CN105199317A - Method for preparing high-tenacity high-strength epoxy-resin-based conductive composite - Google Patents
Method for preparing high-tenacity high-strength epoxy-resin-based conductive composite Download PDFInfo
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- CN105199317A CN105199317A CN201510590328.8A CN201510590328A CN105199317A CN 105199317 A CN105199317 A CN 105199317A CN 201510590328 A CN201510590328 A CN 201510590328A CN 105199317 A CN105199317 A CN 105199317A
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Abstract
The invention relates to a method for preparing a high-tenacity high-strength epoxy-resin-based conductive composite. The method is characterized in that thermoplastic resin is adopted as flexibilizer, carbon fiber sheets are adopted as enhancer, carbon fiber sheets, carbon nanotubes and metal powder are adopted as conductive filler, epoxy resin is adopted as a base body, thermal polymerization initiator is adopted as a curing agent, dichloromethane and chloroform are adopted as solvents, and the epoxy-resin-based conductive composite is prepared through a blending method. The high-tenacity high-strength epoxy-resin-based conductive composite is prepared from, by mass, 100 parts of epoxy resin, 0.01-5 parts of thermal polymerization initiator, 1-8 layers of carbon fiber sheets, 1-10 parts of thermoplastic resin, 0.1-5 parts of carbon nanotubes, 1-10 parts of metal powder and 5-50 parts of solvents. The preparation method is simple, and the obtained high-tenacity high-strength epoxy-resin-based conductive composite has excellent impact strength, bending strength and conductive performance.
Description
Technical field
The invention belongs to high-performance conductive technical field of high-molecule composite preparation, be specifically related to a kind of preparation method of high-toughness high-strength epoxy resin based conductive composite material.
Background technology
Along with the fast development of electronic industry and information technology, the macromolecular material with certain conductivity is more and more subject to the favor of people, and countries in the world being are all are being researched and developed this emerging functional materials energetically.Epoxy resin is a kind of thermosetting resin, has excellent mechanical property and physicals, is widely used in the aspects such as space flight and aviation, electronic product, material of construction, tackiness agent.Because epoxy resin cured product has lower shock strength and insulating property, greatly limit its application at some high-technology field.
The toughness improving epoxy resin adopts blending and modifying approach usually, adds in epoxy resin as toughner as used fluid rubber, thermoplastic resin etc.Aforesaid method can improve the toughness of epoxy resin, but reduces the rigidity of epoxy resin.The method improving epoxy resin conductivity is in epoxy resin, add a certain amount of charcoal system or metal charge.The shortcoming of the method reduces the mechanical property of epoxy resin while of improving epoxy resin conductivity.At present, to there is not yet with thermoplastic resin and carbon cloth as the solidifying agent that toughner and toughener, carbon cloth, carbon nanotube and metal powder are conductive filler material, epoxy resin is matrix, thermal polymerization is epoxy resin, prepare the bibliographical information of high-toughness high-strength epoxy resin based conductive composite material.
Summary of the invention
The object of the present invention is to provide a kind of preparation method of high-toughness high-strength epoxy resin based conductive composite material.The present invention take thermal polymerization as the solidifying agent of epoxy resin, use thermoplastic resin and carbon cloth as toughner and toughener, with carbon cloth, carbon nanotube and metal powder for conductive filler material, prepare the epoxy resin based conductive composite material of high comprehensive performance.The high-toughness high-strength epoxy resin based conductive composite material of gained has excellent shock strength, flexural strength and conductivity.
