CN102629567A - Substrate fixing device and manufacturing method thereof and method for fixing substrate - Google Patents
Substrate fixing device and manufacturing method thereof and method for fixing substrate Download PDFInfo
- Publication number
- CN102629567A CN102629567A CN2011103193356A CN201110319335A CN102629567A CN 102629567 A CN102629567 A CN 102629567A CN 2011103193356 A CN2011103193356 A CN 2011103193356A CN 201110319335 A CN201110319335 A CN 201110319335A CN 102629567 A CN102629567 A CN 102629567A
- Authority
- CN
- China
- Prior art keywords
- substrate
- fixing
- storage tank
- plate
- location
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
Disclosed in the invention is a substrate fixing device, which is used for fixing a substrate (1) in processing equipment. The substrate accommodation groove (13) is arranged on the surface of the substrate fixing device to fix the substrate (1); and the overall dimension of the substrate fixing device is arranged as one enabling the device itself to be fixed on the processing equipment. Besides, provided is a method for fixing a substrate. According to the invention, the substrate fixing devices are employed on different processing equipment, so that an adaptive range of a same substrate to the different processing equipment is enlarged, accurate positioning of the substrate on the different processing equipment is ensured and a problem of dislocation caused by dimension inconsistency between the same substrate and substrate brackets of the different processing equipment can be solved.
Description
Technical field
The invention belongs to flat panel display equipment manufacturing technology field; Be specifically related to a kind of method that in the display device manufacture process, is used for substrate is fixed on the apparatus for fixing substrate and the fixing base of process equipment, also relate to the manufacture method of this apparatus for fixing substrate simultaneously.
Background technology
Organic electroluminescence device is called Organic Light Emitting Diode (Organic Light Emitting Diode again; Be called for short OLED); It is a kind of novel flat-panel display device; Compare with liquid crystal display device; OLED has that active illuminating, driving voltage are low, low in energy consumption, luminosity and efficient is high, ultra-thin, manufacture craft simple, can be easier to realize that full-color flat panel display and flexible shows, with great visual angle and plurality of advantages such as operating temperature range is wide, is considered to the emerging application technology of flat-panel monitor of future generation.
After doctor C.W.Tang found the principle of luminosity of organic electroluminescence device in 1979, countries in the world were all dropped into great amount of manpower and material resources successively and are devoted to its research and application.At present; The OLED technology of China is in that laboratory research and development, pilot scale exploitation transform to volume production and deposits the stage; Wherein the experimental result of the scientific achievement of laboratory research and development, pilot scale exploitation plays crucial effects to the quality of volume production product, will improve constantly the properties of product of OLED on the one hand, and it can be produced in batches; This just requires the OLED manufacturing equipment can standardization, further to reduce cost.In order to make full use of the advantage separately of multiple varying environments such as enterprise and school, R&D institution and resource aspect, production, teaching & research all circles have carried out technological cooperation widely.
The OLED display device is divided into two kinds of active type of drive (AMOLED) and passive drive modes (PMOLED); In the manufacturing of OLED display device; Substrate is as the carrier of all components and parts; In whole manufacturing process, flow and process,, all relate to three big steps such as substrate preparation, vapor deposition, encapsulation no matter be the AMOLED mode or the manufacturing of the OLED display device of PMOLED mode.In the experimentation of laboratory research and development, pilot scale exploitation; Manufacturing negligible amounts, the substrate size of the OLED display device sample of each cooperation unit also has separately specification to adapt to manufacturing equipment separately; Along with the reinforcement of research and development with the industrial field cooperation, the difference that manufacturing equipment exists between each cooperation unit of production, teaching & research becomes the weakness of exchange of technology and cooperation undoubtedly.
For example, in the substrate preparation process, the display device of PMOLED mode only adopts photoetching process and corresponding apparatus; And the display device of AMOLED mode since its on substrate be each pixel all integrated a cluster film transistor (Thin Film Transistor; Be called for short TFT) and storage capacitance; Peripheral drive circuit and array of display whole system are integrated on the same substrate; Therefore not only adopt photoetching process; Also correspondingly relate to kinds of processes and multiple corresponding apparatus such as film forming, exposure, etching, make the manufacturing of display device of AMOLED mode for the manufacturing of the display device of PMOLED mode, not only equipment needed thereby is many but also high to the apparatus and process required precision.In actual production is made; Substrate need be fixed on respectively in the process equipment of different operations such as film-forming apparatus, exposure sources, etching apparatus and process; These equipment fixedly are that substrate carrier (be used for ccontaining and hold up substrate) through variant process equipment realizes to substrate; Because the size of the substrate of different model is had nothing in common with each other, and in a certain process equipment, substrate carrier only adopts one or limited several; In the process of processing different model substrate, can't be fixed on the substrate carrier of process equipment because of undersized (for the substrate carrier) of this substrate sometimes.Simultaneously; Because the size of the different substrate carriage in the different operations also possibly exist than big-difference; When the substrate of certain model of processing, certain type of substrate can occur can be suitable with the size of the substrate carrier used in this technology in some technology, and can not be suitable with the size of the substrate carrier used in this technology in other technologies; When substrate size and substrate carrier size are not suitable; The fixed effect of substrate in process equipment is bad, even can occur being fixed on the phenomenon in the process equipment, thereby influences the crudy of substrate.In addition; Between the equipment between each cooperation unit of production, teaching & research, also there is size difference; These differences have directly caused the size of the different substrate carriage of variant process equipment to have very big difference; Especially in the AMOLED mode substrate to prepare the difference that size that substrate in size and the PMOLED mode of substrate carrier in the equipment prepares substrate carrier in the equipment exists just bigger; And these equipment itself are all expensive, and for the laboratory sample that research and develop in the laboratory, pilot scale is developed that substrate is made negligible amounts, more the cost of exchange device is too high.Along with the reinforcement of research and development with the industrial field cooperation; The linking of same substrate between different process equipment seems important all the more; Make because the problem of the fixedly difficulty of the inconsistent same substrate that causes of substrate carrier size between distinct device between the different process equipment is also outstanding all the more; These factors have further hindered the interchange and the raising of OLED display device development technology, cause the transplanting and the cooperation of technology bottleneck to occur.
