KR101638660B1 - Adhesive resin composition for silicon wafers - Google Patents
Adhesive resin composition for silicon wafers Download PDFInfo
- Publication number
- KR101638660B1 KR101638660B1 KR1020127007294A KR20127007294A KR101638660B1 KR 101638660 B1 KR101638660 B1 KR 101638660B1 KR 1020127007294 A KR1020127007294 A KR 1020127007294A KR 20127007294 A KR20127007294 A KR 20127007294A KR 101638660 B1 KR101638660 B1 KR 101638660B1
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- KR
- South Korea
- Prior art keywords
- epoxy resin
- bisphenol
- skeleton
- resin composition
- diisocyanate
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3225—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
Abstract
The present invention relates to a silicone wafer adhesive resin composition which has good adhesion to a silicon wafer after curing, and is characterized in that a compound having a urea structure is added to 100 parts by weight of an epoxy resin, 0.1 to 50 parts by weight. The epoxy resin is preferably an epoxy resin having a bisphenol A skeleton or a bisphenol F skeleton, and the compound having a urea structure is preferably a reaction product of an amine compound and an isocyanate compound.
Description
The present invention relates to an adhesive resin composition, and more particularly to an epoxy resin composition containing a certain amount of a compound having a urea structure, which is remarkably excellent in adhesion to a silicon wafer.
2. Description of the Related Art In recent years, with the development of IT technology, various mounting techniques have been developed. Particularly, since the direct fixation of the semiconductor element, the insulating property, the adhesion with the substrate, and the like are indispensable for the process of various mounting techniques and the reliability of mounting, an adhesive for bonding a silicon wafer, which is a semiconductor, to another substrate is important. The application method of the adhesive is limited by the mounting form of the semiconductor, and examples of the main application method thereof include underfill, screen printing, inkjet, dry film laminates, spin coating and the like. The adhesive resin to be applied by such a method is required to have a low viscosity, a solvent-free property, a heat resistance after bonding, and the like depending on the application. As the curing mechanism, a thermosetting mechanism that can easily satisfy the above requirements is preferable.
However, as a resin having good adhesion to a silicon wafer, there is only a very small amount of resin such as solubilized polyimide, and it is not yet known that a thermosetting resin has good adhesion to a silicon wafer.
It is therefore an object of the present invention to provide a thermosetting resin composition that exhibits good adhesion to a silicon wafer.
The inventors of the present invention have made intensive investigations in order to achieve the above object, and as a result, they have found that an epoxy resin composition containing a urea structure in an amount of not less than a certain amount is extremely good, and have reached the present invention.
That is, the present invention is a silicone wafer adhesive resin composition comprising a compound having a urea structure in an amount of 0.1 to 50 parts by weight per 100 parts by weight of an epoxy resin so that the urea structure moiety is contained in the compound.
In the present invention, at least one selected from the group consisting of a polyamide compound having a phenolic hydroxyl group at a position adjacent to the amino group and having a structure derived from an aromatic diamine having a phenolic hydroxyl group, and a phenol resin It may contain a resin.
The epoxy resin is preferably an epoxy resin having a bisphenol A skeleton or a bisphenol F skeleton, and the compound having a urea structure is preferably a reaction product of an amine compound and an isocyanate compound.
The silicone wafer adhesive resin composition of the present invention is an epoxy resin cured product having a proper urea structure when thermally cured, so that it adheres extremely well to a silicon wafer.
