CN102598229B - 提高驱动电流的双层nFET埋设应激物元件和集成 - Google Patents
提高驱动电流的双层nFET埋设应激物元件和集成 Download PDFInfo
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- CN102598229B CN102598229B CN201080048613.2A CN201080048613A CN102598229B CN 102598229 B CN102598229 B CN 102598229B CN 201080048613 A CN201080048613 A CN 201080048613A CN 102598229 B CN102598229 B CN 102598229B
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- nfet
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- stressor element
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7848—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being located in the source/drain region, e.g. SiGe source and drain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/161—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys
- H01L29/165—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table including two or more of the elements provided for in group H01L29/16, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66636—Lateral single gate silicon transistors with source or drain recessed by etching or first recessed by etching and then refilled
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7834—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a non-planar structure, e.g. the gate or the source or the drain being non-planar
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/90—MOSFET type gate sidewall insulating spacer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/902—FET with metal source region
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/903—FET configuration adapted for use as static memory cell
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/607,104 | 2009-10-28 | ||
US12/607,104 US8035141B2 (en) | 2009-10-28 | 2009-10-28 | Bi-layer nFET embedded stressor element and integration to enhance drive current |
PCT/EP2010/065495 WO2011051109A1 (en) | 2009-10-28 | 2010-10-15 | BI-LAYER nFET EMBEDDED STRESSOR ELEMENT AND INTEGRATION TO ENHANCE DRIVE CURRENT |
Publications (2)
Publication Number | Publication Date |
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CN102598229A CN102598229A (zh) | 2012-07-18 |
CN102598229B true CN102598229B (zh) | 2014-10-22 |
Family
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CN201080048613.2A Expired - Fee Related CN102598229B (zh) | 2009-10-28 | 2010-10-15 | 提高驱动电流的双层nFET埋设应激物元件和集成 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8035141B2 (zh) |
CN (1) | CN102598229B (zh) |
WO (1) | WO2011051109A1 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8236660B2 (en) | 2010-04-21 | 2012-08-07 | International Business Machines Corporation | Monolayer dopant embedded stressor for advanced CMOS |
US8299535B2 (en) * | 2010-06-25 | 2012-10-30 | International Business Machines Corporation | Delta monolayer dopants epitaxy for embedded source/drain silicide |
JP5707763B2 (ja) | 2010-07-26 | 2015-04-30 | 住友電気工業株式会社 | 半導体装置の製造方法 |
US8361872B2 (en) * | 2010-09-07 | 2013-01-29 | International Business Machines Corporation | High performance low power bulk FET device and method of manufacture |
US9537004B2 (en) * | 2011-05-24 | 2017-01-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Source/drain formation and structure |
US8482079B2 (en) * | 2011-06-15 | 2013-07-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of manufacturing the same |
CN102931222B (zh) * | 2011-08-08 | 2015-05-20 | 中国科学院微电子研究所 | 半导体器件及其制造方法 |
US20130193517A1 (en) * | 2012-01-31 | 2013-08-01 | Toshiba America Electronic Components, Inc. | Semiconductor device with lateral and vertical channel confinement and method of fabricating the same |
KR102059526B1 (ko) | 2012-11-22 | 2019-12-26 | 삼성전자주식회사 | 내장 스트레서를 갖는 반도체 소자 형성 방법 및 관련된 소자 |
TWI643346B (zh) | 2012-11-22 | 2018-12-01 | 三星電子股份有限公司 | 在凹處包括一應力件的半導體裝置及其形成方法(三) |
US9029226B2 (en) | 2013-03-13 | 2015-05-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for doping lightly-doped-drain (LDD) regions of finFET devices |
US9306054B2 (en) * | 2013-05-24 | 2016-04-05 | Samsung Electronics Co., Ltd. | Semiconductor device and a method of fabricating the same |
US9293534B2 (en) | 2014-03-21 | 2016-03-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Formation of dislocations in source and drain regions of FinFET devices |
CN105575810B (zh) * | 2014-10-11 | 2019-03-12 | 中芯国际集成电路制造(上海)有限公司 | 晶体管的形成方法 |