Summary of the invention
Technical problem to be solved by this invention is in the OLED display device manufacture process in the prior art; The deficiency that same substrate causes fixing difficulty maybe can not fix because of process equipment substrate carrier size is inconsistent between different process equipment; Provide a kind of substrate of any type that makes on the substrate carrier of the different size of different process equipment, can both carry out apparatus for fixing substrate effectively fixing and accurately contraposition and adopt this apparatus for fixing substrate that substrate is fixed on the method in the process equipment, also relate to the manufacture method of this apparatus for fixing substrate simultaneously.
Solving a kind of optimized technical scheme that technical problem of the present invention adopted is this apparatus for fixing substrate that is used for substrate is fixed on process equipment; Said apparatus for fixing substrate upper surface is provided with the substrate storage tank with fixing said substrate, and the overall dimension of said apparatus for fixing substrate is arranged so that it can be fixed on the said process equipment.
Preferably, said apparatus for fixing substrate be provided with said substrate on optical registration put corresponding technology loci.
Further preferably, the length of the length of said substrate storage tank, width and the degree of depth and its substrate of fixing, width and highly suitable.
Another kind of optimized technical scheme is; Said apparatus for fixing substrate comprises location-plate, processing engagement unit; The upper surface of said location-plate is provided with the substrate storage tank with fixing said substrate, and said substrate is connected through the processing engagement unit with said apparatus for fixing substrate; Said processing engagement unit comprise positioning convex and with the suitable detent of said positioning convex.
Preferably, the height of the degree of depth of substrate storage tank and its substrate of fixing is suitable in the said location-plate.
Preferably, said positioning convex is arranged in the substrate storage tank of location-plate and is corresponding with the position of detent on the said substrate bottom surface; Perhaps, said detent is arranged in the substrate storage tank of location-plate and is corresponding with the position of positioning convex on the said substrate bottom surface.
More preferably, said positioning convex be shaped as pointed or square or taper shape, detent be shaped as pointed or square or the taper shape adaptive with said positioning convex.
Simultaneously preferably, the apparatus for fixing substrate in above-mentioned two kinds of optimal technical scheme adopts transparent material to process.
A kind of method that adopts any apparatus for fixing substrate fixing base in the technique scheme, it comprises the steps:
1) substrate is fixed in the substrate storage tank in the said apparatus for fixing substrate;
The apparatus for fixing substrate that 2) will be equipped with substrate is fixed on the substrate carrier of process equipment;
Perhaps,
1) said apparatus for fixing substrate is fixed on the substrate carrier of said process equipment;
2) substrate is fixed in the substrate storage tank in the said apparatus for fixing substrate, thereby substrate is fixed in the said process equipment.
Preferably, the method for said fixing base also comprises, makes the technology loci in the apparatus for fixing substrate corresponding with the optical registration point on the substrate.
Further preferably, substrate is fixed in the substrate storage tank in the said apparatus for fixing substrate further comprises: between apparatus for fixing substrate and substrate, put into stickum, make the two bonding fixing; And/or,
When apparatus for fixing substrate comprises location-plate and processing during engagement unit, said method further comprises: make detent and positioning convex contraposition cooperation, make apparatus for fixing substrate and substrate position relative fixed.
The manufacture method of aforesaid substrate fixture comprises the steps:
A) choose a transparent panel as apparatus for fixing substrate, it is cut, the size of substrate carrier in the process equipment of its overall dimension and substrate place operation is fitted mutually;
B) choose the mask plate that a transparent panel processes and cover on the apparatus for fixing substrate, said mask plate be provided with the substrate storage tank mark suitable, the optical registration mark in the zone of said substrate storage tank mark with the overall dimension of substrate and have telltale mark that the fixed position concerns with the optical registration mark, at the extra-regional technology alignment mark of substrate storage tank mark;
C) utilize technology alignment mark manufacture craft loci on apparatus for fixing substrate on the mask plate;
D) be basic point with the technology loci, the upper surface that utilizes substrate storage tank on the mask plate to be marked at apparatus for fixing substrate is offered the substrate storage tank, and the height of the degree of depth of said substrate storage tank and its substrate of fixing is suitable.
The manufacture method of aforesaid substrate fixture also further comprises:
E) utilize the telltale mark on the mask plate in the substrate storage tank, to make positioning convex or detent;
Perhaps,
E) utilize substrate storage tank mark on the mask plate, make the length and the width of length and width and its substrate of fixing of said substrate storage tank suitable.
The invention has the beneficial effects as follows: to the substrate carrier that has nothing in common with each other in the different process equipment; Thereby make same substrate be difficult to the contradiction of simultaneous adaptation kinds of processes equipment; Through making the apparatus for fixing substrate of fitting and be provided with the substrate storage tank of fitting mutually with the overall dimension of different process equipment substrate carrier mutually with substrate; Be used as the middle transition part of size difference between different process equipment substrate carrier and the substrate, thereby same substrate is fixed on the substrate carrier of different process equipment well; Simultaneously, to the substrate of different specification size, through in apparatus for fixing substrate, offering the substrate storage tank of fitting mutually, thereby can the substrate of different specification size be fixed on the same substrate carrier of same equipment well with the specification of said substrate.Therefore; Regulate the overall dimension of apparatus for fixing substrate or the specification of substrate storage tank wherein neatly according to actual operating position; Can realize easily the substrate of different specification size is fixed on the purpose in the different process equipment; Greatly enlarged the accommodation of process equipment and substrate; And guaranteed the accurate location of substrate in different process equipment; Solved same substrate or processing problem of misalignment that different substrate in same process equipment because of substrate size inconsistent cause inconsistent in different processes equipment, be particluarly suitable for using in the process equipment of substrate carrier size greater than the substrate size of being processed because of the substrate carrier size, be particularly suitable for same substrate be in laboratory development and pilot scale during the stage cooperation between different process equipment be connected and use.
