CN102625597A - One-board welding process for printed circuit board components - Google Patents
One-board welding process for printed circuit board components Download PDFInfo
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- CN102625597A CN102625597A CN2011104593411A CN201110459341A CN102625597A CN 102625597 A CN102625597 A CN 102625597A CN 2011104593411 A CN2011104593411 A CN 2011104593411A CN 201110459341 A CN201110459341 A CN 201110459341A CN 102625597 A CN102625597 A CN 102625597A
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Abstract
The invention relates to a one-board welding process for printed circuit board components. A large number of experiments conducted confirm that the welding spot temperature is mainly affected by thickness of bare boards of printed circuit boards and quality of elements of the printed circuit boards. Based on the law that when the set temperature of every temperature zone of a reflow oven is increased by a value, the obtained actual temperature curve and the original temperature curve are basically unchanged, a simulation optimization method of oven temperature setting-up parameters is summed up. When the one-board welding process for the printed circuit board components is applied to passage printed circuit board components, measured temperature curves of cold spots and hot spots of board surfaces of the passage printed circuit board components meet requirements of the lead-containing reflow welding, shapes of the welding spots are good, and electrical performance of the assembling unit before and after experiment is normal when temperature impact experiment is used for testing the quality of the welding spots. By the one-board welding process for the printed circuit board components, the rapid simulation optimization of process parameters is realized, the production efficiency of aerospace electronic products and the product percent of pass are greatly improved and the hidden quality dangers are eliminated, so that the one-board welding process for the printed circuit board components plays a very active role in guaranteeing the quality and the reliability of products.
Description
Technical field
The present invention relates to the circuit assembly technical field, particularly relate to a kind of printed board sub-assembly veneer welding technique.
Background technology
Surface mount production line (SMT line) mainly is made up of screen process press (Stencil printer), chip mounter (Pick&Place machine), reflow ovens (Reflow oven).The reflow process that in reflow ovens, realizes (Reflow soldering process) is an extremely important technical process on the SMT production line, is the key of the control SMT quality of production.The control of reflow process is determining the final mass of SMT product of production line, if the control of reflux course is unreasonable, the technology controlling and process that the aspect such as mounts of printing and components and parts of design, soldering paste of printed circuit board all will lose meaning in early stage.
Reflow process is controlled at the control that shows as reflow soldering temperature curve (Reflow profile) on the technology.The reflow soldering temperature curve is meant the time dependent curve of weld point temperature between the printed circuit board (PCB) and surface-assembled components and parts in welding process.Behind selected a kind of soldering paste, soldering paste factory all can confirm a standard circumfluence welding temperature curve according to solder alloy composition and scaling powder activation temperature.In theory, if all solder joints all experience this calibration curve on the printed board sub-assembly, welding quality will obtain best assurance so.The reflow soldering temperature curve leans on the realization that is provided with of welding condition (mainly comprising: each warm area temperature setting of body of heater, line speed, exhaust air rate etc.); If technological parameter is provided with unreasonable; The curve of the actual experience of solder joint and calibration curve take place to depart from more greatly, will cause huge hidden danger to product quality.
At present, consumer electronic product manufacturing field is " try-and-error " (trial and error pricing) to reflow soldering Parameter Optimization method.Promptly drop into a large amount of testpieces in the new product development stage, through repeatedly, multiple spot with stove thermometric soldering test, continue to optimize technological parameter, product is put into serial production before, confirm also parameters of curing.Be rationally feasible in the production of the product for civilian use that this measure is more single at product variety, production lot is bigger (like mobile phone, TV etc.).Because aerospace electron product self is intrinsic, trial and error pricing is infeasible basically.At first, the aerospace electron product category is various and the lead time short, and each printed board sub-assembly is groped test, all is being unacceptable on manufacturing schedule still on the workload; Secondly, the aerospace electron production is little in batches and price of material is expensive, drops into the rapid rising that testpieces will cause the unit cost, is difficult to bear.At present, can only rely on the experience welding parameters to carry out very rough adjustment during the welding of aerospace electron product single board, this state can't satisfy aerospace electron product high density and miniaturization growth requirement.Therefore provide a kind of under the situation that does not drop into the actual loading test part, carrying out fast to printed board sub-assembly reflow soldering curve, the simulative optimization method is very necessary.
