CN104559885A - Phenol propane epoxy resin adhesive - Google Patents
Phenol propane epoxy resin adhesive Download PDFInfo
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- CN104559885A CN104559885A CN201410779747.1A CN201410779747A CN104559885A CN 104559885 A CN104559885 A CN 104559885A CN 201410779747 A CN201410779747 A CN 201410779747A CN 104559885 A CN104559885 A CN 104559885A
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- epoxy resin
- propane epoxy
- phenolic group
- resin adhesive
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- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention provides a phenol propane epoxy resin adhesive. The phenol propane epoxy resin adhesive is prepared from the following raw materials in parts by weight: 50-100 parts of phenol propane epoxy resin, 40-60 parts of polystyrene, 40-80 parts of acrylate copolymer, 5-10 parts of nitrile rubber, 4-6 parts of isocyanate and 0.5-1.5 parts of silica gel powder. The phenol propane epoxy resin adhesive has the beneficial effects that the phenol propane epoxy resin is matched with the silica gel powder so that the curing speed can be obviously reduced, and meanwhile, the adhesive is excellent in adhesive property and high in temperature resistance, long in service life and wide in application range.
Description
Technical field
The invention belongs to sizing agent manufacture field, be specifically related to a kind of phenolic group propane epoxy resin adhesive.
Background technology
Sizing agent is a kind of material that similar or inhomogeneous material tight can be combined.Along with development that is scientific and technical and national economy, tackiness agent has been widely used in every profession and trade and the high-tech areas such as wood working, construction work, textile printing and dyeing, shoemaking, leather, electronics, automobile, machinery, aerospace, biologic medical.Current sizing agent ubiquity the shortcomings such as curing speed is slow, cementability is poor, high thermal resistance is poor.In order to overcome these shortcomings, by improving formula, thus produce a kind of Novel adhesive.
Summary of the invention
It is fast that technical problem to be solved by this invention is to provide a kind of curing speed, and have the phenolic group propane epoxy resin adhesive of good cementability and high thermal resistance.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of phenolic group propane epoxy resin adhesive, it is made up of the raw material of following weight part: phenolic group propane epoxy resin 50-100 part, polystyrene 40-60 part, acrylate copolymer 40-80 part, paracril 5-10 part, isocyanic ester 4-6 part, silica-gel powder 0.5-1.5 part.
Further, the preparation process of above-mentioned sizing agent is: take each raw material by formula ratio, phenolic group propane epoxy resin, polystyrene, acrylate copolymer, paracril and isocyanic ester are dropped in reactor, be heated to 100-120 DEG C, under the speed of 2000-2700r/min, stir 2-2.5h, then add silica-gel powder under room temperature, solidification 12-20h, be heated to 45-55 DEG C, solidification 6-8h, obtains finished product.
Preferably, above-mentioned sizing agent is made up of the raw material of following weight part: phenolic group propane epoxy resin 80 parts, polystyrene 50 parts, acrylate copolymer 60 parts, paracril 7 parts, isocyanic ester 5 parts, silica-gel powder 1.2 parts.
Compared with prior art, the invention has the beneficial effects as follows: the present invention adopt phenolic group propane epoxy resin and silica-gel powder with the use of, obviously can reduce curing speed, have the cementability and high thermal resistance of applauding, long service life, use range is wide simultaneously.
Embodiment
Below in conjunction with embodiment, the present invention is described in further details.
Embodiment 1
A kind of phenolic group propane epoxy resin adhesive, it is made up of the raw material of following weight part: phenolic group propane epoxy resin 50 parts, polystyrene 40 parts, acrylate copolymer 40 parts, paracril 5 parts, isocyanic ester 4 parts, silica-gel powder 0.5 part.
The preparation process of above-mentioned sizing agent is: take each raw material by formula ratio, phenolic group propane epoxy resin, polystyrene, acrylate copolymer, paracril and isocyanic ester are dropped in reactor, be heated to 100 DEG C, 2h is stirred under the speed of 2000r/min, then add silica-gel powder under room temperature, solidification 14h, is heated to 45 DEG C, solidification 6h, obtains finished product.
Embodiment 2
A kind of phenolic group propane epoxy resin adhesive, it is made up of the raw material of following weight part: phenolic group propane epoxy resin 80 parts, polystyrene 50 parts, acrylate copolymer 60 parts, paracril 7 parts, isocyanic ester 5 parts, silica-gel powder 1.2 parts.
