CN102628116B - Copper-based electric contact material and preparing method thereof - Google Patents
Copper-based electric contact material and preparing method thereof Download PDFInfo
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- CN102628116B CN102628116B CN201210097519.7A CN201210097519A CN102628116B CN 102628116 B CN102628116 B CN 102628116B CN 201210097519 A CN201210097519 A CN 201210097519A CN 102628116 B CN102628116 B CN 102628116B
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Abstract
Provided are a copper-based electric contact material and a preparing method thereof. Conductive ceramics La2NiO4, BaPbO3 or Li1.4A10.4(Ge1-xTix)1.6(PO4)3 serve as a second additive phase and are evenly distributed in a copper matrix in particle shape, and a copper component forms a continuous matrix structure. Conductive ceramics La2NiO4 powder with particle size smaller than 10 mu m and conductive ceramics BaPbO3 and Li1.4A10.4(Ge1-xTix)1.6(PO4)3 powder with particle size smaller than 10 mu m are prepared in a sol-gel method, the powder is respectively mixed with copper powder in high energy ball milling mode and pressed in cold mode to form, and compact materials can be obtained through powder metallurgy methods including sintering in a vacuum furnace, hot pressing and the like. The conductive ceramics La2NiO4, BaPbO3 andLi1.4A10.4(Ge1-xTix)1.6(PO4)3 are added in copper-based electric contact materials, so that heat conduction performance at high temperature is kept to be unchanged, and due to the existing of the conductive ceramics, conduction performance is effectively enhanced. Further, due to high-temperature resistance and fragility, melting points of elements can be improved, viscosity of molten baths is reduced, and the aim of improving fusion welding resisting performance and breaking capacity of the copper-based electric contact elements can be achieved.
Description
Technical field
The present invention relates to a kind of copper-based electric contact material and preparation method thereof, particularly conductivity ceramics La
2niO
4, BaPbO
3or Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3as a kind of copper-based electric contact material of second-phase and preparation method thereof.
Background technology
Contact material is widely used in the electrical equipment such as isolating switch, contactor, rly., and its performance directly has influence on stability and the reliability of electric operation.Contact material is in use subject to the joint effect of electric arc, electric field, magnetic field, high temperature and ambiance, realizes conducting function.Contact material for device for switching is mostly Ag-CdO, Ag-SnO at present
2, Cu-ZnO, Cu-Al
2o
3, Cu-Y
2o
3deng, wherein silver-colored expensive, and consumption is very large, accounts for the 25-30% that silver consumes every year for the production of silver contact with silver; CdO has toxicity; SnO
2can not adulterate in a large number and easily cause high contact resistance; And the second-phase Al adding in copper-based electric contact material
2o
3, Y
2o
3all there is electrical insulation capability, increased contact resistance.Therefore be necessary that the conductivity ceramics of Development of Novel is as the copper-based electric contact material of the second doping phase.
Fine copper has good electric property, and its specific conductivity is 1.72 * 10
-8Ω m (20 ℃), only a little more than silver-colored specific conductivity 1.586 * 10
-8Ω m (20 ℃), resistance fusion welding can be good.But in fine copper, doping has the second-phase of insulating property, will cause contact resistance sharply to rise.Too high contact resistance also can cause contact temperature rise aggravation simultaneously, makes electrical appliance in unsafe condition.
Summary of the invention
In order to overcome the defect of prior art, the object of the present invention is to provide a kind of copper-based electric contact material and preparation method thereof, utilize conductivity ceramics La
2niO
4, BaPbO
3or Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3as second-phase, both high heat conduction in use of holding contact element, the premium properties such as high temperature resistant are substantially constant, improve electroconductibility and corrosion resistance simultaneously, and because the intensity of pottery own is high, fragility is large, not only improve the physical strength of contact element, reduce it simultaneously and in arc erosion process, formed the viscosity in molten bath, thereby improved resistance fusion welding energy.
