信號處理單元222單獨地處理;也就是說,每個所述發光晶片影像都可以被所述信號處理單元222獨立地進行影像處理,其處理過程如下所載。將屬於Tiff影像檔的每個所述發光晶片影像依序經由:轉換RGB影像、灰階化、模糊化、及二值化等步驟,而後將每個所述發光晶片影像轉換並繪出感興趣區域(region of interest,ROI)影像,進而計算出相對應的所述RGB灰階值,但本發明不以此為限。 Wherein, in this embodiment, the signal processing unit 222 processes the light-emitting wafer images corresponding to all light-emitting wafers 200 synchronously, but the light-emitting wafer images of each light-emitting wafer 200 are individually processed by the signal processing unit 222 that is, each of the light-emitting wafer images can be independently processed by the signal processing unit 222, and the processing procedure is described below. Each of the light-emitting chip images belonging to the Tiff image file is sequentially passed through the steps of: converting RGB images, grayscale, blurring, and binarization, and then converting and drawing each of the light-emitting chip images of interest A region of interest (ROI) image is then used to calculate the corresponding RGB grayscale values, but the invention is not limited to this.

據此,所述檢測設備100於本實施例中可以通過在多個所述發光晶片200的光線(如:多道所述第一光線L1)進入所述影像處理模組22之前設置有所述遠心透鏡組21,以通過所述遠心透鏡組21來區隔多個所述發光晶片200的光線(如:多道所述第二光線L2),使得每個所述發光晶片200的光線(如:所述第二光線L2)能夠單獨地被所述影像處理模組22與所述演算模組23所檢測,進而得知每個所述發光晶片200的光參數。 Accordingly, in the present embodiment, the detection apparatus 100 can be provided with the detection device 100 before the light from a plurality of the light-emitting chips 200 (eg, a plurality of the first light rays L1 ) enter the image processing module 22 . The telecentric lens group 21 is used to separate the light of a plurality of the light-emitting chips 200 through the telecentric lens group 21 (eg, multiple channels of the second light L2 ), so that the light of each light-emitting chip 200 (eg : The second light L2) can be independently detected by the image processing module 22 and the calculation module 23, and then the light parameters of each of the light-emitting chips 200 can be obtained.

[實施例二] [Example 2]

請參閱圖4和圖5所示,其為本發明的實施例二。由於本實施例類似上述實施例一,所以兩個實施例的相同處不再加以贅述,而本實施例相 較於上述實施例一的差異主要在於所述收光裝置2。 Please refer to FIG. 4 and FIG. 5 , which is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated. The difference from the first embodiment above mainly lies in the light receiving device 2 .

於本實施例中,所述收光裝置2進一步包含有位於所述入光端211與所述出光面132之間的一減光鏡24、連接於所述遠心透鏡組21的一分光鏡25、及位於所述分光鏡25與所述演算模組23之間的一光譜儀26。其中,所述減光鏡24與所述影像處理模組22相當於分別位在所述遠心透鏡組21的相反兩側,並且所述減光鏡24於本實施例中是以設置於所述遠心透鏡組21的所述入光端211上來說明,據以用來降低每道所述第一光線L1的光線強度。 In this embodiment, the light receiving device 2 further includes a dimming mirror 24 located between the light incident end 211 and the light exit surface 132 , and a beam splitter 25 connected to the telecentric lens group 21 . , and a spectrometer 26 located between the beam splitter 25 and the calculation module 23 . Wherein, the dimming mirror 24 and the image processing module 22 are respectively located on opposite sides of the telecentric lens group 21, and the dimming mirror 24 is arranged on the The light incident end 211 of the telecentric lens group 21 is described above, and is used to reduce the light intensity of each of the first light rays L1.