Examples of the epoxy resin used in the present invention include polyglycidyl ether compounds of monocyclic polyhydric phenol compounds such as hydroquinone, resorcin, pyrocatechol, and fluoroglucinol; Dihydroxynaphthalene, biphenol, methylene bisphenol (bisphenol F), methylene bis (orthocresol), ethylidene bisphenol, isopropylidene bisphenol (bisphenol A), isopropylidene bis (orthocresol), tetrabromobisphenol A, 1,3-bis (4-hydroxycylbenzene), 1,4-bis (4-hydroxycylbenzene), 1,1,3- Tetra (4-hydroxyphenyl) ethane, thiobisphenol, sulfonylbisphenol, oxybisphenol, phenol novolac, orthocresol novolac, ethylphenol novolac, butylphenol novolak, octylphenol novolak, resorcinol novolac , Polyglycidyl ether compounds of polynuclear polyhydric phenol compounds such as terpene phenol; Polyglycidyl ethers of polyhydric alcohols such as ethylene glycol, propylene glycol, butylene glycol, hexanediol, polyglycols, thiodicyclool, glycerin, trimethylol propane, pentaerythritol, sorbitol and bisphenol A- Diester compounds; But are not limited to, maleic, fumaric, itaconic, succinic, glutaric, suberic, adipic, azela, sebacic, dimeric, trimeric, phthalic, Homopolymers or copolymers of glycidyl esters and glycidyl methacrylates of aliphatic, aromatic or alicyclic polybasic acids such as acetic acid, isophthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, and endomethylenetetrahydrophthalic acid; Epoxy compounds having glycidylamino groups such as N, N-diglycidyl aniline, bis (4- (N-methyl-N-glycidylamino) phenyl) methane and diglycidylorthotoluidine; Vinylcyclohexene diepoxide, dicyclopentadiene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-6-methylcyclohexylmethyl-6-methyl Epoxides of cyclic olefin compounds such as cyclohexanecarboxylate and bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate; Epoxidized conjugated diene polymers such as epoxidized polybutadiene and epoxidated styrene-butadiene copolymer, and heterocyclic compounds such as triglycidylisocyanurate.
The above-mentioned epoxy resin may be obtained by internal crosslinking with a prepolymer of terminal isocyanate, or by high molecular weight polymerization using a polyhydric active hydrogen compound (polyhydric phenol, polyamine, carbonyl group-containing compound, polyphosphoric acid ester, etc.).
The compound having a urea structure used in the present invention is preferably a reaction product of an amine compound and an isocyanate compound. Examples of the amine compound include alkylenediamines such as ethylenediamine, 1,2-diaminopropane, 1,3-diaminopropane, 1,3-diaminobutane, and 1,4-diaminobutane; Polyalkylpolyamines such as diethylenetriamine, triethylenetriamine, and tetraethylenepentamine; Alicyclic polyamines such as 1,3-diaminomethylcyclohexane, 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane and isophoronediamine; aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane and diaminodiphenylsulfone; Guanamine such as benzoguanamine and acetoguanamine; 2-methylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-isopropylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, Imidazoles such as phenyl-4-methyl-imidazole and 2-aminopropyl imidazole; There may be mentioned oxalic acid dihydrazide, malonic acid dihydrazide, succinic dihydrazide, glutaric acid dihydrazide, adipic acid dihydrazide, suberic acid dihydrazide, azelic acid dihydrazide, sebacic acid dihydrazide, phthalic acid dihydrazide Dihydrazide; N, N-dimethylaminoethylamine, N, N-diethylaminoethylamine, N, N-diisopropylaminoethylamine, N, N-diallylaminoethylamine, N, N, N-dibenzylaminoethylamine, N, N-dicyclohexylaminoethylamine, N- (2-aminoethyl) pyrrolidine, N- (2-aminoethyl) piperidine, N- (2-aminoethyl) piperazine, N- N, N-diethylaminopropylamine, N, N-diisopropylaminopropylamine, N, N-diallylaminopropylamine, N, N-benzylmethylaminopropylamine, N, Aminopropylamine, N, N-cyclohexylmethylaminopropylamine, N, N-dicyclohexylaminopropylamine, N- (3-aminopropyl) pyrrolidine, N- N- (3-aminopropyl) morpholine, N- (3-aminopropyl) pipera (N, N-diethylamino) benzylamine, 4- (N, N-dimethylamino) benzylamine, N- N, N'-trimethylethylenediamine, N'-ethyl-N, N-diisopropylamino) benzylamine, N, N-dimethylisophthalone diamine, N, N-dimethylbisaminocyclohexane, Dimethylethylenediamine, N, N, N'-trimethylethylenediamine, N'-ethyl-N, N-dimethylpropanediamine, N'-ethyl-N, N-dibenzylaminopropylamine; N, N-bisaminopropylpropylamine, N, N-bisaminopropylpropylamine, N, N-bis (aminopropyl) N, N-diisopropylethylamine, N, N-diisopropylethylamine, aminopropylpentylamine, N, N-bisaminopropylhexylamine, N, (N, N-dimethylaminopropyl) amine, bis [3- (N, N-dimethylaminopropyl) N-diisopropylaminopropyl)] amine, bis [3- (N, N-dibutylaminopropyl)] amine and the like.
