CN102612277A - Method of silver paste grouting process for high-precision circuit board - Google Patents
Method of silver paste grouting process for high-precision circuit board Download PDFInfo
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- CN102612277A CN102612277A CN2012100879147A CN201210087914A CN102612277A CN 102612277 A CN102612277 A CN 102612277A CN 2012100879147 A CN2012100879147 A CN 2012100879147A CN 201210087914 A CN201210087914 A CN 201210087914A CN 102612277 A CN102612277 A CN 102612277A
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- grout
- wiring board
- circuit board
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- silver slurry
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- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a method of silver paste grouting process for high-precision circuit boards. The method comprises the following steps: polishing the green oil plane of the circuit board downwards so as to smoothen the plane of the circuit board; packaging and fixing a grouting tool on the table plane of a silk-screen machine; aligning the screen and regulating the screen distance so as to align a pattern adopted by a screen board with a pattern desired by a produced machine type; regulating angles of a scraper and a turning knife of the silk-screen machine; further regulating the silk-screen pressure and regulating the viscosity of the silver paste; then grouting from the green oil plane to the back plane; placing the grouting circuit board statically for more than 4H; putting the grouting circuit board in an oven of 50-150 DEG C to be baked in three sections; and finally cooling and taking out of the oven so as to obtain the high-precision circuit board. The circuit board produced by the method is not only small in size and thickness, but also saves energy and electricity, has excellent stability, good conductivity, strong smoothness and reliability and excellent printing ability, bending ability and extremely strong adhesion; and the method has the characteristics of being low in temperature, rapid in curing production period, high in cost performance, low in cost, free of the three waste pollution and the like.
Description
Technical field
The present invention relates to wiring board grout method, especially relate to high-accuracy wiring board silver slurry grout process.
Background technology
As everyone knows, wiring board is to realize the interconnective important electronic component of electronic devices and components, is the supporter of electronic devices and components.It mainly is divided into single face wiring board, double-sided wiring board and multiaspect wiring board.The guide hole of crossing of double-sided wiring board mainly adopts heavy copper to electroplate (PTH) grout technology at present; The guide hole of crossing of single face wiring board mainly adopts carbon oil grout technology; But they have following point in grout production: the one, and the copper slurry is electroplated in grout and the carbon oil grout process can discharge a large amount of waste water; Increase the waste water treatment difficulty, caused environmental pollution, improved production cost; The 2nd, wiring board is crossed guide hole, and not only resistance value is excessive, and conductivity is not strong, and not power saving is not energy-conservation, and volume is big, and thickness is big, and inapplicable ultrathin electric equipment products uses; The 3rd, the grout technological operation is not quite convenient, and the route hole needs the specialized hand welding; Be that copper slurry is electroplated grout technology and bubbled easily and separate again, the carbon oil grout explained hereafter cycle is long.
Summary of the invention
To the existing problem of wiring board grout process in the above-mentioned prior art; The invention provides a kind of wiring board not only stability, good, the slickness of conductibility and good reliability; And with short production cycle, grout is easy to operate, production cost is low, the high-accuracy wiring board of three-waste free pollution silver slurry grout process again.
High-accuracy wiring board silver slurry grout process according to the invention is: the wiring board green oil is faced down polish, make wiring board plate face smooth, the encapsulation of grout tool is fixed on the table top of screen printer again; Carry out then net, adjustment net distance makes the used pattern of web plate aim at the required pattern of the machine of producing; The scraper of adjustment screen printer and the angle of replying cutter; Adjust silk-screen air pressure again, in the silver slurry, add an amount of profit of opening then, adjust silver-colored slurry viscosity; The back of the body carries out grout with the silver slurry from the green oil face to face again; Then with more than the static 4H of grout wiring board, the grout wiring board is placed in 50-150 ℃ the baking box divides three sections bakings again, it is high-accuracy silver slurry grout wiring board that cooling is come out of the stove.