也就是說,所述收光裝置2於本實施例中可以通過所述減光鏡24來使穿過其中的每道所述第一光線L1的光線強度衰減,據以避免所述第一光線L1的光線強度過高而影響到後面構件(如:所述影像處理模組22及所述光譜儀26)的測量精準度。舉例來說:所述減光鏡24可以使每道所述第一光線L1的光線強度衰減至所述影像處理模組22(或所述光譜儀26)所能承受的最大強度的80%以下,但本發明不以此為限。 That is to say, in this embodiment, the light receiving device 2 can attenuate the light intensity of each of the first light rays L1 passing therethrough through the dimming mirror 24, so as to avoid the first light rays The light intensity of L1 is too high, which affects the measurement accuracy of the rear components (eg, the image processing module 22 and the spectrometer 26 ). For example, the dimming mirror 24 can attenuate the light intensity of each of the first light rays L1 to below 80% of the maximum intensity that the image processing module 22 (or the spectrometer 26 ) can bear, However, the present invention is not limited to this.

所述分光鏡25連接於所述遠心透鏡組21,用來接收每道所述第二光線L2。其中,所述分光鏡25的位置對應於所述影像處理模組22與所述光譜儀26,用來使其所接收的每道所述第二光線L2被導引至所述影像處理模組22與所述光譜儀26。再者,所述分光鏡25於本實施例中是內建於所述遠心透鏡組21,但本發明不以此為限。 The beam splitter 25 is connected to the telecentric lens group 21 for receiving each of the second light rays L2. The position of the beam splitter 25 corresponds to the image processing module 22 and the spectrometer 26 , so that each second light L2 received by the beam splitter 25 is guided to the image processing module 22 . 26 with the spectrometer. Furthermore, the beam splitter 25 is built in the telecentric lens group 21 in this embodiment, but the present invention is not limited to this.

再者,所述光譜儀26能依據其所接收的多道所述第二光線L2而計算出多個所述發光晶片200的一平均光譜,並且所述光譜儀26電性耦接於所述演算模組23,用以能將其所計算出的所述平均光譜傳輸至所述演算模組23。據此,所述演算模組23能依據所述RGB灰階值與所述平均光譜,而演算出每個所述發光晶片200的所述光參數(如:波峰長或半波寬)。 Furthermore, the spectrometer 26 can calculate an average spectrum of the plurality of light-emitting chips 200 according to the plurality of second light beams L2 received by the spectrometer 26, and the spectrometer 26 is electrically coupled to the calculation module. The group 23 is used to transmit the calculated average spectrum to the calculation module 23 . Accordingly, the calculation module 23 can calculate the light parameters (eg, peak length or half-wave width) of each of the light-emitting chips 200 according to the RGB grayscale values and the average spectrum.

換個角度來說,所述演算模組23可以通過所述平均光譜而演算 出來的一個所述發光晶片200的光參數作為基準參考值,據以使用所述基準參考值來校正通過每個所述RGB灰階值,進而演算出來的每個所述發光晶片200的光參數;其後,所述演算模組23再依據預設的設計需求演算出每個所述發光晶片200的光參數(如:波峰長或半波寬)。 To put it another way, the calculation module 23 can calculate the average spectrum The obtained light parameter of the light-emitting chip 200 is used as a reference reference value, and the light parameter of each light-emitting chip 200 is calculated by using the reference reference value to correct each of the RGB grayscale values. ; After that, the calculation module 23 calculates the light parameters (eg, peak length or half-wave width) of each of the light-emitting chips 200 according to the preset design requirements.

據此,所述收光裝置2可以通過採用具備不同檢測方式的所述影像處理模組22與所述光譜儀26,以使所述演算模組23能通過所述光譜儀26所得出的所述平均光譜來校正自所述影像處理模組22所計算出的每個所述發光晶片200的所述RGB灰階值,進而能夠取得更為精準的每個所述發光晶片200的所述光參數。 Accordingly, the light receiving device 2 can use the image processing module 22 and the spectrometer 26 with different detection methods, so that the calculation module 23 can pass the average obtained by the spectrometer 26 . The spectrum is used to correct the RGB grayscale values of each of the light-emitting chips 200 calculated by the image processing module 22 , so as to obtain more accurate light parameters of each of the light-emitting chips 200 .

