CN101864076A - Cyanate resin modified by phenylacetylene base silane resin and preparation method thereof - Google Patents
Cyanate resin modified by phenylacetylene base silane resin and preparation method thereof Download PDFInfo
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- CN101864076A CN101864076A CN 201010174996 CN201010174996A CN101864076A CN 101864076 A CN101864076 A CN 101864076A CN 201010174996 CN201010174996 CN 201010174996 CN 201010174996 A CN201010174996 A CN 201010174996A CN 101864076 A CN101864076 A CN 101864076A
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- resin
- base silane
- phenylacetylene base
- cyanate
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Abstract
The invention relates to cyanate resin modified by phenylacetylene base silane resin and a preparation method thereof. The preparation method is technically characterized by comprising the steps of: mixing 100 parts by weight of the cyanate resin and 1-100 parts by weight of the phenylacetylene base silane resin in a solvent, then, distilling to remove the solvent, and curing according to a certain curing process to form a three-dimensional network structure. Compared with the traditional modification method of the cyanate resin, in the preparation method, the phenylacetylene base silane resin is soluble in the common organic solvent and has favorable compatibility with the cyanate resin, which can effectively improve the heat resistance and the thermal oxidation property of the cyanate resin. The modification system prepared in the invention has excellent heat resistance, favorable mechanical property and dielectric property and can be sued as matrix resin of the heat resistant and wave-transmitting material.
Description
Technical field
The invention belongs to a kind of novel high polymer material and preparation method thereof, particularly a kind of cyanate resin modified by phenylacetylene base silane resin and preparation method thereof.
Background technology
Cyanate ester resin is the amphyl that contains two or more cyanate functional groups in the molecular structure, under heat or catalyst action three cyclizations can take place, and generates the three dimensional structure that contains triazine ring.Cyanate ester resin has splendid dielectric properties, good heat-resistant, dissolve in the ordinary organic solvents, and good wetting property is arranged with strongtheners such as glass fibre, carbon fibers, be applicable to advanced composite material moulding processs such as autoclave, vacuum bag and resin transfer moulding.
Both at home and abroad researcher mainly concentrates on Research on Toughening to cyanate to the modification of cyanate, and it is toughness reinforcing to adopt Resins, epoxy, bimaleimide resin or thermoplastic resin that cyanate ester resin is carried out, and has obtained certain achievement.Yet because the existence of ehter bond in the cyanate structure, the resistance toheat of material is caused adverse influence.Studies show that when the cyanate short burst to be exposed in the pyritous air (when carrying out spot welding), show satisfactory stability as circuit card.Yet when being in more than 200 ℃ for a long time, the weightless obviously aggravation of cyanate ester resin, this has just greatly limited its application in fields such as aerospace, and the research of this respect is also rarely had report both at home and abroad.
Phenylacetylene base silane is the novel hybrid inorganic-organic materials of a class, and this class material not only has inorganics and organic characteristic concurrently, also has the incomparable special performance of single inorganics and organism.C ≡ C key links to each other by the form of Si-C key with covalent linkage, on molecular level organic constituent and inorganic component is combined.Phenylacetylene base silane has excellent heat resisting and dielectric properties as a kind of novel silicone resin, can be used as high temperature resistant, the matrix resin of wave-penetrating composite material and the carbon matrix (ZL02151140.3 of high-performance carbon-carbon composite; ZL200510110133.5; ZL200510110132.0).
The present invention adopts the phenylacetylene base silane resin that cyanate ester resin is carried out modification, on the dielectric properties that keep the cyanate ester resin excellence, good mechanical performance basis, improve the heat-resisting and thermal oxidation of cyanate ester resin, to satisfy the requirement of high-performance transparent structure material of new generation and aerospace with high performance structures composite resin matrix.At present, yet there are no the report of relevant cyanate resin modified by phenylacetylene base silane resin both at home and abroad.
Summary of the invention
The technical problem that solves
Adopt Resins, epoxy, bimaleimide resin or high-performance thermoplastic resin modified cyanate ester resin to make the resistance toheat of material descend to some extent.For fear of the deficiencies in the prior art part, compare with the method for modifying of former cyanate ester resin, the present invention proposes a kind of cyanate resin modified by phenylacetylene base silane resin and preparation method thereof, with the heat-resisting and thermal oxidation of expectation raising cyanate ester resin, keep the dielectric properties and the good mechanical performance of cyanate ester resin excellence; Satisfy various advanced composite material moulding processs, thereby further widen the application of cyanate ester resin at high-technology fields such as Aeronautics and Astronautics.