Summary of the invention
The objective of the invention is to overcome the above-mentioned deficiency of prior art; A kind of printed board sub-assembly veneer welding technique is provided; Through studying the relation between various influencing factors and the printed board sub-assembly solder joint finite reflux welding temperature curve; Reach technological parameter between variation of grasp major influence factors and reflow soldering temperature curve change the relation between variation and the variation of reflow soldering temperature curve is set; Realization is to the quick simulative optimization of technological parameter; Improved aerospace electron production efficient and product percent of pass, reduction product rework rate and production cost, elimination hidden danger of quality greatly, guaranteed to play very positive effect aspect product quality and the reliability.
Above-mentioned purpose of the present invention is achieved through following technical scheme:
A kind of printed board sub-assembly veneer welding technique; Comprise silk-screen, welt and reflow soldering, when wherein being welded on components and parts on the printed circuit board in the solder reflow process, the temperature=furnace temperature that is provided with of upper and lower each warm area of reflow soldering furnace is provided with parameter baseline+printed circuit board adjusting parameter a+ components and parts adjusting parameter b; It is relevant with the thickness of printed circuit board bare board that wherein printed circuit board is regulated parameter a; Thickness is big more, and adjusting parameter a value is big more, and it is relevant with component quality that components and parts are regulated parameter b; Quality is big more, and adjusting parameter b value is big more.
In above-mentioned printed board sub-assembly veneer welding technique; When adopting nine warm area reflow ovens to carry out reflow soldering; It is as shown in table 1 below that the furnace temperature of upper and lower warm area is provided with the parameter baseline; The thickness relationship of printed circuit board adjusting parameter a and printed circuit board is as shown in table 2 below, and components and parts adjusting parameter b and component quality relation are as shown in table 3 below:
Table 1
| ? | First warm area | Second warm area | Three-temperature-zone | Four-temperature region | The 5th warm area | The 6th warm area | The 7th warm area | The 8th warm area | The 9th warm area |
| On | 80℃ | 100℃ | 120℃ | 140℃ | 160℃ | 180℃ | 215℃ | 235℃ | 240℃ |
| Down | 80℃ | 100℃ | 120℃ | 140℃ | 160℃ | 180℃ | 195℃ | 215℃ | 220℃ |
Table 2
Table 3
Wherein 255 ℃ in the table 3,265 ℃, 275 ℃ of three temperature are respectively the highest temperature that is provided with of nine warm area reflow ovens.
In above-mentioned printed board sub-assembly veneer welding technique, furnace temperature is provided with parameter and comprises that upper and lower each warm area of reflow soldering furnace is provided with temperature and belt speed, and said belt speed is 60mm/s.
The present invention compared with prior art has following beneficial effect:
(1) the present invention is through the relation between various influencing factors of research and the printed board sub-assembly solder joint finite reflux welding temperature curve; Reach technological parameter between variation of grasp major influence factors and reflow soldering temperature curve change the relation between variation and the variation of reflow soldering temperature curve is set; Before being implemented in the welding of printed board sub-assembly; Under the situation that does not drop into the actual loading test part; Actual conditions according to printed board thickness, material, size, regional area density of components, components and parts packing forms, track arrangement mode and solder joint ground connection; Analyze hot and cold some distribution situation of printed board sub-assembly in advance; And calculate and simulate the reflow soldering temperature curve under a certain technological parameter; And then realize printed board sub-assembly reflow soldering curve is carried out simulative optimization fast, realized under the situation that does not drop into the actual loading test part, solve to a great extent the miniaturization day by day of aerospace electron product, densification and current welding parameter very roughly, the contradiction of reflow soldering temperature curve between unreasonable;
(2) the present invention is through lot of test, confirmed that the principal element that the printed circuit board bare board influences weld point temperature is the thickness of printed circuit board, and the principal element that components and parts influence weld point temperature is the quality of components and parts; Based on after each warm area of reflow ovens be provided with temperature increase a value simultaneously; The linear rule that remains unchanged basically of actual temperature curve that obtains and former temperature curve is concluded and is summed up the simulative optimization method that furnace temperature is provided with parameter, and this method is through actual the considering of passage printed circuit board sub-assembly; The observed temperature curve of plate face cold spot and focus meets has plumbous reflow soldering requirement; Solder Joint is good, adopts temperature shock test examination quality of welding spot, and the sub-assembly electrical property is normal before and after the test.Can reach a conclusion thus: the present invention can realize the quick simulative optimization to printed board sub-assembly veneer welding condition, and has promotional value;
(3) a large amount of measured datas that obtain in the process of the test of the present invention become and support the become more meticulous objective basis of control of my the following technology of institute, for improving aerospace electron production efficient and product percent of pass, reduction product rework rate and production cost, elimination hidden danger of quality, guaranteeing that product quality and reliability play the positive effect of ten minutes;
(4) no matter the present invention is to say from improving the quality of products or say from cost and production cycle, and benefit all is very considerable, has stronger practicality.
