CN102642083B - Laser processing mechanism - Google Patents

Laser processing mechanism Download PDF

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Publication number
CN102642083B
CN102642083B CN201110042168.5A CN201110042168A CN102642083B CN 102642083 B CN102642083 B CN 102642083B CN 201110042168 A CN201110042168 A CN 201110042168A CN 102642083 B CN102642083 B CN 102642083B
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group
processed
laser processing
image
spectroscope
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CN201110042168.5A
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CN102642083A (en
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陈鸿隆
潘承文
李佶展
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Abstract

The invention relates to a laser processing mechanism which comprises a laser source, an adjustment device, a lens group, a focusing mirror group and an observation device; the adjustment device changes the advancing direction of a laser beam emitted by the laser source and then forms a light beam to be focused; the lens group enables the light beam to be focused to advance a preset distance and then to be emitted without substantially reducing the energy; the focusing mirror group enables the light beam to be focused emitted by the lens group to be focused to form a processing light beam which is emitted to an object to be processed; the observation device is used for receiving a reference image which is directly from the object to be processed and a processed object which is formed by emitting the processing light beam to the object to be processed; and when the laser processing mechanism processes, the observation device can be used for receiving the reference image and the processed image, and instant observation and correction can be carried out when in processing.

Description

Laser processing mechanism
Technical field
The present invention relates to a kind of organisation of working, particularly relate to a kind of laser processing mechanism of laser beam processing object.
Background technology
Consult Fig. 1, laser processing mechanism in the past comprises one group of lasing light emitter, 101, first spectroscope, 102, one group of adjusting device, 103, one group of focus lamp group, 104, second spectroscope, 113, one group of light source 105, and one group of observation device 106.
Described lasing light emitter 101 produces predetermined wavelength and after adjustment, carries out the laser beam 107 of processing object, and in this example, that this lasing light emitter 101 sends is ultraviolet laser light beam (UV Laser).
This first spectroscope 102 reflects and partial penetration for incident beam section, after this laser beam 107 this first spectroscope 102 incident, penetrates after part reflection towards described adjusting device 103.
Described adjusting device 103 comprises the reflecting optics 108 of two light beam direct of travels changing incidence that match, the light beam of being advanced by this first spectroscope 102 back reflection sequentially changes direct of travel through the cooperation of described two reflecting optics 108, becomes one to treat that focused beam 109 penetrates to described focus lamp group 104.
Described focus lamp group 104 comprises at least one condenser lens 110 focused on for incident light beam, and this forms the machining beams 111 that is incident upon object 100 to be processed after the focus lamp group 104 described in focused beam 109 incidence through focusing.
In addition, this machining beams 111 is incident upon while this object 100 to be processed carries out processing and also produces reflection, the light of reflection along original route sequentially by passing the first spectroscope 102, second spectroscope 113 after described focus lamp group 104, adjusting device 103, and is received by described observation device 106 the processing image 116 that formation one can supply observation.
This second spectroscope 113 reflects and partial penetration for incident beam section, be arranged in this first spectroscope 102 light path online with described adjusting device 103, the light that described light source 105 is sent sequentially by be radiated at after this second spectroscope 113, first spectroscope 102 and adjusting device 103, focus lamp group 104 on this object 100 to be processed and to reflect, and make the light after reflecting along original route return and formed received formation one by described observation device 106 can for the reference images 117 of observing.
The laser beam 107 that described lasing light emitter 101 sends forms this change direct of travel by described adjusting device 103 after the reflection of this first spectroscope 102 after and treats focused beam 109, this treats that focused beam 109 is focused into the machining beams 111 directly acting on object 100 to be processed by described focus lamp group 104, and continue change by two reflecting optics 108 of this adjusting device 103 and to correspond to each other angle and change direct of travel, and then change the position that is incident upon on this object 100 to be processed to carry out Laser Processing.Meanwhile, the reverberation of machining beams 111 by passing this first spectroscope 102, second spectroscope 113 after described focus lamp group 104, adjusting device 103, and is received the processing image 116 being formed and can supply to observe by described observation device 106; In addition, the light that described light source 105 sends also is sequentially by after this second spectroscope 113, first spectroscope 102 and adjusting device 103, focus lamp group 104, then reflection follows original route and advances and received by this observation device 106 that formed can for the reference images 117 of observing.
The advantage of above-mentioned laser processing mechanism is to integrate Laser Processing and detection simultaneously, that is, the processing image 116 received by finder 106, also be Working position and the machining status that laser beam 107 acts on object 100 to be processed, in addition, light source 105 is radiated at object 100 to be processed and forms the use that reference images 117 then can be used as corresponding comparison, location, and after machining, directly can carry out on-line checkingi.
But, due to the processing image 116 observed of above-mentioned laser processing mechanism, or reference images 117, be all that the light of laser beam 107 or light source 105 is formed back and forth through after described adjusting device 103; Two reflector plates 108 of adjusting device 103 are then constantly starts and then change the position that this machining beams 111 is incident upon this object 100 to be processed in process, so, in Laser Processing is carried out, in fact the processing image 116 and the reference images 117 that receive from finder 106 are fuzzy in fact, and the situation that practical laser is processed cannot be seen, that is, existing laser processing mechanism also cannot reach while Laser Processing is carried out, and can actually observe the object of the situation that Laser Processing is carried out.