Technical scheme
The raw material that the present invention adopts is bisphenol A cyanate ester, Cyclopeutadiene type cyanate ester resin or phenol aldehyde type cyanate ester resin, and its structure is respectively suc as formula shown in (1)~(3):
The raw material that the present invention adopts is tolane base silane resin, three phenylacetylene base silane resins or four phenylacetylene base silane resins, and its structure is respectively suc as formula shown in (4)~(6):
Wherein: R
1, R
2Be alkyl, aryl or hydrogen atom
(4)
Wherein: R is alkyl, aryl or hydrogen atom
(5)
Technical characterictic of the present invention is that the composition of raw materials composition is by mass: 100 parts of cyanate ester resins, 1~100 part of phenylacetylene base silane resin.
Described cyanate ester resin is bisphenol A cyanate ester resin, Cyclopeutadiene type cyanate ester resin or phenol aldehyde type cyanate ester resin.
Described phenylacetylene base silane resin is tolane base silane resin, three phenylacetylene base silane resins or four phenylacetylene base silane resins.
A kind of method for preparing cyanate resin modified by phenylacetylene base silane resin is characterized in that the preparation method is as follows:
(1) the phenylacetylene base silane resin of different mass proportioning and cyanate ester resin are dissolved in the organic solvent mix.
(2) treat fully dissolving after, add thermal distillation, remove organic solvent, prepare the cyanate resin modified by phenylacetylene base silane resin blend.
(3) above-mentioned blend is solidified under certain curing process.Solidification value is 110~300 ℃, and be 8~20 hours set time, promptly gets a kind of cyanate resin modified by phenylacetylene base silane resin.
The preparation method of described cyanate resin modified by phenylacetylene base silane resin is characterized in that not using catalyzer, directly is cured by reacting by heating.
Embodiment
Below the present invention is further described:
The present invention relates to a kind of cyanate resin modified by phenylacetylene base silane resin and preparation method thereof.At first with 1~100 part of cyanate ester resin 100 parts (mass fraction) and phenylacetylene base silane resin, mix in solvent, after treating to dissolve fully, solvent is removed in distillation, prepares the cyanate resin modified by phenylacetylene base silane resin blend.Above-mentioned blend is solidified under certain curing process, and solidification value is 110~300 ℃, and be 8~20 hours set time, promptly gets a kind of cyanate resin modified by phenylacetylene base silane resin.Do not use catalyzer in the above-mentioned cyanate resin modified by phenylacetylene base silane resin preparation process, directly be cured by reacting by heating.Cyanate ester resin can be bisphenol A cyanate ester resin, Cyclopeutadiene type cyanate ester resin or phenol aldehyde type cyanate ester resin.The phenylacetylene base silane resin can be tolane base silane resin, three phenylacetylene base silane resins or four phenylacetylene base silane resins.
Embodiment 1:
At first with 10 parts of bisphenol A cyanate ester resin 100 parts (mass fraction) and methyldiphenyl ethynyl silane resins, in acetone, mix, after treating to dissolve fully, add thermal distillation and remove solvent, prepare methyldiphenyl ethynyl silane resin modified bisphenol A cyanate ester resin blend.Above-mentioned blend is being solidified under certain curing process, and curing process is 110 ℃/1h → 150 ℃/1h → 200 ℃/2h → 250 ℃/2h → 300 ℃/4h, promptly gets a kind of methyldiphenyl ethynyl silane resin modified bisphenol A cyanate ester resin.
Embodiment 2:
At first with 80 parts of bisphenol A cyanate ester resin 100 parts (mass fraction) and four phenylacetylene base silane resins, in acetone, mix, after treating to dissolve fully, add thermal distillation and remove solvent, prepare four phenylacetylene base silane resin modified bisphenol A cyanate ester resin blends.Above-mentioned blend is being solidified under certain curing process, and curing process is 110 ℃/1h → 150 ℃/1h → 200 ℃/4h → 250 ℃/4h → 300 ℃/4h, promptly gets a kind of four phenylacetylene base silane resin modified bisphenol A cyanate ester resins.
Embodiment 3:
At first with 50 parts of phenol aldehyde type cyanate ester resin 100 parts (mass fraction) and methyl three phenylacetylene base silane resins, in acetone, mix, after treating to dissolve fully, add thermal distillation and remove solvent, prepare methyl three phenylacetylene base silane resin modified phenolic type cyanate resin resin blends.Above-mentioned blend is being solidified under certain curing process, and curing process is 110 ℃/1h → 150 ℃/1h → 200 ℃/2h → 250 ℃/2h → 300 ℃/4h, promptly gets a kind of three phenylacetylene base silane resin modified phenolic type cyanate ester resins.
Claims (5)
1. a cyanate resin modified by phenylacetylene base silane resin is characterized in that the composition of raw materials of described modified system is by mass: 100 parts of cyanate ester resins, 1~100 part of phenylacetylene base silane resin.
