CN102575137B - Adhesive resin composition for silicon wafers - Google Patents
Adhesive resin composition for silicon wafers Download PDFInfo
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- CN102575137B CN102575137B CN201080042465.3A CN201080042465A CN102575137B CN 102575137 B CN102575137 B CN 102575137B CN 201080042465 A CN201080042465 A CN 201080042465A CN 102575137 B CN102575137 B CN 102575137B
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- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3225—Polyamines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
Abstract
An adhesive resin composition for silicon wafers which, when in a cured state, exhibits excellent adhesiveness to silicon wafers, characterized by comprising an epoxy resin and a compound having a urea structure in such amounts that the urea-structure moiety of the compound is contained in an amount of 0.1 to 50 parts by mass per 100 parts by mass of the epoxy resin. The epoxy resin is preferably an epoxy resin that has a bisphenol A skeleton or a bisphenol F skeleton, while the compound having a urea structure is preferably a product of reaction of an amine compound with an isocyanate compound.
Description
Technical field
The present invention relates to tackiness resin combination, particularly significantly excellent with the tackiness of Silicon Wafer, the composition epoxy resin of the compound that contains a certain amount of above tool urea structure.
Background technology
In recent years, along with the development of IT technology, developed package technique miscellaneous.Particularly, the directly fixing or insulativity of semiconductor element, with the tackiness of substrate etc., owing to being that in the step of package technique miscellaneous or assembling reliability, institute is necessary and integral, so the tamanori that binds semi-conductive Silicon Wafer and other base material comes into one's own.The coating process of tamanori is limited by semi-conductive assembling morphology, as its main coating process, can enumerate the methods such as bottom filling, screen painting, ink-jet, dry film lamination, spin coating.In the tackiness resin with as this method was coated with, depending on purposes, require low-viscosity, solvent-free, the thermotolerance after binding etc.In addition, as hardening mechanism, be preferably the heat embrittlement mechanism that can meet easily above-mentioned requirements.
Yet, as there is the resin of good tackiness for Silicon Wafer, only had the resin of few part such as solubilization polyimide to exist in the past, with thermosetting resin, have for the resin of the good tackiness of Silicon Wafer and not yet know.
Summary of the invention
Invent problem to be solved
Therefore, the object of the present invention is to provide the good tackiness of thermosetting resin composition bring into play to(for) Silicon Wafer.
The technical scheme of dealing with problems
The inventor, in order to reach above-mentioned purpose, by repeatedly furtheing investigate, found that the composition epoxy resin that contains a certain amount of above urea structure is very good, and reaches the present invention.
That is, the present invention is a kind of adhesive resin composition for silicon wafers, it is characterized by for the epoxy resin of 100 mass parts, and the compound that contains tool urea structure, so that the urea structure part in this compound becomes 0.1～50 mass parts.
In the present invention, can further contain by thering is phenol hydroxyl with amido adjoining position and thering is the polyamide compound from the structure of the aromatic diamine of tool phenol hydroxyl, and the resin of at least a kind of selecting in the group that forms of phenol resins.
In addition, aforementioned epoxy resins is preferably the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton, and the compound of aforementioned tool urea structure is preferably the resultant of reaction of amine compound and isocyanate compound.
The effect of invention
Adhesive resin composition for silicon wafers of the present invention, owing to becoming the epoxy cure thing with appropriate urea structure when the heat embrittlement, therefore can carry out very good bonding for Silicon Wafer.
