CN102610549A - Substrate processing apparatus and substrate processing method - Google Patents
Substrate processing apparatus and substrate processing method Download PDFInfo
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- CN102610549A CN102610549A CN2011102944678A CN201110294467A CN102610549A CN 102610549 A CN102610549 A CN 102610549A CN 2011102944678 A CN2011102944678 A CN 2011102944678A CN 201110294467 A CN201110294467 A CN 201110294467A CN 102610549 A CN102610549 A CN 102610549A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a substrate processing apparatus and a substrate processing method, wherein a substrate is transported while being heated. When the front end surface of a substrate (9) passes the upstream end portion of a high-temperature heating plate (11), the height of the front end surface of the substrate (9) is switched to be above the transporting position (lowering position), namely the above position. Then the substrate (9) is transported at the transporting position. When the rear end surface of the substrate (9) passes the downstream end portion of the high-temperature heating plate (11), the height of the rear end surface of the substrate (9) is switched to be at an elevating position. As a result, the front end surface and the rear end surface of the substrate (9) are hard to be influenced by the heat of the high-temperature heating plate (11), so that the heat influence of the high-temperature heating plate (11) on the front end surface and the rear end surface of the substrate (9) can be avoided. Therefore, the heat uniformity of the substrate (9) is improved.
Description
Technical field
The present invention relates to substrate board treatment and substrate processing method using same that one side carrying substrate heats this substrate on one side.
Background technology
At liquid crystal indicator with glass substrate, organic EL (Electro Luminescence: electroluminescence) substrate for display, semiconductor wafer, PDP (Plasma Display Panel: in the manufacturing process of the substrate of plasma display panel) using with precision electronic devices such as substrates with substrate, used for solar batteries substrate, Electronic Paper with flexible base, board, base board for optical mask, color filter base plate, record disc, substrate is carried out suitable heat treated with glass substrate, film liquid crystal.For example, in photo-mask process, after applying liquid against corrosion on the surface of substrate, substrate is carried out heat treated for the close property that improves substrate surface and liquid against corrosion to substrate.
For example, the existing substrate board treatment that in such heat treated, uses is disclosed in patent documentation 1.
Patent documentation 1: TOHKEMY 2008-16543 communique
In the 0066-0093 section of patent documentation 1, put down in writing a kind of substrate board treatment, this substrate board treatment has: a plurality of plates have heater; Carrying mechanism is along the upper surface carrying substrate of this plate.In this substrate board treatment, along the upper surface carrying substrate of a plurality of plates and be used to substrate heated from the heat of plate.
Yet; In the substrate board treatment that carrying substrate heats this substrate on one side so on one side; Than other position of substrate, be heated more easily near the leading section of substrate (end in carrying direction downstream) and near the rearward end (end of carrying direction upstream side).This is because not only be heated from the lower surface of substrate near the leading section of substrate and near the rearward end, and be heated because of the upstream side of substrate and the air that was heated in downstream.Therefore, on the plate of steady temperature, if with the constant speed carrying substrate, then near near the leading section of substrate temperature and that rearward end is is compared and might be uprised with substrate center portion.
In order to suppress such non-uniform temperature, near near the preferred heat that leading section is and rearward end is that puts on substrate that reduces.Yet,, be difficult to temporarily reduce when only passing through near the leading section of substrate and near the rearward end temperature of plate owing in the heating cooling of plate self, need the response of height.
Summary of the invention
The present invention proposes in view of such problem, and its purpose is, a kind of technology that in substrate board treatment that one side carrying substrate heats this substrate and substrate processing method using same, improves the thermal uniformity of substrate on one side is provided.
In order to address the above problem, the application's technical scheme 1 is a kind of substrate board treatment, said substrate is heated side one side carrying substrate one side downstream from upstream side, it is characterized in that having: the heating part, substrate is heated; Carrying mechanism; The carrying substrate along said heating part; Said carrying mechanism has switch unit; This switch unit switches the distance between said substrate and the said heating part at least in first distance with between two stages than the big second distance of said first distance, during through the regional upstream-side-end of the predetermined heating of said heating part, said switch unit switches to said second distance with the distance between said substrate and the said heating part at the leading section of said substrate.