Description of drawings
Fig. 1 is entrenched in the cross sectional view in the location-plate for substrate in the embodiment of the invention 1;
Fig. 2 is the structural representation of substrate 1 among Fig. 1;
Fig. 3 is the structural representation of location-plate 2 among Fig. 1;
Fig. 4 is the structural representation of mask plate 9.
Among the figure: the 1-substrate; The 2-location-plate; The 3-detent; The 4-positioning convex; 5-display device area of the pattern; 6-technology loci; 7-optical registration point; The 8-telltale mark; The 9-mask plate; 10-substrate storage tank mark; 11-technology alignment mark; 12-optical registration mark; 13-substrate storage tank.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, apparatus for fixing substrate of the present invention and method and the manufacture method of apparatus for fixing substrate that substrate is fixed in the process equipment are described in further detail below in conjunction with accompanying drawing and specific embodiment.
A kind of technical scheme on basis the most is this apparatus for fixing substrate that is used for substrate is fixed on process equipment; Said apparatus for fixing substrate upper surface is provided with substrate storage tank 13 with fixing said substrate, and the overall dimension of said apparatus for fixing substrate is arranged so that it can be fixed on the said process equipment.
General, the front of substrate 1 is provided with display device area of the pattern 5, and the non-display device area of the pattern of substrate front side is provided with optical registration point 7, and said optical registration point 7 adopts two or more.As correspondence; Apparatus for fixing substrate be provided with said substrate 1 on optical registration put 7 corresponding technology loci 6; Technology loci 6 is generally positioned at the position that apparatus for fixing substrate is not offered substrate storage tank 13, and said technology loci 6 adopts two or more.
In addition, the length of the length of substrate storage tank 13, width and the degree of depth and its substrate of fixing 1, width and highly suitable.
Another kind of technical scheme is as shown in Figure 1; A kind of apparatus for fixing substrate that is used for substrate 1 is fixed on process equipment; Comprise location-plate 2 and processing engagement unit, the overall dimension of location-plate 2 is arranged so that on its substrate carrier that can be fixed on process equipment, location-plate 2 be provided with can ccontaining substrate 1 substrate storage tank 13; Substrate 1 is fixed in the substrate storage tank 13 through the processing engagement unit, the shape of substrate storage tank 13 and its shape of ccontaining substrate 1 suitable.
Wherein, the degree of depth of the substrate storage tank 13 in the location-plate 2 and the height of its substrate of fixing 1 are suitable, are in same horizontal plane with the surface of assurance substrate and the surface of apparatus for fixing substrate, are convenient to processing; The length of substrate storage tank 13 and width can be suitable with the length and the width of substrate 1, so that fixing base 1 better, the length of substrate storage tank 13 and width also can be convenient to putting into and taking out of substrate less times greater than the length and the width of substrate 1.
As preferably, the processing engagement unit comprise positioning convex 4 and with the suitable detent 3 of positioning convex, positioning convex 4 is arranged in the substrate storage tank 13 in the location-plate 2, detent 3 is arranged on the bottom surface of substrate 1 and is corresponding with the position of positioning convex 4; Perhaps, positioning convex is arranged on the bottom surface of substrate 1, and detent is arranged in the substrate storage tank of location-plate and is corresponding with the position of positioning convex.Detent and positioning convex adopt suitable two couple or how right.
Apparatus for fixing substrate preferably adopts transparent material to process, and is more convenient for observing operation, improves aligning accuracy and homework precision.
A kind ofly adopt that any apparatus for fixing substrate is fixed on the method in the process equipment with substrate in the technique scheme, comprise the steps:
1) substrate 1 is fixed in the substrate storage tank 13 in the apparatus for fixing substrate;
The apparatus for fixing substrate that 2) will be equipped with substrate 1 is fixed on the substrate carrier of process equipment;
Perhaps,
1) apparatus for fixing substrate is fixed on the substrate carrier of process equipment;
2) substrate 1 is fixed in the substrate storage tank 13 in the apparatus for fixing substrate, thereby substrate 1 is fixed in the process equipment.
In order to guarantee accurate positioning, it is 7 corresponding that technology loci 6 and the optical registration on the substrate 1 in the apparatus for fixing substrate put.
Simultaneously, firm in order to guarantee the location, substrate 1 is fixed in the substrate storage tank in the said apparatus for fixing substrate further comprises: between apparatus for fixing substrate and substrate 1, put into stickum, make the two bonding fixing, can reduce operation, convenient working simultaneously; And/or; When employing includes the base positioner of location-plate 2 and processing engagement unit; Above-mentioned substrate is fixed in the substrate storage tank in the apparatus for fixing substrate further comprises: detent and positioning convex contraposition are cooperated, make apparatus for fixing substrate and substrate 1 position relative fixed.Certainly, it is 7 corresponding to guarantee to make this moment technology loci 6 and the optical registration on the substrate 1 in the apparatus for fixing substrate to put.
Wherein, the manufacture method of apparatus for fixing substrate comprises the steps:
A) choose an overall dimension greater than the transparency glass plate of contour substrate size as apparatus for fixing substrate, it is cut, the size of the substrate carrier in the overall dimension that makes apparatus for fixing substrate and the process equipment is fitted mutually;
B) choose the mask plate 9 that a transparent panel processes and cover on the apparatus for fixing substrate, said mask plate 9 be provided with the substrate storage tank mark 10 suitable, the optical registration mark 12 in the zone of said substrate storage tank mark 10 with the overall dimension of substrate 1 and have telltale mark 8 that the fixed position concerns with the optical registration mark, at the extra-regional technology alignment mark 11 of substrate storage tank mark 10;
C) coverage mask plate 9 on apparatus for fixing substrate utilizes the technology alignment mark 11 manufacture craft loci 6 on apparatus for fixing substrate on the mask plate 9;
In this step, the technology loci 6 on the apparatus for fixing substrate can particularly, can be vapor deposition loci or sputter loci or ion pair site for multiple.
