CN102569230A - 一种半导体器件和电子装置 - Google Patents
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Abstract
本发明提供一种半导体器件,其包括:硅基板,用于承载芯片;电源管理模块,设于所述硅基板内部,用于将供电电压转化为所述芯片需要的输入电压;互连系统,用于接收所述供电电压,将所述供电电压发送给所述电源管理模块,以及用于将所述输入电压发送给所述芯片。采用本发明实施例提供的半导体器件,供电电压产生后可以直接从硅基板发送至芯片,缩短了供电链路,减少了电源地噪声。
Description
技术领域
本发明实施例涉及一种半导体器件以及相应的电子装置。
背景技术
随着芯片技术的发展,目前存在一种PCB上的芯片布局方式,即在PCB上再布置一层承载板,然后再将芯片布置到该承载板上。芯片通过承载板上的过孔与PCB上的电路电性连接。这样做可以更合理的利用PCB板上的空间。在这种情况下,设置在PCB上的电源管理模块也只能通过承载板上的过孔给承载板上的相应的引脚供电。
但是,由于目前芯片的集成度越来越高,芯片的不同引脚的输入电压可谓五华八门。结果就造成了PCB上的电源管理模块要提供多种输出引脚。繁多的电源管理模块的电压输出引脚为PCB上的其它电器件带来复杂的电源供电噪声、电磁干扰/电磁兼容等问题,这极大地增加了PCB的成本。
进一步的,电源管理模块的输出电压通过承载板上的过孔给承载板上的芯片进行供电,芯片在工作过程中产生电流的快速变动,尤其是高性能芯片的工作电流变动更为激烈,而芯片封装电源供电链路的寄生电感造成了芯片封装系统的电源地噪声,供电链路的长度过长会带来较大的电源地噪声,无法满足高性能芯片的需要。
发明内容
本发明提供一种半导体器件,其特征在于,包括:硅基板,用于承载芯片;电源管理模块,设于所述硅基板内部,用于将供电电压转化为所述芯片需要的输入电压;互连系统,用于接收所述供电电压,将所述供电电压发送给所述电源管理模块,以及用于将所述输入电压发送给所述芯片。
本发明还提供了相应的采用了所述半导体器件的电子装置。
采用本发明实施例提供的半导体器件,供电电压产生后可以直接从硅基板发送至芯片,缩短了供电链路,减少了电源地噪声。
附图说明
为了更清楚地说明本发明实施例的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1所示为本发明实施例提供的半导体器件的示意图。
图2所示为本发明又一实施例提供的半导体器件的示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
请参照图1,图1所示为应用了本发明实施例提供的半导体器件的电子装置的示意图。本发明实施例所提供的半导体器件包括用于承载芯片102的硅基板107,设于所述硅基板107上的电源管理模块103,以及布设于所述硅基板107内部以及表面的互连系统。所述电源管理模块103用于接收输入电压,并将所述供电电压转化为芯片102需要的输入电压。在本发明实施例中,所述电源管理管理模块103可以为布设于硅基板107的表面的用于将输入电压转化为芯片102需要的供电电压的电源转化电路,在其他可选择的实施例中所述电源管理模块103也可以布设于所述硅基板107内部的某一个电路层中,作用不变。所述互连系统用于输送所述供电电压以及所述输入电压。
在应用中,硅基板107设于承载板105上。所述承载板可以是通常的各种电路板,通常用于实现信号连接和电源传输。在本发明实施例中,承载板105上设有电源或者接收外界供电的电源接口,用来为所述硅基板107提供所述供电电压。在其他可选择的实施例中,承载板105也可以为承载在其他电路板上的基板,并且自电路板上接收供电电压以及将所述供电电压传送给硅基板107。
硅基板107可以通过焊锡的方式固定于承载板105上,也可以通过机械结构固定在承载板105上。当所述硅基板107通过焊锡固定于所述承载板105上时,承载板105上的供电电压就可以通过承载板105上的焊盘、焊锡、以及硅基板107的下表面的焊盘传送至硅基板107上,当然,所述芯片102也可以通过焊锡固定的方式与所述硅基板107电性连接,并且通过焊锡接收电源管理模块103生成的输入电压。如图1所示,所述芯片102的下表面设有焊盘,以与所述硅基板107的上表面的焊盘通过焊锡固定连接并传递电信号。
