CN102575137A - Adhesive resin composition for silicon wafers - Google Patents
Adhesive resin composition for silicon wafers Download PDFInfo
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- CN102575137A CN102575137A CN2010800424653A CN201080042465A CN102575137A CN 102575137 A CN102575137 A CN 102575137A CN 2010800424653 A CN2010800424653 A CN 2010800424653A CN 201080042465 A CN201080042465 A CN 201080042465A CN 102575137 A CN102575137 A CN 102575137A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3225—Polyamines
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Abstract
An adhesive resin composition for silicon wafers which, when in a cured state, exhibits excellent adhesiveness to silicon wafers, characterized by comprising an epoxy resin and a compound having a urea structure in such amounts that the urea-structure moiety of the compound is contained in an amount of 0.1 to 50 parts by mass per 100 parts by mass of the epoxy resin. The epoxy resin is preferably an epoxy resin that has a bisphenol A skeleton or a bisphenol F skeleton, while the compound having a urea structure is preferably a product of reaction of an amine compound with an isocyanate compound.
Description
Technical field
The present invention relates to the tackiness resin combination, particularly significantly excellent with the tackiness of Silicon Wafer, contain the composition epoxy resin of the compound of a certain amount of above tool urea structure.
Background technology
In recent years, along with the development of IT technology, developed package technique miscellaneous.Particularly; The directly fixing or insulativity of semiconductor element, with the tackiness of substrate etc.; Owing to be that institute is necessary and integral in step or the assembling safety of package technique miscellaneous, so the tamanori that binds semi-conductive Silicon Wafer and other base material comes into one's own.The coating process of tamanori is limited by semi-conductive assembling morphology, as its main coating process, can enumerate methods such as bottom filling, screen painting, ink-jet, dry film lamination, spin coating.With in like the tackiness resin that this method was coated with, look purposes and decide, require low-viscosity, solvent-free, the thermotolerance after binding etc.In addition, as hardening mechanism, be preferably the heat embrittlement mechanism that can satisfy above-mentioned requirements easily.
Yet, as the resin that has good tackiness for Silicon Wafer, had only the resin that can dissolve a few part such as polyimide to exist in the past, have with thermosetting resin for the resin of the good tackiness of Silicon Wafer and do not know as yet.
Summary of the invention
Invent problem to be solved
Therefore, the object of the present invention is to provide the good tackiness of thermosetting resin composition bring into play to(for) Silicon Wafer.
The technical scheme of dealing with problems
The inventor is in order to reach above-mentioned purpose, and through further investigation repeatedly, the composition epoxy resin that the result finds to contain a certain amount of above urea structure is very good, and reaches the present invention.
That is, the present invention is that a kind of Silicon Wafer is used the tackiness resin combination, it is characterized by for the epoxy resin of 100 mass parts, contains the compound of tool urea structure, so that the structure of the urea in this compound part becomes 0.1～50 mass parts.
In the present invention, can further contain by having phenol property hydroxyl with the amido adjoining position and having polyamide compound from the structure of the aromatic diamine of tool phenol property hydroxyl, and at least a kind the resin of selecting among the crowd that forms of phenol resins.
In addition, aforementioned epoxy resins is preferably the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton, and the compound of aforementioned tool urea structure is preferably the resultant of reaction of amine compound and isocyanate compound.
The effect of invention
Silicon Wafer of the present invention is used the tackiness resin combination, owing to when heat embrittlement, become the epoxy cure thing of the urea structure with appropriateness, therefore can carry out very good bonding for Silicon Wafer.