The technical solution used in the present invention: a kind of preparation method of high-toughness high-strength epoxy resin based conductive composite material, it is characterized in that: high-toughness high-strength epoxy resin based conductive composite material is by epoxy resin 100 mass parts, thermal polymerization 0.01-5 mass parts, carbon cloth 1-8 layer, thermoplastic resin 1-10 mass parts, carbon nanotube 0.1-5 mass parts, metal powder 1-10 mass parts and solvent 5-50 mass parts composition;
Above-mentioned epoxy resin, thermal polymerization, thermoplastic resin, carbon nanotube, metal powder and solvent are added in mixing kettle according to quality proportioning, stirs 1-8 hour, at 50-200
oc and decompression go down to desolventize.Epoxy resin composition and carbon cloth are put into mould, at 4-14MPa and 60-200
obe pressed into sheet material with vulcanizing press under C, finally cool, obtain described high-toughness high-strength epoxy resin based conductive composite material.
Described epoxy resin is bisphenol A type epoxy resin; Described thermal polymerization is hexafluoro-antimonic acid phenmethyl quinoxaline; Described thermoplastic resin is polysulfones, polycarbonate or polyethersulfone; Described carbon nanotube is carboxylic carbon nano-tube; Described metal powder is copper powder or aluminium powder; Described solvent is methylene dichloride or chloroform.
Beneficial effect of the present invention: first important technical measures of the present invention use thermoplastic resin and carbon cloth modified epoxy, contributes to the shock strength and the flexural strength that improve epoxy resin.Second important technical measures of the present invention use carbon cloth, carbon nanotube and metal powder as conductive filler material, can improve the conductivity of epoxy resin.3rd important measures of the present invention are the solidifying agent using thermal polymerization as epoxy resin, can increase the operating time of resin, simplify moulding process again.
Embodiment
The following examples further illustrate of the present invention, instead of restriction is to protection scope of the present invention.
Embodiment 1
Epoxy resin: the epoxy resin used in the present embodiment is 184-200g/mol for epoxy resin E51, epoxy equivalent (weight), is produced by Xingchen Synthetic Matrials Co., Ltd., Nantong.
Thermal polymerization: the thermal polymerization used in the present embodiment is hexafluoro-antimonic acid phenmethyl quinoxaline, and its building-up process is as follows:
Quinoxaline in molar ratio: cylite=1.0:1.2 adds in reactor, then adds acetonitrile, at room temperature stirring reaction 48 hours.Filtered by the mixture be obtained by reacting, and clean decorating film with acetonitrile, drying obtains intermediate.Weigh and the equimolar sodium hexafluoroantimonate of intermediate, be made into hexafluoro-antimonic acid sodium water solution.Added by intermediate in hexafluoro-antimonic acid sodium water solution, at room temperature stir 30 minutes, suction filtration, with ether cleaning, recrystallization in methyl alcohol, obtains white crystal hexafluoro-antimonic acid phenmethyl quinoxaline.
Carbon cloth: the carbon cloth used in the present embodiment for PAN-based carbon fiber cloth, specification be 12K, by JiYan High Science Fibre Co., Ltd., Jilin City.
Thermoplastic resin: the thermoplastic resin used in the present embodiment is polysulfones, polycarbonate and polyethersulfone, is produced by Changchun Jida special plastic engineering Co., Ltd.
Carbon nanotube: the carbon nanotube used in the present embodiment is carboxylic carbon nano-tube, external diameter is 20-30nm, and length is 10-30 μm, is produced by Chengdu Organical Chemical Co., Ltd., Chinese Academy of Sciences.
Metal powder: the metal powder used in the present embodiment is copper powder and aluminium powder, and granularity is 200 orders, is produced by Tianjin Yong great chemical reagent company limited.
By 100 parts of epoxy resin, 0.5 part of thermal polymerization, 10 parts of methylene dichloride add in mixing kettle successively, stir 2 hours, 100
oc and decompression go down to desolventize.Epoxy resin composition and 2 layers of carbon cloth are put into mould, at 8MPa and 160
obe pressed into sheet material with vulcanizing press under C, finally cool, obtain described high-toughness high-strength epoxy resin based conductive composite material.
National Standard of the People's Republic of China's (shock strength: GB/T1843-2008 is adopted to the product of embodiment 1; Flexural strength: GB/T9341-2000; Conductivity: GB/T24525-2009) carry out the test of various performance, its test-results is in table 1.