Examples of the isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, phenylene diisocyanate, xylylene diisocyanate, Xylylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, lysine diisocyanate ester, 1,4-cyclohexylene diisocyanate, 4,4'-dicyclohexylene methane diisocyanate, 3,3'-dime 4,4'-biphenylene diisocyanate, 1,5-naphthalene diisocyanate, 1,5-tetrahydronaphthalene diisocyanate, isophorone diisocyanate, and the like.
Examples of commercial products of compounds having a urea structure that can be used in the present invention include Adeka Hardener EH-4380S (trade name of an amine-based curing agent having a urea structure of ADEKA Co., Ltd.) "urea structure content U-CAT 3503N (trade name of an aliphatic dimethyl urea compound manufactured by SANA PRO Co., Ltd.), Dyhard UR (trade name, manufactured by Nippon Kayaku Co., Ltd.), 22.8 wt% Dyhard UR 300 (trade name of aromatic gum urea compound, manufactured by Degussa Japan), Dyhard UR 200 (aromatic dimethyl aromatic compound, manufactured by Degussa Japan Co., Ltd.) (Trade name of urea compound).
In the silicone wafer adhesive resin composition of the present invention, the urea structure moiety in the compound is preferably 0.1 to 50 parts by weight, preferably 0.2 to 30 parts by weight per 100 parts by weight of the epoxy resin use. When the portion having a urea structure (-NHCONH-) is less than 0.1 part by weight or exceeds 50 parts by weight, sufficient adhesion can not be obtained, which is not preferable.
In the silicone wafer adhesive resin composition of the present invention, other resins may be used together with the epoxy resin. Examples of the other resin include phenol resin, polyamide resin, polyimide resin, cyanate ester compound, phenoxy resin, polybutadiene rubber and the like.
The silicone wafer adhesive resin composition of the present invention preferably further contains a phenolic resin. As a result, the inherent regions can be obtained in terms of temperature, toughness, water resistance, chemical resistance, and high adhesion.
As the phenol resin, there is a phenol resin synthesized from phenols and aldehydes. Examples of the phenol include phenol, cresol, ethylphenol, n-propylphenol, isopropylphenol, butylphenol, tert-butylphenol, octylphenol, nonylphenol, dodecylphenol, cyclohexylphenol, chlorophenol, (4-hydroxyphenyl) propane, 4,4'-thiodiphenol, dihydroxydiphenylmethane, naphthol, terpene phenol, phenol dicyclohexylcarbodiimide And chloropentadiene. Examples of the aldehyde include formaldehyde.
In the present invention, a part of the phenols may be substituted with an aromatic compound such as biphenyl. A phenol resin obtained by linking the phenols with dicyclopentadiene can also be used.
The silicone wafer adhesive resin composition of the present invention preferably further contains a polyamide compound having a phenolic hydroxyl group at a position adjacent to the amino group and having a structure derived from a phenolic hydroxyl group-containing aromatic diamine. Thereby, the inherent regions are further improved in temperature, toughness, high adhesion, and low thermal expansion.
