CN102548238A - Method for improving resistance accuracy of buried resistor in PCB (printed circuit board) - Google Patents
Method for improving resistance accuracy of buried resistor in PCB (printed circuit board) Download PDFInfo
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- CN102548238A CN102548238A CN2011104610489A CN201110461048A CN102548238A CN 102548238 A CN102548238 A CN 102548238A CN 2011104610489 A CN2011104610489 A CN 2011104610489A CN 201110461048 A CN201110461048 A CN 201110461048A CN 102548238 A CN102548238 A CN 102548238A
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Abstract
The invention relates to a method for improving the resistance accuracy of a buried resistor in a PCB (printed circuit board), which comprises the following steps of: a step 1 of carrying out precompensation on an expected resistance of the buried resistor when the PCB is made into a finished product according to the resistance change rate of the buried resistor in the subsequent processing link so as to obtain a target resistance for making the buried resistor, and determining the length and the width of the buried resistor according to the target resistance; a step 2 of carrying out copper foil removal processing on a line layer on which the buried resistor needs to be made and making a square groove which has corresponding size and is used for accommodating the buried resistor at a preset position of the line layer; a step 3 of carrying out silk-screen printing in the square groove by adopting a screen printing plate to form a layer of resistor ink and baking and curing the resistance ink to form a buried resistor to be modified; and a step 4 of carrying out on-line dynamic modification and regulation on the buried resistor to be modified by adopting a resistor testing instrument and a laser ablation machine until the buried resistor with the target resistance is obtained. The method for improving the resistance accuracy of the buried resistor in the PCB, which is provided by the invention, can be used for obtaining the buried resistor with the high accuracy resistance.
Description
Technical field
The present invention relates to wiring board and make the field, relate in particular to a kind of method that improves the resistance value precision of pcb board embedded resistors.
Background technology
Buried resistor has following advantage on the high-speed transfer circuit design: the impedance matching that improves circuit; Shorten the path of signal transmission, reduced stray inductance; Eliminated the induction reactance that produces in surface mount or the plug-in unit technology; Reduce signal cross-talk, noise and electromagnetic interference.
Existing pcb board embedded resistors adopts dull and stereotyped interlayer resistance material (Ohmega-ply) processing usually; Cause product cost high because its resistance material costs an arm and a leg, and receive its side's resistance limitation (current have only 10 Ω/◇, 25 Ω/◇ commonly used; 50 Ω/◇; 100 Ω/◇, five kinds of 250 Ω/◇), therefore can make the finished product resistance value and be limited in scope.For solving this deficiency; Also occur employing at present and buried oil resistance China ink (the for example TU-XX-08 of Asahi series) processing; The price of its resistance printing ink is very cheap, can make Standard resistance range wide (the TU-XX-08 series of Asahi has 15 Ω/◇, 50 Ω/◇, 100 Ω/◇ until many series of 100M Ω/◇).But, receiving silk screen printing process and device-restrictive, the existing resistance accuracy that adopts silk-screen to make is all relatively poor, is difficult to satisfy the special applications requirement high to the resistance value required precision.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of method that improves the resistance value precision of pcb board embedded resistors, can obtain the buried resistor of precision resister value.
For realizing above-mentioned purpose, the present invention provides a kind of method that improves the resistance value precision of pcb board embedded resistors, comprises the steps:
Step 1: according to the resistance change rate of buried resistor in the subsequent treatment link, the expectation resistance value of buried resistor was carried out the target resistance values that precompensation obtains the buried resistor making when pcb board was processed finished product, and confirmed the length and the width of buried resistor according to target resistance values;
Step 2: the line layer of needs being made buried resistor goes Copper Foil to handle, and according to the length and the width of the determined buried resistor of step 1, makes the square groove that corresponding size is used for ccontaining buried resistor in said line layer precalculated position;
Step 3: adopt half tone silk-screen one deck resistance printing ink in said square groove, then resistance printing ink is carried out baking-curing and form buried resistor to be finished;
Step 4: adopt resistance test instrument and laser ablation machine that buried resistor to be finished is carried out line dynamic and modify adjustment; Said laser ablation machine is used for the figure of buried resistor to be finished is carried out dynamic embellishment; Said resistance test instrument is used for real-time testing and is in the resistance value of the buried resistor in the modification; And test result fed back to the dynamic control that the laser ablation machine carries out online modification; Up to the buried resistor that obtains the tool target resistance values, said resistance test instrument can adopt the existing known resistance test instrument that can carry out real-time testing to resistance, and the laser ablation machine can adopt existing known laser ablation machine.