Embodiment 2
Except thermal polymerization consumption being changed into 1 part, carbon cloth consumption changes into except 3 layers, and all the other are with embodiment 1.The component of high-toughness high-strength epoxy resin based conductive composite material and test-results are in table 1.
Embodiment 3
Except thermal polymerization consumption being changed into 1.5 parts, carbon cloth consumption changes into except 4 layers, and all the other are with embodiment 1.The component of high-toughness high-strength epoxy resin based conductive composite material and test-results are in table 1.
Embodiment 4
Except thermal polymerization consumption being changed into 2 parts, carbon cloth consumption changes into except 5 layers, and all the other are with embodiment 1.The component of high-toughness high-strength epoxy resin based conductive composite material and test-results are in table 1.
Embodiment 5
Except thermal polymerization consumption being changed into 1.5 parts, carbon cloth consumption changes 4 layers into, polysulfones consumption is 3 parts, and carbon nanotube consumption is 0.5 part, and methylene chloride changes 30 into especially, and all the other are with embodiment 1.The component of high-toughness high-strength epoxy resin based conductive composite material and test-results are in table 1.
Embodiment 6
Except thermal polymerization consumption being changed into 1.5 parts, carbon cloth consumption changes 4 layers into, polycarbonate consumption is 5 parts, and copper powder consumption is 5 parts, and methylene chloride changes 50 into especially, and all the other are with embodiment 1.The component of high-toughness high-strength epoxy resin based conductive composite material and test-results are in table 1.
Embodiment 7
Except thermal polymerization consumption being changed into 1.5 parts, carbon cloth consumption changes 4 layers into, polyethersulfone consumption is 7 parts, and aluminium powder consumption is 5 parts, and chloroform consumption is 70 especially, and all the other are with embodiment 1.The component of high-toughness high-strength epoxy resin based conductive composite material and test-results are in table 1.
Embodiment 8
Except thermal polymerization consumption being changed into 1.5 parts, carbon cloth consumption changes 4 layers into, polysulfones consumption is 5 parts, and carbon nanotube consumption is 1 part, and copper powder consumption is 5 parts, and methylene chloride changes 50 into especially, and all the other are with embodiment 1.The component of high-toughness high-strength epoxy resin based conductive composite material and test-results are in table 1.
Embodiment 9
Except thermal polymerization consumption being changed into 1.5 parts, carbon cloth consumption changes 5 layers into, polyethersulfone consumption is 5 parts, and carbon nanotube consumption is 2 parts, and aluminium powder consumption is 5 parts, and chloroform consumption is 50 especially, and all the other are with embodiment 1.The component of high-toughness high-strength epoxy resin based conductive composite material and test-results are in table 1.
Comparative example 1
100 parts of epoxy resin and 1.5 parts of thermal polymerizations are added in mixing kettle, stirs 2 hours.Epoxy resin composition is put into mould, at 8MPa and 160
obe pressed into sheet material with vulcanizing press under C, finally cool, obtain epoxy resin-cured product.Adopt National Standard of the People's Republic of China to carry out the test of various performance to the product of comparative example 1, its test-results is in table 1.
Table 1
Can be found out by comparing embodiment 1-9 and comparative example 1, compared with pure epoxy resin, take thermoplastic resin as toughner, carbon cloth is toughener, carbon cloth, carbon nanotube and metal powder be conductive filler material, not only can significantly improve shock strength and the flexural strength of epoxy resin based conductive composite material, improve the conductivity of epoxy resin based conductive composite material simultaneously.
Described content be only the present invention conceive under basic explanation, and according to any equivalent transformation that technical scheme of the present invention is done, all belong to protection scope of the present invention.