需補充說明的是,所述收光裝置2於本實施例中雖是以包含上述構件來說明,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述收光裝置2也可以依據設計需求而選擇性地省略所述減光鏡24、所述分光鏡25、及所述光譜儀26的至少其中之一。 It should be added that although the light receiving device 2 is described in this embodiment as including the above components, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the light receiving device 2 may also selectively omit the dimming mirror 24 , the spectroscope 25 , and the spectrometer 26 according to design requirements at least one of them.

[本發明實施例的技術效果] [Technical effects of the embodiments of the present invention]

綜上所述,本發明實施例所公開的檢測設備及其收光裝置,通過在多個所述發光晶片的光線進入所述影像處理模組之前設置有所述遠心透鏡組,以通過所述遠心透鏡組來區隔多個所述發光晶片的光線,每個所述發光晶片的光線能夠單獨地被所述影像處理模組與所述演算模組所檢測,進而得知每個所述發光晶片的光參數。 To sum up, in the detection device and the light receiving device thereof disclosed in the embodiments of the present invention, the telecentric lens group is provided before the light from a plurality of the light-emitting chips enters the image processing module, so as to pass the light from the light-emitting chips. A telecentric lens group is used to separate the light of a plurality of the light-emitting chips, and the light of each light-emitting chip can be independently detected by the image processing module and the calculation module, and then the light of each light-emitting chip can be known. Optical parameters of the wafer.

再者,本發明實施例所公開的檢測設備及其收光裝置,通過以所述遠心透鏡組來多道所述第一光線形成具有較小發散角度的多道所述第二光線,據以有效地避免多道所述第二光線之間的相互干擾。其中,所述遠心透鏡組較佳是能夠使得局部重疊的多道所述第一光線形成彼此不重疊的多道所述第二光線。 Furthermore, in the detection device and the light-receiving device thereof disclosed in the embodiments of the present invention, the telecentric lens group is used to generate multiple first rays of light to form multiple second rays with smaller divergence angles. Mutual interference between multiple second light beams is effectively avoided. Wherein, the telecentric lens group is preferably capable of forming a plurality of the partially overlapping first rays of light to form a plurality of the second rays of light which do not overlap each other.

另,本發明實施例所公開的檢測設備及其收光裝置,可以通過在所述遠心透鏡組的所述入光端與所述透光載盤的所述出光面之間設置有減光鏡,使得穿過所述減光鏡的每道所述第一光線的光線強度衰減,據以避免所述第一光線的光線強度過高而影響到後面構件(如:所述影像處理模組及所述光譜儀)的測量精準度。 In addition, in the detection device and the light-receiving device thereof disclosed in the embodiments of the present invention, a dimming mirror can be arranged between the light-incident end of the telecentric lens group and the light-emitting surface of the light-transmitting carrier disk , so that the light intensity of each first light passing through the ND filter is attenuated, so as to prevent the light intensity of the first light from being too high and affecting the rear components (such as the image processing module and the the measurement accuracy of the spectrometer).

又,本發明實施例所公開的檢測設備及其收光裝置,通過採用具備不同檢測方式的所述影像處理模組與所述光譜儀,以使所述演算模組能通過所述光譜儀所得出的所述平均光譜來校正自所述影像處理模組所計算出的每個所述發光晶片的所述RGB灰階值,進而能夠取得更為精準的每個所述發光晶片的所述光參數。 In addition, the detection device and the light-receiving device thereof disclosed in the embodiments of the present invention employ the image processing module and the spectrometer with different detection methods, so that the calculation module can obtain the result obtained by the spectrometer. The average spectrum is used to correct the RGB grayscale values of each of the light-emitting chips calculated by the image processing module, so that more accurate light parameters of each of the light-emitting chips can be obtained.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的專利範圍內。 The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