D) be basic point with technology loci 6, utilize the substrate storage tank mark 10 etch substrate storage tank 13 on apparatus for fixing substrate on the mask plate 9, the height of the degree of depth of said substrate storage tank 13 and its substrate of fixing 1 is suitable.
Accordingly, the manufacture method of aforesaid substrate fixture also comprises:
E) in the process of etch substrate storage tank 13, utilize the relevant position of telltale mark 8 in substrate storage tank 13 on the mask plate 9 to form positioning convex or detent;
Perhaps,
E) utilize substrate storage tank mark 10 on the mask plate 9, make the length and the width of length and width and its substrate of fixing 1 of said substrate storage tank 13 suitable.
The manufacture method of the processing engagement unit on the substrate comprises the steps:
A) coverage mask plate 9 on substrate 1, and make the optical registration point 7 in the positive non-display device area of the pattern of optical registration mark 12 align substrates 1 on the mask plate 9;
B) be basic point with optical registration point 7, utilize the telltale mark 8 on the mask plate 9 to make substrate orientation groove or positioning convex in substrate 1 bottom surface.
Here it should be understood that the above-mentioned mask plate that is used to make the processing engagement unit on apparatus for fixing substrate and the substrate is same mask plates 9, and above-mentioned making to making of the processing engagement unit on the substrate 1 and apparatus for fixing substrate is independent respectively.Positioning convex and the detent made through above-mentioned manufacture method directly are formed on the correspondence position of apparatus for fixing substrate and substrate.Certainly, said positioning convex and said detent can be independently, are bonded in respectively on the correspondence position of apparatus for fixing substrate and substrate through stickum then.
Simultaneously, the manufacture method introduction of the above-mentioned processing engagement unit that is used on apparatus for fixing substrate and the substrate being made the mask plate 9 adopted here is following, and it mainly comprises the steps:
A) choose a transparency glass plate, on this transparency glass plate, make substrate storage tank mark 10 according to the overall dimension of substrate 1;
C) in the zone of substrate storage tank mark 10, make optical registration mark 12, it is 7 corresponding that optical registration mark 12 and the optical registration in substrate 1 front are put;
D) be benchmark with optical registration mark 12, in the zone of substrate storage tank mark 10, make telltale mark 8, manufacture craft alignment mark 11 outside substrate storage tank mark 10 regional.
Embodiment 1:
Existing problem is in the present embodiment; The substrate of research and development OLED display device prepares in the process in the laboratory; The overall dimension of substrate 1 and substrate prepare the size of the substrate carrier in the equipment fits mutually, thereby substrate 1 can be fixed on substrate well and prepares on the substrate carrier in the equipment; But; The size of the substrate carrier in the evaporated device prepares the size of substrate carrier in the equipment greater than substrate; Thereby make the size of substrate 1 less than the size of the substrate carrier in the evaporated device, if the substrate 1 that directly will accomplish behind the substrate preparation section is fixed on the substrate carrier of evaporated device, it is fixing unstable then in evaporate process, to occur substrate easily; Thereby make the display device vapor deposition on the substrate misplace, finally influence the crudy of substrate 1.Through adopting apparatus for fixing substrate of the present invention, can make to prepare the substrate 1 of accomplishing corresponding preparation section the equipment from substrate and can easily be applicable in the evaporated device of substrate carrier size greater than this substrate 1.
As shown in Figure 2; In the present embodiment; The front of substrate 1, promptly the one side of substrate 1 with display device area of the pattern 5 is provided with at least two optical registration points 7, is that basic point can be in substrate 1 positive display device pattern or the metal electrode pattern made from optical registration point 7.
As shown in Figure 3; This apparatus for fixing substrate comprises location-plate 2 and processing positioning unit in the present embodiment; The overall dimension of location-plate 2 be set to evaporated device in the size of substrate carrier fit mutually, offer on the location-plate 2 and can be ccontaining prepare the substrate storage tank 13 of accomplishing the substrate 1 behind the corresponding preparation section the equipment from substrate.Wherein, The length of the length of substrate storage tank 13, width and the degree of depth and substrate 1, width and fit highly mutually; Make substrate 1 just in time can be entrenched in the substrate storage tank 13, and the display device pattern that is provided with on the substrate 1 just in time with location-plate 2 in do not offer the substrate storage tank the position be in same plane.In the present embodiment, the profile of substrate 1 is a cuboid, thereby the shape of substrate storage tank 13 also is a cuboid.
Substrate 1 is fixed in the substrate storage tank 13 through the processing engagement unit; Processing engagement unit comprise positioning convex 4 and with the suitable detent 3 of positioning convex; In the present embodiment; Positioning convex 4 is arranged in the substrate storage tank 13 in the location-plate 2, and detent 3 is arranged on the bottom surface of substrate 1 and is corresponding with the position of positioning convex 4.Wherein, detent 3 adopts suitable two couple with positioning convex 4.
In the present embodiment, being shaped as of positioning convex 4 is pointed, being shaped as and suitable pointed of positioning convex of detent 3.Through making the positioning convex 4 on the location-plate 2 chimeric fixing with the detent 3 that substrate 1 bottom surface is provided with; Thereby make location-plate 2 and substrate 1 can keep strict fixed position; In order to make the fixing more firm of the two, can substrate 1 be bonded and fixed in the substrate storage tank 13.