Description of drawings
Fig. 1 is a printed circuit board layout of the present invention;
Fig. 2 is a testpieces cold spot measured curve 1 in the embodiment of the invention 5;
Fig. 3 is a testpieces cold spot measured curve 2 in the embodiment of the invention 5;
Fig. 4 is curve 1 of the present invention and curve 2 comparison diagrams;
Fig. 5 is the observed temperature curve of plate face cold spot of the present invention and focus;
Fig. 6 detects figure for BGA1020 X-ray of the present invention.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:
The present invention adopts nine warm area reflow ovens to carry out the reflow soldering of components and parts; The engineer testing design Selection totally 17 kinds of components and parts of totally 22 kinds of printed circuit boards and the different components and parts encapsulating material of different-thickness, the number of plies, area, components and parts weldering end form, component quality (size), adopt different technical parameters to weld.
Through arrangement and analysis, find following rule to printed circuit board bare board influencing factor test data:
The first, the area of printed circuit board size butt welding point Influence of Temperature is little, can ignore;
The second, the number of plies butt welding point Influence of Temperature of printed circuit board is little, can ignore;
Three, the thickness of printed circuit board is the principal element of weld point temperature influence.
Through arrangement and analysis, find following rule to components and parts influencing factor test data:
The first, the weldering end form butt welding point temperature effect of components and parts is bigger, and the components and parts of hiding weldering end such as BGA more are prone to cause the welding cold spot than the components and parts of visible weldering end;
The second, BGA device bottom centre position is the cold spot of this device weld point temperature;
Three, the quality of BGA device is the principal element that influences weld point temperature.The BGA number is the secondary cause that influences weld point temperature;
Four, in large area bare spots is not a cold spot on printed circuit board sub-assembly (containing the BGA device), and the cold spot of printed circuit board sub-assembly generally is distributed under the bigger BGA device of quality;
Five, the packing density butt welding point temperature effect of printed board sub-assembly regional area is less, can ignore;
Six, along with the progressively lifting that temperature is set, the temperature gap of bare board and BGA bottom progressively strengthens.
Through arrangement and analysis, find following rule to welding curve linear Changing Pattern test data: after each warm area of reflow ovens is provided with temperature and increases a value simultaneously, the actual temperature curve that obtains and former temperature curve is linear remains unchanged basically.
Because the different-thickness printed circuit board has the rule of " each warm area is increased certain temperature value simultaneously, and the thermometric line linearity of writing music remains unchanged basically in fact ", and components and parts have the rule of " device is main relevant with the character of device itself to the response of temperature ".Therefore can obtain following method:
When being welded on components and parts on the printed circuit board, the temperature=furnace temperature that is provided with of upper and lower each warm area of reflow soldering furnace is provided with parameter baseline+printed circuit board adjusting parameter a+ components and parts adjusting parameter b,
It is as shown in table 1 below that the furnace temperature of upper and lower warm area is provided with the parameter baseline:
Table 1
| ? | First warm area | Second warm area | Three-temperature-zone | Four-temperature region | The 5th warm area | The 6th warm area | The 7th warm area | The 8th warm area | The 9th warm area |
| On | 80℃ | 100℃ | 120℃ | 140℃ | 160℃ | 180℃ | 215℃ | 235℃ | 240℃ |
| Down | 80℃ | 100℃ | 120℃ | 140℃ | 160℃ | 180℃ | 195℃ | 215℃ | 220℃ |
The thickness relationship of printed circuit board adjusting parameter a and printed circuit board is as shown in table 2 below:
Table 2
| Thickness | 1.6mm | 1.8mm | 2.0mm | 2.2mm | 2.4mm |
| a | 0 | 2℃ | 4℃ | 7℃ | 9℃ |
Components and parts adjusting parameter b and component quality relation are as shown in table 3 below:
Table 3
Wherein 255 ℃, 265 ℃, 275 ℃ of three temperature are respectively the highest temperature that is provided with of nine warm area reflow ovens.
