CN103059786A - Adhesive for insulating materials - Google Patents
Adhesive for insulating materials Download PDFInfo
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- CN103059786A CN103059786A CN2011103212287A CN201110321228A CN103059786A CN 103059786 A CN103059786 A CN 103059786A CN 2011103212287 A CN2011103212287 A CN 2011103212287A CN 201110321228 A CN201110321228 A CN 201110321228A CN 103059786 A CN103059786 A CN 103059786A
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- insulating material
- epoxy
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Abstract
The invention relates to an adhesive for insulating materials. The adhesive is composed of the following components by weight: 80-90 parts of epoxy resin, 3-5 parts of isocyanate, 2-3 parts of acetone, 2-3 parts of quartz powder, 0.5-1 part of silica-gel powder and 1-2 parts of ethylenediamine. And the adhesive is prepared by: weighing the raw materials and mixing them evenly, conducting curing at room temperature for 12-24h, and then performing curing at 40-50DEG C for 5-7h. With good water resistance, oil resistance, alcohol resistance and heat resistance, the adhesive provided in the invention has high resistivity, and is suitable for bonding of insulating materials, especially bonding of plastic, wood, floor, and decorative materials, etc.
Description
Technical field
The present invention discloses a kind of sizing agent.
Background technology
The characteristics such as glued joint (bonding, bonding, cementing, gluing) and refer to the technology that homogeneity or heterogeneous body surface link together with sizing agent, it is continuous to have stress distribution, lightweight, or sealing, and most technological temperatures are low.Glued joint and to be specially adapted to unlike material, different thickness, ultra-thin specification and to be connected connection with complex component.Show also four kinds of different situations now during glue-joint failure from the cementitious system breaking test: 1. interfacial failure: adhesive layer all separates (the complete disengaging in gluing interface) with sticking surface; 2. force of cohesion destroys: destroy and occur in sizing agent or clung body itself, and not between gluing interface; 3. mix to destroy: adherend and adhesive layer itself have in partial destruction or the two and only have one.These destroy explanation bonding strengths not only with relevant by reactive force between stick and the adherend, also with the molecule of polymkeric substance sizing between reactive force relevant.
Resins, epoxy is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule, and except indivedual, their relative molecular mass is not high.The molecular structure of Resins, epoxy is to contain active epoxide group to be its feature in molecular chain, and epoxide group can be positioned at the end, centre of molecular chain or structure circlewise.Owing to contain active epoxide group in the molecular structure, make them can form with polytype solidifying agent generation crosslinking reaction insoluble, the not molten cancellated superpolymer of three-dimensional that has.Epoxy adhesive can make self-vulcanizing and the two kinds of glue that are heating and curing because of the difference of filling a prescription, and is mainly used to bonded metal, glass, pottery, rubber, timber, plastics etc.The epoxy glue of bi-component package of supply has room temperature curing type in the market, such as SW-3, and HY-914, CJ-90, AD-V, the trades mark such as No. 2, CX-212, KD-504 and agricultural machinery.Middle temperature (about 80 ℃) is solidified glue JW-1, J-32 etc.
Its main component of organosilicon gluing agent is organic silica protective embankment.It has good UV resistant, anti-ozone, resistant to chemical media and humidity, also has good thermostability and low temperature flexibility.The materials such as its energy bonded metal, glass, pottery especially can bonding bonding silicon rubber, the viton etc. of usually being difficult for.
Do not have in the world multi-purpose adhesive, different adherends is preferably selected special-purpose sizing agent.For insulating material, the sizing agent that needs needs water-tolerant, resistivity height.
Summary of the invention
Purpose of the present invention has just provided a kind of adhesive for insulating material, and this kind sizing agent is fit to the bonding of insulating material.
The present invention is achieved by the following technical solutions:
A kind of adhesive for insulating material, its weight part ratio consists of: Resins, epoxy 80-90 part, isocyanic ester 3-5 part, acetone 2-3 part, silica powder 2-3 part, silica-gel powder 0.5-1 part and quadrol 1-2 part.
Described adhesive for insulating material, its weight part ratio composition is preferably: 85 parts of Resins, epoxy, 3 parts of isocyanic ester, 3 parts in acetone, 2 parts of silica powders, 2 parts of 1 part of silica-gel powder and quadrols.
The preparation method of above-mentioned adhesive for insulating material: mix behind each raw material of weighing, solidified 12-24 hour under the room temperature, again 40-50 ℃ of lower curing 5-7 hour.
The present invention combines Resins, epoxy, isocyanic ester, silica powder, silica-gel powder, makes solidifying agent with quadrol, and two sections curing reactions make sizing agent.The gained sizing agent is water-fast, oil resistant, ethanol-tolerant, resistance toheat are better, and resistivity is large, is applicable to the bonding of the bonding of insulating material, particularly plastics, timber, floor, finishing material etc.
Embodiment
Below the present invention will be further described.
Embodiment 1
A kind of adhesive for insulating material, its weight part ratio consists of: 90 parts of Resins, epoxy, 4 parts of isocyanic ester, 3 parts in acetone, 2 parts of silica powders, 2 parts of 0.5 part of silica-gel powder and quadrols.
The preparation method of described adhesive for insulating material: mix behind each raw material of weighing, solidified 12 hours under the room temperature, again 50 ℃ of lower curing 7 hours.
Embodiment 2
A kind of adhesive for insulating material, its weight part ratio consists of: 80 parts of Resins, epoxy, 5 parts of isocyanic ester, 2 parts in acetone, 3 parts of silica powders, 1 part of 1 part of silica-gel powder and quadrol.