所述互连系统用于实现硅基板107中的电器件间的电信号的流通,以及用于实现硅基板107中的电器件与外界的电性联通,比如供电电压和输入电压均是通过互连系统在承载板105、硅基板107以及芯片102间流通。硅基板107的内部和表面上设有各种各样的具有特定功能的功能模块,比如电源滤波和匹配无源电路或者本发明实施例中的电源管理模块103。本发明实施例中的互连系统是用于为所述功能模块传输信号或电力。比如,设于硅基板107上下表面的焊盘、硅基板107内部和表面的电通路,以及芯片和硅基板107间的电压接口均属于所述互连系统。设于硅基板107的下表面的焊盘用于通过焊锡将硅基板107固定于承载板105上并自承载板105中接收供电电压;设于硅基板107的上表面的焊盘则用于通过焊锡固定芯片102并向芯片102传送输入电压。
在本发明实施例中,所述互连系统还可以包括硅穿孔(Through SiliconVia,简称TSV)106。硅穿孔106用于实现处于硅基板107内部的各个层上的电通路中的电信号的流通。具体的,在本发明实施例中,当硅基板107从承载板105处获得供电电压时,硅穿孔106将供电电压传送给与电源管理模块103的相应接口连通的电路;而当电源管理模块103生成了输入电压,如图1所示,电源管理模块103可以直接通过芯片102与硅基板107之间的焊锡将供电电压传送给芯片102。当然,如果电源管理模块103并没有布设于硅基板107的表面,则可以利用硅穿孔106或者其他电压输送电路将所述供电电压传送给硅基板107与芯片102间的电压接口电路上,以将所述供电电压传送给芯片102。
在本发明实施例中,硅基板107的下表面设有焊盘,从而当硅基板107通过焊锡与承载板105固定连接时,承载板105产生的输入供电电压可以通过焊锡被传送至硅基板107上。硅基板107的下表面的一个或多个焊盘周围布设有电通路,当供电电压被传送到硅基板107的下表面的焊盘上时,供电电压可以通过焊盘周围的电通路被传送给相应的硅穿孔中的电通路中,然后再经由硅穿孔内的电通路达到与电源管理模块103电压输入接口相对应的电通路上。当电源管理模块103产生了供电电压后,则将所述供电电压利用焊锡或者电压接口传送给芯片102。
在实际应用中,芯片、硅基板和承载板这三者之间的电信号的传递并不一定要通过焊盘、焊锡来完成。比如,如图2所示,芯片202可以通过焊锡或者机械结构固定在硅基板207上,芯片202上接有跳线204,跳线204搭接在硅基板207的电通路上,用于接收供电电压,类似的,硅基板207也可以通过跳线自承载板205中接收输入电压。在其他可选择的实施例中,硅基板上也可以设有外接接口,外界接口与电源管理模块相接,或者通过硅穿孔与电性管理模块相接,用于接收输入电压或者发送供电电压,而承载板则通过与外接接口相匹配的连接件向硅基板输入输入电压,或者芯片通过与所述外界接口相匹配的连接件自硅基板中接收供电电压。
采用本发明实施例提供的半导体器件,设于硅基板中的电源管理模块可以尽可能的靠近芯片,从而缩短供电电压的传输路径,有效地减少了供电电压传送过程中产生的电源地噪声。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应所述以权利要求的保护范围为准。
Claims (12)
1.一种半导体器件,其特征在于,包括:
硅基板,用于承载芯片;
电源管理模块,设于所述硅基板内部,用于将供电电压转化为所述芯片需要的输入电压;
互连系统,用于接收所述供电电压,将所述供电电压发送给所述电源管理模块,以及用于将所述输入电压发送给所述芯片。
2.如权利要求1所述的半导体器件,其特征在于,所述互连系统包括硅穿孔,所述硅穿孔设于所述硅基板中,且所述硅穿孔中设有电通路,用于传输所述供电电压和所述输入电压。
3.如权利要求2所述的半导体器件,其特征在于,所述互连系统还包括设于所述硅基板的上表面的焊盘,所述焊盘用于电性连接所述芯片,所述焊盘与所述硅穿孔中的电通路电性连接。
4.如权利要求2所述的半导体器件,其特征在于,所述互连系统还包括设于所述硅基板下表面的焊盘,所述设于所述硅基板下表面的焊盘用于自所述承载板上接收所述供电电压,所述设于所述硅基板下表面的焊盘与所述硅穿孔电性连接。
5.如权利要求1所述的半导体器件,其特征在于,所述互连系统还包括设于所述硅基板上的外接接口,用于接收所述输入电压并将所述输入电压传送给所述电源管理模块,或者,用于将所述电源管理模块产生的供电电压发送给所述芯片。
6.如权利要求1所示的半导体器件,其特征在于,所述硅基板的构成材料中包括半导体硅。
7.一种电子装置,其特征在于,包括:
芯片;
承载板,用于为所述芯片提供供电电压;以及