Embodiment
As the epoxy resin using in the present invention, for example, can enumerate quinhydrones, Resorcinol, pyrocatechol, the poly epihydric alcohol ether compound of the monokaryon multivalence phenolic compound of Phloroglucinol etc., dihydroxy naphthlene, connection phenol, methylene radical bis-phenol (Bisphenol F), methylene-bis (ortho-cresol), ethylidene bis-phenol, isopropylidene bis-phenol (dihydroxyphenyl propane), isopropylidene two (ortho-cresol), tetrabromo-bisphenol, 1,3-two (4-hydroxyl cumyl benzene), Isosorbide-5-Nitrae-bis-(4-hydroxyl cumyl benzene), 1,1,3-tri-(4-hydroxy phenyl) butane, 1,1,2,2-tetra-(4-hydroxy phenyl) ethane, thiobisphenol, sulfo group bis-phenol, oxygen base bis-phenol, phenol phenolic varnish, o-Hydroxytoluene Novolac, ethylphenol phenolic varnish, butylphenol phenolic varnish, octyl phenol phenolic varnish, Resorcinol phenolic varnish, the poly epihydric alcohol ether compound of the multinuclear polyphenol compound of terpenes phenol etc., ethylene glycol, propylene glycol, butyleneglycol, hexylene glycol, polyoxyethylene glycol, thiodiglycol, glycerol, TriMethylolPropane(TMP), tetramethylolmethane, Sorbitol Powder, the poly epihydric alcohol ether compound of the polyalcohols of dihydroxyphenyl propane-ethylene oxide adduct etc., toxilic acid, fumaric acid, Yi Kang acid, succsinic acid, pentanedioic acid, suberic acid, hexanodioic acid, nonane diacid, sebacic acid, dimeracid, trimer acid, phthalic acid, m-phthalic acid, terephthalic acid, trimellitic acid, trimesic acid, pyromellitic acid, tetrahydrochysene phthalic acid, hexahydrobenzene dioctyl phthalate, the aliphatics of interior methylene radical tetrahydrochysene phthalic acid etc., the glycidyl ester class of aromatic series or alicyclic polyprotonic acid and homopolymer or the multipolymer of glycidyl methacrylate, N, N-diglycidylaniline, two (4-(N-methyl-N-glycidyl amido) phenyl) methane, the epoxy compounds with glycidyl amido of diglycidyl Ortho Toluidine etc., vinyl cyclohexene diepoxide, Dicyclopentadiene (DCPD) diepoxide, 3,4-epoxy group(ing) cyclohexyl methyl-3,4-epoxy-cyclohexane carboxylicesters, 3,4-epoxy group(ing)-6-methyl cyclohexane ylmethyl-6-methylcyclohexanecarboxylic acid ester, the epoxide of the cyclic olefin compound of two (3,4-epoxy group(ing)-6-methyl cyclohexane ylmethyl) adipic acid ester etc., epoxidized polybutadiene, the epoxidation conjugated diolefin polymer of epoxidation vinyl benzene-butadienecopolymer etc., the heterogeneous ring compound of triglycidylisocyanurates etc.
Above-mentioned epoxy resin also can be the material through the prepolymer institute internal crosslinking of terminal isocyanate, or the material quantizing through the active dydrogen compounds of multivalence (polyphenol, polyamines, containing the compound of carbonyl, poly phosphate etc.) institute's polymer.
As the compound of tool urea structure used in the present invention, be preferably the resultant of reaction of amine compound and isocyanate compound.As aforementioned amine compound, for example, can enumerate quadrol, 1,2-, bis-amido propane, 1,3-, bis-amido propane, 1,3-, bis-amido butane, the alkane Diamines of Isosorbide-5-Nitrae-bis-amido butane etc., two stretch second triamine, three stretch second triamine, four stretch many alkyl polyamines class of second five amine etc., 1,3-, bis-aminomethyl hexanaphthenes, 1,2-diamines basic ring hexane, Isosorbide-5-Nitrae-bis-amido-3,6-diethyl cyclohexane, the ester ring type polyamines class of isophorone diamine etc., MXDP, two amido ditans, the aromatic polyamine class of two amido sulfobenzides etc., benzoguanamine, the guanidine amine of acetoguanamine etc., glyoxal ethyline, 2-ethyl-4-methylimidazole, 2 isopropyl imidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, the imidazoles of 2-aminocarbonyl propyl imidazoles etc., careless acid dihydrazide, propanedioic acid two hydrazides, amber acid dihydrazide, pentanedioic acid two hydrazides, adipic dihydrazide, suberic acid two hydrazides, nonane diacid two hydrazides, sebacic