High-accuracy wiring board silver slurry grout process according to the invention is compared the characteristics that have with existing line plate grout technology and is:
1, the wiring board of the present invention's production has characteristics such as volume is little, thickness is little, energy saving, and the ultrathin electronics remote controller that can satisfy electric equipment products uses,
2, the wiring board of the present invention's production has characteristics such as low temperature, quick curing, has good printing, conductivity, bending property and extremely strong paying to put forth effort, and cost performance is high,
3, because silver slurry grout product contains the controllable rheology thing, thereby have good through-hole rate, and do not have pin hole and crack; The silver slurry has outstanding adhesion to copper metal and phenolic aldehyde sheet material, and the silver slurry has distinctive inorganic matter and resin to fill, and its reliability, conductibility can be guaranteed, and the silver slurry has good circulation under transformation,
4, the method for the invention is with short production cycle, cost is low, three-waste free pollution, and having solved the lower voltage components hole can not be common, distance between borehole is big, VTRCDFDDTe game machine electronic instrument can not be welded in the hole,
5, wiring board via hole Dao energising Zu ≦ 3 Europe mother of the present invention's production reaches energy-saving and emission-reduction 40%, saves production cost 30%; Make SMT simplify, be more suitable for the printed board environment-friendly type mode of production with the technological process of two-sided hole metallization printed board, more competitive on price.
High-accuracy silver slurry grout process main contents according to the invention:
1., used silver slurry is conductive silver paste, can corresponding line plate aperture warp and highdensity product use broad knife, stuffy during seal, roasting plate is divided into 3 sections from one section, temperature from high to low, the time from length to weak point,
2., use silver slurry grout technology to replace the carbon oil grout technology of the heavy copper electroplating technology and the patrilineal line of descent with only one son in each generation system single sided board of traditional double panel; When can reducing production costs, make and reduce discharge of wastewater 40% in the production process, solve the excessive problem of via hole conducting resistance simultaneously,
3., silver slurry area can significantly dwindle through hole behind the mistake guide hole grout; Resistance is that 35 Ω/1 hole has superior volume production operation property; Can form stable grout shape; Cross-line hole good stability, cost are low, manual welding leveling difficulty needs with special equipment VTR CTV DTV CD, and plated-through hole is trusted reliably, plated-through hole and component hole can be shared
4., silver slurry grout plate is starched silver and is connected, make the two sides circuit be able to connect, thereby replaces a kind of new technology of traditional P TH; Conduct electricity very well, cost is low, than using PTH technology cost to reduce 30%-50%; And the more environmental protection of its manufacture craft, the toxic gas and the harmful substance that more do not resemble PTH, PP technology produce, and meet the requirement of ROHS green product; Has good market development potential
5., this technology is through testting many times, using thick frictioning to make the silver slurry be hand-hole in web plate time of staying length at last; Use different time again, different temperatures divides the baked dried replacement of San Duan Yi baked dried method, guarantees incremental the drying of silver slurry, guarantees not crack, the effect of quick-fried slurry not, and success rate reaches more than 97%,
6., silver slurry grout product contains the controllable rheology thing, have good through-hole rate, and do not have pin hole and crack; The silver slurry has outstanding adhesion to copper metal and phenolic aldehyde sheet material,
7., silver slurry has distinctive inorganic matter and resin to fill, its reliability, conductibility can be guaranteed, the silver slurry has good circulation under transformation, be more suitable in the dense wire plate so silver is starched grout.
Embodiment
High-accuracy silver slurry grout process step according to the invention is:
1, nog plate: the wiring board green oil that last process has been carried out green oil faces down, and wiring board is crossed sander, guarantees that the plate face is smooth, guarantees quality,
2, dress net: the grout tool is fixed on joint sealing glue on the table top of screen printer, carries out net with the identical web plate of machine then, net distance is adjusted into 5 ± 1 lattice, carries out tentatively net again, lets the required pattern of the used pattern aligning of the web plate machine of producing,
3, accent machine: the scraper of at first adjusting screen printer is respectively (10 ± 5 degree) with the angle of replying cutter, (35 ± 5 degree) adjusted silk-screen air pressure then, be respectively (0.7 ± 0.1kg), (0.5 ± 0.1kg),
4, size mixing: in silver slurry (said silver slurry is existing conductive silver paste), add an amount of profit (diluent of opening; Be meant the addition that can make the silver slurry keep following viscosity in right amount), stirred the viscosity of adjustment silver slurry 5-10 minute; Using viscosimeter to measure silver-colored slurry viscosity is 35 ± 5 (PaS); Again silver was starched static 20-30 minute, prevented bubble
5, test manufacture: test-manufacture after accomplishing above work, carry out grout from the green oil face and carry on the back, see that from the face back of the body 360 ° of orifice rings have oil not have hangover and solid phenomenon for best, test-manufacture and deliver quality portion after qualified and do FAA first article assurance, then produce in batches to face,
6, static: will be the wiring board of silver slurry grout carry out staticly, prevent silver slurry cracking at high temperature, be more than the 4H quiescent time, one of every silk-screen, last 1PNL comes timing,
7, roasting plate: after the roasting plate of vertical baking box divides three sections when low temperature is grown, progressively to toast to high temperature, short time, freely cool off outlet.Its baking process is following:
First section: be warming up to 50 ℃, be incubated 90 minutes,
Second section: be warming up to 120 ℃ again, be incubated 30 minutes,
The 3rd section: be warming up to 150 ℃ again, be incubated 40 minutes,
7, come out of the stove: open baking box, natural cooling or air cooling are come out of the stove.