Embodiment
As the epoxy resin that uses among the present invention; For example can enumerate the poly epihydric alcohol ether compound of the monokaryon multivalence phenolic compound of quinhydrones, Resorcinol, pyrocatechol, Phloroglucinol etc.; Dihydroxy naphthlene, couplet phenol, methylene radical bis-phenol (Bisphenol F), methylene-bis (ortho-cresol), ethylidene bis-phenol, isopropylidene bis-phenol (dihydroxyphenyl propane), isopropylidene two (ortho-cresol), tetrabromo-bisphenols, 1; 3-two (4-hydroxyl cumyl benzene), 1; 4-two (4-hydroxyl cumyl benzene), 1; 1; 3-three (4-hydroxy phenyl) butane, 1; 1; 2; The poly epihydric alcohol ether compound of the multinuclear polyphenol compound of 2-four (4-hydroxy phenyl) ethane, thiobisphenol, sulfo group bis-phenol, oxygen base bis-phenol, phenol phenolic varnish, o-Hydroxytoluene Novolac, ethylphenol phenolic varnish, butylphenol phenolic varnish, octyl phenol phenolic varnish, Resorcinol phenolic varnish, terpenes phenol etc.; The poly epihydric alcohol ether compound of the polyalcohols of terepthaloyl moietie, Ucar 35, butyleneglycol, pinakon, polyoxyethylene glycol, thiodiglycol, USP Kosher, TriMethylolPropane(TMP), tetramethylolmethane, Sorbitol Powder, dihydroxyphenyl propane-ethylene oxide adduct etc.; The glycidyl ester class of aliphatics, aromatic series or the alicyclic polyprotonic acid of toxilic acid, fumaric acid, Yi Kang acid, succsinic acid, pentanedioic acid, suberic acid, hexanodioic acid, nonane diacid, sebacic acid, dimeracid, trimer acid, phthalic acid, m-phthalic acid, terephthalic acid, trimellitic acid, trimesic acid, PMA, tetrahydrochysene phthalic acid, hexahydrobenzene dioctyl phthalate, interior methylene radical tetrahydrochysene phthalic acid etc. and the homopolymer or the multipolymer of SY-Monomer G, N, the epoxy compounds with glycidyl amido of N-diglycidylaniline, two (4-(N-methyl-N-glycidyl amido) phenyl) methane, diglycidyl Ortho Toluidine etc.; VCH diepoxide, Dicyclopentadiene (DCPD) diepoxide, 3; 4-epoxy group(ing) cyclohexyl methyl-3,4-epoxy-cyclohexane carboxylicesters, 3,4-epoxy group(ing)-6-methyl cyclohexane ylmethyl-6-methylcyclohexanecarboxylic acid ester, two (3; 4-epoxy group(ing)-6-methyl cyclohexane ylmethyl) epoxide of the cyclic olefin compound of adipic acid ester etc., the heterogeneous ring compound of the epoxidation conjugated diolefin polymer of epoxidized polybutadiene, epoxidation vinyl benzene-butadienecopolymer etc., triglycidylisocyanurates etc.
Above-mentioned epoxy resin also can be the material through the prepolymer institute internal crosslinking of terminal isocyanate, or the material that quantizes through polyvalent active dydrogen compounds (polyphenol, polyamines, the compound that contains carbonyl, poly phosphate etc.) institute polymer.
As the compound of tool urea structure used in the present invention, be preferably the resultant of reaction of amine compound and isocyanate compound.As aforementioned amine compound, for example can enumerate quadrol, 1,2-two amido propane, 1,3-two amido propane, 1; 3-two amido butane, 1, alkane two amines of 4-two amido butane etc., two stretch second triamine, three stretches many alkyl polyamines class that second triamine, four is stretched second five amine etc., 1; 3-two aminomethyl hexanaphthenes, 1,2-diamines basic ring hexane, 1,4-two amidos-3, the ester ring type polyamines class of 6-diethyl cyclohexane, isophorone diamine etc.; The aromatic polyamine class of MXDP, two amido ditans, two amido sulfobenzides etc., the guanamines class of benzoguanamine, acetoguanamine etc., the imidazoles of glyoxal ethyline, 2-ethyl-4-methylimidazole, 2 isopropyl imidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-aminocarbonyl propyl imidazoles etc., two hydrazides classes of