The application's technical scheme 2 is on the basis of the substrate board treatment of technical scheme 1 record; It is characterized in that said carrying mechanism is the roller carrying mechanism, and has: the carrying roller; Distance between said substrate and said heating part be first apart from the time, said substrate is applied actuating force; Up-down rollers; Carrying direction to said substrate is rotated; And can move along above-below direction, said switch unit moves up and down through making said up-down rollers, and the distance between said substrate and the said heating part is switched to said second distance from said first distance.
The application's technical scheme 3 is on the basis of the substrate board treatment of technical scheme 2 records; It is characterized in that; After the leading section from said substrate had passed through official hour with said second distance through said up-down rollers, said switch unit switched the distance between said substrate and the said heating part.
The application's technical scheme 4 is on the basis of the substrate board treatment of technical scheme 1 record; It is characterized in that; When end of downstream side through said heating region of the rearward end of said substrate, said switch unit also switches to said second distance with the distance between said substrate and the said heating part.
The application's technical scheme 5 is on the basis of the substrate board treatment of technical scheme 4 records; It is characterized in that; When the rearward end of said substrate has arrived ad-hoc location; Said switch unit switches to said second distance with the distance between said substrate and the said heating part from said first distance, and this ad-hoc location is meant, is positioned at upstream side and the position that has the distance of regulation with the downstream side end of said heating region of the downstream side end of said heating region.
On the basis of technical scheme 6 substrate board treatment of each record in technical scheme 1～5 of the application, it is characterized in that said heating part comprises: flat heat plate; Flat low-temperature heat plate is configured in the downstream of said heat plate, and the temperature of this low-temperature heat plate is lower than the temperature of said heat plate, and said heating region is the zone of said heat plate.
The application's the 7th technical scheme is a kind of substrate processing method using same; On one side the distance between substrate and the heating part is switched between two stages of first distance and the second distance bigger than said first distance at least; On one side along the heating part from upstream side side carrying substrate downstream; Thus substrate is heated, it is characterized in that, comprising: first switching process; When upstream-side-end through the predetermined heating zone of said heating part of the leading section of said substrate, the distance between said substrate and the said heating part is switched to said second distance.
The application's technical scheme 8 is on the basis of the substrate processing method using same that technical scheme 7 is put down in writing; It is characterized in that; Have: second switching process; From having switched through said first switching process after distance between said substrate and the said heating part passed through official hour, the distance between said substrate and the said heating part is switched to said first distance from said second distance.
The application's technical scheme 9 is on the basis of the substrate processing method using same that technical scheme 7 is put down in writing; It is characterized in that; Also comprise: the 3rd switching process when the rearward end of said substrate has arrived ad-hoc location, switches to said second distance with the distance between said substrate and the said heating part; This ad-hoc location is meant, is positioned at upstream side and the position that has the distance of regulation with the downstream side end of said heating region of the downstream side end of said heating region.
The application's technical scheme 10 is on the basis of the substrate processing method using same that technical scheme 9 is put down in writing; It is characterized in that; Have: the 4th switching process; When the rearward end of said substrate has been passed through the end of downstream side of said heating region, the distance between said substrate and the said heating part is switched to said first distance from said second distance.
On the basis of technical scheme 11 substrate processing method using same of each record in technical scheme 7～10 of the application, it is characterized in that said heating part comprises: flat heat plate; Flat low-temperature heat plate is configured in the downstream of said heat plate, and the temperature of this low-temperature heat plate is lower than the temperature of said heat plate, and said heating region is the zone of said heat plate.
If adopt technical scheme 1～technical scheme 11 of the application, then can be when carrying substrate is on one side to this this substrate heating on one side, improve thermal uniformity.
Especially,,, and make the leading section rising of substrate, can reduce influence from the heat of heating part with simple method then through utilizing roller to come carrying substrate if adopt technical scheme 2.
Especially, if adopt technical scheme 3 and technical scheme 8, then also can reduce heat from the heating part near the influence the leading section.
Especially, if adopt technical scheme 4 and technical scheme 9, then also can reduce from the influence of the heat of heating part to the rearward end of substrate.
Especially, if adopt technical scheme 5 and technical scheme 10, then also can reduce heat from the heating part near the influence the rearward end.
Especially, if adopt technical scheme 6 and technical scheme 11, then can carry out uniform heating to whole base plate.
Description of drawings
Fig. 1 is the stereogram of substrate board treatment.
Fig. 2 is the vertical view of substrate board treatment.