So existing laser processing mechanism still needs to be improved, and clearly can observe at any time in process, and and then is revised.
Summary of the invention
The object of the present invention is to provide a kind of laser processing mechanism that clearly can carry out instant observation in process.
A kind of laser processing mechanism of the present invention, comprises one group and produces the lasing light emitter of laser beam, one group of adjusting device, one group of set of lenses, one group of focus lamp group, and one group of observation device.
Form one after the laser beam that this lasing light emitter produces by described adjusting device changes direct of travel and treat focused beam, this is made after focused beam advances preset distance can quality entity not penetrate with not reducing again by described set of lenses, afterwards, the focused beam for the treatment of that described focus lamp group order is penetrated through this set of lenses is focused and forms one and be incident upon object to be processed to carry out the machining beams of Laser Processing, and, described observation device is in order to receive the reference images fetched from object to be processed always, and one is incident upon by this machining beams the processing image that object reflection to be processed formed.
Preferably, described set of lenses comprises two planoconvex spotlights arranged separately, and described two planoconvex spotlights are each other with its plane in opposite directions.
Preferably, described focus lamp group comprises a spaced spectroscope, and a condenser lens, this spectroscope changes converging through this condenser lens after the course of focused beam and forming this machining beams of this set of lenses injection, and this machining beams is incident upon the light after object reflection to be processed is received by this observation device by this spectroscope after this condenser lens converges and form this processing image, meanwhile, directly after this condenser lens converges, this reference images of formation is received by this spectroscope by this observation device from the light of this object to be processed.
Preferably, described observation device comprises one group of image adjustment unit changing processing image position and this processing image is overlapped with this reference images, and one group receives this reference images and the image acquisition unit of this processing image for observation.
Preferably, described image adjustment unit has two spaced prisms, at least one lens, and one group of adjustment assembly, two described prisms have first plane of an essence perpendicular to an axis formed by described two prisms respectively, and one is not parallel to the second plane of this first plane in contrast to this first plane, and, first plane of one of them prism is the second plane towards another prism, described adjustment assembly is changed two described prisms and is changed processing image position around the rotational angle of this axis with controlling, and captured by this image acquisition unit with changing the processing image definition of these lens along the position of this axis direction after making change position.
Preferably, described laser processing mechanism also comprises one group and produces the light irradiating object to be processed and then the light source forming this reference images.
Beneficial effect of the present invention is: the laser beam that lasing light emitter produces through adjusting device, set of lenses and focus lamp group extremely object to be processed to process, the reference images that the processing image formed with seasonal laser beam reflection and light source produce is observed device to advance without the light path of adjusting device and receives, observes, and then reach and carry out adding man-hour with laser beam, can correct, clear, immediately observe machining status, and instant comparison can be carried out to be corrected immediately when abnormal generation.
Accompanying drawing explanation
Fig. 1 is a schematic diagram, and existing laser processing mechanism is described;
Fig. 2 is a schematic diagram, and one first preferred embodiment of laser processing mechanism of the present invention is described;
Fig. 3 is a schematic diagram, and one second preferred embodiment of laser processing mechanism of the present invention is described;
Fig. 4 is a cross-sectional schematic, the image adjustment unit of one group of observation device in aid illustration Fig. 3 second preferred embodiment.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in detail:
Consult Fig. 2, one first preferred embodiment of laser processing mechanism of the present invention comprises one group of lasing light emitter, 2, one group of adjusting device, 3, one group of set of lenses, 4, one group of focus lamp group, 5, one group of light source 6, and one group of observation device 7.
Described lasing light emitter 2 produces predetermined wavelength and carry out the laser beam 900 processed after adjustment, and in this example, what lasing light emitter 2 sent is ultraviolet laser light beam.
Described adjusting device 3 comprises the reflecting optics 31 of two change incident beam direct of travels that match, and this laser beam 900 that lasing light emitter 2 sends sequentially is formed after changing direct of travel through the cooperation of described two reflecting optics 31 and treats that focused beam 901 penetrates.
Described set of lenses 4 comprises two planoconvex spotlights arranged at intervals 41, two described planoconvex spotlights 41 have a plane 411 respectively, and a convex surface 412 in contrast to this plane 411, and, two described planoconvex spotlights 41 arrange opposite to each other with its plane 411 each other, and make after focused beam 901 is by described adjusting device 3, two planoconvex spotlights 41 of scioptics group 4 match and make the energy quality entity after focused beam 901 passes through constant, namely continue to advance to energy not dissipation.
Described focus lamp group 5 comprises a spaced spectroscope 51, and a condenser lens 52 focused on for incident light beam, from the injection of described set of lenses 4 until focused beam 901 this focus lamp group 5 incident time, reflect through this spectroscope 51 and continue to be advanced through this condenser lens 52 and be focused into one and be incident upon the machining beams 902 that object 100 to be processed carries out processing.
In addition, this machining beams 902 is incident upon while this object 100 to be processed carries out processing and also can reflects, the light of reflection passes through this condenser lens 52 along original route, and through after this spectroscope 51, another spectroscope 73, received by the image acquisition unit 72 of described observation device 7 and form processing image 903.This part will coordinate after this light source 6 and the detailed description of this observation device 7 when being well understood to.