US10734489B2 (en) * | 2018-07-31 | 2020-08-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for forming semiconductor device structure with metal silicide layer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1797783A (zh) * | 2004-12-28 | 2006-07-05 | 富士通株式会社 | 半导体器件及其制造方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
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US7329923B2 (en) | 2003-06-17 | 2008-02-12 | International Business Machines Corporation | High-performance CMOS devices on hybrid crystal oriented substrates |
US7023055B2 (en) | 2003-10-29 | 2006-04-04 | International Business Machines Corporation | CMOS on hybrid substrate with different crystal orientations using silicon-to-silicon direct wafer bonding |
US20050116290A1 (en) | 2003-12-02 | 2005-06-02 | De Souza Joel P. | Planar substrate with selected semiconductor crystal orientations formed by localized amorphization and recrystallization of stacked template layers |
US7288448B2 (en) * | 2004-08-24 | 2007-10-30 | Orlowski Marius K | Method and apparatus for mobility enhancement in a semiconductor device |
US20060234455A1 (en) | 2005-04-19 | 2006-10-19 | Chien-Hao Chen | Structures and methods for forming a locally strained transistor |
JP4984665B2 (ja) * | 2005-06-22 | 2012-07-25 | 富士通セミコンダクター株式会社 | 半導体装置およびその製造方法 |
US7612389B2 (en) | 2005-09-15 | 2009-11-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedded SiGe stressor with tensile strain for NMOS current enhancement |
US7288828B2 (en) * | 2005-10-05 | 2007-10-30 | United Microelectronics Corp. | Metal oxide semiconductor transistor device |
US7727845B2 (en) * | 2005-10-24 | 2010-06-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ultra shallow junction formation by solid phase diffusion |
JP2007157924A (ja) | 2005-12-02 | 2007-06-21 | Fujitsu Ltd | 半導体装置および半導体装置の製造方法 |
US7939413B2 (en) | 2005-12-08 | 2011-05-10 | Samsung Electronics Co., Ltd. | Embedded stressor structure and process |
US7718500B2 (en) | 2005-12-16 | 2010-05-18 | Chartered Semiconductor Manufacturing, Ltd | Formation of raised source/drain structures in NFET with embedded SiGe in PFET |
US8900980B2 (en) | 2006-01-20 | 2014-12-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Defect-free SiGe source/drain formation by epitaxy-free process |
US7446026B2 (en) | 2006-02-08 | 2008-11-04 | Freescale Semiconductor, Inc. | Method of forming a CMOS device with stressor source/drain regions |
US7413961B2 (en) | 2006-05-17 | 2008-08-19 | Chartered Semiconductor Manufacturing Ltd. | Method of fabricating a transistor structure |
US7618866B2 (en) | 2006-06-09 | 2009-11-17 | International Business Machines Corporation | Structure and method to form multilayer embedded stressors |
US8853746B2 (en) | 2006-06-29 | 2014-10-07 | International Business Machines Corporation | CMOS devices with stressed channel regions, and methods for fabricating the same |
US7554110B2 (en) * | 2006-09-15 | 2009-06-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | MOS devices with partial stressor channel |
US7494884B2 (en) | 2006-10-05 | 2009-02-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | SiGe selective growth without a hard mask |
US20080157200A1 (en) | 2006-12-27 | 2008-07-03 | International Business Machines Corporation | Stress liner surrounded facetless embedded stressor mosfet |
US7736957B2 (en) | 2007-05-31 | 2010-06-15 | Freescale Semiconductor, Inc. | Method of making a semiconductor device with embedded stressor |
KR101369907B1 (ko) * | 2007-10-31 | 2014-03-04 | 주성엔지니어링(주) | 트랜지스터 및 그 제조 방법 |
US20090140351A1 (en) | 2007-11-30 | 2009-06-04 | Hong-Nien Lin | MOS Devices Having Elevated Source/Drain Regions |
US20090152626A1 (en) * | 2007-12-18 | 2009-06-18 | Texas Instruments Incorporated | Super Halo Formation Using a Reverse Flow for Halo Implants |
US7687354B2 (en) | 2008-02-29 | 2010-03-30 | Freescale Semiconductor, Inc. | Fabrication of a semiconductor device with stressor |
US20090242989A1 (en) | 2008-03-25 | 2009-10-01 | Chan Kevin K | Complementary metal-oxide-semiconductor device with embedded stressor |
-
2009
- 2009-10-28 US US12/607,104 patent/US8035141B2/en active Active
-
2010
- 2010-10-15 CN CN201080048613.2A patent/CN102598229B/zh not_active Expired - Fee Related
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1797783A (zh) * | 2004-12-28 | 2006-07-05 | 富士通株式会社 | 半导体器件及其制造方法 |
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US8035141B2 (en) | 2011-10-11 |
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US20110095343A1 (en) | 2011-04-28 |
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