Fig. 3 is the partial side view from the being seen substrate board treatment of A direction of Fig. 2.
Fig. 4 is the partial sectional view from the being seen substrate board treatment of B direction of Fig. 2.
Fig. 5 is the flow chart of flow process of the processing substrate of expression substrate leading section.
Fig. 6 is the sketch map of the action of explanation substrate board treatment.
Fig. 7 is the sketch map of the action of explanation substrate board treatment.
Fig. 8 is the sketch map of the action of explanation substrate board treatment.
Fig. 9 is the sketch map of the action of explanation substrate board treatment.
Figure 10 is the flow chart of flow process of the processing substrate of expression substrate rearward end.
Figure 11 is the sketch map of the action of explanation substrate board treatment.
Figure 12 is the sketch map of the action of explanation substrate board treatment.
Figure 13 A, Figure 13 B are the figure of the relation between expression substrate surface temperature and the substrate position.
Description of reference numerals
1 substrate board treatment
9 substrates
10 heating plates
11 heat plates
12 low-temperature heat plates
15 side plates
20 backing rolls
21 up-down rollers
22 carrying rollers
23 move into roller
30 driving mechanisms
Motor about in the of 31
32 CD-ROM drive motors
50 control parts
Roll shaft about in the of 211
221 carrying roll shafts
222 carrying roller gears
Motor drive shaft about in the of 311
312 cams
313 flanges
322 intermediate calender rolls
325 rotating bands
X0, X1 position
T0, T1, T2 substrate surface temperature
Embodiment
Below, with reference to accompanying drawing execution mode of the present invention is described.In addition, the direction with carrying substrate 9 is called " carrying direction " below, will be called " Width " with the vertical horizontal direction of carrying direction.
The structure of substrate board treatment < 1. about >
Fig. 1 is the stereogram of the substrate board treatment 1 of first execution mode of the present invention.In addition, Fig. 2 is the vertical view of this substrate board treatment 1.This substrate board treatment 1 is that the upper surface of the glass substrate 9 (following only be called " substrate 9 ") at the rectangle of selectively liquid crystal indicator being used carries out in the etched photo-mask process, is used for the substrate 9 behind the coating resist is carried out the device of heat treated.Substrate board treatment 1 is side carrying substrate 9 and substrate 9 heated downstream along the carrying direction of regulation from upstream side.
Like Fig. 1 and shown in Figure 2, the carrying direction along substrate in substrate board treatment 1 is arranged with many heating plates 10.Heating plate 10 further is used as heat plate 11 and low-temperature heat plate 12 by adjustment, and the structure of this heat plate 11 and low-temperature heat plate 12 is identical, only is that design temperature is different.Among Fig. 1,, only described two heating plates, but that kind in fact as shown in Figure 2 comprises a heat plate and two low-temperature heat plates for the ease of diagram.
These heating plates 10 all form the tabular of rectangle long on Width, and fixing by side plate 15.In the inside of each heating plate 11,12, not shown laminal heater is embedded in the inside of each heating plate.If to the heater energising, then the heating because of heater is risen the temperature of each heating plate 10.The substrate 9 that is handled upside down along the upper surface of each heating plate 10 receives from the radiant heat of the upper surface of each heating plate 10 and advection heat and is heated.
The following effect of heat plate 11 performances: substrate 9 is heated, the temperature of substrate 9 is risen near the temperature as target apace.The temperature of the upper surface of heat plate 11 is set at the high temperature of temperature that likens to the substrate 9 of target.For example, the temperature with the upper surface of heat plate 11 is set at centigrade 1.5～3 times Celsius temperature as the substrate 9 of target.
Two low-temperature heat plates 12 are configured in the downstream of the carrying direction of heat plate 11.The following effect of low-temperature heat plate 12 performance: substrate 9 is heated, and with the temperature maintenance of substrate 9 in temperature as target.The temperature of low-temperature heat plate 12 upper surfaces is set at the low temperature of temperature than the upper surface of heat plate 11.For example, the temperature with the upper surface of low-temperature heat plate 12 is set at centigrade 1～1.3 times Celsius temperature as the substrate 9 of target.
That is, the substrate board treatment 1 of this execution mode has the heating part, and this heating part is made up of 3 heating plates 11,12,12.And heat plate 11 constitutes the heating region of Fast Heating substrate 9, and low-temperature heat plate 12 constitutes the heating region of the temperature of stably keeping substrate 9.