Described light source 6 is arranged on this object 100 to be processed with in the light path of described focus lamp group 5 on line, described observation device 7 comprises one and is arranged at this object 100 to be processed and the spectroscope 73 in light path formed by this focus lamp group 5, and one group to should spectroscope 73 arrange image acquisition unit 72, the light that this light source 6 sends is radiated on this object 100 to be processed and produces reflection, the light of reflection passes through this condenser lens 52 along original route, and through this spectroscope 51, after spectroscope 73, received by the image acquisition unit 72 of observation device 7 and form reference images 904, in this example, this image acquisition unit 72 is charge coupled cell.
After the incident adjusting device 3 of laser beam 900 that described lasing light emitter 2 sends, through two reflecting optics 31 of adjusting device 3 match this laser beam 900 of adjustment direct of travel after form this and treat that focused beam 901 penetrates; Treat that focused beam 901 makes by described set of lenses 4 quality entity not reduce the focus lamp group 5 of ground described in incidence, front dissipate energy can not focused on through this focus lamp group 5, and, this machining beams 902 directly acting on this object 100 to be processed is focused into, to carry out Laser Processing by this condenser lens 52 after the reflection of this spectroscope 51.Further, control described two reflecting optics 31 and change constantly, this treats that the direct of travel of focused beam 901 is also by control break, and then this machining beams 902 of adjustable is incident upon the different precalculated position of this object 100 to be processed to carry out Laser Processing.
Produce reflection while described machining beams 902 is incident upon this object 100 to be processed, the light part of reflection sequentially passes through the rear injection of condenser lens 52, and part is through this spectroscope 51 injection also this observation device 7 of incidence; Spectroscope 73 reflection again through this observation device 7 enters this image acquisition unit 72 and forms this processing image 903; Simultaneously, the light that this light source 6 sends is incident upon this object 100 to be processed after this spectroscope 51, this condenser lens 52, sequentially enter this observation device 7 by this condenser lens 52, this spectroscope 51, spectroscope 73 along original route after reflection again, and form this reference images 904 for observation.
From above-mentioned light traveling process explanation, this laser beam 900 that the lasing light emitter 2 of laser processing mechanism of the present invention sends, after this adjusting device 3, set of lenses 4, focus lamp group 5, be incident upon this object 100 to be processed carry out Laser Processing, and two reflecting optics 31 that can control adjusting device 3 match constantly fine setting light direct of travel and Laser Processing is carried out to this object 100 precalculated position to be processed; And this processing image 903 that machining beams 902 reverberation is formed, this reference images 904 that the light sent with this light source 6 reflects to form, then directly by receiving for observation by this observation device 7 after this focus lamp group 5, can't be disturbed because of the variation of two of adjusting device 3 reflecting optics 31, so in laser processing procedure, this processing image 903 received from this finder 7 and this reference images 904 are image clearly, and can observe the instant situation of practical laser processing, and can be revised at once when work in-process notes abnormalities.
Consult Fig. 3, 4, second preferred embodiment and the first described preferred embodiment of laser processing mechanism of the present invention are similar, difference is that this observation device 7 also comprises one group of image adjustment unit 71 be located between spectroscope 73 and image acquisition unit 72, this image adjustment unit 71 has two intervals and arranges and the prism 711 of the change image direct of travel that matches, the lens 712 of a change image focal length, and one group can be connected the adjustment assembly 713 of described two prisms 711 with these lens 712 respectively with controlling, described two prisms 711 have first plane 714 of an essence perpendicular to the formed axis 716 of described two prisms 711 respectively, and one is not parallel to the second plane 715 of this first plane 714 in contrast to this first plane 714, and the first plane 714 of one of them prism 711 is second planes 715 towards another prism 711.
Described adjustment assembly 713 drives described two prisms 711 to change advancing of light around this axis 716 own rotation predetermined angular with being controlled respectively, with the relative position of these lens 712 of change along this axis 716 direction, and the processing image 903 after by described two prisms 711 is clearly captured by this image acquisition unit 72.
When this processing image 903 cannot be observed from the datum mark skew of observation picture because of going direction changing, can by described two prisms 711 match change light direct of travel and can again observe, mobile whole table apparatus is not needed to receive this processing image 903 with correspondence, and, make this processing image 903 can clearly be captured by this image acquisition unit 72 with this reference images 904 and supply to observe by this lens 712 adjusting focal length.
In sum, laser processing mechanism of the present invention be application described in lasing light emitter 2 produce laser beam 900 through adjusting device 3, this object 100 to be processed is incident upon to process after set of lenses 4 and focus lamp group 5 form machining beams 902, and, the reference images 904 that processing image 903 and this light source 6 that this machining beams 902 reflects and formed produce is to advance without the light path of this adjusting device 3 and to be received by this observation device 7, observe, and then reach when carrying out Laser Processing, simultaneously correct, clear and immediately observe machining status, and instant comparison can be carried out to be corrected immediately when extremely occurring, in addition, the image adjustment unit 71 that the present invention puts 7 by this observation sight makes this processing image 903 can clearly be received by this observation device 7 once again after change direct of travel, and do not need this observation device 7 mobile to receive this processing image 903 with correspondence, therefore really can reach object of the present invention.