dihydrazide, two hydrazides classes of phthalic acid two hydrazides etc., N, N-dimethyl amido ethylamine, N, N-diethyl amido ethylamine, N, N-diisopropyl amido ethylamine, N, N-diallyl amido ethylamine, N, N-benzyl methyl amido ethylamine, N, N-dibenzyl amido ethylamine, N, N-cyclohexyl methyl amido ethylamine, N, N-dicyclohexyl amido ethylamine, N-(2-amido ethyl) Pyrrolizidine, N-(2-amido ethyl) piperidines, N-(2-amido ethyl) morpholine, N-(2-amido ethyl) piperazine, N-(2-amido ethyl)-N '-methylpiperazine, N, N-dimethyl amido propyl group amine, N, N-diethyl amido propyl group amine, N, N-diisopropyl amido propyl group amine, N, N-diallyl amido propyl group amine, N, N-benzyl methyl aminocarbonyl propyl amine, N, N-dibenzyl amido propyl group amine, N, N-cyclohexyl methyl aminocarbonyl propyl amine, N, N-dicyclohexyl amido propyl group amine, N-(3-aminocarbonyl propyl) Pyrrolizidine, N-(3-aminocarbonyl propyl) piperidines, N-(3-aminocarbonyl propyl) morpholine, N-(3-aminocarbonyl propyl) piperazine, N-(3-aminocarbonyl propyl)-N '-methyl piperidine, 4-(N, N-dimethyl amido) benzyl amine, 4-(N, N-diethyl amido) benzyl amine, 4-(N, N-diisopropyl amido) benzyl amine, N, N ,-dimethyl isophorone diamine, N, N-dimethyl diamine basic ring hexane, N, N, N '-trimethylammonium quadrol, N '-ethyl-N, N-dimethyl-ethylenediamine, N, N, N '-trimethylammonium quadrol, N '-ethyl-N, N-dimethylated propyl diethylenetriamine, N '-ethyl-N, N-dibenzyl amido propyl group amine, N, N-(two aminocarbonyl propyl)-N-methylamine, N, the two aminocarbonyl propyl ethylamines of N-, N, the two aminocarbonyl propyl propyl group amine of N-, N, the two aminocarbonyl propyl butylamines of N-, N, the two aminocarbonyl propyl amylamines of N-, N, the two aminocarbonyl propyl hexyl amines of N-, N, the two aminocarbonyl propyl-2-DEHAs of N-, N, the two aminocarbonyl propyl cyclo-hexylamine of N-, N, the two aminocarbonyl propyl benzyl amine of N-, N, the two aminocarbonyl propyl allyl amines of N-, two [3-(N, N-dimethyl amido propyl group)] amine, two [3-(N, N-diethyl amido propyl group)] amine, two [3-(N, N-diisopropyl amido propyl group)] amine, two [3-(N, N-dibutyl amido propyl group)] amine etc.
As aforementioned isocyanate compound, for example can enumerate 2, 4-tolylene diisocyanate, 2, 6-tolylene diisocyanate, 4, 4-diphenylmethanediisocyanate, stretch phenyl diisocyanate, xylylene vulcabond, tetramethyl-benzene dimethyl vulcabond, tetramethylene diisocyanate, hexamethylene diisocyanate, lysinediisocyanate, 1, 4-cyclohexylene vulcabond, 4, 4 '-dicyclohexyl methane diisocyanate, 3, 3 '-dimethoxy-4 ', 4 '-stretch xenyl vulcabond, 1, 5-naphthalene diisocyanate, 1, 5-naphthane vulcabond, isophorone diisocyanate etc.
The commercially available product of the compound of constructing as the spendable tool urea of the present invention, for example can enumerate Adekahardener EH-4380S (trade(brand)name of the amine type hardeners of the tool urea structure that (strain) ADEKA produces) " urea structure containing ratio (the quality % of account in compound-NHCONH-): 22.8 quality % ", U-CAT3502T (the aromatic series dimethyl urea compound that SAN-APRO (strain) produces), U-CAT3503N (trade(brand)name of the aliphatics dimethyl urea compound that SAN-APRO (strain) produces), Dyhard UR500 (trade(brand)name of the aromatic series dimethyl urea compound that DEGUSSA Japan (strain) produces), Dyhard UR300 (trade(brand)name of the aromatic series dimethyl urea compound that DEGUSSA Japan (strain) produces), Dyhard UR200 (trade(brand)name of the aromatic series dimethyl urea compound that DEGUSSA Japan (strain) produces) etc.
In adhesive resin composition for silicon wafers of the present invention, for the epoxy resin of 100 mass parts, make the compound of apparatus urea structure, so that the structure of the urea in this compound part becomes 0.1～50 mass parts, be preferably 0.2～30 mass parts.When the part (NHCONH-) of tool urea structure is lower than 0.1 mass parts or while surpassing 50 mass parts, unsuitable owing to can not get sufficient tackiness.