Claims (8)
1. the preparation method of a high-toughness high-strength epoxy resin based conductive composite material, it is characterized in that: high-toughness high-strength epoxy resin based conductive composite material is by epoxy resin 100 mass parts, thermal polymerization 0.01-5 mass parts, carbon cloth 1-8 layer, thermoplastic resin 1-10 mass parts, carbon nanotube 0.1-5 mass parts, metal powder 1-10 mass parts and solvent 5-50 mass parts composition;
Above-mentioned epoxy resin, thermal polymerization, thermoplastic resin, carbon nanotube, metal powder and solvent are added in mixing kettle according to quality proportioning, stirs 1-8 hour, at 50-200
oc and decompression go down to desolventize; Epoxy resin composition and carbon cloth are put into mould, at 4-14MPa and 60-200
obe pressed into sheet material with vulcanizing press under C, finally cool, obtain described high-toughness high-strength epoxy resin based conductive composite material.
2. epoxy resin composition and carbon cloth are put into mould, at 4-14MPa and 60-200
obe pressed into sheet material with vulcanizing press under C, finally cool, obtain described high-toughness high-strength epoxy resin based conductive composite material.
3. the preparation method of high-toughness high-strength epoxy resin based conductive composite material according to claim 1, is characterized in that: described epoxy resin is bisphenol A type epoxy resin.
4. the preparation method of high-toughness high-strength epoxy resin based conductive composite material according to claim 1, is characterized in that: described thermal polymerization is hexafluoro-antimonic acid phenmethyl quinoxaline.
5. the preparation method of high-toughness high-strength epoxy resin based conductive composite material according to claim 1, is characterized in that: described thermoplastic resin is polysulfones, polycarbonate or polyethersulfone.
6. the preparation method of high-toughness high-strength epoxy resin based conductive composite material according to claim 1, is characterized in that: described carbon nanotube is carboxylic carbon nano-tube.
7. the preparation method of high-toughness high-strength epoxy resin based conductive composite material according to claim 1, is characterized in that: described metal powder is copper powder or aluminium powder.
8. the preparation method of high-toughness high-strength epoxy resin based conductive composite material according to claim 1, is characterized in that: described solvent is methylene dichloride or chloroform.
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Cited By (5)
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| CN105547538A (en) * | 2016-02-04 | 2016-05-04 | 山东大学 | Concrete structure object stress strain sensor and monitoring method |
| CN105623193A (en) * | 2016-01-28 | 2016-06-01 | 南京理工大学 | Distributed carbon fiber bar and preparation method and strain determination method thereof |
| CN108340639A (en) * | 2017-09-19 | 2018-07-31 | 安徽旭升新材料有限公司 | A kind of high conductivity carbon fiber board and preparation method thereof |
| CN108384184A (en) * | 2018-03-06 | 2018-08-10 | 吉林化工学院 | A kind of preparation method of grounded screen graphite/thermosetting resin conducing composite material |
| WO2021097649A1 (en) * | 2019-11-19 | 2021-05-27 | 南京中弘华飞信息科技有限公司 | Soft prosthesis composite material and preparation method therefor |
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| CN103756258A (en) * | 2013-12-30 | 2014-04-30 | 北京交通大学 | Preparation method of Ti3AlC2 epoxy resin conductive composite material |
| CN103881298A (en) * | 2012-12-20 | 2014-06-25 | 南京理工大学 | Thermosetting resin composite material with electricity and heat conduction functions, and preparation method thereof |
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| CN102070876A (en) * | 2010-12-30 | 2011-05-25 | 桂林电子科技大学 | Epoxy resin base polynary conductive composite material with ultra-low threshold value and preparation method thereof |
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| CN105623193A (en) * | 2016-01-28 | 2016-06-01 | 南京理工大学 | Distributed carbon fiber bar and preparation method and strain determination method thereof |
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| CN108340639A (en) * | 2017-09-19 | 2018-07-31 | 安徽旭升新材料有限公司 | A kind of high conductivity carbon fiber board and preparation method thereof |
| CN108384184A (en) * | 2018-03-06 | 2018-08-10 | 吉林化工学院 | A kind of preparation method of grounded screen graphite/thermosetting resin conducing composite material |
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