Claims (5)

1. a laser processing mechanism, comprises one group and produces the lasing light emitter of laser beam, one group of adjusting device, one group of set of lenses, one group of focus lamp group, and one group of observation device, it is characterized in that:
Form one after the laser beam that this lasing light emitter produces by described adjusting device changes direct of travel and treat focused beam, this is made after focused beam advances preset distance can quality entity not penetrate with not reducing again by described set of lenses, afterwards, the focused beam for the treatment of that described focus lamp group order is penetrated through this set of lenses is focused and forms one and be incident upon object to be processed to carry out the machining beams of Laser Processing, and, described observation device is in order to receive the reference images fetched from object to be processed always, and one is incident upon by this machining beams the processing image that object reflection to be processed formed, described observation device comprises one group of image adjustment unit changing processing image position and this processing image is overlapped with this reference images, and one group receives this reference images and the image acquisition unit of this processing image for observation.
2. laser processing mechanism according to claim 1, is characterized in that: described set of lenses comprises two planoconvex spotlights arranged separately, and described two planoconvex spotlights are each other with its plane in opposite directions.
3. laser processing mechanism according to claim 2, it is characterized in that: described focus lamp group comprises a spaced spectroscope, and a condenser lens, this spectroscope changes converging through this condenser lens after the course of focused beam and forming this machining beams of this set of lenses injection, and this machining beams is incident upon the light after object reflection to be processed is received by this observation device by this spectroscope after this condenser lens converges and form this processing image, simultaneously, light directly from this object to be processed is received this reference images of formation by this spectroscope by this observation device after this condenser lens converges.
4. laser processing mechanism according to claim 1, it is characterized in that: described image adjustment unit has two spaced prisms, at least one lens, and one group of adjustment assembly, two described prisms have first plane of an essence perpendicular to an axis formed by described two prisms respectively, and one is not parallel to the second plane of this first plane in contrast to this first plane, and, first plane of one of them prism is the second plane towards another prism, described adjustment assembly is changed two described prisms and is changed processing image position around the rotational angle of this axis with controlling, and captured by this image acquisition unit with changing the processing image definition of these lens along the position of this axis direction after making change position.
5. laser processing mechanism according to claim 4, is characterized in that: described laser processing mechanism also comprises one group and produces the light irradiating object to be processed and then the light source forming this reference images.
CN201110042168.5A 2011-02-22 2011-02-22 Laser processing mechanism Expired - Fee Related CN102642083B (en)

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CN103252579A (en) * 2013-03-21 2013-08-21 常州镭赛科技有限公司 Laser welder
CN111055030A (en) * 2019-12-20 2020-04-24 武汉华工激光工程有限责任公司 Device and method for monitoring and feeding back light beam pointing stability

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Publication number Priority date Publication date Assignee Title
TW201021951A (en) * 2008-09-29 2010-06-16 Fujifilm Corp Laser processing device
TW201029782A (en) * 2008-11-28 2010-08-16 Hamamatsu Photonics Kk Laser machining device

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JPH11179579A (en) * 1997-12-22 1999-07-06 Sony Corp Method and device for correcting optical axis, and exposure-machining device using it

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201021951A (en) * 2008-09-29 2010-06-16 Fujifilm Corp Laser processing device
TW201029782A (en) * 2008-11-28 2010-08-16 Hamamatsu Photonics Kk Laser machining device

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