Wherein, substrate 1 positive display device area of the pattern is outside equipped with optical registration point 7, and optical registration point 7 adopts two; The position that location-plate 2 is not offered the substrate storage tank is provided with technology loci 6, and technology loci 6 adopts two.In the present embodiment, technology loci 6 is the vapor deposition loci, and two vapor deposition loci are relatively arranged on the both sides of substrate storage tank 13.Through making optical registration point 7 and the vapor deposition loci on the location-plate 2 on the substrate 1 keep the relative fixed distance; Thereby can guarantee that after substrate 1 being fixed on the substrate carrier that is fixed on evaporated device in the location-plate 2 and with location-plate 2 evaporated device promptly can carry out vapor deposition exactly to the display device pattern on the substrate 1.
The making of location-plate 2 with and optical registration point and the making of detent 3 on the ccontaining substrate 1, can realize by mask plate shown in Figure 49.In semiconductor and display device industry, generally be earlier various optical markings and pattern to be set on mask plate, then through technologies such as exposure, development, etchings, with the various optical markings on the mask plate and pattern Mapping on substrate or other similar planar plates.
In the present embodiment, mask plate 9 adopts specific glass to make, and this glass surface is provided with the chromium metallic film, the chromium metallic film is carried out special processing just can on mask plate 9, form various optical markings and pattern.As shown in Figure 4, in the present embodiment, mask plate 9 is provided with substrate storage tank mark 10, alignment mark and telltale mark 8, and wherein alignment mark comprises technology alignment mark 11 and optical registration mark 12.In practical application; Substrate storage tank mark 10 is used for making the substrate storage tank 13 that location-plate 2 is used for ccontaining substrate 1; Technology alignment mark 11 is used to make the technology loci 6 on the location-plate 2; Optical registration mark 12 be used for substrate 1 on optical registration put 7 contrapositions, telltale mark 8 is used to make the location-plate positioning convex 4 on detent 3 and the location-plate 2 on substrate 1 bottom surface.Above-mentioned optical markings and pattern can be made on the mask plate 9 according to practical situations in advance.
Because the detent 3 of substrate 1 bottom surface, location-plate 2 positive substrate storage tank 13 and the positioning convex 4 in the substrate storage tank are made by same mask plates 9, can guarantee that therefore the 2 pairs of position locations of substrate 1 in process equipment of this location-plate are accurately corresponding.
After location-plate 2 preparations finish; Can substrate 1 be placed in the substrate storage tank 13 in the location-plate 2; Through the positioning convex 4 in the substrate storage tank is aimed at, thereby with substrate 1 accurate contraposition and be entrenched on the location-plate 2; Before chimeric, can in substrate 1 bottom surface and substrate storage tank, smear binding agent earlier, thereby substrate 1 and location-plate 2 are fixed as one, guarantee that substrate 1 is fixing with the firm and precision of location-plate 2 relative positions.Then; The location-plate that is equipped with substrate 12 is fixed on the substrate carrier of evaporated device; Because the display device area of the pattern 5 on substrate 1 front is fixed with optical registration point 7 and two technology loci 6 relative positions that are oppositely arranged on the location-plate 2; Thereby just can realize substrate 1 and the accurate contraposition of vapor deposition through the technology loci 6 on the location-plate 2, realize vapor deposition, thereby accomplish the vapor deposition of OLED the display device organic material on the substrate 1 with metal mask plate.
In actual application, the making of this location-plate and processing engagement unit is between substrate preparation section and vapor deposition operation, and concrete manufacture method comprises the steps:
11) make mask plate 9:
A) choose a glass plate, on this glass plate, make substrate storage tank mark 10 according to the overall dimension of substrate 1;
B) it is 7 corresponding that making optical registration mark 12 in the zone of substrate storage tank mark 10, this optical registration mark 12 and the optical registration on the substrate 1 are put;
C) be benchmark with optical registration mark 12; In the zone of substrate storage tank mark 10, make telltale mark 8, manufacture craft alignment mark 11 outside substrate storage tank mark 10 regional; This technology alignment mark 11 is corresponding with the technology loci 6 on the apparatus for fixing substrate, and technology alignment mark 11 is the vapor deposition alignment mark in the present embodiment;
12) on substrate 1, directly form the processing engagement unit:
A) after the substrate preparation section is accomplished, the one side that is provided with the display device pattern in the substrate 1 is for positive, and substrate 1 front also is provided with optical registration point 7 simultaneously.In the present embodiment, display device is OLED in the substrate 1, and the display device pattern in the display device area of the pattern 5 in substrate 1 front comprises OLED electrode and lead pattern thereof;
B) coverage mask plate 9 on substrate 1, and make the positive optical registration point 7 of optical registration mark 12 align substrates 1 on the mask plate 9 is a basic point with optical registration point 7, utilize telltale mark 8 on the mask plate 9 in substrate 1 bottom surface making detent 3.In the present embodiment, substrate orientation groove 3 is pointed.Because substrate adopts glass to process, but has perspectivity, thereby is easy to just can produce pointed detent 3 through technologies such as etching or sandblasts in the relevant position on the bottom surface of substrate 1;
13) make location-plate, and on location-plate, directly form the processing engagement unit:
A) choose an overall dimension greater than the glass plate of substrate 1 overall dimension as location-plate 2, it is cut, the size of the substrate carrier in its overall dimension and the evaporated device substrate is fitted mutually.In the present embodiment, the profile of location-plate 2 is a cuboid;
B) coverage mask plate 9 on location-plate 2; Utilize the technology alignment mark 11 manufacture craft loci 6 on location-plate 2 on the mask plate 9; Technology loci 6 can take different shapes and size, technology loci 6 through coverage mask plate 9 on location-plate 2 make public, steps such as development, etching form.In the present embodiment, technology loci 6 is the vapor deposition loci;
C) be basic point with technology loci 6; Utilize the substrate storage tank mark 10 etch substrate storage tank 13 on location-plate 2 on the mask plate 9; The shape and size of the shape and size of formed substrate storage tank 13 and substrate 1 are suitable, and the degree of depth of substrate storage tank 13 can be controlled through the concentration and the etch period of etching liquid;
D) in etching storage tank process, utilize the relevant position in the substrate storage tank 13 of telltale mark 8 in location-plate 2 on the mask plate 9 to form pointed positioning convex 4, positioning convex 4 can be made through technologies such as etching or sandblasts and form.