The preparation method of described adhesive for insulating material: mix behind each raw material of weighing, solidified 24 hours under the room temperature, again 40 ℃ of lower curing 5 hours.
Embodiment 3
A kind of adhesive for insulating material, its weight part ratio consists of: 85 parts of Resins, epoxy, 3 parts of isocyanic ester, 3 parts in acetone, 2 parts of silica powders, 2 parts of 1 part of silica-gel powder and quadrols.
Simultaneous test
Control group 1:HYJ-26 epoxy adhesive.
Control group 2:HY-3 sizing agent.
Experimental group 1 embodiment of the invention 1 prescription.
Experimental group 2 embodiment of the invention 3 prescriptions.
Table 1
Claims (3)
1. an adhesive for insulating material is characterized in that, its weight part ratio consists of: Resins, epoxy 80-90 part, isocyanic ester 3-5 part, acetone 2-3 part, silica powder 2-3 part, silica-gel powder 0.5-1 part and quadrol 1-2 part.
2. adhesive for insulating material according to claim 1 is characterized in that, its weight part ratio consists of: 85 parts of Resins, epoxy, 3 parts of isocyanic ester, 3 parts in acetone, 2 parts of silica powders, 2 parts of 1 part of silica-gel powder and quadrols.
3. the preparation method of claim 1 or 2 described adhesive for insulating materials is characterized in that, mixes behind each raw material of weighing, solidifies 12-24 hour under the room temperature, again 40-50 ℃ of lower curing 5-7 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103212287A CN103059786A (en) | 2011-10-21 | 2011-10-21 | Adhesive for insulating materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103212287A CN103059786A (en) | 2011-10-21 | 2011-10-21 | Adhesive for insulating materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103059786A true CN103059786A (en) | 2013-04-24 |
Family
ID=48102695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103212287A Pending CN103059786A (en) | 2011-10-21 | 2011-10-21 | Adhesive for insulating materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103059786A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103289623A (en) * | 2013-05-24 | 2013-09-11 | 苏州富通高新材料科技股份有限公司 | Bi-component adhesive for wood floor |
| CN103911091A (en) * | 2014-04-02 | 2014-07-09 | 施朗格(漳州)建材科技有限公司 | Marble high-strength complex glue |
| CN104559885A (en) * | 2014-12-17 | 2015-04-29 | 唐华烨 | Phenol propane epoxy resin adhesive |
| CN106146958A (en) * | 2016-07-05 | 2016-11-23 | 安徽三彩工贸有限责任公司 | A kind of additive of silica gel special on mouse pad |
| CN107652905A (en) * | 2017-10-03 | 2018-02-02 | 江苏联禹智能工程有限公司 | A kind of adhesive for being used to prepare building block |
| CN109111886A (en) * | 2018-08-24 | 2019-01-01 | 湖州市南浔三亚家私有限公司 | Timber floor adhesive and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1064093A (en) * | 1991-02-09 | 1992-09-02 | 辽阳市文圣化工总厂 | With boron mud and corrosion-resistant insulation adhesive of producing of diamines residue and preparation method thereof |
| CN1757693A (en) * | 2005-11-03 | 2006-04-12 | 南京航空航天大学 | Wet-adhering, quick-curing binder for stone type cultural relic |
| CN101173085A (en) * | 2007-10-25 | 2008-05-07 | 长江水利委员会长江科学院 | Crash resistant composite material and method for producing the same |
| WO2011039948A1 (en) * | 2009-10-01 | 2011-04-07 | 株式会社Adeka | Adhesive resin composition for silicon wafers |
-
2011
- 2011-10-21 CN CN2011103212287A patent/CN103059786A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1064093A (en) * | 1991-02-09 | 1992-09-02 | 辽阳市文圣化工总厂 | With boron mud and corrosion-resistant insulation adhesive of producing of diamines residue and preparation method thereof |
| CN1757693A (en) * | 2005-11-03 | 2006-04-12 | 南京航空航天大学 | Wet-adhering, quick-curing binder for stone type cultural relic |
| CN101173085A (en) * | 2007-10-25 | 2008-05-07 | 长江水利委员会长江科学院 | Crash resistant composite material and method for producing the same |
| WO2011039948A1 (en) * | 2009-10-01 | 2011-04-07 | 株式会社Adeka | Adhesive resin composition for silicon wafers |
Non-Patent Citations (1)
| Title |
|---|
| 孔望清等: "乙二胺的应用及其下游产品开发", 《河北化工》, no. 3, 31 March 2005 (2005-03-31) * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103289623A (en) * | 2013-05-24 | 2013-09-11 | 苏州富通高新材料科技股份有限公司 | Bi-component adhesive for wood floor |
| CN103911091A (en) * | 2014-04-02 | 2014-07-09 | 施朗格(漳州)建材科技有限公司 | Marble high-strength complex glue |
| CN103911091B (en) * | 2014-04-02 | 2016-01-13 | 施朗格(漳州)建材科技有限公司 | A kind of marble high-strength complex rubber alloy |
| CN104559885A (en) * | 2014-12-17 | 2015-04-29 | 唐华烨 | Phenol propane epoxy resin adhesive |
| CN106146958A (en) * | 2016-07-05 | 2016-11-23 | 安徽三彩工贸有限责任公司 | A kind of additive of silica gel special on mouse pad |
| CN107652905A (en) * | 2017-10-03 | 2018-02-02 | 江苏联禹智能工程有限公司 | A kind of adhesive for being used to prepare building block |
| CN109111886A (en) * | 2018-08-24 | 2019-01-01 | 湖州市南浔三亚家私有限公司 | Timber floor adhesive and preparation method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130424 |