The preparation process of above-mentioned sizing agent is: take each raw material by formula ratio, phenolic group propane epoxy resin, polystyrene, acrylate copolymer, paracril and isocyanic ester are dropped in reactor, be heated to 120 DEG C, 2.2h is stirred under the speed of 2500r/min, then add silica-gel powder under room temperature, solidification 16h, is heated to 50 DEG C, solidification 7h, obtains finished product.
Embodiment 3
A kind of phenolic group propane epoxy resin adhesive, it is made up of the raw material of following weight part: phenolic group propane epoxy resin 100 parts, polystyrene 60 parts, acrylate copolymer 80 parts, paracril 10 parts, isocyanic ester 6 parts, silica-gel powder 1.5 parts.
The preparation process of above-mentioned sizing agent is: take each raw material by formula ratio, phenolic group propane epoxy resin, polystyrene, acrylate copolymer, paracril and isocyanic ester are dropped in reactor, be heated to 120 DEG C, 2.5h is stirred under the speed of 2700r/min, then add silica-gel powder under room temperature, solidification 20h, is heated to 55 DEG C, solidification 8h, obtains finished product.
Finally it should be noted that, the foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although with reference to previous embodiment to invention has been detailed description, for a person skilled in the art, it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. a phenolic group propane epoxy resin adhesive, is characterized in that, it is made up of the raw material of following weight part: phenolic group propane epoxy resin 50-100 part, polystyrene 40-60 part, acrylate copolymer 40-80 part, paracril 5-10 part, isocyanic ester 4-6 part, silica-gel powder 0.5-1.5 part.
2. the preparation process of a kind of phenolic group propane epoxy resin adhesive according to claim 1 is: take each raw material by formula ratio, phenolic group propane epoxy resin, polystyrene, acrylate copolymer, paracril and isocyanic ester are dropped in reactor, be heated to 100-120 DEG C, 2-2.5h is stirred under the speed of 2000-2700r/min, then add silica-gel powder under room temperature, solidification 12-20h, is heated to 45-55 DEG C, solidification 6-8h, obtains finished product.
3. a kind of phenolic group propane epoxy resin adhesive according to claim 1, it is characterized in that, this sizing agent is made up of the raw material of following weight part: phenolic group propane epoxy resin 80 parts, polystyrene 50 parts, acrylate copolymer 60 parts, paracril 7 parts, isocyanic ester 5 parts, silica-gel powder 1.2 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410779747.1A CN104559885A (en) | 2014-12-17 | 2014-12-17 | Phenol propane epoxy resin adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410779747.1A CN104559885A (en) | 2014-12-17 | 2014-12-17 | Phenol propane epoxy resin adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104559885A true CN104559885A (en) | 2015-04-29 |
Family
ID=53076983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410779747.1A Pending CN104559885A (en) | 2014-12-17 | 2014-12-17 | Phenol propane epoxy resin adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104559885A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106221634A (en) * | 2016-08-22 | 2016-12-14 | 安徽大松树脂有限公司 | A kind of thermal resistance and acid-alkali resistance modified polyurethane adhesive for shoes |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006096834A (en) * | 2004-09-29 | 2006-04-13 | Toagosei Co Ltd | Adhesive composition including epoxy resin |
| CN101343399A (en) * | 2008-09-02 | 2009-01-14 | 中南大学 | Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method |
| CN103059786A (en) * | 2011-10-21 | 2013-04-24 | 山东轻工业学院 | Adhesive for insulating materials |
| CN103788910A (en) * | 2014-02-20 | 2014-05-14 | 铜陵祥云消防科技有限责任公司 | Packaging adhesive containing modified sepiolite powder |
-
2014
- 2014-12-17 CN CN201410779747.1A patent/CN104559885A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006096834A (en) * | 2004-09-29 | 2006-04-13 | Toagosei Co Ltd | Adhesive composition including epoxy resin |
| CN101343399A (en) * | 2008-09-02 | 2009-01-14 | 中南大学 | Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method |
| CN103059786A (en) * | 2011-10-21 | 2013-04-24 | 山东轻工业学院 | Adhesive for insulating materials |
| CN103788910A (en) * | 2014-02-20 | 2014-05-14 | 铜陵祥云消防科技有限责任公司 | Packaging adhesive containing modified sepiolite powder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106221634A (en) * | 2016-08-22 | 2016-12-14 | 安徽大松树脂有限公司 | A kind of thermal resistance and acid-alkali resistance modified polyurethane adhesive for shoes |
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Application publication date: 20150429 |
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| RJ01 | Rejection of invention patent application after publication |