半导体器件,包括:硅基板,用于承载所述芯片;电源管理模块,设于所述硅基板内部,用于将供电电压转化为所述芯片需要的输入电压;以及互连系统,用于接收供电电压,将所述供电电压发送给所述电源管理模块,以及用于将所述输入电压发送给所述芯片。
8.如权利要求7所述的半导体器件,其特征在于,所述互连系统包括设于所述硅基板上的硅穿孔,所述硅穿孔中设有电通路,用于传输所述供电电压和所述输入电压。
9.如权利要求8所述的半导体器件,其特征在于,所述互连系统还包括设于所述硅基板的上表面的焊盘,所述焊盘用于电性连接所述芯片,所述焊盘与所述硅穿孔中的电通路电性连接。
10.如权利要求8所述的半导体器件,其特征在于,所述互连系统还包括设于所述硅基板下表面的焊盘,所述设于所述硅基板下表面的焊盘用于自所述承载板上接收所述供电电压,所述设于所述硅基板下表面的焊盘与所述硅穿孔电性连接。
11.如权利要求7所述的半导体器件,其特征在于,所述互连系统还包括设于所述硅基板上的外接接口,用于接收所述输入电压并将所述输入电压传送给所述电源管理模块,或者,用于将所述电源管理模块产生的供电电压发送给所述芯片。
12.如权利要求7所示的半导体器件,其特征在于,所述硅基板的构成材料中包括半导体硅。
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CN106332499A (zh) * | 2015-06-26 | 2017-01-11 | 台达电子工业股份有限公司 | 一种用于芯片供电的组装结构、电子设备 |
WO2022001065A1 (zh) * | 2020-07-01 | 2022-01-06 | 无锡中微亿芯有限公司 | 利用硅连接层集成电源门控电路的半导体装置 |
CN114585159A (zh) * | 2022-02-24 | 2022-06-03 | 平头哥(上海)半导体技术有限公司 | 电子组件及电子组件设置供电电路的方法 |
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US20050094374A1 (en) * | 2002-02-07 | 2005-05-05 | Cooligy, Inc. | Power conditioning module |
CN101378624A (zh) * | 2007-08-29 | 2009-03-04 | 海华科技股份有限公司 | 整合周边电路的模块结构及其制造方法 |
CN101452915A (zh) * | 2007-11-28 | 2009-06-10 | 纮华电子科技(上海)有限公司 | 具功能性载板的多系统模块 |
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US20050094374A1 (en) * | 2002-02-07 | 2005-05-05 | Cooligy, Inc. | Power conditioning module |
CN101378624A (zh) * | 2007-08-29 | 2009-03-04 | 海华科技股份有限公司 | 整合周边电路的模块结构及其制造方法 |
CN101452915A (zh) * | 2007-11-28 | 2009-06-10 | 纮华电子科技(上海)有限公司 | 具功能性载板的多系统模块 |
Cited By (4)
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CN106332499A (zh) * | 2015-06-26 | 2017-01-11 | 台达电子工业股份有限公司 | 一种用于芯片供电的组装结构、电子设备 |
CN111315112A (zh) * | 2015-06-26 | 2020-06-19 | 台达电子工业股份有限公司 | 一种用于芯片供电的组装结构、电子设备 |
WO2022001065A1 (zh) * | 2020-07-01 | 2022-01-06 | 无锡中微亿芯有限公司 | 利用硅连接层集成电源门控电路的半导体装置 |
CN114585159A (zh) * | 2022-02-24 | 2022-06-03 | 平头哥(上海)半导体技术有限公司 | 电子组件及电子组件设置供电电路的方法 |
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