In order to achieve the above object, technical scheme of the present invention is achieved in that
A copper-based electric contact material, is characterized in that, comprises that accounting for gross weight is that the particle size of 1%-10% is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that the grain-size of 99%-90% is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 95-99.9%, wherein conductivity ceramics La
2niO
4form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, with conductivity ceramics La
2niO
4for second-phase, comprise the following steps:
Step 1, conductivity ceramics La
2niO
4powder is to prepare by the method for collosol and gel, and concrete grammar is: the La (NO that is 2: 1 by mol ratio
3)
36H
2o and Ni (NO
3)
36H
2o adds to and in deionized water, forms mixing solutions, add citric acid, citric acid is 1.5-3 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion: 1, when stirring, be heated to 90 ℃, add ethylene glycol, ethylene glycol is 1-2 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion: 1, at 90 ℃ of temperature, until solution becomes, thickness obtains gelinite in stirring, at 110 ℃, be placed in loft drier and be incubated 12h, after dry, at 850 ℃-1100 ℃, be incubated 4h and carry out roasting, finally grind the conductivity ceramics La that obtains being less than 10 μ m
2niO
4powder;
Step 2, by accounting for gross weight, be that the particle size of 1%-10% is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that the grain-size of 99%-90% is that the copper powder of 45 μ m mixes with high energy ball mill mixing under argon gas atmosphere protection for 10-24 hour; rotating speed is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa cold pressing, 900 ℃ of sintering 1-5 hours, 700-1000 ℃ hot extrusion are prepared into fine and close copper/conductivity ceramics La
2niO
4matrix material.
A copper-based electric contact material, comprises that accounting for gross weight is the conductivity ceramics BaPbO that the particle size of 1%-10% is less than 10 μ m
3powder and to account for gross weight be that the grain-size of 99%-90% is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 95-99.9%, conductivity ceramics BaPbO
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, with conductivity ceramics BaPbO
3for second-phase, comprise the following steps: by accounting for gross weight, be the conductivity ceramics BaPbO that the particle size of 1%-10% is less than 10 μ m
3powder and to account for gross weight be that the grain-size of 99%-90% is the copper powder of 45 μ m; under argon gas atmosphere protection, through the mode of high-energy mechanical ball milling, mix 12-24 hour; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa, colds pressing, 900 ℃ of sintering 1-5 hours, 700-950 ℃, is hot extruded into as fine and close copper/conductivity ceramics BaPbO
3matrix material.
A copper-based electric contact material, comprises that accounting for gross weight is that the particle size of 1%-10% is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that the grain-size of 99%-90% is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 95-99.9%, wherein conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3, comprise the following steps: by accounting for gross weight, be that the particle size of 1%-10% is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that the grain-size of 99%-90% is that the copper powder of 45 μ m is mixed 12-24 hour through the mode of high-energy mechanical ball milling under argon gas atmosphere protection; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa, colds pressing, 900 ℃ of sintering 1-5 hours, 600-1000 ℃ hot re-pressing, becomes fine and close copper/conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3matrix material.
The present invention is according to being that copper constituent element forms successive substrates tissue, and conductivity ceramics has good conductivity, so adds conductivity ceramics La
2niO
4, BaPbO
3or Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3do not affect the heat conductivility of electrical-contact element, also improved its electroconductibility.Simultaneously owing to existing conductivity ceramics can improve the resistance fusion welding energy of electrical-contact element in molten bath.Conductivity ceramics fusing point is high, fragility is large, and in arc erosion process, still the form with particle is present in weld pool surface, effectively reduces molten bath viscosity, has reached the object that improves resistance fusion welding energy and breaking capacity.
The invention has the beneficial effects as follows:
Conductivity ceramics La
2niO
4, BaPbO
3, Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3there is the features such as good anti-oxidant, anticorrosive, high temperature resistant, high mechanical strength.The two compound contact material that is expected to obtain thering is high conduction performance simultaneously, keeps high thermal conductivity and improve resistance fusion welding energy.
In copper-based electric contact material, add conductivity ceramics La
2niO
4, BaPbO
3, Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3, substantially do not affect its heat conductivility at high temperature, and due to the existence of conductivity ceramics, the object that strengthens its conductivity can be reached, again because of ceramic high thermal resistance and fragility, the fusing point of electrical-contact element can be improved, reduce molten bath viscosity, improved its high temperature resistance fusion welding energy and breaking capacity.
Embodiment
Embodiment mono-
A copper-based electric contact material, comprises that accounting for gross weight is that 5% particle size is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that 95% grain-size is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 98%, wherein conductivity ceramics La
2niO
4form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, with conductivity ceramics La
2niO
4for second-phase, comprise the following steps:
Step 1, conductivity ceramics La
2niO
4powder is to prepare by the method for collosol and gel, and concrete grammar is: the La (NO that is 2: 1 by mol ratio
3)
36H
2o and Ni (NO
3)
36H
2o adds to and in deionized water, forms mixing solutions, add citric acid, citric acid is 1.5: 1 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion, when stirring, be heated to 90 ℃, add ethylene glycol, ethylene glycol is 2: 1 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion, at 90 ℃ of temperature, until solution becomes, thickness obtains gelinite in stirring, at 110 ℃, be placed in loft drier and be incubated 12h, after being dried, at 850 ℃, be incubated 4h and carry out roasting, finally grind the conductivity ceramics La that obtains being less than 10 μ m
2niO
4powder;
Step 2, by accounting for gross weight, be that 5% particle size is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that 95% grain-size is that the copper powder of 45 μ m is mixed and mixed for 18 hours with high energy ball mill under argon gas atmosphere protection; rotating speed is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa cold pressing, 3 hours, 850 ℃ hot extrusions of 900 ℃ of sintering are prepared into fine and close copper/conductivity ceramics La
2niO
4matrix material.