The silicone wafer adhesive resin composition of the present invention may further contain additives such as glass fiber, carbon fiber, cellulose, silica, cement, kaolin, clay, aluminum hydroxide, bentonite, talc, silica, fine powder silica, , Fillers or pigments such as graphite, iron oxide, bituminous material, metal particles, resin particles coated with metal, and the like; Thickener; Thixotropic agents; Flame retardant; Defoamer; Waterproofing agent; Colloidal silica, colloidal alumina and the like may be added, or a tacky resin such as xylene resin or petroleum resin may be used in combination.
Particularly when a silica filler is used in combination, not only the control of the coefficient of thermal expansion of the composition becomes easy, but also the elasticity of the cured resin after the heat curing of the silicone wafer adhesive resin composition of the present invention is improved, Is preferable because of its high strength.
The silicone wafer adhesive resin composition of the present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.
[Examples 1 to 11 and Comparative Examples 1 to 5]
The resin composition shown in Tables 1 or 2 and propylene glycol monomethyl ether were mixed and applied on a silicon wafer so that the film thickness after curing became 30 to 40 占 퐉 and the solvent was removed at 100 占 폚 for 10 minutes And then the resin was cured at 180 캜 for 1 hour. The obtained test pieces were subjected to a fill test (cross-cut test) using a cellophane adhesive tape conforming to the cross-cut test method of JIS DO202, and the number of the remaining portions was shown in the table. Further, a pressure cooker test was conducted for 96 hours under the condition of 121 占 폚 / 2.1 atm / 100% RH, followed by a crosscut test, and the number of the remaining portions was shown in the table.
Reference Example (Synthesis of urea-containing Compound 1)
162.5 g of isobutanol, 162.5 g of xylene, 408 g of N, N-dimethylaminopropylamine and 148 g of 1,2-propanediamine were charged and stirred and mixed at 60 to 70 DEG C for 30 minutes. Next, 190 g of Adeka Resin EP-4100E (bisphenol A type epoxy resin manufactured by ADEKA Corporation, trade name of epoxy equivalent 190) was slowly added dropwise so that the temperature in the reaction system did not rise, and the mixture was refluxed for 2 hours and aged.
Further, 666 g of a 67% by weight xylene solution of isophorone diisocyanate was slowly added dropwise so that the temperature in the reaction system did not rise. After completion of the dropwise addition, the temperature was raised, and the mixture was aged at 140 to 150 ° C for 2 hours under reflux. After confirming that the absorption of 2,250 cm -1 , which is absorption of isocyanate by IR, disappeared, the temperature was raised to 200 ° C, Respectively. And further subjected to vacuum degassing at 190 to 200 DEG C and 50 to 60 mmHg for 1 hour to obtain a pale-colored solid.
[Table 1]
[Table 2]
The results of Tables 1 and 2 demonstrate the effect of the present invention that the compound having a urea structure is contained in an amount of 0.1 to 50 parts by weight based on 100 parts by weight of the epoxy resin.
The silicone wafer adhesive resin composition of the present invention has good adhesion to a silicon wafer after curing and is useful when bonding different materials to metal silicon or when mounting semiconductor devices directly on different substrates Alternatively, the composition itself may be used as an interlayer insulating film or a protective film, and thus is extremely useful in industry.
Claims (9)
The adhesive resin composition for a silicon wafer, which further comprises a polyamide compound having a phenolic hydroxyl group at a position adjacent to the amino group and having a structure derived from an aromatic diamine having a phenolic hydroxyl group.
Also disclosed is a silicone wafer adhesive resin composition comprising a phenol resin.
Also disclosed is a silicone wafer adhesive resin composition comprising a phenol resin.
Wherein the epoxy resin is an epoxy resin having a bisphenol A skeleton or a bisphenol F skeleton.