On the upper surface of heating plate 10, open the compartment of terrain along Width and length direction sky and dispose a plurality of backing rolls 20.The part of backing roll 20 is contained in the recess of the upper surface setting of each heating plate 10 or the inside of through hole.The upper end of backing roll 20 is outstanding to the top from the upper surface of each heating plate 10.
Said backing roll 20 also is classified into up-down rollers 21, carrying roller 22 and moves into roller 23.Up-down rollers is only in heat plate 11 configuration, and with carrying roller 22 row alternate configurations.Mechanism up and down about up-down rollers explains in the back.In addition, carrying roller 22, move into roller 23, be equivalent to first distance between substrate of the present invention and the heating part from the upper surface of each heating plate 10 height to the outstanding part in top.
Carrying roller 22 disposes at heat plate 11 and low-temperature heat plate 12, and has following function: through making 22 rotations of carrying roller, carrying substrate 9 on the carrying direction.
In addition, move into the upstream side that roller 23 is configured in heat plate 11 and promptly move into the position, be used for moving into substrate to substrate board treatment 1.
Various backing rolls 20 connect through rotating shaft separately, and are supported for and can rotate to the carrying direction of substrate by side plate 15.Through with such backing roll 20 along disposing on the carrying directions, can supporting substrate 9 and at carrying substrate 9 on the direction of the upper surface of heating plate 10.
Fig. 3 is the partial side view that is used to explain driving mechanism 30.On side plate 15, dispose the driving mechanism 30 that is used to drive each backing roll 20.
Carrying roller 22 is the center with carrying roll shaft 221, is supported for and can rotates by side plate 15.In addition, to have be the carrying roller gear 222 at center with carrying roll shaft 221 equally to carrying roller 22.CD-ROM drive motor 32 is connected with carrying roller gear 222 through rotating band 325.In addition, the carrying roller 22 among the figure shown in the right side is connected with CD-ROM drive motor 32 by rotating band 325 via intermediate calender rolls 322.
In addition, though omitted diagram, be disposed at the carrying roller 22 of moving into roller 23 and being disposed on the low-temperature heat plate 12 of moving into the position and be connected with CD-ROM drive motor 32 by driving driving-belt 325 too.
That kind as shown in Figure 1, CD-ROM drive motor 32 is electrically connected with control part 50.Control part 50 is made up of the computer with CPU and memory.Control part 50 can stop the starting of CD-ROM drive motor 32 switching and the rotating speed of CD-ROM drive motor 32 being controlled through CD-ROM drive motor 32 is carried out electrical control.
If the instruction through control part 50 makes CD-ROM drive motor 32 actions, the rotary driving force that then produces by CD-ROM drive motor 32 makes a plurality of carrying rollers 22 to identical direction rotation.In addition, move into roller 23 also to identical direction rotation.Therefore, through the rotation of these rollers 22,23, make and carrying roller 22 or moving into roller 23 and upload substrate 9 side carrying downstream of putting along the carrying directions from upstream side.
Fig. 4 is the being seen partial sectional view of the B from Fig. 2 that is used to explain the mechanism up and down of up-down rollers 21.On side plate 15 motor up and down of configuration 31 or more down motor drive shaft 311 drive for the center, and then, about on the motor drive shaft 311, be connected with core shift cam 312 with up-down rollers 21 corresponding positions.And,, dispose flange (flange) 313 for the upper surface with core shift cam 312 contacts.
In addition, the up-down rollers 21 of arranging along the Width of substrate board treatment 1 is that the center disposes with same roll shaft 211 up and down, and under the state of keeping identical height, integral body moves up and down.In addition, each up-down rollers 21 can freely be rotated to the carrying direction of substrate.Therefore, make up-down rollers 21 move to lifting position through instruction from control part 50, thus make the substrate 9 of the upper surface of heating plate 10 carrying with a part by to above the state that boosts along the carrying of carrying direction.
That is, in this execution mode, constitute along the carrying mechanism of the upper surface carrying substrate 9 of heating plate 10 by backing roll 20, driving mechanism 30 and control part 50.