Furnace temperature is provided with parameter and comprises that upper and lower each warm area of reflow soldering furnace is provided with temperature and belt speed, and belt speed is 60mm/s in the embodiment of the invention.
Through concrete embodiment welding technique of the present invention is carried out detailed description below:
Embodiment 1:
1. basic condition
1.1 printed board
Aspect the printed circuit plate thickness, my institute's printed circuit board operating limit thickness is 0.8mm and 3.0mm at present.The printed circuit plate thickness that generally uses is 1.6mm, 1.8mm, 2.0mm, 2.2mm, 2.4mm.Therefore select above 7 kinds of thickness to make an experiment, research printed circuit plate thickness butt welding point Influence of Temperature.
Aspect the number of plies of printed circuit board, the printed circuit board operating limit number of plies is 2 layers and 20 layers usually.The printed circuit board number of plies is a main flow with 10 layers.Therefore in the selection of the printed circuit board number of plies, selected 2 laminates, 10 laminates and 20 laminates to make an experiment, in order to consider the contribution of printed circuit board number of plies butt welding point temperature.
Aspect the selection of printed circuit board area, the present invention investigates to the size of large-tonnage product printed circuit board, and adopting 175mm * 175mm is that the basic space of a whole page (1/4 plate) is expanded, and is spliced into a big plate by 4 basic spaces of a whole page.When engineer testing, big plate, 1/2 plate, 1/4 plate are carried out technological parameter grope, probe into printed circuit board area butt welding point Influence of Temperature.
The printed circuit board large tracts of land cover copper can butt welding point temperature exert an influence, but large tracts of land is covered copper butt welding point Influence of Temperature degree and need be tested further checking.Through statistics, double sided board does not generally carry out large tracts of land and covers the copper design, and multi-layer sheet adopts large tracts of land stratum, bus plane design more; Therefore; When the design of breadboard, 10 layers, 20 layers printed circuit board have carried out 4 layers of large tracts of land and have covered copper, and 2 layers of printed circuit board do not carry out large tracts of land and cover copper.
The packing density of printed board sub-assembly regional area also is the possible factor that influences weld point temperature.Therefore on printed circuit board is arranged, nine kinds of BGA are concentrated discharging with triplex row three row forms, the simulation existing product forms the relative concentrated area of packing density.The printed circuit board layout is seen Fig. 1.
Influencing factor through to printed circuit board is arranged, and designs 22 kinds of printed circuit boards altogether, sees table 4.
1.2 scolder and solder flux
Scolder has been selected kupper solder Sn63Pb37 for use, and solder flux is selected neutral scaling powder for use, should meet the GB9491-88 regulation.
1.3 production, testing tool and equipment
A.HELLER 1809EXLA nine warm area reflow ovens;
B. drying box
C. solder paste stirrer
D. reflow welding stove: answer among the accord with Q J3086-99 regulation of a.b.d in the 4.3.4.2 bar.
E. maintenance station or maintenance system: answer 4.3.5 bar regulation among the accord with Q J3086-99.
F. chip mounter
The g.TTrack3 temperature measurer
2. process implementing step
2.1 point for measuring temperature setting
To 2a-1,2a-2,2a-3,2m-1,2m-2,2m-3,10m-1,10m-2,10m-3,2b-1,2b-2,2b-3,10b-1,10b-2,10b-3,20b-1,20b-2,20b-3 totally 18 kinds of printed circuit board bare board mounting temperature test points.
TTrack3 provides 8 temperature test passages altogether.Printed circuit board is positive to adopt 6 thermometric passages to test, and the back side adopts 2 thermometric passages to test.Be respectively: front front end single-point point for measuring temperature (CH3), positive surface rear end single-point point for measuring temperature (CH2), large tracts of land ground connection single-point point for measuring temperature (CH5), D1 BGA belly point for measuring temperature (CH6), D2 BGA belly point for measuring temperature (CH7), D3 BGA belly point for measuring temperature (CH4), back side front end single-point point for measuring temperature (CH8), rear end, back side single-point point for measuring temperature (CH1).Wherein CH3 and CH8 are for be provided with back-to-back.