In the said step 1, buried resistor comprises that in the resistance change rate of subsequent treatment link buried resistor is through resistance varying-ratio behind the lamination and the resistance varying-ratio of buried resistor after spray tin is handled.
In the said step 1, the change in resistance of buried resistor behind lamination carried out-1.6% precompensation, the change in resistance of buried resistor after spray tin is handled carried out+0.7% precompensation.
In the said step 3, during the silk-screen resistance printing ink, it is that 325 orders, silk footpath are that 28 μ m, aperture opening ratio are 41% and cross the China ink amount and be 26.4cm that half tone adopts the order number
3/ cm
2Half tone.
In the said step 3, during the silk-screen resistance printing ink, half tone and line layer contact position post adhesive tape, and adopt specific silk-screen parameter to come the thickness of controlling resistance ink lay, and said silk-screen parameter is: half tone is 2mm from the line layer distance; Scraper hardness is 75 degree; Silk-screen air pressure is 5kg/cm
2Silk-screen speed is 3m/min; The silk-screen cutter tilt is 5 degree; It is 8-10mm that the silk-screen cutter presses down the degree of depth; The silk-screen number of times is a cutter.
In the said step 3, when treating that there is multiple resistance in the silk-screen buried resistor, before the silk-screen resistance printing ink; Divide into groups by the resistance value of treating the silk-screen buried resistor earlier, carry out silk-screen by group then, every silk-screen finishes one group of resistance printing ink; This group resistance printing ink is carried out preliminary drying with this group resistance printing ink of primary solidification, carries out next group resistance printing ink silk-screen again, treat intact last group resistance printing ink of silk-screen after; Carry out the back baking, so that the resistance printing ink full solidification of all silk-screens.
In the said step 3, during the silk-screen resistance printing ink, the half tone periphery is provided with printing ink lid so that the edge of the resistance printing ink of silk-screen and on every side the distance between the Copper Foil more than 10mil.
Beneficial effect of the present invention: the method for the resistance value precision of raising pcb board embedded resistors of the present invention, make buried resistor through the silk-screen mode, can make undersized resistance; Adopt resistance test instrument and laser ablation machine that buried resistor to be finished is carried out line dynamic simultaneously and modify adjustment; Can obtain the buried resistor of high accuracy (± 1%) resistance value, and be directed against the rate of change of buried resistor resistance value in the follow-up pcb board course of processing, when silk-screen resistance, carry out corresponding compensation; Can the trueness error of the actual resistance of finished product pcb board embedded resistors and expectation resistance value be controlled at ± 5% in; In addition, modify through silk-screen and laser and to process buried resistor, reduced the difficulty of silk-screen processing; Possess the stability and the reappearance of batch process, possess good Commercial Prospect.
For further setting forth technological means and the effect that the present invention takes for the predetermined purpose of realization; See also following about detailed description of the present invention and accompanying drawing; Believe the object of the invention, characteristic and characteristics; Should obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, describe in detail through specific embodiments of the invention, will make technical scheme of the present invention and other beneficial effects obvious.
In the accompanying drawing,
The sketch map that Fig. 1 calculates for the silk-screen resistance;
Fig. 2 improves the schematic flow sheet of method of the resistance value precision of pcb board embedded resistors for the present invention.
Embodiment
Sketch map as shown in Figure 1, as to calculate for the resistance of silk-screen buried resistor.
The computing formula of buried resistor is: and R=ρ * L/ (W * H).
For side's resistance of specific thickness, the buried resistor computing formula is: R=R ◇ * L/W, and in the formula, R represents resistance value, the R ◇ side of representative resistance, L represents resistance length, and W represents the resistance width.
The side resistance: when resistance material identical, when resistance thickness is identical, the square area of unit are, its resistance is identical.
Can know by definition, outside the Pass square resistance is removed and to be had with material property, also relevant with resistance thickness (for example: R ◇=1000 Ω/square/14 μ m, expression requires to toast fully the rear, and to hinder thickness be 14 ± 1um); Can know that from top formula the factor that influences resistance value has resistance length L, resistance width W, resistance thickness H.
