CN102636060A

CN102636060A - Thin heat pipe with spiral heat radiation channel

Info

Publication number: CN102636060A
Application number: CN2012101282082A
Authority: CN
Inventors: 洪进兴; 郑伟杰; 徐阿祥; 牛石建
Original assignee: KUNSHAN CHANGYUN ELECTRONIC INDUSTRY Co Ltd
Current assignee: KUNSHAN CHANGYUN ELECTRONIC INDUSTRY Co Ltd
Priority date: 2012-04-28
Filing date: 2012-04-28
Publication date: 2012-08-15

Abstract

The invention belongs to the field of heat radiation devices, in particular relates to a thin heat pipe with a spiral heat radiation channel, which comprises a heat pipe wall, a copper powder layer filled and sintered in a heat pipe and a water layer filled in the heat pipe, wherein the inside of the heat pipe wall is a vacuum state. The thin heat pipe is characterized by also comprising a continuous spiral groove arranged on the heat pipe wall, wherein the continuous spiral groove forms an air or liquid channel; the filling mode of the copper powder layer is a single-side filling mode or two-side filling mode, the single-side filling mode comprises a complete single-side filling or local single-side filling mode, and the two-side filling mode comprises a shaft-symmetric filling or shaft-asymmetric filling mode. The heat pipe manufactured by the invention is thinner, which is beneficial to miniaturization and light property of electronic products; and the continuous spiral groove is additionally arranged at a part where steam and condensate water are accumulated, and forms the air or liquid channel, so that gas or water can be distributed, and circulation of water in the heat pipe is prevented from being blocked due to the over-thin heat pipe wall.

Description

Slim heat pipe with spiral heat dissipation channel

Technical field

The invention belongs to the heat abstractor field, be specifically related to a kind of slim heat pipe with spiral heat dissipation channel.

Background technology

Need dispel the heat in the time of the computer main board operation, adopt the heat radiation copper pipe usually.The preparation method of existing heat radiation copper pipe is following: sintered copper powder forms the copper powder layer in heat pipe, fills part water after vacuumizing and flattens heat pipe; To heat pipe one end that contacts with thermal source; The water of this end absorbs heat and distributes steam; Steam moves to the other end of heat pipe, and through the capillary suction-operated of copper powder, the water of the other end moves on to the heat pipe one end conduct that contacts with thermal source and replenishes; Steam then is condensed into water, so constitutes the circulation of sealing water and accomplishes heat radiation.Usually the thickness of heat radiation copper pipe is more than 3-4mm, and the heat radiation copper pipe is thicker, is unfavorable for miniaturization, the lightweight of electronic product, therefore tends to adopt comparatively frivolous slim heat pipe at present.The problem of slim heat pipe is: because the heat pipe attenuation, correspondingly, the thickness of copper powder layer reduces; Copper powder also tails off; The capillary absorption affinity reduces, and steam and condensed water can form at local (two end regions of especially slim heat pipe) and liquidate, and the retardance thermal cycle flocks together.

Summary of the invention

Technical purpose of the present invention is to overcome the problems of the prior art, provide a kind of in heat pipe the accumulation regions of steam and condensed water spiral heat dissipation channel is set, stops steam and condensed water to form to liquidate, make heat pipe water the slim heat pipe unimpeded, that thermal diffusivity is good that circulates with spiral heat dissipation channel in the part.

For realizing the object of the invention; The technical scheme that the present invention adopts is: the slim heat pipe with spiral heat dissipation channel; Comprise heat pipe wall, fill the copper powder layer that is sintered in the heat pipe, the water layer that is filled in heat pipe; In the described heat pipe wall is vacuum state, it is characterized in that: also comprise the continuous helical groove that is arranged at heat pipe wall, continuous helical groove constitutes gas or fluid passage.

Aforesaid slim heat pipe with spiral heat dissipation channel, described helical groove is the line shape in the shape of a spiral, is positioned at the inboard of heat pipe wall.

Aforesaid slim heat pipe with spiral heat dissipation channel, the filling mode of described copper powder layer are monolateral filled type or bilateral filled type, and monolateral filled type comprises complete monolateral filling or local monolateral filling, and bilateral filled type comprises axisymmetric or the asymmetric formula of axle.