Above-mentioned steps 12), the mask plate 13) is same mask plates 9.Above-mentioned steps 12) relates generally to making, promptly be mainly used in and make detent 3 the processing engagement unit on the substrate 1; Above-mentioned steps 13) relates generally to the making of location-plate 2 and the making of the processing engagement unit on the location-plate 2 thereof, promptly be mainly used in vapor deposition loci, substrate storage tank 13 and the positioning convex 4 made in the location-plate.Above-mentioned to substrate 1 processing and be respectively independently to the treatment step of location-plate 2, can be according to circumstances in practical operation set by step 11), 12), 13) or 11), 13), 12) order make.
Use when location-plate is fixed on substrate 1 in the evaporated device in the present embodiment; Earlier substrate 1 is placed in the substrate storage tank 13 of location-plate 2; Make the pointed detent 3 on the substrate 1 chimeric with the pointed positioning convex 4 on the location-plate 2; Reach the accurate location of substrate 1 and location-plate 2; And bonding is firmly, and the optical registration point 7 on this moment substrate 1 is accurately located with the technology loci 6 on the location-plate 2, thus the accurate location of the technology loci 6 on display device pattern and the location-plate 2 on the realization substrate 1; And then the location-plate 2 that will be equipped with substrate 1 is fixed on the substrate carrier of evaporated device, by normal flow substrate 1 carried out vapor deposition treatment then.
Embodiment 2:
The difference of present embodiment and embodiment 1 is; Substrate carrier in the evaporated device is shaped as circle; Therefore the profile of location-plate 2 be with evaporated device in the substrate carrier shape circle of fitting mutually, detent 3 on the substrate 1 and the positioning convex 4 on the location-plate 2 be shaped as suitable taper shape.
Other structures and manufacturing process are all identical with embodiment 1 in the present embodiment, repeat no more here.
Here it should be understood that; The shape that the shape of detent 3 and positioning convex 4 is not limited to enumerate in the foregoing description, any mutual shape adapting that makes substrate and location-plate combine and be convenient to pick and place all should be included in protection scope of the present invention.
It should be understood that simultaneously the shape of substrate 1 among the present invention and the shape of substrate storage tank 13 are not limited to the described shape of the foregoing description; The profile of location-plate 2 also is not limited to the described shape of the foregoing description; Any and suitable substrate storage tank 13 shape and size, any and the profile of the location-plate 2 that the substrate carrier shape and size are suitable and the combination of size of substrate 1 shape and size include in protection scope of the present invention.At this moment, should make the mask plate of fitting mutually with it with the shape and size of equipment substrate carrier according to the shape and size of said substrate, and produce corresponding location-plate substrate storage tank suitable and processing engagement unit with making location-plate and substrate.For example: the process equipment in the substrate preparation is the circular substrate carriage, and substrate is circular, and then the substrate storage tank in the location-plate is set to circle, its size is decided according to substrate size; And the process equipment in the evaporated device is the circular substrate carriage, and then the profile of location-plate is set to circle, and its size is decided according to the substrate carrier size in the evaporated device.In practical application, the user can make location-plate and suitable processing engagement unit is set on substrate according to the different mask plate of concrete condition design of substrate and process equipment substrate carrier.
Substrate among embodiment 1 and the embodiment 2 is through location-plate and process engagement unit accordingly; Make substrate accurate positioning in location-plate; Then location-plate is placed on the substrate carrier of evaporated device, thereby make substrate accurate positioning in follow-up large-sized evaporated device, enlarged the accommodation of evaporated device different substrate; Realize substrate accurate purpose of vapor deposition display device organic material and metal electrode in evaporated device; Solved at OLED and prepared in the process, especially active drive-type OLED display in the preparation process same substrate (for example: substrate prepares equipment and evaporated device) it is workable because the inconsistent display device location problem of misalignment that causes of equipment substrate carrier size in different process equipment; Less equipment investment, cost is low.
Certainly; Here it should be understood that; The substrate that apparatus for fixing substrate of the present invention is not only applicable to the OLED display device prepares the conversion linking of same substrate between different process equipment in the process; Also be applicable in other any process equipments that substrate size is limited to some extent; Promptly when only allowing the substrate of fixing a certain size in the equipment; Can adopt this apparatus for fixing substrate to enlarge its fixable substrate size scope, for example: in the manufacturing process of liquid crystal display substrate, when the substrate size that the ion implantation device substrate carrier that substrate size that substrate carrier can be supported in the sputtering equipment of sputtered film and ion inject can be supported is different; Just can adopt this apparatus for fixing substrate to make these two kinds of different process equipments of substrate carrier size of same substrate simultaneous adaptation, thereby enlarge the scope of application of sputtering equipment and ion implantation device.
It is understandable that above execution mode only is the illustrative embodiments that adopts for principle of the present invention is described, yet the present invention is not limited thereto.For the one of ordinary skilled in the art, under the situation that does not break away from spirit of the present invention and essence, can make various modification and improvement, these modification also are regarded as protection scope of the present invention with improving.
Claims (13)
1. apparatus for fixing substrate; Be used for substrate (1) is fixed on process equipment; It is characterized in that said apparatus for fixing substrate upper surface is provided with substrate storage tank (13) with fixing said substrate (1), the overall dimension of said apparatus for fixing substrate is arranged so that it can be fixed on the said process equipment.
2. apparatus for fixing substrate according to claim 1, it is characterized in that said apparatus for fixing substrate be provided with said substrate (1) on the corresponding technology loci of optical registration point (7) (6).
3. apparatus for fixing substrate according to claim 2 is characterized in that length, width and the degree of depth of said substrate storage tank (13) and length, the width and highly suitable of its substrate of fixing (1).