oxalic acid two hydrazides, propanedioic acid two hydrazides, amber acid dihydrazide, pentanedioic acid two hydrazides, adipic dihydrazide, suberic acid two hydrazides, nonane diacid two hydrazides, sebacic dihydrazide, phthalic acid two hydrazides etc.; N, N-dimethyl amido ethylamine, N, N-diethylammonium amido ethylamine, N, N-diisopropyl amido ethylamine, N; N-diallyl amido ethylamine, N, N-benzyl methyl amido ethylamine, N, N-dibenzyl amido ethylamine, N, N-cyclohexyl methyl amido ethylamine, N; N-dicyclohexyl amido ethylamine, N-(2-amido ethyl) Pyrrolizidine, N-(2-amido ethyl) piperidines, N-(2-amido ethyl) morpholine, N-(2-amido ethyl) piperazine, N-(2-amido ethyl)-N '-N-METHYL PIPERAZINE, N, N-dimethyl amido propyl group amine, N, N-diethylammonium amido propyl group amine, N, N-diisopropyl amido propyl group amine, N; N-diallyl amido propyl group amine, N, N-benzyl methyl aminocarbonyl propyl amine, N, N-dibenzyl amido propyl group amine, N; N-cyclohexyl methyl aminocarbonyl propyl amine, N, N-dicyclohexyl amido propyl group amine, N-(3-aminocarbonyl propyl) Pyrrolizidine, N-(3-aminocarbonyl propyl) piperidines, N-(3-aminocarbonyl propyl) morpholine, N-(3-aminocarbonyl propyl) piperazine, N-(3-aminocarbonyl propyl)-N '-methyl piperidine, 4-(N, N-dimethyl amido) benzyl amine, 4-(N; N-diethylammonium amido) benzyl amine, 4-(N, N-diisopropyl amido) benzyl amine, N, N;-dimethyl-isophorone diamine, N, N-dimethyl-diamine basic ring hexane, N, N; N '-trimethylammonium quadrol, N '-ethyl-N, N-dimethyl-ethylenediamine, N, N; N '-trimethylammonium quadrol, N '-ethyl-N, N-dimethylated propyl diethylenetriamine, N '-ethyl-N, N-dibenzyl amido propyl group amine; N, N-(diamine base propyl group)-N-methylamine, N, N-diamine base propyl group ethylamine, N; N-diamine base propyl group propyl group amine, N, N-diamine base propyl group butylamine, N, N-diamine base propyl group amylamine, N; N-diamine base propyl group hexyl amine, N, N-diamine base propyl group-2-DEHA, N, N-diamine base propyl group cyclo-hexylamine, N; N-diamine base propyl group benzyl amine, N, N-diamine base propyl group allyl amine, two [3-(N, N-dimethyl amido propyl group)] amine, two [3-(N; N-diethylammonium amido propyl group)] amine, two [3-(N, N-diisopropyl amido propyl group)] amine, two [3-(N, N-dibutyl amido propyl group)] amine etc.
As aforementioned isocyanate compound, for example can enumerate 2,4 toluene diisocyanate, 2; 6-tolylene diisocyanate, 4; The 4-diphenylmethanediisocyanate, stretch phenyl diisocyanate, xylylene vulcabond, tetramethyl-benzene dimethyl-vulcabond, tetramethylene diisocyanate, hexamethylene diisocyanate, from amino acid isocyanic ester, 1,4-stretches cyclohexyl diisocyanate, 4,4 '-two stretch cyclohexyl-methane vulcabond, 3; 3 '-dimethoxy-4 '; 4 '-stretch xenyl vulcabond, 1,5-naphthalene diisocyanate, 1,5-naphthane vulcabond, isophorone diisocyanate etc.
As the commercially available article of the compound of the spendable tool urea of the present invention structure, for example can enumerate Adekahardener EH-4380S (trade(brand)name of the amine type hardeners of the tool urea structure that (strain) ADEKA produces) " urea structure containing ratio (account in the compound-NHCONH-quality %): 22.8 quality % ", U-CAT3502T (the aromatic series dimethyl urea compound that SAN-APRO (strain) produces), U-CAT3503N (trade(brand)name of the aliphatics dimethyl urea compound that SAN-APRO (strain) produces), Dyhard UR500 (trade(brand)name of the aromatic series dimethyl urea compound that DEGUSSA Japan (strain) produces), Dyhard UR300 (trade(brand)name of the aromatic series dimethyl urea compound that DEGUSSA Japan (strain) produces), Dyhard UR200 (trade(brand)name of the aromatic series dimethyl urea compound that DEGUSSA Japan (strain) produces) etc.