2.2 silk-screen
A. use according to process lead welding cream is arranged;
B. tin cream stirs: take out in the refrigerator and should at room temperature place 2h, manually a direction stirs that (or mixer stirs 3～5min) and can use after evenly;
C. tin cream thermometric: thermometer inserted in the tin cream after stirring measure temperature, temperature should be at 22 ± 2 ℃;
D. paste solder printing: a certain amount of tin cream is added on the web plate, and hand-held scraper applies a downward pressure to it, and scraper angle is 45 °, and scraper pressure is advisable with the tin cream scraping that satisfies on the web plate, scrapes the back demoulding.
Silk-screen check: estimate should not have bridge joint between each pad, the scolder edge should not have the limit of collapsing, the damaged phenomenon of scolder, and thickness is even.
2.3 reflow soldering
Adopt high, medium and low three kinds of temperature with fast, in, slow three kinds of belt speed are combined to form 9 kinds of furnace temperature parameter are set, the weld point temperature influencing factor of printed board bare board is groped.(furnace temperature setting is seen table 5)
Table 5 furnace temperature is provided with parameter list
2.4 test data and analysis
Through 1296 temperature curve combination interpretations, following problem is considered:
printed circuit board area is to the influence of bare board weld point temperature;
printed circuit board number of plies is to the influence of bare board weld point temperature;
The gap of
printed circuit board positive and negative weld point temperature.
Through the data compare of analysis, find following rule:
The area size butt welding point Influence of Temperature of
printed circuit board is little, can ignore;
The number of plies butt welding point Influence of Temperature of
printed circuit board is little, can ignore;
The thickness of
printed circuit board is the principal element of weld point temperature influence.
Embodiment 2:
1. basic condition
1.1 printed board
Analyze the general used thickness of printed circuit board, on the basis of original first printed circuit board, further weighing factor segmentation test is carried out in 1.8mm, 2.0mm, 2.2mm, 4 kinds of thickness printed boards of 2.4mm.
1.2 scolder and solder flux
With " the 1st embodiment "
1.3 production, testing tool and equipment
With " the 1st embodiment "
2. process implementing step
2.1 point for measuring temperature setting
To 10-1.8,10-2.0,10-2.2,10-2.4 totally 4 kinds of printed circuit board mounting temperature test points.Point for measuring temperature is provided with " the 1st embodiment ".
2.2 silk-screen
With " the 1st embodiment "
2.3 reflow soldering
With " the 1st embodiment "
2.4 test data and analysis
Measure 36 groups 288 solder joint actual welding temperature curves altogether.Calculate through data compare of analysis and linear regression, find following rule:
Under the uniform temp condition, the linear trend of influence (seeing table 6～table 14) of different-thickness printed circuit board butt welding point peak temperature.
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Table 13
Table 14
Embodiment 3:
1. basic condition
1.1 printed board
Adopt 2a-3,10m-3,10b-3,10-1.8,10-2.0,10-2.2,10-2.4 printed circuit board.
1.2 scolder and solder flux
With " the 1st embodiment "
1.3 production, testing tool and equipment
With " the 1st embodiment "
1.4 components and parts
1) kind of components and parts (weldering end form)
In the selection of components and parts kind, this institute typical package components and parts commonly used base oneself upon in seminar, choose resistor-capacitor unit, QFP packaging, QFN packaging, bga device as the test components and parts.
Resistor-capacitor unit is chosen 0603,0805,1,812 three kinds of packing forms;
QFP chooses the plastic packaging and the metal-back packaging of 100 pins, 240 pins;
QFN choose I the most frequently used 20 pin plastic devices;
BGA chooses 100ball, 484ball, 672ball, 896ball, 1020ball plastic packaging and metal-back packaging.
2) components and parts encapsulating material
The device package material is mainly selected two kinds of metal and plastic packagings, and the encapsulating material of element is selected the ceramic material that generally uses at present.
3) component quality (size)
In the selection of component quality, pay attention to selection to the bga device of hiding solder joint.
The components and parts kind is seen table 15.
2. process implementing step
2.1 point for measuring temperature setting
To 2a-3,10m-3,10b-3,10-1.8,10-2.0,10-2.2,10-2.4 totally 7 kinds of printed circuit board mounting temperature test points.
On the basis of Fig. 2 test point layout, CH1, two back side test points of CH8 are moved on to D5 BGA belly (CH1), D7 BGA belly (CH8) respectively.Other point for measuring temperature invariant positions.