Embodiment bis-
A copper-based electric contact material, comprises that accounting for gross weight is that 1% particle size is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that 99% grain-size is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 96%, wherein conductivity ceramics La
2niO
4form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, with conductivity ceramics La
2niO
4for second-phase, comprise the following steps:
Step 1, conductivity ceramics La
2niO
4powder is to prepare by the method for collosol and gel, and concrete grammar is: the La (NO that is 2: 1 by mol ratio
3)
36H
2o and Ni (NO
3)
36H
2o adds to and in deionized water, forms mixing solutions, add citric acid, citric acid is 2: 1 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion, when stirring, be heated to 90 ℃, add ethylene glycol, ethylene glycol is 1.5: 1 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion, at 90 ℃ of temperature, until solution becomes, thickness obtains gelinite in stirring, at 110 ℃, be placed in loft drier and be incubated 12h, after being dried, at 1000 ℃, be incubated 4h and carry out roasting, finally grind the conductivity ceramics La that obtains being less than 10 μ m
2niO
4powder;
Step 2, by accounting for gross weight, be that 1% particle size is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that 99% grain-size is that the copper powder of 45 μ m is mixed and mixed for 12 hours with high energy ball mill under argon gas atmosphere protection; rotating speed is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa cold pressing, 1 hour, 700 ℃ hot extrusions of 900 ℃ of sintering are prepared into fine and close copper/conductivity ceramics La
2niO
4matrix material.
Embodiment tri-
A copper-based electric contact material, comprises that accounting for gross weight is that 10% particle size is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that 90% grain-size is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 99.9%, wherein conductivity ceramics La
2niO
4form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, with conductivity ceramics La
2niO
4for second-phase, comprise the following steps:
Step 1, conductivity ceramics La
2niO
4powder is to prepare by the method for collosol and gel, and concrete grammar is: the La (NO that is 2: 1 by mol ratio
3)
36H
2o and Ni (NO
3)
36H
2o adds to and in deionized water, forms mixing solutions, add citric acid, citric acid is 3: 1 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion, when stirring, be heated to 90 ℃, add ethylene glycol, ethylene glycol is 1: 1 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion, at 90 ℃ of temperature, until solution becomes, thickness obtains gelinite in stirring, at 110 ℃, be placed in loft drier and be incubated 12h, after being dried, at 1100 ℃, be incubated 4h and carry out roasting, finally grind the conductivity ceramics La that obtains being less than 10 μ m
2niO
4powder;
Step 2, by accounting for gross weight, be that 10% particle size is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that 90% grain-size is that the copper powder of 45 μ m is mixed and mixed for 24 hours with high energy ball mill under argon gas atmosphere protection; rotating speed is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa cold pressing, 5 hours, 1000 ℃ hot extrusions of 900 ℃ of sintering are prepared into fine and close copper/conductivity ceramics La
2niO
4matrix material.
Embodiment tetra-
A copper-based electric contact material, comprises that accounting for gross weight is the conductivity ceramics BaPbO that 1% particle size is less than 10 μ m
3powder and to account for gross weight be that 99% grain-size is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 95%, conductivity ceramics BaPbO
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, with conductivity ceramics BaPbO
3for second-phase, comprise the following steps: by accounting for gross weight, be the conductivity ceramics BaPbO that 1% particle size is less than 10 μ m
3powder and to account for gross weight be that 99% grain-size is the copper powder of 45 μ m; under argon gas atmosphere protection, by the mode of high-energy mechanical ball milling, mix 12 hours; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa, colds pressing, 1 hour, 700 ℃ of 900 ℃ of sintering, is hot extruded into as fine and close copper/conductivity ceramics BaPbO
3matrix material.
Embodiment five
A copper-based electric contact material, comprises that accounting for gross weight is the conductivity ceramics BaPbO that 5% particle size is less than 10 μ m
3powder and to account for gross weight be that 95% grain-size is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 98%, conductivity ceramics BaPbO
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, with conductivity ceramics BaPbO
3for second-phase, comprise the following steps: by accounting for gross weight, be the conductivity ceramics BaPbO that 5% particle size is less than 10 μ m
3powder and to account for gross weight be that 95% grain-size is the copper powder of 45 μ m; under argon gas atmosphere protection, by the mode of high-energy mechanical ball milling, mix 18 hours; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa, colds pressing, in 900 ℃ of sintering 3 hours, 850 ℃ of hot extrusion 30MPa hot pressing, becomes fine and close copper/conductivity ceramics BaPbO
3matrix material.