< 2. moving>about the processing of substrate board treatment 1
Next, the handling process to the substrate leading section in the above-mentioned substrate board treatment 1 describes with reference to Fig. 5～Fig. 9.Fig. 5 is the flow chart of the flow process of the processing substrate in the expression substrate board treatment 1.Fig. 6 to Fig. 9 is respectively the partial side view of substrate board treatment 1 of variation of the processing position of expression substrate.
The substrate of being moved into after the processing of the operation before accomplishing in the said device 19 is at first carried (step S11) through moving into roller 23.Specifically, control part 50 makes a plurality of roller 23 rotations of moving into through making CD-ROM drive motor 32 actions.Thus, the substrate of moving on the roller 23 9 is carried to the downstream of carrying direction.In this execution mode, come carrying substrate 9 with the transporting velocity of 3m～5m/min.
As shown in Figure 6; If the up-down rollers 21a that the leading section of substrate 9 is come heat plate 11 (here; The up-down rollers of carrying direction upstream side as 21a, is come additional symbols with the up-down rollers in downstream as 21b, below too); Then control part 50 makes motor 31 actions up and down, makes up-down rollers 21a move to lifting position (step S13: first switching process).Specifically, before the front end of substrate 9 was about to come the center of up-down rollers 21a, beginning is the vertical motion of motor 31 up and down, but is not limited to this, can suitably select in time, locational context.
Make this up-down rollers 21 move the arrival lifting position and spent for 1 second, prevent the rapid bending stress of effect on substrate 9 thus from down position.In addition, down position is to displacement suitably adjustment between 1mm～10mm of lifting position.
Next, as shown in Figure 7, up-down rollers 21a is being maintained under the state of lifting position, continue to come carrying substrate 9 through moving into roller 23.Specifically,, the rising of up-down rollers 21a keeps the lifting position time in about 1 second (step S14) after accomplishing.In this period, the leading section of substrate 9 is through the top of the driven roller 22 in the carrying direction downstream of up-down rollers 21a.
Afterwards, 50 pairs of control parts motor 31 are up and down given instruction, make up-down rollers 21a move to down position (step S15: second switching process).As shown in Figure 8, in the moment that up-down rollers 21a descends and accomplishes, the leading section of substrate 9 is carried to the position (step S16) that is about to arrive up-down rollers 21b.
And then as shown in Figure 9, if the leading section of substrate 9 is come up-down rollers 21b, then up-down rollers 21b and up-down rollers 21a move to lifting position and down position equally, and same step below the repetition (step S12～S15).
Afterwards, control part 50 is kept up-down rollers 21 and is in down position, under this state, continues carrying substrate 9.Therefore, up-down rollers 21 is with the height rotation identical with carrying roller 22 and keep the height and position of substrate 9.
Next, the flow process to the processing of the substrate rearward end in the substrate board treatment 1 describes with reference to Figure 10～Figure 12.Figure 10 is the flow chart of the flow process of the processing substrate in the expression substrate board treatment 1.Figure 11 and Figure 12 are respectively the partial side views of substrate board treatment 1 of the variation of expression processing substrate position.
Shown in figure 11, if the rearward end of substrate 9 is come the position of regulation with respect to the up-down rollers 21a of heat plate, then control part 50 makes motor 31 actions up and down, makes up-down rollers 21a move to lifting position (step 522: the 3rd switching process).Specifically, if the position apart from the center 150mm of up-down rollers 21a is come in the rear end of substrate 9, then begin the vertical motion of motor 31 up and down.
Afterwards, if the rearward end of substrate 9 is through the position (step S23) of up-down rollers 21a, then control part is given instruction to motor 31 up and down, and makes up-down rollers 21a move to down position (step S24: the 4th switching process).Shown in figure 12, in the moment that up-down rollers 21a descends and accomplishes, come supporting substrate 9 through driven roller 22, substrate 9 is carried to the downstream of carrying direction.In addition, if the rearward end of substrate 9 is come up-down rollers 21b, then up-down rollers 21b and up-down rollers 21a move to lifting position and down position equally, and same step below the repetition (step S21～S24).
Figure 13 is the figure of the surface temperature of each position on the expression substrate, and Figure 13 A representes not adopt situation of the present invention, and Figure 13 B representes to adopt situation of the present invention.Under carrying substrate 9 and situation about substrate 9 being heated from lower surface; Because the leading section of substrate 9 also is heated from the space of the upstream side of carrying direction; Therefore shown in Figure 13 A; Portion compares with substrate center, and the zone between the position X0～X1 suitable with the leading section of substrate is heated easily.Its result is heated in the surface temperature with substrate center portion under the situation of T0, and leading section can be heated to than near the higher temperature T 1 of temperature T 0.This influence is present in the substrate rearward end too.