4. apparatus for fixing substrate according to claim 2; It is characterized in that said apparatus for fixing substrate comprises location-plate (2), processing engagement unit; The upper surface of said location-plate (2) is provided with substrate storage tank (13) with fixing said substrate (1), and said substrate (1) is connected through the processing engagement unit with said apparatus for fixing substrate; Said processing engagement unit comprise positioning convex and with the suitable detent of said positioning convex.
5. apparatus for fixing substrate according to claim 4 is characterized in that the height of the degree of depth and its substrate of fixing (1) of the substrate storage tank (13) in the said location-plate (2) is suitable.
6. apparatus for fixing substrate according to claim 5 is characterized in that said positioning convex (4) is arranged in the substrate storage tank of location-plate (2) and corresponding with the position of detent (3) on said substrate (1) bottom surface; Perhaps, said detent is arranged in the substrate storage tank of location-plate (2) and is corresponding with the position of positioning convex on said substrate (1) bottom surface.
7. apparatus for fixing substrate according to claim 6 is characterized in that being shaped as of said positioning convex pointed or square or taper shape, detent be shaped as pointed or square or the taper shape adaptive with said positioning convex.
8. according to each described apparatus for fixing substrate of claim 1-7, it is characterized in that said apparatus for fixing substrate adopts transparent material to process.
9. a method that adopts each described apparatus for fixing substrate fixing base of claim 1-8 is characterized in that comprising the steps:
1) substrate (1) is fixed in the substrate storage tank (13) in the said apparatus for fixing substrate;
The apparatus for fixing substrate that 2) will be equipped with substrate (1) is fixed on the substrate carrier of process equipment;
Perhaps,
1) said apparatus for fixing substrate is fixed on the substrate carrier of said process equipment;
2) substrate (1) is fixed in the substrate storage tank (13) in the said apparatus for fixing substrate.
10. method according to claim 9 is characterized in that also comprising, makes the technology loci (6) in the said apparatus for fixing substrate corresponding with the optical registration point (7) on the substrate (1).
11. method according to claim 9 is characterized in that substrate (1) is fixed in the substrate storage tank in the said apparatus for fixing substrate and comprises: between apparatus for fixing substrate and substrate (1), put into stickum, make the two bonding fixing; And/or,
When apparatus for fixing substrate comprises location-plate (2) and processing during engagement unit, said method further comprises: make detent and positioning convex contraposition cooperation, make apparatus for fixing substrate and substrate (1) position relative fixed.
12. method according to claim 9 is characterized in that the manufacture method of said apparatus for fixing substrate comprises the steps:
A) choose a transparent panel as apparatus for fixing substrate, it is cut, the size of substrate carrier in the process equipment of its overall dimension and substrate (1) place operation is fitted mutually;
B) choose the mask plate (9) that a transparent panel processes and cover on the apparatus for fixing substrate, said mask plate (9) be provided with the substrate storage tank mark (10) suitable, the optical registration mark (12) in the zone of said substrate storage tank mark (10) with the overall dimension of substrate (1) and have telltale mark (8) that the fixed position concerns with optical registration mark (12), at the extra-regional technology alignment mark (11) of substrate storage tank mark (10);
C) utilize technology alignment mark (11) manufacture craft loci (6) on apparatus for fixing substrate on the mask plate (9);
D) be basic point with technology loci (6), utilize the substrate storage tank mark (10) on the mask plate (9) to offer substrate storage tank (13) at the upper surface of apparatus for fixing substrate, the height of the degree of depth of said substrate storage tank (13) and its substrate of fixing (1) is suitable.
13. method according to claim 12 is characterized in that the manufacture method of said apparatus for fixing substrate also further comprises:
E) utilize telltale mark (8) on the mask plate (9), in the substrate storage tank, make positioning convex or detent;
Perhaps,
E) utilize substrate storage tank mark (10) on the mask plate (9), make the length and the width of length and width and its substrate of fixing (1) of said substrate storage tank (13) suitable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110319335.6A CN102629567B (en) | 2011-10-19 | 2011-10-19 | Substrate fixing device and manufacturing method thereof and method for fixing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110319335.6A CN102629567B (en) | 2011-10-19 | 2011-10-19 | Substrate fixing device and manufacturing method thereof and method for fixing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102629567A true CN102629567A (en) | 2012-08-08 |
| CN102629567B CN102629567B (en) | 2015-06-24 |
Family
ID=46587795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110319335.6A Expired - Fee Related CN102629567B (en) | 2011-10-19 | 2011-10-19 | Substrate fixing device and manufacturing method thereof and method for fixing substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102629567B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103805962A (en) * | 2014-03-06 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Chip position aligning tool and aligning method, and chemical vapor deposition reaction cavity |
| CN103852241A (en) * | 2012-11-30 | 2014-06-11 | 中国科学院光电研究院 | V-shaped block position conversion mechanism |
| CN104726839A (en) * | 2015-03-27 | 2015-06-24 | 京东方科技集团股份有限公司 | Substrate fixing device |
| CN105296957A (en) * | 2014-06-04 | 2016-02-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber |
| WO2016086536A1 (en) * | 2014-12-04 | 2016-06-09 | 深圳市华星光电技术有限公司 | Oled material vacuum thermal evaporation deposition mask plate |
| CN110048026A (en) * | 2018-01-17 | 2019-07-23 | 上海视涯信息科技有限公司 | Oled panel manufacturing system, the device for being used to form interim pairing unit |
| CN110462282A (en) * | 2017-03-30 | 2019-11-15 | 本田技研工业株式会社 | The front lamp device of saddle-ride type vehicle |
| WO2020029408A1 (en) * | 2018-08-09 | 2020-02-13 | 深圳市华星光电半导体显示技术有限公司 | Mask replacement device and replacement method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1828859A (en) * | 2005-02-28 | 2006-09-06 | 大日本网目版制造株式会社 | Wafer treating apparatus |
| CN101078887A (en) * | 2006-05-22 | 2007-11-28 | Asml荷兰有限公司 | Lithographic apparatus and lithographic apparatus cleaning method |
| CN101826482A (en) * | 2009-03-06 | 2010-09-08 | 台湾积体电路制造股份有限公司 | Wafer holding mechanism, wafer holding system and wafer matched with wafer carrier |
| CN102136445A (en) * | 2010-12-23 | 2011-07-27 | 大连艾科科技开发有限公司 | Special fixture for assembling small semiconductor refrigerator |
| CN102651457A (en) * | 2011-04-28 | 2012-08-29 | 京东方科技集团股份有限公司 | Fixing device of substrate and fixing method based on device |
| CN102674710A (en) * | 2011-06-21 | 2012-09-19 | 京东方科技集团股份有限公司 | Protection device and method for processing glass substrate |
-
2011
- 2011-10-19 CN CN201110319335.6A patent/CN102629567B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1828859A (en) * | 2005-02-28 | 2006-09-06 | 大日本网目版制造株式会社 | Wafer treating apparatus |
| CN101078887A (en) * | 2006-05-22 | 2007-11-28 | Asml荷兰有限公司 | Lithographic apparatus and lithographic apparatus cleaning method |
| CN101826482A (en) * | 2009-03-06 | 2010-09-08 | 台湾积体电路制造股份有限公司 | Wafer holding mechanism, wafer holding system and wafer matched with wafer carrier |
| CN102136445A (en) * | 2010-12-23 | 2011-07-27 | 大连艾科科技开发有限公司 | Special fixture for assembling small semiconductor refrigerator |
| CN102651457A (en) * | 2011-04-28 | 2012-08-29 | 京东方科技集团股份有限公司 | Fixing device of substrate and fixing method based on device |
| CN102674710A (en) * | 2011-06-21 | 2012-09-19 | 京东方科技集团股份有限公司 | Protection device and method for processing glass substrate |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103852241A (en) * | 2012-11-30 | 2014-06-11 | 中国科学院光电研究院 | V-shaped block position conversion mechanism |
| CN103805962A (en) * | 2014-03-06 | 2014-05-21 | 上海华虹宏力半导体制造有限公司 | Chip position aligning tool and aligning method, and chemical vapor deposition reaction cavity |
| CN103805962B (en) * | 2014-03-06 | 2016-03-02 | 上海华虹宏力半导体制造有限公司 | Chip position truing tool and calibration steps, chemical vapour deposition reaction chamber |
| CN105296957A (en) * | 2014-06-04 | 2016-02-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Reaction chamber |
| CN105296957B (en) * | 2014-06-04 | 2019-01-18 | 北京北方华创微电子装备有限公司 | A kind of reaction chamber |
| WO2016086536A1 (en) * | 2014-12-04 | 2016-06-09 | 深圳市华星光电技术有限公司 | Oled material vacuum thermal evaporation deposition mask plate |
| CN104726839A (en) * | 2015-03-27 | 2015-06-24 | 京东方科技集团股份有限公司 | Substrate fixing device |
| US9957605B2 (en) | 2015-03-27 | 2018-05-01 | Boe Technology Group Co., Ltd. | Substrate fixing apparatus |
| CN110462282A (en) * | 2017-03-30 | 2019-11-15 | 本田技研工业株式会社 | The front lamp device of saddle-ride type vehicle |
| CN110048026A (en) * | 2018-01-17 | 2019-07-23 | 上海视涯信息科技有限公司 | Oled panel manufacturing system, the device for being used to form interim pairing unit |
| WO2020029408A1 (en) * | 2018-08-09 | 2020-02-13 | 深圳市华星光电半导体显示技术有限公司 | Mask replacement device and replacement method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102629567B (en) | 2015-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102629567A (en) | Substrate fixing device and manufacturing method thereof and method for fixing substrate | |
| CN106653812B (en) | The production method of flexible display panels | |
| CN106654046B (en) | OLED display panel and preparation method thereof | |
| US10837111B2 (en) | Holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber, apparatus for depositing a layer on a substrate, and method for aligning a substrate carrier supporting a substrate and a mask carrier | |
| CN202139291U (en) | Vacuum evaporation device | |
| CN103981485B (en) | Mask plate and manufacture method thereof | |
| CN103700692A (en) | OLED (organic light emitting diode) display panel and production method thereof | |
| CN105445986A (en) | Display panel and preparation method thereof as well as display device | |
| KR101479943B1 (en) | The System and Method to Align Substrate and Mask | |
| CN102723445A (en) | OLED (organic light-emitting diode) display unit and OLED spliced display screen with same | |
| US9735186B2 (en) | Manufacturing method and structure thereof of TFT backplane | |
| US20190044068A1 (en) | Mask plate | |
| US20160310988A1 (en) | Mask assembly, a method of manufacturing a mask assembly, and a method of manufacturing display device | |
| KR101462159B1 (en) | Alligner structure for substrate | |
| CN104865731A (en) | Display panel and manufacturing method thereof and display device | |
| CN105093659A (en) | Liquid crystal display panel and manufacturing method thereof | |
| CN104979223B (en) | A kind of wafer bonding technique | |
| CN102651457B (en) | The fixture of substrate and the fixing means based on this device | |
| KR20080027269A (en) | Position correcting device, vacuum processing equipment, and position correcting method | |
| CN103487997B (en) | Tft array substrate, display panels and display device | |
| CN104022079A (en) | Manufacturing method for substrate of thin film transistor | |
| CN102709479A (en) | Package structure and package method for organic light emitting diode (OLED) device | |
| CN105870103A (en) | Alignment mark and preparation method thereof, substrate, display panel and display device | |
| CN103647028B (en) | Array base palte and preparation method thereof, display device | |
| KR20170066766A (en) | Method for manufacturing a mask assembly and method for manufacturing a display apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 Termination date: 20211019 |