As shown in Figure 2, the present invention improves the method for the resistance value precision of pcb board embedded resistors, comprises the steps:
Step 1: according to the resistance change rate of buried resistor in the subsequent treatment link, the expectation resistance value of buried resistor was carried out the target resistance values that precompensation obtains the buried resistor making when pcb board was processed finished product, and confirmed the length and the width of buried resistor according to target resistance values;
Step 2: the line layer of needs being made buried resistor goes Copper Foil to handle, and according to the length and the width of the determined buried resistor of step 1, makes the square groove that corresponding size is used for ccontaining buried resistor in said line layer precalculated position;
Step 3: adopt half tone silk-screen one deck resistance printing ink in said square groove, then resistance printing ink is carried out baking-curing and form buried resistor to be finished;
Step 4: adopt resistance test instrument and laser ablation machine that buried resistor to be finished is carried out line dynamic and modify adjustment; Said laser ablation machine is used for the figure of buried resistor to be finished is carried out dynamic embellishment; Said resistance test instrument is used for real-time testing and is in the resistance value of the buried resistor in the modification; And test result fed back to the dynamic control that the laser ablation machine carries out online modification, up to the buried resistor that obtains the tool target resistance values.
The inventor is through discovering in a large number, and in having made the follow-up pcb board course of processing of buried resistor, buried resistor is through after handling behind the lamination and through spray tin; Its resistance value all can sending out, and confirms through lot of experiment validation, and buried resistor is+0.8～2.2% through the rate of change of resistance value behind the lamination; Average out to+1.6%; And the rate of change of process spray tin processing back resistance value is-0.7%, wherein "+" expression resistance value increase, and "-" representes that then resistance value reduces.Therefore, in said step 1, buried resistor comprises that in the resistance change rate of subsequent treatment link buried resistor is through resistance varying-ratio behind the lamination and the resistance varying-ratio of buried resistor after spray tin is handled.For improving the resistance value precision of finished product pcb board embedded resistors; In the said step 1; Through the change in resistance of buried resistor behind lamination being carried out-1.6% precompensation; The change in resistance of buried resistor after spray tin is handled carried out+0.7% precompensation, to reduce the influence of resistance change to the resistance value precision.
In the said step 3, during the silk-screen resistance printing ink, it is that 325 orders, silk footpath are that 28 μ m, aperture opening ratio are 41% and cross the China ink amount and be 26.4cm that half tone adopts the order number
3/ cm
2Half tone.
In the said step 3, during the silk-screen resistance printing ink, half tone and line layer contact position post adhesive tape, and adopt specific silk-screen parameter to come the thickness of controlling resistance ink lay, and said silk-screen parameter is: half tone is 2mm from the line layer distance; Scraper hardness is 75 degree; Silk-screen air pressure is 5kg/cm2; Silk-screen speed is 3m/min; The silk-screen cutter tilt is 5 degree; It is 8-10mm that the silk-screen cutter presses down the degree of depth; The silk-screen number of times is a cutter.Through to the resistance printing ink Thickness Control, behind drying-plate, can obtain precision ± 20% with interior buried resistor to be finished.
In the said step 3, when treating that there is multiple resistance in the silk-screen buried resistor, before the silk-screen resistance printing ink; Divide into groups by the resistance value of treating the silk-screen buried resistor earlier, carry out silk-screen by group then, every silk-screen finishes one group of resistance printing ink; This group resistance printing ink is carried out preliminary drying with this group resistance printing ink of primary solidification, carries out next group resistance printing ink silk-screen again, treat intact last group resistance printing ink of silk-screen after; Carry out the back baking, so that the resistance printing ink full solidification of all silk-screens.Carry out packet transaction through treating the seal buried resistor, can improve the resistance value precision of finished product pcb board embedded resistors.
In the said step 3, during the silk-screen resistance printing ink, the half tone periphery is provided with printing ink lid so that the edge of the resistance printing ink of silk-screen and on every side the distance between the Copper Foil more than 10mil, flow to the Copper Foil zone to prevent resistance printing ink, thereby influence the resistance value precision of buried resistor.
The method of the resistance value precision of above-mentioned raising pcb board embedded resistors is made buried resistor through the silk-screen mode, can make undersized resistance; Adopt resistance test instrument and laser ablation machine that buried resistor to be finished is carried out line dynamic simultaneously and modify adjustment, can obtain the buried resistor of high accuracy (± 1%) resistance value, and be directed against the rate of change of buried resistor resistance value in the follow-up pcb board course of processing; When silk-screen resistance, carry out corresponding compensation; Can the trueness error of the actual resistance of finished product pcb board embedded resistors and expectation resistance value be controlled at ± 5% in,, in addition; Modify through silk-screen and laser and to process buried resistor; Reduce the difficulty of silk-screen processing, possessed the stability and the reappearance of batch process, possessed good Commercial Prospect.