13:透光載盤 131:承載面 132:出光面 2:收光裝置 21:遠心透鏡組 211:入光端 212:出光端 22:影像處理模組 221:影像接收器 222:信號處理單元 23:演算模組 24:減光鏡 25:分光鏡 26:光譜儀 200:發光晶片 300:載體 13: Translucent carrier disc 131: Bearing surface 132: Light-emitting surface 2: Light receiving device 21: Telecentric lens group 211: light-in side 212: light output end 22: Image processing module 221: Image Receiver 222: Signal Processing Unit 23: Calculation module 24: ND filter 25: Beamsplitter 26: Spectrometer 200: Luminous Chip 300: Carrier

Claims (10)

一種檢測設備,其包括: 一電性檢測裝置,包含: 一探針卡; 一光學對位模組,其位置對應於所述探針卡; 一透光載盤,其位置與所述探針卡相對應,並且所述透光載盤具有用來承載多個發光晶片的一承載面與位於所述承載面相反側的一出光面; 其中,所述探針卡能通過所述光學對位模組的對位後,而用來同時供電且電性檢測所述透光載盤上的多個所述發光晶片,以使每個所述發光晶片朝向所述出光面發出具有第一發散角度的一第一光線;以及 一收光裝置,其鄰近地設置於所述透光載盤的所述出光面,並且所述收光裝置包含有: 一遠心透鏡組,其包含有一入光端及一出光端;其中,所述遠心透鏡組用來導引由所述出光面穿出而自所述入光端穿入其內的多道所述第一光線,並使多道所述第一光線自所述出光端穿出且形成多道第二光線;其中,每道所述第二光線的第二發散角度小於相對應所述第一光線的所述第一發散角度; 一影像處理模組,其設置於所述遠心透鏡組的所述出光端,用來接收並處理自所述出光端穿出的每道所述第二光線,以計算出相對應的所述發光晶片的RGB灰階值;及 一演算模組,其電性耦接於所述影像處理模組,用來接收每個所述發光晶片的所述RGB灰階值並演算出每個所述發光晶片的光參數。 A detection device comprising: An electrical detection device, including: a probe card; an optical alignment module, the position of which corresponds to the probe card; a light-transmitting carrier, the position of which corresponds to the probe card, and the light-transmitting carrier has a carrier surface for carrying a plurality of light-emitting chips and a light-emitting surface on the opposite side of the carrier surface; Wherein, the probe card can be used to simultaneously supply power and electrically detect a plurality of the light-emitting chips on the light-transmitting carrier after being aligned by the optical alignment module, so that each the light-emitting chip emits a first light with a first divergence angle toward the light-emitting surface; and A light-receiving device, which is disposed adjacent to the light-emitting surface of the light-transmitting carrier, and the light-receiving device includes: A telecentric lens group, which includes a light entrance end and a light exit end; wherein, the telecentric lens group is used to guide the multiple channels of the light passing through the light exit surface and entering it from the light entrance end. the first light rays, and make a plurality of the first light rays pass out from the light-emitting end to form a plurality of second light rays; wherein, the second divergence angle of each of the second light rays is smaller than that of the corresponding first light rays the first divergence angle of ; an image processing module, disposed at the light-emitting end of the telecentric lens group, for receiving and processing each of the second light rays passing through the light-emitting end, so as to calculate the corresponding light emission the RGB grayscale values of the chip; and A calculation module, which is electrically coupled to the image processing module, is used for receiving the RGB grayscale values of each of the light-emitting chips and calculating light parameters of each of the light-emitting chips. 如請求項1所述的檢測設備,其中,所述收光裝置進一步包含有位於所述遠心透鏡組的所述入光端與所述透光載盤的所述出光面之間的一減光鏡,並且所述減光鏡用來降低每道所述第一光線的光線強度。The detection device according to claim 1, wherein the light-receiving device further comprises a light-reducing device located between the light-incident end of the telecentric lens group and the light-emitting surface of the light-transmitting carrier disk and the dimming filter is used to reduce the light intensity of each of the first light rays. 