Silicon Wafer of the present invention with the tackiness resin combination in, for the epoxy resin of 100 mass parts, make the compound of apparatus urea structure so that the structure of the urea in this compound part becomes 0.1～50 mass parts, be preferably 0.2～30 mass parts.When the part of tool urea structure (NHCONH-) be lower than 0.1 mass parts or when surpassing 50 mass parts unsuitable owing to can not get sufficient tackiness.
Silicon Wafer of the present invention with the tackiness resin combination in, when using epoxy resin, can together and use other resin.As above-mentioned other resin, for example can enumerate phenol resins, polyamide resin, polyimide resin, cyanate esters, phenoxy resin, polybutadiene rubber etc.
Silicon Wafer of the present invention is preferably with the tackiness resin combination and further contains phenol resins.Thus, can access high glass tansition temperatures, obdurability, water tolerance, chemical-resistant and high tack etc.
As above-mentioned phenol resins, have by phenols and aldehydes institute synthetic phenol resins.As above-mentioned phenols; For example can enumerate phenol, cresols, ethylphenol, n-propyl phenol, isopropyl-phenol, butylphenol, tributyl phenol, octyl phenol, nonylphenol, dodecyl phenol, cyclohexylphenol, chlorophenol, bromophenol, Resorcinol, catechol, quinhydrones, 2; Two (4-hydroxy phenyl) propane, 4 of 2-; 4 '-sulfo-biphenol, dihydroxyl ditan, naphthols, terpenes phenol, phenol Dicyclopentadiene (DCPD) etc. as aforementioned aldehydes, can be enumerated formaldehyde.
In addition, in the present invention, also can use the material that the part of phenols is replaced as the aromatics of biphenyl etc.Moreover, also can use with Dicyclopentadiene (DCPD) to link above-mentioned phenols and the phenol resins that obtains.
Silicon Wafer of the present invention is preferably further to contain with the tackiness resin combination to have phenol property hydroxyl with the amido adjoining position and is having the polyamide compound of the structure of the aromatic diamine that comes self-contained phenol property hydroxyl.Thus, further improve high glass tansition temperatures, obdurability, high tack and low heat expansion property.
Also have; Silicon Wafer of the present invention with the tackiness resin combination in, also can contain spun glass, thomel, Mierocrystalline cellulose, silica sand, cement, kaolin, clay, white lake, swollen soil, talcum, silica, micropowder silica, titanium oxide, carbon black, graphite, red stone, asphaltic substances, metallics as required, through the weighting agent or the pigment of resin particle that metal was covered etc., viscosity increaser; shake the change agent; incombustible agent, skimmer, rust-preventive agent; the conventional additives of colloided silica, colloidal alumina etc., moreover also can and with the resene of the tackyness of xylene resin, petroleum resin etc.
Particularly when and when using silica filler; Because not only the control of the thermal expansivity of compsn becomes easy; And Silicon Wafer of the present invention is improved with tackiness resin combination modulus of elasticity after heat embrittlement, hardening resin; Resin after the heat embrittlement becomes HS therefrom, and is therefore preferred.
Below come further explain Silicon Wafer of the present invention to use the tackiness resin combination through embodiment, but the present invention do not receive its limit.
[embodiment 1～11 and comparative example 1～5]
The resin combination of propylene glycol monomethyl ether with combination shown in below table 1 or the table 2 mixed; Coat on the Silicon Wafer; So that after the film thickness after the sclerosis becomes 30～40 μ m, removed solvents in 10 minutes and drying, spend 1 hour at 180 ℃ then and make hardening of resin 100 ℃ of costs.Use the test film of gained,, carry out the stripping test (cross cutting test) that zellglas sticks together adhesive tape, show the number of nubbin in the table according to the checker testing method of JIS D0202.Moreover, under 121 ℃/2.1 normal atmosphere/100%RH condition, after the pressure cooking of carrying out 96 hours is tested, carry out the cross cutting test, show the number of nubbin in the table.
Reference example (compound 1 synthetic that contains urea)
Prepare 162.5 and restrain isopropylcarbinols, 162.5 gram YLENE, 408 gram N, N-dimethyl amido propyl group amine and 148 grams 1, the 2-tn mixes stirring 30 minutes at 60～70 ℃.Then, so that the mode that the temperature in the reaction system does not rise, the 190 gram Adekaresin EP-4100E (bisphenol A type epoxy resins that Asahi Denka Co., Ltd. produces slowly drip; The trade(brand)name of epoxy equivalent (weight) 190), refluxed 2 hours and maturation.