As the present invention, substrate leading section and rearward end through heat plate 11 above the time, upper surface through increasing heating plate and the distance between the base lower surface can reduce the photothermal influence from heating plate.Its result shown in Figure 13 B, makes the surface temperature of substrate leading section be reduced to the T2 that more approaches T0 than T1, thereby makes the surface temperature homogenizing of substrate 9.
3. variation
More than, be illustrated to an embodiment of the invention, but the invention is not restricted to above-mentioned execution mode.
In above-mentioned execution mode, through heat plate 11 and two low-temperature heat plate 12 heated substrates 9, but be not limited thereto, also can arrange two heat plates 11, the number of low-temperature heat plate 12 also is not limited to this.Heating plate 10 integral body also can be made up of single heating plate.For example, heat zone and low-temperature heat zone also can be set in a heating plate.In addition, heating part of the present invention also can only be made up of a heat plate 11.In addition, heating part of the present invention also can be arranged with a plurality of bar-shaped or spherical heaters as lamp heater (lamp heater).
The mechanism up and down of motor 31 and cam 312 about the mechanism up and down of up-down rollers 21 has been to use, but be not limited thereto.Also can use the Direct Action Type mechanism of cylinder etc. to make up-down rollers 21 knee-actions.
In addition, carrying roller 22 disposes with adjacent mode with up-down rollers 21 continuously, but is not limited thereto, and also can dispose two row carrying rollers 22 continuously and insert configuration up-down rollers 21 afterwards again.In addition, in execution mode, the configuration space of each roller is identical, but spacing also can change.
In execution mode, with respect to the transporting velocity of substrate 9, the speed ratio up and down of up-down rollers is very fast.Therefore, after the up-down rollers 21a of upstream side rose, descends, the up-down rollers 21b in downstream began to rise, but is not limited thereto.Specifically, after can rising at the up-down rollers 21a of upstream side, keep the propradation stipulated time longer than execution mode; And, before up-down rollers 21a begins to descend, make the up-down rollers 21b in the leading section arrival downstream of substrate 9; And then, up-down rollers 21b is risen.So, can further reduce the heat of the leading section of substrate 9 from 11 acceptance of heat plate.
In addition, in above-mentioned execution mode, through a plurality of carrying rollers 22 and move into roller 23 and come carrying substrate 9.But carrying of the present invention unit also can be to use other method to come the unit of carrying substrate 9.For example, the both sides of the edge portion that can keep substrate 9 with the retaining member of regulation moves carrying substrate 9 through making this retaining member to carrying direction downstream.
In addition; Above-mentioned substrate board treatment 1 is the device that the glass substrate of rectangle that liquid crystal indicator is used heats; But, substrate board treatment of the present invention also can be to organic EL substrate for display, semiconductor wafer, PDP with glass substrate, film liquid crystal with flexible base, board, base board for optical mask, color filter base plate, record disc with substrate, used for solar batteries substrate, Electronic Paper with other substrates such as substrates.
Claims (11)
1. substrate board treatment from upstream side side carrying substrate downstream, heats this substrate on one side on one side, it is characterized in that having:
The heating part, it heats substrate,
Carrying mechanism, it is carrying substrate along said heating part;
Said carrying mechanism has switch unit, and this switch unit is used for the distance between said substrate and the said heating part is switched in first distance with between two stages than the big second distance of said first distance at least;
When upstream-side-end through the predetermined heating zone of said heating part of the leading section of said substrate, said switch unit switches to said second distance with the distance between said substrate and the said heating part.
2. according to the substrate board treatment of claim 1 record, it is characterized in that,
Said carrying mechanism is the roller carrying mechanism, and has:
The carrying roller, its distance between said substrate and said heating part be first apart from the time, said substrate is applied actuating force,
Up-down rollers, its carrying direction to said substrate is rotated, and can move along above-below direction;
Said switch unit moves up and down through making said up-down rollers, and the distance between said substrate and the said heating part is switched to said second distance from said first distance.
3. according to the substrate board treatment of claim 2 record, it is characterized in that,
After the leading section from said substrate had passed through official hour with said second distance through said up-down rollers, said switch unit switched the distance between said substrate and the said heating part.