如請求項1所述的檢測設備,其中,所述收光裝置進一步包含有: 一光譜儀,其電性耦接於所述演算模組;及 一分光鏡,其連接於所述遠心透鏡組並用來接收每道所述第二光線;其中,所述分光鏡的位置對應於所述影像處理模組與所述光譜儀,用來使其所接收的每道所述第二光線被導引至所述影像處理模組與所述光譜儀; 其中,所述光譜儀能依據其所接收的多道所述第二光線而計算出多個所述發光晶片的一平均光譜;所述演算模組能依據所述RGB灰階值與所述平均光譜,而演算出每個所述發光晶片的所述光參數。 The detection device according to claim 1, wherein the light receiving device further comprises: a spectrometer electrically coupled to the calculation module; and a beam splitter connected to the telecentric lens group and used for receiving each of the second light rays; wherein, the position of the beam splitter corresponds to the image processing module and the spectrometer, and is used for the beam splitter to receive Each of the second light rays is guided to the image processing module and the spectrometer; Wherein, the spectrometer can calculate an average spectrum of a plurality of the light-emitting chips according to the plurality of channels of the second light received by the spectrometer; the calculation module can calculate an average spectrum according to the RGB grayscale value and the average spectrum , and calculate the light parameters of each of the light-emitting wafers. 如請求項1所述的檢測設備,其中,所述影像處理模組包含有: 一影像接收器,其鄰接於所述遠心透鏡組的所述出光端,並且所述影像接收器能以其多個像素接收任一道所述第二光線而對應產生一發光晶片影像;及 一信號處理單元,其電性耦接所述影像接收器與所述演算模組;所述信號處理單元能用來對每個所述發光晶片影像進行影像處理,以計算出相對應的所述RGB灰階值。 The detection device according to claim 1, wherein the image processing module comprises: an image receiver adjacent to the light-emitting end of the telecentric lens group, and the image receiver can receive any one of the second light rays with its plurality of pixels to correspondingly generate a light-emitting chip image; and a signal processing unit electrically coupled to the image receiver and the computing module; the signal processing unit can be used to perform image processing on each of the light-emitting chip images to calculate the corresponding RGB grayscale value. 如請求項1所述的檢測設備,其中,所述透光載盤所能用來承載的多個所述發光晶片的數量為100顆以上且設置於一載體,並且所述收光裝置的所述遠心透鏡組能用來同時導引100顆以上的多個所述發光晶片所發出的多道所述第一光線,以形成100道以上彼此不重疊的多道所述第二光線。The testing apparatus according to claim 1, wherein the number of the light-emitting chips that can be carried by the light-transmitting carrier plate is more than 100 and is arranged on a carrier, and all the light-receiving devices The telecentric lens group can be used to simultaneously guide multiple channels of the first light rays emitted by more than 100 of the light-emitting chips, so as to form more than 100 channels of the second lights that do not overlap each other. 一種檢測設備的收光裝置,其包括: 一遠心透鏡組,其包含有一入光端及一出光端;其中,所述遠心透鏡組用來導引多個發光晶片所發出且自所述入光端穿入其內的多道第一光線,並使多道所述第一光線自所述出光端穿出且形成多道第二光線;其中,每道所述第二光線的第二發散角度小於相對應所述第一光線的第一發散角度; 一影像處理模組,其設置於所述遠心透鏡組的所述出光端,用來接收並處理自所述出光端穿出的每道所述第二光線,以計算出相對應的所述發光晶片的RGB灰階值;以及 一演算模組,其電性耦接於所述影像處理模組,用來接收每個所述發光晶片的所述RGB灰階值並演算出每個所述發光晶片的光參數。 A light-receiving device of a detection device, comprising: A telecentric lens group, which includes a light entrance end and a light exit end; wherein, the telecentric lens group is used to guide a plurality of first rays emitted by a plurality of light-emitting chips and penetrated from the light entrance end. , and make a plurality of the first rays pass through the light-emitting end to form a plurality of second rays; wherein, the second divergence angle of each of the second rays is smaller than the corresponding first rays of the first rays. divergence angle; an image processing module, disposed at the light-emitting end of the telecentric lens group, for receiving and processing each of the second light rays passing through the light-emitting end, so as to calculate the corresponding light emission the RGB grayscale values of the chip; and A calculation module, which is electrically coupled to the image processing module, is used for receiving the RGB grayscale values of each of the light-emitting chips and calculating light parameters of each of the light-emitting chips. 