And then, so that the mode that the temperature in the reaction system does not rise, xylene solution 666 grams of the isophorone diisocyanate 67 quality % that drip slowly.Drip and finish the back intensification,, confirm that through IR the absorption of isocyanic ester is 2250cm 140～150 ℃ of backflow maturations of carrying out 2 hours
-1Absorption disappear after, be warmed up to till 200, carry out 2 hours, non-pressurized desolventizing and handle.And then, carry out 1 hour decompression desolventizing at 190～200 ℃, 50～60mmHg, and obtain pale solid substance.
Table 1
Epoxy resin 1:Adekaresin EP-4100L (bisphenol A type epoxy resin that (strain) ADEEA produces)
Epoxy resin 2:EPICLON HP-4032 (the naphthalene type epoxy resin that big Japanese ink chemical industry (strain) is produced)
Epoxy resin 3:Adekaresin EP-4000L (the modified bisphenol A type epoxy resin that (strain) ADEEA produces)
Phenol resins: MEH-7851 (bright stretch biphenyl resin) with the phenol that changes into production
Stiffening agent 1: above-mentioned reference example contain the compound 1 that urea contains, urea structure containing ratio: 20.4 quality %
Stiffening agent 2:Adekahardener EH-4380S (amine type hardeners that contains the urea structure that (strain) ADEKA produces), urea structure containing ratio: 22.8 quality %
Stiffening agent 3: the resultant of reaction of isophorone diisocyanate and n n dimetylaniline (mol ratio 1: 2), the urea structure has closed rate: 18.6 quality %
Stiffening agent 4:1, the bisphenol type epoxy affixture of 2-tn
Stiffening agent 5:2-phenyl-4,5-dihydroxyl Methylimidazole
Stiffening agent 6: cyanoguanidine
Polyamide resin: have phenol property hydroxyl with the amido adjoining position and having the polyamide compound of the structure of the aromatic diamine that comes self-contained phenol property hydroxyl
Silica filler: SE2030-GRJ (the spherical silica of surface treatment that (strain) ADTEX produces)
Table 2
The result of table 1 and table 2 confirms for the epoxy resin of 100 mass parts, to contain the compound of tool urea structure, so that the structure of the urea in this compound part becomes the effect of the present invention of 0.1～50 mass parts.
Industrial applicibility
Silicon Wafer of the present invention is used the tackiness resin combination; Owing to have the good tackiness in sclerosis back for Silicon Wafer; When directly being assembled in other base material when not being only applicable to or with semiconductor element for other material of Pure Silicon Metal bonding; And it is can make composition itself become interlayer dielectric or protective membrane, so extremely useful on the industry.
Claims (9)
1. a Silicon Wafer is used the tackiness resin combination, it is characterized in that: for the epoxy resin of 100 mass parts, contain the compound of tool urea structure, so that the structure of the urea in this compound part becomes 0.1～50 mass parts.
2. Silicon Wafer as claimed in claim 1 is used the tackiness resin combination, it is characterized in that: also contain and have phenol property hydroxyl with the amido adjoining position and having the polyamide compound from the structure of the aromatic diamine of tool phenol property hydroxyl.
3. Silicon Wafer as claimed in claim 1 is used the tackiness resin combination, it is characterized in that: also contain phenol resins.
4. Silicon Wafer as claimed in claim 2 is used the tackiness resin combination, it is characterized in that: also contain phenol resins.
5. Silicon Wafer as claimed in claim 1 is used the tackiness resin combination, it is characterized in that: this epoxy resin is the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton.
6. Silicon Wafer as claimed in claim 2 is used the tackiness resin combination, it is characterized in that: this epoxy resin is the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton.
7. Silicon Wafer as claimed in claim 3 is used the tackiness resin combination, it is characterized in that: this epoxy resin is the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton.
8. Silicon Wafer as claimed in claim 4 is used the tackiness resin combination, it is characterized in that: this epoxy resin is the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton.