Claims (1)
1. high-accuracy wiring board silver slurry grout process is characterized in that: the wiring board green oil is faced down polish, make wiring board plate face smooth; Again the encapsulation of grout tool is fixed on the table top of screen printer, carries out then, adjustment net distance net; Make the used pattern of web plate aim at the required pattern of the machine of producing, the scraper of adjustment screen printer and the angle of replying cutter are adjusted silk-screen air pressure again; In the silver slurry, add an amount of profit of opening then; Adjust silver-colored slurry viscosity, the back of the body carries out grout with the silver slurry from the green oil face to face again, then with more than the static 4H of grout wiring board; The grout wiring board is placed on again and divides three sections bakings in 50-150 ℃ the baking box, it is high-accuracy silver slurry grout wiring board that cooling is come out of the stove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100879147A CN102612277A (en) | 2012-03-30 | 2012-03-30 | Method of silver paste grouting process for high-precision circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100879147A CN102612277A (en) | 2012-03-30 | 2012-03-30 | Method of silver paste grouting process for high-precision circuit board |
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| Publication Number | Publication Date |
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| CN102612277A true CN102612277A (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012100879147A Pending CN102612277A (en) | 2012-03-30 | 2012-03-30 | Method of silver paste grouting process for high-precision circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430926A (en) * | 2015-12-03 | 2016-03-23 | 建业科技电子（惠州）有限公司 | Fabrication method of copper paste through hole PCB |
| CN105916306A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | PCB jack panel segmented panel baking method |
| CN110012617A (en) * | 2019-04-03 | 2019-07-12 | 东莞塘厦裕华电路板有限公司 | A kind of via-hole of circuit board production method |
| CN112672531A (en) * | 2020-11-30 | 2021-04-16 | 江门荣信电路板有限公司 | Double-sided processing method of PCB single-sided substrate |
Citations (2)
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| KR20000054626A (en) * | 2000-03-15 | 2000-09-05 | 이재국 | Method for manufacturing through hole of printed circuit board |
| CN101827502A (en) * | 2009-03-06 | 2010-09-08 | 佛山市顺德区锐新科屏蔽材料有限公司 | Environment-friendly preparation method of multilayer circuit board and special device thereof |
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2012
- 2012-03-30 CN CN2012100879147A patent/CN102612277A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000054626A (en) * | 2000-03-15 | 2000-09-05 | 이재국 | Method for manufacturing through hole of printed circuit board |
| CN101827502A (en) * | 2009-03-06 | 2010-09-08 | 佛山市顺德区锐新科屏蔽材料有限公司 | Environment-friendly preparation method of multilayer circuit board and special device thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430926A (en) * | 2015-12-03 | 2016-03-23 | 建业科技电子（惠州）有限公司 | Fabrication method of copper paste through hole PCB |
| CN105916306A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | PCB jack panel segmented panel baking method |
| CN110012617A (en) * | 2019-04-03 | 2019-07-12 | 东莞塘厦裕华电路板有限公司 | A kind of via-hole of circuit board production method |
| CN112672531A (en) * | 2020-11-30 | 2021-04-16 | 江门荣信电路板有限公司 | Double-sided processing method of PCB single-sided substrate |
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Application publication date: 20120725 |