Wherein the epoxy resin is an epoxy resin having a bisphenol A skeleton or a bisphenol F skeleton.
Wherein the epoxy resin is an epoxy resin having a bisphenol A skeleton or a bisphenol F skeleton.
Wherein the epoxy resin is an epoxy resin having a bisphenol A skeleton or a bisphenol F skeleton.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2009-229185 | 2009-10-01 | ||
| JP2009229185A JP5565931B2 (en) | 2009-10-01 | 2009-10-01 | Silicon wafer adhesive resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120090984A KR20120090984A (en) | 2012-08-17 |
| KR101638660B1 true KR101638660B1 (en) | 2016-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127007294A KR101638660B1 (en) | 2009-10-01 | 2010-09-07 | Adhesive resin composition for silicon wafers |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5565931B2 (en) |
| KR (1) | KR101638660B1 (en) |
| CN (1) | CN102575137B (en) |
| TW (1) | TWI504710B (en) |
| WO (1) | WO2011039948A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103059786A (en) * | 2011-10-21 | 2013-04-24 | 山东轻工业学院 | Adhesive for insulating materials |
| DE102011118760A1 (en) | 2011-11-15 | 2013-05-16 | Alzchem Ag | Use of N, N '(-dimethyl) -units and methods for curing epoxy resin compositions |
| CN115003726B (en) * | 2020-03-25 | 2023-12-05 | 株式会社艾迪科 | Curable resin composition and method for inhibiting curing shrinkage of curable resin composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049086A (en) | 1999-08-09 | 2001-02-20 | Sumitomo Metal Mining Co Ltd | Electrically conductive resin composition |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56133856A (en) * | 1980-03-21 | 1981-10-20 | Nitto Electric Ind Co Ltd | Epoxy resin composition for sealing semiconductor |
| US20030069331A1 (en) * | 2000-02-15 | 2003-04-10 | Inada Teiichi | Adhesive composition , process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| JP2004231932A (en) * | 2002-12-02 | 2004-08-19 | Nitto Denko Corp | Adhesive composition, adhesive film, and semiconductor device using this |
| JP2004189790A (en) * | 2002-12-09 | 2004-07-08 | Hitachi Chem Co Ltd | Resin paste composition and semiconductor device using the same |
| KR100938523B1 (en) * | 2005-02-23 | 2010-01-25 | 아사히 가세이 케미칼즈 가부시키가이샤 | Latent hardener for epoxy resin and epoxy resin composition |
| JP4662793B2 (en) * | 2005-03-01 | 2011-03-30 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Negative photosensitive resin composition containing epoxy-containing substance |
| KR101262143B1 (en) * | 2005-05-31 | 2013-05-15 | 가부시키가이샤 아데카 | Hardenable epoxy resin composition |
| WO2007088889A1 (en) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article |
-
2009
- 2009-10-01 JP JP2009229185A patent/JP5565931B2/en active Active
-
2010
- 2010-09-07 CN CN201080042465.3A patent/CN102575137B/en not_active Expired - Fee Related
- 2010-09-07 WO PCT/JP2010/005479 patent/WO2011039948A1/en active Application Filing
- 2010-09-07 KR KR1020127007294A patent/KR101638660B1/en active IP Right Grant
- 2010-09-13 TW TW099130893A patent/TWI504710B/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001049086A (en) | 1999-08-09 | 2001-02-20 | Sumitomo Metal Mining Co Ltd | Electrically conductive resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102575137A (en) | 2012-07-11 |
| JP5565931B2 (en) | 2014-08-06 |
| CN102575137B (en) | 2014-11-26 |
| WO2011039948A1 (en) | 2011-04-07 |
| JP2011074298A (en) | 2011-04-14 |
| KR20120090984A (en) | 2012-08-17 |
| TWI504710B (en) | 2015-10-21 |
| TW201120172A (en) | 2011-06-16 |
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