CN102593014A - Multilayer encapsulating process and encapsulating structure of light-emitting diode (LED) driver - Google Patents
Multilayer encapsulating process and encapsulating structure of light-emitting diode (LED) driver Download PDFInfo
- Publication number
- CN102593014A CN102593014A CN2011104314521A CN201110431452A CN102593014A CN 102593014 A CN102593014 A CN 102593014A CN 2011104314521 A CN2011104314521 A CN 2011104314521A CN 201110431452 A CN201110431452 A CN 201110431452A CN 102593014 A CN102593014 A CN 102593014A
- Authority
- CN
- China
- Prior art keywords
- encapsulating
- driver
- embedding
- led driver
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to a multilayer encapsulating process and an encapsulating structure of a LED driver, wherein the encapsulating process includes the steps of coating a chip mounting surface of a printed circuit board (PCB) of the driver with a layer of varnish, then coating the surface with a layer of silicon gel, and finally performing integral encapsulation with encapsulating silica gel. The multilayer encapsulating process and the encapsulating structure of the LED driver has the advantages of being water-proof, aging-resistant and corrosion-free, being capable of effectively preventing mounted elements from falling off and being damaged by pulling, being high in radiating coefficient and power supply reliability, and having a shock-proof function due to the elasticity and softness of the solidified encapsulating silica gel.
Description
Technical field
The present invention relates to electronic devices and components encapsulation technology field, particularly a kind of led driver multiple field dosing technology and embedding structure.
Background technology
The embedding of present most of LED driving powers all is to adopt the single embedding of epoxy resin embedding, and the thermal conductivity of epoxy resin neither be very desirable, and temperature can not get in time distributing during power work, works long hours to diminish power supply, causes shorten useful life.Owing to very hard behind the epoxy resin cure, bigger shrinkage is arranged again in addition, embedding makes some components and parts pulled easily after solidifying, and reprocesses very difficulty owing to have cured, and causes product rejection.Therefore, need design a kind of dosing technology and embedding structure again, solve the above problems.
Summary of the invention
The power supply heat sinking that causes for the single embedding of led driver epoxy resin that solves prior art; Problems such as former device protection; The present invention has adopted a kind of led driver multiple field dosing technology and embedding structure, and said dosing technology is on the PCB of driver paster face, to brush one deck varnish earlier, is coated with one deck silicon gel again; Carry out whole embedding with embedding silica gel at last, so just solved heat radiation well and components and parts are pulled problem.
According to led driver multiple field dosing technology of the present invention; Described led driver multiple field embedding structure from inside to outside is followed successively by, led driver PCB, the layer of varnish on PCB paster face surface; Silicon gel layer on the layer of varnish, and the embedding silica gel that whole driver is surrounded.
Led driver multiple field dosing technology of the present invention and embedding structure thereof have waterproof, and be ageing-resistant, free from corrosion characteristics; Can avoid the paster components and parts to pull, come off effectively; Coefficient of heat transfer is high, and power supply stability is high; Because the flexible matter in embedding silica gel curing back is soft, has shockproof function in addition.
Description of drawings
Through the detailed description below in conjunction with accompanying drawing, aforesaid purpose, the feature and advantage with other of the present invention will become obvious.Wherein:
Shown in Figure 1 is the sketch map of led driver multiple field embedding structure of the present invention;
Shown in Figure 2 is the process flow diagram of led driver multiple field dosing technology of the present invention.
Embodiment
Led driver multiple field embedding structure of the present invention and dosing technology schematic flow sheet shown in seeing figures.1.and.2, described multiple field dosing technology are earlier at paster panel brush one deck varnish 20 of driver finished product PCB10, with the fixing components and parts of varnish 20; Be coated with one deck silicon gel 30 again; The silicon gel can keep elasticity for a long time in-65～200 ℃ of temperature ranges, have good electric property and chemical stability, and is water-fast; Weather-resistant; Moistureproof nothing corrosion, insulation has improved power supply reliability effectively; With 40 perfusions of embedding silica gel, what embedding silica gel solidified back formation is resilient solid, can be shockproof at last.Because be elastic solid (Hookean body), there is not the crack.The curing back is easy to excavate owing to silica gel matter is soft reprocesses; The conductive coefficient of silica gel is high in addition, can distribute the power supply heat faster.With this embedding mode, effectively avoided pulling components and parts, reduced bad product, better distribute heat is for the permanent normal work of power supply provides guarantee.
The present invention is not limited to described embodiment, and those skilled in the art still can do some corrections or change, so rights protection scope of the present invention is as the criterion with claims restricted portion not breaking away from spirit of the present invention promptly openly in the scope.
Claims (2)
1. a led driver multiple field dosing technology is characterized in that, said dosing technology is on the PCB of driver paster face, to brush one deck varnish earlier, and then is coated with one deck silicon gel, carries out whole embedding with embedding silica gel at last.