如請求項6所述的檢測設備的收光裝置,其中,所述收光裝置進一步包含有位於所述遠心透鏡組的所述入光端與所述透光載盤的所述出光面之間的一減光鏡,並且所述減光鏡用來降低每道所述第一光線的光線強度。The light-receiving device of the detection device according to claim 6, wherein the light-receiving device further comprises a light-receiving device located between the light-incident end of the telecentric lens group and the light-emitting surface of the light-transmitting carrier disk A dimming mirror is provided, and the dimming mirror is used to reduce the light intensity of each of the first light rays. 如請求項6所述的檢測設備的收光裝置,其中,所述收光裝置進一步包含有: 一光譜儀,其電性耦接於所述演算模組;及 一分光鏡,其連接於所述遠心透鏡組並用來接收每道所述第二光線;所述分光鏡的位置對應於所述影像處理模組與所述光譜儀,用來使其所接收的每道所述第二光線被導引至所述影像處理模組與所述光譜儀; 其中,所述光譜儀能依據其所接收的多道所述第二光線而計算出多個所述發光晶片的一平均光譜;所述演算模組能依據所述RGB灰階值與所述平均光譜,而演算出每個所述發光晶片的所述光參數。 The light-receiving device of the detection equipment according to claim 6, wherein the light-receiving device further comprises: a spectrometer electrically coupled to the calculation module; and a beam splitter connected to the telecentric lens group and used to receive each of the second rays; the position of the beam splitter corresponds to the image processing module and the spectrometer, and is used to make the received the second light is guided to the image processing module and the spectrometer; Wherein, the spectrometer can calculate an average spectrum of a plurality of the light-emitting chips according to the plurality of channels of the second light received by the spectrometer; the calculation module can calculate an average spectrum according to the RGB grayscale value and the average spectrum , and calculate the light parameters of each of the light-emitting wafers. 如請求項6所述的檢測設備的收光裝置,其中,所述影像處理模組包含有: 一影像接收器,其鄰接於所述遠心透鏡組的所述出光端,並且所述影像接收器能以其多個像素來接收任一道所述第二光線而對應產生一發光晶片影像;及 一信號處理單元,其電性耦接所述影像接收器與所述演算模組;所述信號處理單元能用來對每個所述發光晶片影像進行影像處理,以計算出相對應的所述RGB灰階值。 The light receiving device of the detection equipment according to claim 6, wherein the image processing module comprises: an image receiver adjacent to the light-emitting end of the telecentric lens group, and the image receiver can receive any one of the second light rays with its plurality of pixels to generate a light-emitting chip image correspondingly; and a signal processing unit electrically coupled to the image receiver and the computing module; the signal processing unit can be used to perform image processing on each of the light-emitting chip images to calculate the corresponding RGB grayscale value. 如請求項6所述的檢測設備的收光裝置,其中,所述收光裝置的所述遠心透鏡組能用來同時導引100顆以上的多個所述發光晶片所發出的多道所述第一光線,以形成100道以上彼此不重疊的多道所述第二光線。The light-receiving device of the inspection equipment according to claim 6, wherein the telecentric lens group of the light-receiving device can be used to simultaneously guide the multi-channels of the light-emitting chips emitted by more than 100 light-emitting chips. the first light rays to form more than 100 non-overlapping lines of the second light rays.
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