In adhesive resin composition for silicon wafers of the present invention, when using epoxy resin, can together and use other resin.As above-mentioned other resin, such as enumerating phenol resins, polyamide resin, polyimide resin, cyanate esters, phenoxy resin, polybutadiene rubber etc.
Adhesive resin composition for silicon wafers of the present invention is preferably and further contains phenol resins.Thus, can access high glass tansition temperature, obdurability, water tolerance, chemical-resistant and high tack etc.
As above-mentioned phenol resins, there is the phenol resins by phenols and aldehydes synthesized.As above-mentioned phenols, for example can enumerate phenol, cresols, ethylphenol, n-propyl phenol, isopropyl-phenol, butylphenol, tributyl phenol, octyl phenol, nonylphenol, dodecyl phenol, cyclohexylphenol, chlorophenol, bromophenol, Resorcinol, catechol, quinhydrones, 2, two (4-hydroxy phenyl) propane, 4 of 2-, 4 '-sulfo-biphenol, dihydroxyl ditan, naphthols, terpenes phenol, phenol Dicyclopentadiene (DCPD) etc., as aforementioned aldehydes, can enumerate formaldehyde.
In addition, in the present invention, also can use the material that a part for phenols is replaced as to the aromatics of biphenyl etc.Moreover, also can use with Dicyclopentadiene (DCPD) and link above-mentioned phenols and the phenol resins that obtains.
Adhesive resin composition for silicon wafers of the present invention is preferably further to contain to be had phenol hydroxyl with amido adjoining position and is having the polyamide compound of the structure of the aromatic diamine that carrys out self-contained phenol hydroxyl.Thus, further improve high glass tansition temperature, obdurability, high tack and low heat expansion property.
Also have, in adhesive resin composition for silicon wafers of the present invention, also can contain glass fibre as required, carbon fiber, Mierocrystalline cellulose, silica sand, cement, kaolin, clay, aluminium hydroxide, swollen soil, talcum, silica, micropowder silica, titanium dioxide, carbon black, graphite, ferric oxide, asphaltic substances, metallics, weighting agent or pigment through resin particle of metal institute coating etc., viscosity increaser, shake change agent, incombustible agent, defoamer, rust-preventive agent, colloided silica, the conventional additives of colloidal alumina etc., moreover also can and use xylene resin, the resene of the tackyness of petroleum resin etc.
Particularly when and while using silica filler, because the control of the thermal expansivity of composition not only becomes easy, and adhesive resin composition for silicon wafers of the present invention modulus of elasticity after heat embrittlement, hardening resin is improved, resin after heat embrittlement becomes high strength therefrom, therefore preferably.
Further describe by the following examples adhesive resin composition for silicon wafers of the present invention, but the present invention is not limited by it.
[embodiment 1～11 and comparative example 1～5]
Propylene glycol monomethyl ether is mixed with the resin combination of combination shown in following table 1 or table 2, coat on Silicon Wafer, so that the film thickness after sclerosis becomes after 30～40 μ m, 100 ℃ of costs, within 10 minutes, remove solvent and be dried, then 180 ℃ of costs, within 1 hour, make hardening of resin.The test film that uses gained, according to the checker testing method of JIS D0202, carries out the stripping test (cross cutting test) that glassine paper sticks together adhesive tape, shows the number of nubbin in table.Moreover under 121 ℃/2.1 normal atmosphere/100%RH condition, the pressure cooking of carrying out 96 hours is carried out cross cutting test after testing, and shows the number of nubbin in table.
Reference example (containing the compound 1 of urea synthetic)
Prepare 162.5 grams of isopropylcarbinols, 162.5 grams of dimethylbenzene, 408 grams of N, N-dimethyl amido propyl group amine and 148 gram 1,2-propylene diamine, 60～70 ℃ of mix and blends 30 minutes.Then, so that the mode that the temperature in reaction system does not rise, the 190 grams of Adekaresin EP-4100E that the slowly drip (bisphenol A type epoxy resin that Asahi Denka Co., Ltd. produces; The trade(brand)name of epoxy equivalent (weight) 190), reflux 2 hours and maturation.