2. a led driver multiple field embedding structure is characterized in that described embedding structure from inside to outside is followed successively by, led driver PCB, the layer of varnish on PCB paster face surface, the silicon gel layer on the layer of varnish, and the embedding silica gel that whole driver is surrounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104314521A CN102593014A (en) | 2011-12-20 | 2011-12-20 | Multilayer encapsulating process and encapsulating structure of light-emitting diode (LED) driver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104314521A CN102593014A (en) | 2011-12-20 | 2011-12-20 | Multilayer encapsulating process and encapsulating structure of light-emitting diode (LED) driver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102593014A true CN102593014A (en) | 2012-07-18 |
Family
ID=46481486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104314521A Pending CN102593014A (en) | 2011-12-20 | 2011-12-20 | Multilayer encapsulating process and encapsulating structure of light-emitting diode (LED) driver |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102593014A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602865A (en) * | 2019-06-17 | 2019-12-20 | 厦门佳普乐电子科技有限公司 | Circuit device with multiple layers of glue filling and glue filling method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060082994A1 (en) * | 2004-10-18 | 2006-04-20 | Harvatek Corporation | LED lamp |
| CN201697077U (en) * | 2010-06-23 | 2011-01-05 | 广州冠今电子科技有限公司 | LED driving power |
| CN201788643U (en) * | 2010-09-26 | 2011-04-06 | 深圳市联建光电股份有限公司 | Semi-outdoor surface mounted type LED display module adapt to high moisture environment |
| CN202373572U (en) * | 2011-12-20 | 2012-08-08 | 殷晨钟 | Multi-layer filling and sealing structure of light-emitting diode (LED) driver |
-
2011
- 2011-12-20 CN CN2011104314521A patent/CN102593014A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060082994A1 (en) * | 2004-10-18 | 2006-04-20 | Harvatek Corporation | LED lamp |
| CN201697077U (en) * | 2010-06-23 | 2011-01-05 | 广州冠今电子科技有限公司 | LED driving power |
| CN201788643U (en) * | 2010-09-26 | 2011-04-06 | 深圳市联建光电股份有限公司 | Semi-outdoor surface mounted type LED display module adapt to high moisture environment |
| CN202373572U (en) * | 2011-12-20 | 2012-08-08 | 殷晨钟 | Multi-layer filling and sealing structure of light-emitting diode (LED) driver |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602865A (en) * | 2019-06-17 | 2019-12-20 | 厦门佳普乐电子科技有限公司 | Circuit device with multiple layers of glue filling and glue filling method |
| CN110602865B (en) * | 2019-06-17 | 2020-12-22 | 厦门佳普乐电子科技有限公司 | Circuit device with multiple layers of glue filling and glue filling method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5497690B2 (en) | Power package module | |
| JP2013541857A5 (en) | LED-based light source using anisotropic conductor | |
| US20140362590A1 (en) | Electronic module, lighting device and manufacturing method of the electronic module | |
| TW200731432A (en) | Semiconductor device and manufacturing method for the same | |
| CN106068559A (en) | Insulated substrate and semiconductor device | |
| CN102098870A (en) | Composite printed circuit board (PCB) and manufacturing method thereof | |
| CN202373572U (en) | Multi-layer filling and sealing structure of light-emitting diode (LED) driver | |
| CN102593014A (en) | Multilayer encapsulating process and encapsulating structure of light-emitting diode (LED) driver | |
| CN201986260U (en) | Composite PCB | |
| CN202855803U (en) | High heat conduction LED packaging substrate | |
| CN203585898U (en) | Large-angle clamp slot LED (light emitting diode) module | |
| CN105529916A (en) | Electronic module and the fabrication method thereof | |
| KR20110129820A (en) | Electronic device having electrically grounded heat sink and method of manufacturing the same | |
| CN209882211U (en) | HDI high density lamination circuit board | |
| US8232469B2 (en) | Solar battery module and forming method thereof | |
| CN202905029U (en) | Light-emitting diode (LED) full-color display screen | |
| KR101363070B1 (en) | Led lighting module | |
| KR101235176B1 (en) | Method for manufacturing high-heat dissipation circuit substrate useful to LED | |
| CN210986564U (en) | L ED packaging circuit board with half plug holes | |
| KR101154592B1 (en) | The radiant heat circuit board and the method for manufacturing the same | |
| CN102931319A (en) | Manufacturing method for LED (Light-Emitting Diode) package substrate with high thermal conductivity | |
| CN210537200U (en) | Heat conduction assembly and display screen | |
| CN207625874U (en) | A kind of nested composite circuit board | |
| CN206301785U (en) | A kind of rectifier bridge stack of high connductivity stream | |
| JP2011071462A (en) | Solar cell module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120718 |
|
| WD01 | Invention patent application deemed withdrawn after publication |