2.2 components and parts are supporting
A. it is supporting to carry out components and parts by product drawing
B. check the components and parts specification, model should be consistent with design document.
C. check components and parts outward appearance not damaged, crackle, distortion, no foreign matter.
D. supporting the finishing of components and parts should be stored in the drying box, and humidity is controlled within 20%～40%.
2.3 silk-screen
With " the 1st embodiment "
2.4 paster
With " the 1st embodiment "
2.5 reflow soldering
With " the 1st embodiment "
2.6 test data and analysis
Through 504 temperature curve combination interpretations, following problem is considered:
components and parts encapsulating material butt welding point Influence of Temperature;
Quality (size) the butt welding point Influence of Temperature of
components and parts;
Point for measuring temperature data and bare board relevant position point for measuring temperature, other position point for measuring temperature data through to BGA device bottom centre compare analysis, find following rule:
The weldering end form butt welding point temperature effect of
components and parts is bigger, and the components and parts of hiding weldering end such as BGA more are prone to cause the welding cold spot than the components and parts of visible weldering end;
The quality of
BGA device is the principal element that influences weld point temperature.The BGA number is the secondary cause that influences weld point temperature;
The packing density butt welding point temperature effect of
printed board sub-assembly regional area is less, can ignore.
Embodiment 4:
1. basic condition
1.1 printed board
(10-1.6 10 layers of 1.6mm are thick), 2 kinds of printed circuit boards of 10-2.4 (10 layers of 2.4mm are thick)
1.2 scolder and solder flux
With " the 1st embodiment "
1.3 production, testing tool and equipment
With " the 1st embodiment "
1.4 components and parts
With " the 3rd embodiment "
2. process implementing step
2.1 point for measuring temperature setting
Point for measuring temperature is provided with " the 3rd embodiment ".
2.2 components and parts are supporting
With " the 3rd embodiment "
2.3 silk-screen
With " the 1st embodiment "
2.4 reflow soldering
Furnace temperature shown in the employing table 16 is provided with parameter and makes an experiment.
Table 16 furnace temperature is provided with parameter list
2.5 paster
With " the 3rd embodiment "
2.6 test data and analysis
Adopt the TTrack3 temperature measurer that each plate is tested.Measure 8 groups 64 solder joint actual welding temperature curves altogether, labor device quality butt welding point temperature effect weight.
Through the data compare of analysis, find following rule:
Along with the progressively lifting that temperature is set, the temperature gap of bare board and BGA bottom progressively strengthens
.
Table 17 896 plastic packaging BGA device temperatures response list
Table 18 896 metallic packaging BGA device temperatures response list
Table 19 1020 metallic packaging BGA device temperatures response list
Embodiment 5:
1. basic condition
1.1 printed board
10-2.4 bare board
1.2 scolder and solder flux
With " the 1st embodiment "
1.3 production, testing tool and equipment
With " the 1st embodiment "
2. process implementing step
2.1 point for measuring temperature setting
Point for measuring temperature is provided with " the 3rd embodiment ".
2.2 silk-screen
With " the 1st embodiment "
2.3 reflow soldering
Adopt 2 kinds of furnace temperature that parameter is set and make an experiment, like table 20, shown in 21.
Table 20
Table 21
2.4 test data and analysis
Adopt " furnace temperature is provided with 1 " that the 10-2.4 bare board is made an experiment, obtain testpieces cold spot measured curve 1, as shown in Figure 2.
On the basis of " furnace temperature is provided with 1 ", each warm area is provided with temperature increases by 35 ℃ simultaneously, forms " furnace temperature is provided with 2 ".Adopt " furnace temperature is provided with 2 " that the 10-2.4 bare board is made an experiment, obtain testpieces cold spot measured curve 2, as shown in Figure 3.
Through above-mentioned two curves of contrast, find that curve is linear to remain unchanged basically, be illustrated in figure 4 as the comparison diagram of curve 1 and curve 2.
Embodiment thus, find important rule: after each warm area of reflow ovens is provided with temperature and increases a value simultaneously, the actual temperature curve that obtains and former temperature curve is linear remains unchanged basically.
Embodiment 6:
1. basic condition
1.1 printed board
10-1.6 bare board
1.2 scolder and solder flux
With " the 1st embodiment "
1.3 production, testing tool and equipment
With " the 1st embodiment "
2. process implementing step
2.1 point for measuring temperature setting
Point for measuring temperature is provided with " the 3rd embodiment ".