2. cyanate resin modified by phenylacetylene base silane resin system according to claim 1, it is characterized in that: described cyanate ester resin is bisphenol A cyanate ester resin, Cyclopeutadiene type cyanate ester resin or phenol aldehyde type cyanate ester resin, and its structural formula is shown in (1)~(3):
3. cyanate resin modified by phenylacetylene base silane resin system according to claim 1, it is characterized in that: described phenylacetylene silane resin is tolane base silane resin, three phenylacetylene base silane resins or four phenylacetylene base silane resins, and its structural formula is shown in (4)~(6):
Wherein: R
1, R
2Be alkyl, aryl or hydrogen atom
(4)
Wherein: R is alkyl, aryl or hydrogen atom
(5)
4. preparation method who prepares the described cyanate resin modified by phenylacetylene base silane resin of claim 1~3 is characterized in that the preparation method is as follows:
(1) cyanate ester resin and the phenylacetylene base silane resin dissolves of different mass proportioning are mixed in organic solvent.
(2) treat fully dissolving after, add thermal distillation, remove organic solvent, prepare the cyanate resin modified by phenylacetylene base silane resin blend.
(3) above-mentioned blend is solidified under certain curing process.Solidification value is 110~300 ℃, set time
Be 8~20 hours, promptly get a kind of cyanate resin modified by phenylacetylene base silane resin.
5. as the preparation method of cyanate resin modified by phenylacetylene base silane resin as described in the claim 4, it is characterized in that not using catalyzer, directly be cured by reacting by heating.
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103435988A (en) * | 2013-09-11 | 2013-12-11 | 无锡新宏泰电器科技股份有限公司 | High-temperature resistant unsaturated polyester resin system and preparation method thereof |
CN107556479A (en) * | 2017-10-19 | 2018-01-09 | 苏州大学 | A kind of hyperbranched polyorganosiloxane and preparation method thereof |
CN107722266A (en) * | 2017-10-19 | 2018-02-23 | 苏州大学 | A kind of hyperbranched polyorganosiloxane/cyanate ester resin and preparation method thereof |
CN108395532A (en) * | 2018-02-12 | 2018-08-14 | 华东理工大学 | Modified cyanic acid ester resin and preparation method thereof |
CN109321199A (en) * | 2017-07-31 | 2019-02-12 | 比亚迪股份有限公司 | High-temperature Resistance Adhesives and preparation method thereof and composite-insulating paper |
CN111269569A (en) * | 2018-12-04 | 2020-06-12 | 洛阳尖端技术研究院 | Polyaryne resin modified cyanate ester resin and preparation method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1763052A (en) * | 2005-11-09 | 2006-04-26 | 华东理工大学 | Triphenylacetylene silane novle synthesis method |
CN101117383A (en) * | 2007-07-10 | 2008-02-06 | 华东理工大学 | Aryl radical acetylene and cyanate resin copolymer |
-
2010
- 2010-05-14 CN CN 201010174996 patent/CN101864076A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1763052A (en) * | 2005-11-09 | 2006-04-26 | 华东理工大学 | Triphenylacetylene silane novle synthesis method |
CN101117383A (en) * | 2007-07-10 | 2008-02-06 | 华东理工大学 | Aryl radical acetylene and cyanate resin copolymer |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103435988A (en) * | 2013-09-11 | 2013-12-11 | 无锡新宏泰电器科技股份有限公司 | High-temperature resistant unsaturated polyester resin system and preparation method thereof |
CN103435988B (en) * | 2013-09-11 | 2015-07-01 | 无锡新宏泰电器科技股份有限公司 | High-temperature resistant unsaturated polyester resin system and preparation method thereof |
CN109321199A (en) * | 2017-07-31 | 2019-02-12 | 比亚迪股份有限公司 | High-temperature Resistance Adhesives and preparation method thereof and composite-insulating paper |
CN109321199B (en) * | 2017-07-31 | 2022-02-08 | 比亚迪股份有限公司 | High-temperature-resistant adhesive, preparation method thereof and composite insulating paper |
CN107556479A (en) * | 2017-10-19 | 2018-01-09 | 苏州大学 | A kind of hyperbranched polyorganosiloxane and preparation method thereof |
CN107722266A (en) * | 2017-10-19 | 2018-02-23 | 苏州大学 | A kind of hyperbranched polyorganosiloxane/cyanate ester resin and preparation method thereof |
CN107722266B (en) * | 2017-10-19 | 2020-06-16 | 苏州大学 | Hyperbranched polysiloxane/cyanate ester resin and preparation method thereof |
CN107556479B (en) * | 2017-10-19 | 2020-07-21 | 苏州大学 | Hyperbranched polysiloxane and preparation method thereof |
CN108395532A (en) * | 2018-02-12 | 2018-08-14 | 华东理工大学 | Modified cyanic acid ester resin and preparation method thereof |
CN111269569A (en) * | 2018-12-04 | 2020-06-12 | 洛阳尖端技术研究院 | Polyaryne resin modified cyanate ester resin and preparation method thereof |
CN111269569B (en) * | 2018-12-04 | 2023-04-07 | 洛阳尖端技术研究院 | Polyaryne resin modified cyanate ester resin and preparation method thereof |
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Open date: 20101020 |