Embodiment six
A copper-based electric contact material, comprises that accounting for gross weight is the conductivity ceramics BaPbO that 10% particle size is less than 10 μ m
3powder and to account for gross weight be that 90% grain-size is the copper powder of 45 μ m, after mixing, through powder metallurgy process, preparation becomes dense material, and its density is 99%, conductivity ceramics BaPbO
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, with conductivity ceramics BaPbO
3for second-phase, comprise the following steps: by accounting for gross weight, be the conductivity ceramics BaPbO that 10% particle size is less than 10 μ m
3powder and to account for gross weight be that 90% grain-size is the copper powder of 45 μ m; under argon gas atmosphere protection, by the mode of high-energy mechanical ball milling, mix 24 hours; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa, colds pressing, at 950 ℃ of hot re-pressings of 5 hours, 950 ℃ hot extrusions of 900 ℃ of sintering, becomes fine and close copper/conductivity ceramics BaPbO
3matrix material.
Embodiment seven
A copper-based electric contact material, comprises that accounting for gross weight is that 1% particle size is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that 99% grain-size is the copper powder of 45 μ m, after mixing, through powder metallurgy process, preparation becomes dense material, and its density is 95%, wherein conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3, comprise the following steps: by accounting for gross weight, be that 1% particle size is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that 99% grain-size is that the copper powder of 45 μ m is mixed 12 hours by the mode of high-energy mechanical ball milling under argon gas atmosphere protection; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa, colds pressing, at 1 hour, 600 ℃ hot re-pressings of 900 ℃ of sintering, becomes fine and close copper/conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3matrix material.
Embodiment eight
A copper-based electric contact material, comprises that accounting for gross weight is that 5% particle size is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that 95% grain-size is the copper powder of 45 μ m, after mixing, through powder metallurgy process, preparation becomes dense material, and its density is 98%, wherein conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3, comprise the following steps: by accounting for gross weight, be that 5% particle size is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that 95% grain-size is that the copper powder of 45 μ m is mixed 18 hours through the mode of high-energy mechanical ball milling under argon gas atmosphere protection; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa, colds pressing, at 3 hours, 850 ℃ hot re-pressings of 900 ℃ of sintering, becomes fine and close copper/conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3matrix material.
Embodiment nine
A copper-based electric contact material, comprises that accounting for gross weight is that 10% particle size is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that 90% grain-size is the copper powder of 45 μ m, after mixing, through powder metallurgy process, preparation becomes dense material, and its density is 99.9%, wherein conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
A preparation method for copper-based electric contact material, conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3, comprise the following steps: by accounting for gross weight, be that 10% particle size is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x) 1.6 (PO
4)
3powder and to account for gross weight be that 90% grain-size is that the copper powder of 45 μ m is mixed 24 hours through the mode of high-energy mechanical ball milling under argon gas atmosphere protection; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10: 1, through 600MPa, colds pressing, at 5 hours, 1000 ℃ hot re-pressings of 900 ℃ of sintering, becomes fine and close copper/conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3matrix material.
Claims (6)
1. a copper-based electric contact material, is characterized in that, comprises that accounting for gross weight is that 5%-10% particle size is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that 95%-90% grain-size is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 95-99.9%, wherein conductivity ceramics La
2niO
4form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
2. the preparation method of a kind of copper-based electric contact material according to claim 1, is characterized in that, with conductivity ceramics La
2niO
4for second-phase, comprise the following steps:
Step 1, conductivity ceramics La
2niO
4powder is to prepare by the method for collosol and gel, and concrete grammar is: the La (NO that is 2: 1 by mol ratio
3)
36H
2o and Ni (NO
3)
36H
2o adds to and in deionized water, forms mixing solutions, add citric acid, citric acid is 1.5-3: 1 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion, when stirring, be heated to 90 ℃, add ethylene glycol, ethylene glycol is 1-2: 1 with the amount of substance ratio that GOLD FROM PLATING SOLUTION belongs to ion, at 90 ℃ of temperature, until solution becomes, thickness obtains gelinite in stirring, at 110 ℃, be placed in loft drier and be incubated 12h, after dry, at 850 ℃-1100 ℃, be incubated 4h and carry out roasting, finally grind the conductivity ceramics La that obtains being less than 10 μ m
2niO
4powder;
Step 2, by accounting for gross weight, be that 1%-10% particle size is the conductivity ceramics La that is less than 10 μ m
2niO
4powder and to account for gross weight be that 99%-90% grain-size is that the copper powder of 45 μ m is mixed and mixed for 10-24 hours with high energy ball mill under argon gas atmosphere protection; rotating speed is 2800r/min; ratio of grinding media to material is 10:1, through 600MPa cold pressing, 1-5 hours, 700-1000 ℃ hot extrusions of 900 ℃ of sintering are prepared into fine and close copper/conductivity ceramics La
2niO
4matrix material.