Aforesaid slim heat pipe with spiral heat dissipation channel, the cross section of described copper powder layer are that circle, rectangle, two semicircle or double-paraboloid are linear.

The present invention is designed to local monolateral filled type or the slim copper powder layer of local bilateral filled type with the copper powder layer of heat pipe, makes the heat pipe that makes thinner, helps miniaturization, the lighting of electronic product; Through adding continuous helical groove at steam and condensed water habitat, this continuous helical groove constitutes gas or fluid passage, and gas or moisture can be shunted, and the water circulation that prevents heat pipe has better heat radiating effect owing to thin excessively heat pipe wall blocks.

Description of drawings

Fig. 1 is a structural representation of the present invention;

Fig. 2 is in the slim heat pipe sectional view of position I for copper powder;

Fig. 3 is in the slim heat pipe structure figure of position I for copper powder;

Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9 are respectively the slim heat pipe sectional view that copper powder is in diverse location;

Wherein, 1 heat pipe wall, 2 copper powder layers, 3 helical grooves.

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The specific embodiment

For technical scheme, technical characterictic that the present invention is realized, reach purpose and effect and be easy to understand and understand, below in conjunction with the specific embodiment, further set forth the present invention.

According to Fig. 1-Fig. 9 preferred implementation of the present invention is described below, wherein the cross section of copper powder layer 2 is semicircle during the I of position.

Slim heat pipe with spiral heat dissipation channel; Comprise heat pipe wall 1, fill the copper powder layer 2 that is sintered in the heat pipe, the water layer that is filled in heat pipe; In the described heat pipe wall 1 is vacuum state; It is characterized in that: also comprise the continuous helical groove 3 that is arranged at heat pipe wall 1, continuous helical groove 3 constitutes gas or fluid passage; Helical groove 3 is the line shape in the shape of a spiral, is positioned at the inboard of heat pipe wall 1; The filling mode of copper powder layer 2 is monolateral filled type (Fig. 2, Fig. 6, Fig. 8, Fig. 9) or bilateral filled type (Fig. 4, Fig. 5, Fig. 7); Monolateral filled type comprises complete monolateral filling or local monolateral filling (Fig. 2, Fig. 6, Fig. 8, Fig. 9), and bilateral filled type comprises axisymmetric (Fig. 4) or axle asymmetric formula (Fig. 5, Fig. 7); The cross section of copper powder layer 2 is circular (Fig. 8), rectangle (Fig. 9), two semicircle (Fig. 4), double-paraboloid linear (Fig. 5, Fig. 7), single parabola shaped (Fig. 6) or semicircle (Fig. 2).

The present invention is designed to local monolateral filled type or the slim copper powder layer 2 of local bilateral filled type with the copper powder layer 2 of heat pipe, makes the heat pipe that makes thinner, helps miniaturization, the lighting of electronic product; Through adding continuous helical groove 3 at steam and condensed water habitat, this continuous helical groove 3 constitutes gas or fluid passage, and gas or moisture can be shunted, and the water circulation that prevents heat pipe is owing to thin excessively heat pipe wall 1 blocks.

More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection domain to be defined by appending claims and equivalent thereof.

Claims

1. the slim heat pipe that has spiral heat dissipation channel; Comprise heat pipe wall, fill the copper powder layer that is sintered in the heat pipe, the water layer that is filled in heat pipe; In the described heat pipe wall is vacuum state; It is characterized in that: also comprise the continuous helical groove that is arranged at heat pipe wall, continuous helical groove constitutes gas or fluid passage.

2. the slim heat pipe with spiral heat dissipation channel according to claim 1, it is characterized in that: described helical groove is the line shape in the shape of a spiral, is positioned at the inboard of heat pipe wall.

3. the slim heat pipe with spiral heat dissipation channel according to claim 1; It is characterized in that: the filling mode of described copper powder layer is monolateral filled type or bilateral filled type; Monolateral filled type comprises complete monolateral filling or local monolateral filling, and bilateral filled type comprises axisymmetric or the asymmetric formula of axle.

4. the slim heat pipe with spiral heat dissipation channel according to claim 3 is characterized in that: the cross section of described copper powder layer is that circle, rectangle, two semicircle or double-paraboloid are linear.