9. Silicon Wafer as claimed in claim 1 is used the tackiness resin combination, it is characterized in that: the compound of this tool urea structure is the resultant of reaction of amine compound and isocyanate compound.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-229185 | 2009-10-01 | ||
| JP2009229185A JP5565931B2 (en) | 2009-10-01 | 2009-10-01 | Silicon wafer adhesive resin composition |
| PCT/JP2010/005479 WO2011039948A1 (en) | 2009-10-01 | 2010-09-07 | Adhesive resin composition for silicon wafers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102575137A true CN102575137A (en) | 2012-07-11 |
| CN102575137B CN102575137B (en) | 2014-11-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080042465.3A Expired - Fee Related CN102575137B (en) | 2009-10-01 | 2010-09-07 | Adhesive resin composition for silicon wafers |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5565931B2 (en) |
| KR (1) | KR101638660B1 (en) |
| CN (1) | CN102575137B (en) |
| TW (1) | TWI504710B (en) |
| WO (1) | WO2011039948A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103059786A (en) * | 2011-10-21 | 2013-04-24 | 山东轻工业学院 | Adhesive for insulating materials |
| DE102011118760A1 (en) | 2011-11-15 | 2013-05-16 | Alzchem Ag | Use of N, N '(-dimethyl) -units and methods for curing epoxy resin compositions |
| CN115003726B (en) * | 2020-03-25 | 2023-12-05 | 株式会社艾迪科 | Curable resin composition and method for inhibiting curing shrinkage of curable resin composition |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049086A (en) * | 1999-08-09 | 2001-02-20 | Sumitomo Metal Mining Co Ltd | Electrically conductive resin composition |
| WO2001060938A1 (en) * | 2000-02-15 | 2001-08-23 | Hitachi Chemical Co., Ltd. | Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| WO2006129480A1 (en) * | 2005-05-31 | 2006-12-07 | Adeka Corporation | Hardenable epoxy resin composition |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56133856A (en) * | 1980-03-21 | 1981-10-20 | Nitto Electric Ind Co Ltd | Epoxy resin composition for sealing semiconductor |
| JP2004231932A (en) * | 2002-12-02 | 2004-08-19 | Nitto Denko Corp | Adhesive composition, adhesive film, and semiconductor device using this |
| JP2004189790A (en) * | 2002-12-09 | 2004-07-08 | Hitachi Chem Co Ltd | Resin paste composition and semiconductor device using the same |
| KR100938523B1 (en) * | 2005-02-23 | 2010-01-25 | 아사히 가세이 케미칼즈 가부시키가이샤 | Latent hardener for epoxy resin and epoxy resin composition |
| JP4662793B2 (en) * | 2005-03-01 | 2011-03-30 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Negative photosensitive resin composition containing epoxy-containing substance |
| WO2007088889A1 (en) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article |
-
2009
- 2009-10-01 JP JP2009229185A patent/JP5565931B2/en active Active
-
2010
- 2010-09-07 CN CN201080042465.3A patent/CN102575137B/en not_active Expired - Fee Related
- 2010-09-07 WO PCT/JP2010/005479 patent/WO2011039948A1/en active Application Filing
- 2010-09-07 KR KR1020127007294A patent/KR101638660B1/en active IP Right Grant
- 2010-09-13 TW TW099130893A patent/TWI504710B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049086A (en) * | 1999-08-09 | 2001-02-20 | Sumitomo Metal Mining Co Ltd | Electrically conductive resin composition |
| WO2001060938A1 (en) * | 2000-02-15 | 2001-08-23 | Hitachi Chemical Co., Ltd. | Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| WO2006129480A1 (en) * | 2005-05-31 | 2006-12-07 | Adeka Corporation | Hardenable epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5565931B2 (en) | 2014-08-06 |
| CN102575137B (en) | 2014-11-26 |
| WO2011039948A1 (en) | 2011-04-07 |
| JP2011074298A (en) | 2011-04-14 |
| KR20120090984A (en) | 2012-08-17 |
| KR101638660B1 (en) | 2016-07-11 |
| TWI504710B (en) | 2015-10-21 |
| TW201120172A (en) | 2011-06-16 |
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