3. a copper-based electric contact material, is characterized in that, comprises that accounting for gross weight is the conductivity ceramics BaPbO that 5%-10% particle size is less than 10 μ m
3powder and to account for gross weight be that 95%-90% grain-size is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 95.0-99.9%,, conductivity ceramics BaPbO
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
4. the preparation method of a kind of copper-based electric contact material according to claim 3, is characterized in that, with conductivity ceramics BaPbO
3for second-phase, comprise the following steps: by accounting for gross weight, be the conductivity ceramics BaPbO that 1%-10% particle size is less than 10 μ m
3powder and to account for gross weight be that 99%-90% grain-size is the copper powder of 45 μ m; under argon gas atmosphere protection, through the mode of high-energy mechanical ball milling, mix 12-24 hours; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10:1, through 600MPa, colds pressing, 1-5 hours, 700-950 ℃ of 900 ℃ of sintering, is hot extruded into as fine and close copper/conductivity ceramics BaPbO
3matrix material.
5. a copper-based electric contact material, is characterized in that, comprises that accounting for gross weight is that 5%-10% particle size is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that 95%-90% grain-size is that after the copper powder of 45 μ m is mixed, preparation becomes dense material through powder metallurgy process, its density is 95-99.9%, wherein conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3form with particle is uniformly distributed in copper matrix, and copper constituent element forms successive substrates tissue.
6. the preparation method of a kind of copper-based electric contact material according to claim 5, is characterized in that, conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3, comprise the following steps: by accounting for gross weight, be that 1%-10% particle size is the conductivity ceramics Li that is less than 10 μ m
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3powder and to account for gross weight be that 99%-90% grain-size is that the copper powder of 45 μ m is mixed 12-24 hours through the mode of high-energy mechanical ball milling under argon gas atmosphere protection; wherein drum's speed of rotation is 2800r/min; ratio of grinding media to material is 10:1, through 600MPa, colds pressing, in 1-5 hours, 600-1000 ℃ hot re-pressing 30MPa of 900 ℃ of sintering hot pressing, becomes fine and close copper/conductivity ceramics Li
1.4al
0.4(Ge
1-xti
x)
1.6(PO
4)
3matrix material.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101134165A (en) * | 2006-08-28 | 2008-03-05 | 黑龙江大学 | Catalyzer catalyzing and directly decomposing nitrogen oxide and preparing method and application of the same |
CN101145450A (en) * | 2007-08-17 | 2008-03-19 | 上海中希电工合金有限公司 | Special powder copper alloy electric contact material and method for making same |
CN101564690A (en) * | 2009-06-04 | 2009-10-28 | 天津渤海职业技术学院 | Preparation method of perovskite-like La*NiO* and applications |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101134165A (en) * | 2006-08-28 | 2008-03-05 | 黑龙江大学 | Catalyzer catalyzing and directly decomposing nitrogen oxide and preparing method and application of the same |
CN101145450A (en) * | 2007-08-17 | 2008-03-19 | 上海中希电工合金有限公司 | Special powder copper alloy electric contact material and method for making same |
CN101564690A (en) * | 2009-06-04 | 2009-10-28 | 天津渤海职业技术学院 | Preparation method of perovskite-like La*NiO* and applications |
Non-Patent Citations (4)
Title |
---|
导电陶瓷Ti3SiC2颗粒表面无敏化活化的化学镀铜;赵清碧等;《稀有金属快报》;20081231;第27卷(第10期);第32-35页 * |
许少凡等.镀铜导电陶瓷颗粒Ti_3SiC_2对铜-石墨复合材料性能的影响.《金属功能材料》.2008,第15卷(第6期), |
赵清碧等.导电陶瓷Ti3SiC2颗粒表面无敏化活化的化学镀铜.《稀有金属快报》.2008,第27卷(第10期), |
镀铜导电陶瓷颗粒Ti_3SiC_2对铜-石墨复合材料性能的影响;许少凡等;《金属功能材料》;20081231;第15卷(第6期);第18-21页 * |
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