And then, so that the mode that the temperature in reaction system does not rise, 666 grams of the xylene solutions of the isophorone diisocyanate 67 quality % that slowly drip.Drip and finish rear intensification, 140～150 ℃ of backflow maturations of carrying out 2 hours, by IR, confirm that the absorption of isocyanic ester is 2250cm
-1absorption disappear after, be warmed up to till 200, carry out 2 hours, the desolventizing of normal pressure and process.And then, at 190～200 ℃, 50～60mmHg, carry out 1 hour decompression desolventizing, and obtain pale solid substance.
Table 1
Epoxy resin 1:Adekaresin EP-4100L (bisphenol A type epoxy resin that (strain) ADEEA produces)
Epoxy resin 2:EPICLON HP-4032 (the naphthalene type epoxy resin that large Japanese ink chemical industry (strain) is produced)
Epoxy resin 3:Adekaresin EP-4000L (the modified bisphenol A type epoxy resin that (strain) ADEEA produces)
Phenol resins: MEH-7851 (phenol bright and that change into production is stretched biphenyl resin)
Stiffening agent 1: the compound 1 containing containing urea of above-mentioned reference example, urea structure containing ratio: 20.4 quality %
Stiffening agent 2:Adekahardener EH-4380S (amine type hardeners containing urea structure that (strain) ADEKA produces), urea structure containing ratio: 22.8 quality %
Stiffening agent 3: the resultant of reaction of isophorone diisocyanate and dimethylamine (mol ratio 1: 2), urea structure has closed rate: 18.6 quality %
Stiffening agent 4:1, the bisphenol type epoxy affixture of 2-propylene diamine
Stiffening agent 5:2-phenyl-4,5-dihydroxyl Methylimidazole
Stiffening agent 6: cyanoguanidine
Polyamide resin: there is phenol hydroxyl with amido adjoining position and thering is the polyamide compound of the structure of the aromatic diamine that carrys out self-contained phenol hydroxyl
Silica filler: SE2030-GRJ (the spherical silica of surface treatment that (strain) ADTEX produces)
Table 2
The result of table 1 and table 2 confirms for the epoxy resin of 100 mass parts, and the compound that contains tool urea structure, so that the urea structure part in this compound becomes the effect of the present invention of 0.1～50 mass parts.
Industrial applicibility
Adhesive resin composition for silicon wafers of the present invention; owing to thering is the rear good tackiness of sclerosis for Silicon Wafer; while not being only applicable to bind other material for Pure Silicon Metal or by semiconductor element direct-assembling when other base material; and can make composition itself become interlayer dielectric or protective membrane, so extremely useful in industry.
Claims (8)
1. an adhesive resin composition for silicon wafers, is characterized in that: for the epoxy resin of 100 mass parts, the compound that contains tool urea structure, so that the urea structure part in this compound becomes 0.1～50 mass parts;
The compound of this tool urea structure is the resultant of reaction of amine compound and isocyanate compound;
This amine compound is for being selected from alkane Diamines, many alkyl polyamines class, ester ring type polyamines class, guanidine amine, imidazoles, two hydrazides classes, N-(2-amido ethyl) Pyrrolizidine, N-(3-aminocarbonyl propyl) Pyrrolizidine, N-(2-amido ethyl) piperidines, N-(3-aminocarbonyl propyl) piperidines, N-(3-aminocarbonyl propyl)-N '-methyl piperidine, N-(3-aminocarbonyl propyl) morpholine, N-(2-amido ethyl) morpholine, N-(2-amido ethyl) piperazine, N-(2-amido ethyl)-N '-methylpiperazine and N-(3-aminocarbonyl propyl) piperazine at least a kind,
This isocyanate compound is tetramethylene diisocyanate, hexamethylene diisocyanate, lysinediisocyanate, Isosorbide-5-Nitrae-cyclohexylene vulcabond, HMDI, isophorone diisocyanate at least a kind.
2. adhesive resin composition for silicon wafers as claimed in claim 1, is characterized in that: also contain and have phenol hydroxyl with amido adjoining position and having the polyamide compound from the structure of the aromatic diamine of tool phenol hydroxyl.
3. adhesive resin composition for silicon wafers as claimed in claim 1, is characterized in that: also contain phenol resins.
4. adhesive resin composition for silicon wafers as claimed in claim 2, is characterized in that: also contain phenol resins.
