CN102576705B - 电路装置及其制造方法 - Google Patents
电路装置及其制造方法 Download PDFInfo
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- CN102576705B CN102576705B CN201080044718.0A CN201080044718A CN102576705B CN 102576705 B CN102576705 B CN 102576705B CN 201080044718 A CN201080044718 A CN 201080044718A CN 102576705 B CN102576705 B CN 102576705B
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- wiring layer
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- circuit arrangement
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- H01L2924/1304—Transistor
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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Abstract
Description
Claims (25)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09171447 | 2009-09-28 | ||
EP09171447.7 | 2009-09-28 | ||
PCT/EP2010/064377 WO2011036307A1 (en) | 2009-09-28 | 2010-09-28 | Circuit arrangement and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
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CN102576705A CN102576705A (zh) | 2012-07-11 |
CN102576705B true CN102576705B (zh) | 2015-10-21 |
Family
ID=41510589
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Application Number | Title | Priority Date | Filing Date |
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CN201080044718.0A Active CN102576705B (zh) | 2009-09-28 | 2010-09-28 | 电路装置及其制造方法 |
Country Status (6)
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US (1) | US20120199989A1 (zh) |
EP (1) | EP2483922A1 (zh) |
JP (1) | JP2013506310A (zh) |
KR (1) | KR20120073302A (zh) |
CN (1) | CN102576705B (zh) |
WO (1) | WO2011036307A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130175704A1 (en) | 2012-01-05 | 2013-07-11 | Ixys Corporation | Discrete power transistor package having solderless dbc to leadframe attach |
EP2862202B1 (en) * | 2012-06-19 | 2016-04-27 | ABB Technology AG | Substrate for mounting multiple power transistors thereon and power semiconductor module |
CN111916422B (zh) * | 2020-07-13 | 2023-01-24 | 株洲中车时代半导体有限公司 | 一种功率模块封装结构 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1841726A (zh) * | 2005-03-30 | 2006-10-04 | 丰田自动车株式会社 | 电路装置及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US4766670A (en) * | 1987-02-02 | 1988-08-30 | International Business Machines Corporation | Full panel electronic packaging structure and method of making same |
DE4300516C2 (de) | 1993-01-12 | 2001-05-17 | Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
EP0706221B8 (en) * | 1994-10-07 | 2008-09-03 | Hitachi, Ltd. | Semiconductor device comprising a plurality of semiconductor elements |
JPH11186689A (ja) * | 1997-12-25 | 1999-07-09 | Kyocera Corp | 配線基板の接続構造 |
DE10355925B4 (de) * | 2003-11-29 | 2006-07-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren seiner Herstellung |
JP2006196853A (ja) | 2004-12-13 | 2006-07-27 | Daikin Ind Ltd | ヒートポンプ装置 |
DE102008047028B4 (de) * | 2008-09-13 | 2011-06-09 | Infineon Technologies Ag | Schaltungsanordnung zur Ansteuerung eines Leistungshalbleiterschalters und Halbleitermodul |
-
2010
- 2010-09-28 CN CN201080044718.0A patent/CN102576705B/zh active Active
- 2010-09-28 EP EP10757227A patent/EP2483922A1/en not_active Withdrawn
- 2010-09-28 KR KR1020127010816A patent/KR20120073302A/ko not_active Application Discontinuation
- 2010-09-28 WO PCT/EP2010/064377 patent/WO2011036307A1/en active Application Filing
- 2010-09-28 JP JP2012531365A patent/JP2013506310A/ja active Pending
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2012
- 2012-03-27 US US13/431,457 patent/US20120199989A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1841726A (zh) * | 2005-03-30 | 2006-10-04 | 丰田自动车株式会社 | 电路装置及其制造方法 |
Also Published As
Publication number | Publication date |
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KR20120073302A (ko) | 2012-07-04 |
JP2013506310A (ja) | 2013-02-21 |
EP2483922A1 (en) | 2012-08-08 |
WO2011036307A1 (en) | 2011-03-31 |
CN102576705A (zh) | 2012-07-11 |
US20120199989A1 (en) | 2012-08-09 |
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