2.2 silk-screen
With " the 1st embodiment "
2.3 reflow soldering
Adopt " furnace temperature is provided with 3 " to make an experiment, concrete parameter is seen table 22.
Table 22
2.4 test data and analysis
The observed temperature curve of " furnace temperature is provided with 3 " meets has plumbous reflow soldering requirement.See table 23.
Table 23
Embodiment has confirmed that furnace temperature is provided with baseline thus.
Embodiment 7
1. basic condition
1.1 printed board
10-1.6 bare board
1.2 scolder and solder flux
With " the 1st embodiment "
1.3 production, testing tool and equipment
With " the 1st embodiment "
1.4 components and parts
With " the 3rd embodiment "
2. process implementing step
2.1 point for measuring temperature setting
Point for measuring temperature is provided with " the 3rd embodiment ".
2.2 components and parts are supporting
With " the 3rd embodiment "
2.3 silk-screen
With " the 1st embodiment "
2.4 reflow soldering
With " the 6th embodiment "
2.5 test data and analysis
(1) is baseline with " furnace temperature is provided with 3 ", gropes the printed circuit board furnace temperature and regulate parameter.See table 24.
Table 24
| Thickness | 1.6mm | 1.8mm | 2.0mm | 2.2mm | 2.4mm |
| a | 0 | 2℃ | 4℃ | 7℃ | 9℃ |
(2) be baseline with " furnace temperature is provided with 3 ", grope the components and parts furnace temperature and regulate parameter.See table 25.
Table 25
Embodiment 8
1. basic condition
1.1 printed board
2 of passage printed circuit boards
1.2 scolder and solder flux
With " the 1st embodiment "
1.3 production, testing tool and equipment
With " the 1st embodiment "
1.4 components and parts
Main components and parts are seen table 26:
Table 26
| Sequence number | Model specification | The unleaded state of packing forms/have | Manufacturer | Quantity | Remarks | |
| 1 | MAX824SEUK | 5SOT23-5 | |
2 | ? | |
| 2 | | TQFP100 | IDT | 2 | ? | |
| 3 | | SOP8 | MAXIM | 6 | ? | |
| 4 | SST39VF1601-70-4I- | TSOP48 | SST | 2 | ? | |
| 5 | | TSSOP14 | TI | 2 | ? | |
| 6 | AD9288BST-80 | | AD | 6 | ? | |
| 7 | | TSSOP16 | MAXIM | 2 | ? | |
| 8 | ICS525- | SSOP28 | ICST | 2 | ? | |
| 9 | | FBGA672 | ALTERA | 2 | ? | |
| 10 | | BGA272 | TI | 2 | ? | |
| 11 | MAX6025AEUR-T | 3SOT23-3 | |
2 | ? | |
| 12 | | 10UMAX | MAXIM | 2 | ? | |
| 13 | MAX682EESA | SOP8 | MAXIM | 4 | ? | |
| 14 | MIC5245-3.3BM5 | SOT-23-5 | MICREL | 20 | ? | |
| 15 | ADSP-TS101SAB1-100 | 625BALLBGA | AD | 8 | ? | |
| 16 | XC4VLX80-10FF1148C | 1148FCBGA | XILINX | 1 | ? | |
| 17 | MT48LC32M16AZP-75IT | TSOP54 | MT | 8 | ? | |
| 18 | SST39VF1681-70-4I- | TSOP48 | SST | 2 | ? | |
| 19 | XCF32PVO48C | TSOP48 | XILINX | 1 | ? | |
| 20 | ICS601M-02I | SOIC-16 | ICST | 1 | ? | |
| 21 | IDT74FCT3807APYI | SOIC20 | IDT | 3 | ? | |
| 22 | TPS54616PWP | HTSSOP28 | TI | 1 | ? | |
| 23 | TPS70402PWP | HTSSOP24 | TI | 1 | ? | |
| 24 | | LCCC20 | TI | 2 | ? | |
| 25 | AD8041AR | SOIC8 | AD | 1 | ? |
2. process implementing step
2.1 point for measuring temperature setting
Point for measuring temperature is provided with " the 3rd embodiment ".
2.2 components and parts are supporting
With " the 3rd embodiment "
2.3 silk-screen
With " the 1st embodiment "
2.4 reflow soldering
According to printed board sub-assembly veneer welding condition simulative optimization method the furnace temperature parameter is set.It is 0 ℃ that printed circuit board is regulated parameter a, and it is 12 ℃ that components and parts are regulated parameter b.Therefore obtaining actual furnace temperature is provided with parameter and sees table 27.