5. adhesive resin composition for silicon wafers as claimed in claim 1, is characterized in that: this epoxy resin is the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton.
6. adhesive resin composition for silicon wafers as claimed in claim 2, is characterized in that: this epoxy resin is the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton.
7. adhesive resin composition for silicon wafers as claimed in claim 3, is characterized in that: this epoxy resin is the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton.
8. adhesive resin composition for silicon wafers as claimed in claim 4, is characterized in that: this epoxy resin is the epoxy resin with dihydroxyphenyl propane skeleton or Bisphenol F skeleton.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-229185 | 2009-10-01 | ||
| JP2009229185A JP5565931B2 (en) | 2009-10-01 | 2009-10-01 | Silicon wafer adhesive resin composition |
| PCT/JP2010/005479 WO2011039948A1 (en) | 2009-10-01 | 2010-09-07 | Adhesive resin composition for silicon wafers |
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| Publication Number | Publication Date |
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| CN102575137A CN102575137A (en) | 2012-07-11 |
| CN102575137B true CN102575137B (en) | 2014-11-26 |
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| JP (1) | JP5565931B2 (en) |
| KR (1) | KR101638660B1 (en) |
| CN (1) | CN102575137B (en) |
| TW (1) | TWI504710B (en) |
| WO (1) | WO2011039948A1 (en) |
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| CN103059786A (en) * | 2011-10-21 | 2013-04-24 | 山东轻工业学院 | Adhesive for insulating materials |
| DE102011118760A1 (en) | 2011-11-15 | 2013-05-16 | Alzchem Ag | Use of N, N '(-dimethyl) -units and methods for curing epoxy resin compositions |
| CN115003726B (en) * | 2020-03-25 | 2023-12-05 | 株式会社艾迪科 | Curable resin composition and method for inhibiting curing shrinkage of curable resin composition |
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| WO2006129480A1 (en) * | 2005-05-31 | 2006-12-07 | Adeka Corporation | Hardenable epoxy resin composition |
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| JPS56133856A (en) * | 1980-03-21 | 1981-10-20 | Nitto Electric Ind Co Ltd | Epoxy resin composition for sealing semiconductor |
| JP2001049086A (en) * | 1999-08-09 | 2001-02-20 | Sumitomo Metal Mining Co Ltd | Electrically conductive resin composition |
| JP2004231932A (en) * | 2002-12-02 | 2004-08-19 | Nitto Denko Corp | Adhesive composition, adhesive film, and semiconductor device using this |
| JP2004189790A (en) * | 2002-12-09 | 2004-07-08 | Hitachi Chem Co Ltd | Resin paste composition and semiconductor device using the same |
| KR100938523B1 (en) * | 2005-02-23 | 2010-01-25 | 아사히 가세이 케미칼즈 가부시키가이샤 | Latent hardener for epoxy resin and epoxy resin composition |
| JP4662793B2 (en) * | 2005-03-01 | 2011-03-30 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | Negative photosensitive resin composition containing epoxy-containing substance |
| WO2007088889A1 (en) * | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article |
-
2009
- 2009-10-01 JP JP2009229185A patent/JP5565931B2/en active Active
-
2010
- 2010-09-07 CN CN201080042465.3A patent/CN102575137B/en not_active Expired - Fee Related
- 2010-09-07 WO PCT/JP2010/005479 patent/WO2011039948A1/en active Application Filing
- 2010-09-07 KR KR1020127007294A patent/KR101638660B1/en active IP Right Grant
- 2010-09-13 TW TW099130893A patent/TWI504710B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001060938A1 (en) * | 2000-02-15 | 2001-08-23 | Hitachi Chemical Co., Ltd. | Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| WO2006129480A1 (en) * | 2005-05-31 | 2006-12-07 | Adeka Corporation | Hardenable epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102575137A (en) | 2012-07-11 |
| JP5565931B2 (en) | 2014-08-06 |
| WO2011039948A1 (en) | 2011-04-07 |
| JP2011074298A (en) | 2011-04-14 |
| KR20120090984A (en) | 2012-08-17 |
| KR101638660B1 (en) | 2016-07-11 |
| TWI504710B (en) | 2015-10-21 |
| TW201120172A (en) | 2011-06-16 |
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