4. according to the substrate board treatment of claim 1 record, it is characterized in that,
When end of downstream side through said heating region of the rearward end of said substrate, said switch unit also switches to said second distance with the distance between said substrate and the said heating part.
5. according to the substrate board treatment of claim 4 record, it is characterized in that,
When the rearward end of said substrate has arrived ad-hoc location; Said switch unit switches to said second distance with the distance between said substrate and the said heating part from said first distance; This ad-hoc location is meant, is positioned at upstream side and the position that has the distance of regulation with the downstream side end of said heating region of the downstream side end of said heating region.
6. according to the substrate board treatment of each record in the claim 1～5, it is characterized in that,
Said heating part comprises:
Flat heat plate,
Flat low-temperature heat plate, it is configured in the downstream of said heat plate, and the temperature of this low-temperature heat plate is lower than the temperature of said heat plate;
Said heating region is the zone of said heat plate.
7. substrate processing method using same; On one side the distance between substrate and the heating part is switched between two stages of first distance and the second distance bigger than said first distance at least; On one side along the heating part from upstream side side carrying substrate downstream; Thus substrate is heated, it is characterized in that, comprising:
First switching process when upstream-side-end through the predetermined heating zone of said heating part of the leading section of said substrate, switches to said second distance with the distance between said substrate and the said heating part.
8. the substrate processing method using same of putting down in writing according to claim 7 is characterized in that, comprising:
Second switching process; From having switched through said first switching process after distance between said substrate and the said heating part passed through official hour, the distance between said substrate and the said heating part is switched to said first distance from said second distance.
9. the substrate processing method using same of putting down in writing according to claim 7 is characterized in that, also comprises:
The 3rd switching process; When the rearward end of said substrate has arrived ad-hoc location; Distance between said substrate and the said heating part is switched to said second distance; This ad-hoc location is meant, is positioned at upstream side and the position that has the distance of regulation with the downstream side end of said heating region of the downstream side end of said heating region.
10. the substrate processing method using same of putting down in writing according to claim 9 is characterized in that, comprising:
The 4th switching process when the rearward end of said substrate has been passed through the end of downstream side of said heating region, switches to said first distance with the distance between said substrate and the said heating part from said second distance.
11. the substrate processing method using same according to each record in the claim 7～10 is characterized in that,
Said heating part comprises:
Flat heat plate,
Flat low-temperature heat plate, it is configured in the downstream of said heat plate, and the temperature of this low-temperature heat plate is lower than the temperature of said heat plate;
Said heating region is the zone of said heat plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011008372A JP2012151258A (en) | 2011-01-19 | 2011-01-19 | Substrate processing apparatus, and substrate processing method |
| JP2011-008372 | 2011-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102610549A true CN102610549A (en) | 2012-07-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102944678A Pending CN102610549A (en) | 2011-01-19 | 2011-09-21 | Substrate processing apparatus and substrate processing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2012151258A (en) |
| KR (1) | KR101255480B1 (en) |
| CN (1) | CN102610549A (en) |
| TW (1) | TW201232604A (en) |
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| CN108698899A (en) * | 2017-01-30 | 2018-10-23 | 法国圣戈班玻璃厂 | Method and apparatus for making glass disc be bent |
| CN109819663A (en) * | 2017-09-18 | 2019-05-28 | 应用材料公司 | Vacuum flush system and method for being vacuum-treated one or more substrates |
| CN110147032A (en) * | 2018-02-12 | 2019-08-20 | 上海微电子装备（集团）股份有限公司 | Mask mobile device, litho machine and photolithography method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6053117B2 (en) * | 2012-09-12 | 2016-12-27 | 株式会社アルバック | Vacuum processing equipment |
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- 2011-09-20 KR KR1020110094689A patent/KR101255480B1/en not_active IP Right Cessation
- 2011-09-21 CN CN2011102944678A patent/CN102610549A/en active Pending
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| JP2009290207A (en) * | 2008-05-30 | 2009-12-10 | Semes Co Ltd | Substrate processing apparatus and method used for manufacture of flat panel display |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2012151258A (en) | 2012-08-09 |
| KR101255480B1 (en) | 2013-04-16 |
| TW201232604A (en) | 2012-08-01 |
| KR20120084248A (en) | 2012-07-27 |
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