Table 27
2.5 test data and analysis
2.5.1 observed temperature checking
Be provided with by above furnace temperature that parameter is welded the plate face cold spot that obtained to breadboard and the observed temperature curve of focus is seen shown in Figure 5; It is analyzed discovery; The major parameter of cold spot and focus all in critical field, proves that the simulative optimization method of being taked is correctly feasible.
As shown in Figure 5, the observed temperature curve of plate face cold spot and focus meets has plumbous reflow soldering requirement.See table 28.
Table 28
2.5.2 solder joint Non-Destructive Testing
(1) furnace temperature that adopts printed board sub-assembly veneer welding condition simulative optimization method to obtain is provided with parameter and pastes the main components and parts that are welded on the printed circuit board and carried out the X-RAY detection, testing result draws, the BGA soldered ball evenly, no bubble, no bridge joint.Other device solder joints do not have bubble, bridging phenomenon.Part test part X-RAY detection case is seen shown in Figure 6;
(2) the BGA device has correctly been carried out the concealed solder joint inspection of ERSA SPACE, testing result shows that four side weld point printing opacities are good, and the solder joint sedimentation is consistent.
2.5.3 environmental test and electric performance test
Passage printed board sub-assembly is carried out temperature shock test, be used for certification test checking part and can satisfy the environmental test requirement.Test is undertaken by product screening condition on the bullet.Experimental condition is following:
High temperature :+75 ± 2 ℃
Low temperature :-55 ± 3 ℃
Temperature change rate :≤5min
The temperature spot time of staying: 30min
Cycle-index: 10 times
Carry out the circuit function test before and after the environmental test respectively, the circuit board function is normal, no change before and after the environmental test.
3. conclusion
The present invention is through lot of test, confirmed that the principal element that the printed circuit board bare board influences weld point temperature is the thickness of printed circuit board.The principal element that components and parts influence weld point temperature is the quality of components and parts; Based on after each warm area of reflow ovens is provided with temperature increases a value simultaneously, the linear rule that remains unchanged basically of actual temperature curve that obtains and former temperature curve is concluded the simulative optimization method that furnace temperature is provided with parameter that sums up.This method is through actual the considering of passage printed circuit board sub-assembly, and the observed temperature curve of plate face cold spot and focus meets has plumbous reflow soldering requirement, and Solder Joint is good, adopts temperature shock test examination quality of welding spot, and the sub-assembly electrical property is normal before and after the test.Can reach a conclusion thus: the present invention can realize the quick simulative optimization to printed board sub-assembly veneer welding condition.And has a promotional value.
The above; Be merely the best embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
The content of not doing to describe in detail in the specification of the present invention belongs to this area professional and technical personnel's known technology.
Claims (3)
1. printed board sub-assembly veneer welding technique; It is characterized in that: comprise silk-screen, welt and reflow soldering, when wherein being welded on components and parts on the printed circuit board in the solder reflow process, the temperature=furnace temperature that is provided with of upper and lower each warm area of reflow soldering furnace is provided with parameter baseline+printed circuit board adjusting parameter a+ components and parts adjusting parameter b; It is relevant with the thickness of printed circuit board bare board that wherein printed circuit board is regulated parameter a; Thickness is big more, and adjusting parameter a value is big more, and it is relevant with component quality that components and parts are regulated parameter b; Quality is big more, and adjusting parameter b value is big more.
2. a kind of printed board sub-assembly veneer welding technique according to claim 1; It is characterized in that: when adopting nine warm area reflow ovens to carry out reflow soldering; It is as shown in table 1 below that the furnace temperature of upper and lower warm area is provided with the parameter baseline; The thickness relationship of printed circuit board adjusting parameter a and printed circuit board is as shown in table 2 below, and components and parts adjusting parameter b and component quality relation are as shown in table 3 below:
Table 1
Table 2
Table 3
Wherein 255 ℃ in the table 3,265 ℃, 275 ℃ of three temperature are respectively the highest temperature that is provided with of nine warm area reflow ovens.
3. a kind of printed board sub-assembly veneer welding technique according to claim 1 and 2 is characterized in that: said furnace temperature is provided with parameter and comprises that upper and lower each warm area of reflow soldering furnace is provided with temperature and belt speed, and said belt speed is 60mm/s.
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