The above; For the person of ordinary skill of the art; Can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (7)
1. a method that improves the resistance value precision of pcb board embedded resistors is characterized in that, comprises the steps:
Step 1: according to the resistance change rate of buried resistor in the subsequent treatment link, the expectation resistance value of buried resistor was carried out the target resistance values that precompensation obtains the buried resistor making when pcb board was processed finished product, and confirmed the length and the width of buried resistor according to target resistance values;
Step 2: the line layer of needs being made buried resistor goes Copper Foil to handle, and according to the length and the width of the determined buried resistor of step 1, makes the square groove that corresponding size is used for ccontaining buried resistor in said line layer precalculated position;
Step 3: adopt half tone silk-screen one deck resistance printing ink in said square groove, then resistance printing ink is carried out baking-curing and form buried resistor to be finished;
Step 4: adopt resistance test instrument and laser ablation machine that buried resistor to be finished is carried out line dynamic and modify adjustment; Said laser ablation machine is used for the figure of buried resistor to be finished is carried out dynamic embellishment; Said resistance test instrument is used for real-time testing and is in the resistance value of the buried resistor in the modification; And test result fed back to the dynamic control that the laser ablation machine carries out online modification, up to the buried resistor that obtains the tool target resistance values.
2. the method for the resistance value precision of raising pcb board embedded resistors as claimed in claim 1; It is characterized in that; In the said step 1, buried resistor comprises that in the resistance change rate of subsequent treatment link buried resistor is through resistance varying-ratio behind the lamination and the resistance varying-ratio of buried resistor after spray tin is handled.
3. the method for the resistance value precision of raising pcb board embedded resistors as claimed in claim 2; It is characterized in that; In the said step 1, the change in resistance of buried resistor behind lamination carried out-1.6% precompensation, the change in resistance of buried resistor after spray tin is handled carried out+0.7% precompensation.
4. the method for the resistance value precision of raising pcb board embedded resistors as claimed in claim 1 is characterized in that, in the said step 3, during the silk-screen resistance printing ink, it is that 325 orders, silk footpath are that 28 μ m, aperture opening ratio are 41% and cross the China ink amount and be 26.4cm that half tone adopts the order number
3/ cm
2Half tone.
5. like the method for the resistance value precision of claim 1 or 4 described raising pcb board embedded resistors; It is characterized in that; In the said step 3, during the silk-screen resistance printing ink, half tone and line layer contact position post adhesive tape; And adopting specific silk-screen parameter to come the thickness of controlling resistance ink lay, said silk-screen parameter is: half tone is 2mm from the line layer distance; Scraper hardness is 75 degree; Silk-screen air pressure is 5kg/cm
2Silk-screen speed is 3m/min; The silk-screen cutter tilt is 5 degree; It is 8-10mm that the silk-screen cutter presses down the degree of depth; The silk-screen number of times is a cutter.
6. the method for the resistance value precision of raising pcb board embedded resistors as claimed in claim 1 is characterized in that, in the said step 3; When treating that there is multiple resistance in the silk-screen buried resistor, before the silk-screen resistance printing ink, divide into groups by the resistance value of treating the silk-screen buried resistor earlier; Carry out silk-screen by group then, every silk-screen finishes one group of resistance printing ink, and this group resistance printing ink is carried out preliminary drying with this group resistance printing ink of primary solidification; Carry out next group resistance printing ink silk-screen again; After treating intact last group resistance printing ink of silk-screen, carry out the back baking, so that the resistance printing ink full solidification of all silk-screens.
7. the method for the resistance value precision of raising pcb board embedded resistors as claimed in claim 1; It is characterized in that, in the said step 3, during the silk-screen resistance printing ink; The half tone periphery is provided with printing ink lid so that the edge of the resistance printing ink of silk-screen and on every side the distance between the Copper Foil more than 10mil.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104610489A CN102548238A (en) | 2011-12-31 | 2011-12-31 | Method for improving resistance accuracy of buried resistor in PCB (printed circuit board) |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011104610489A CN102548238A (en) | 2011-12-31 | 2011-12-31 | Method for improving resistance accuracy of buried resistor in PCB (printed circuit board) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102928671A (en) * | 2012-11-13 | 2013-02-13 | 大连太平洋电子有限公司 | Testing method of printed wiring board conductive ink resistance value |
| CN109640520A (en) * | 2018-12-10 | 2019-04-16 | 江门崇达电路技术有限公司 | A kind of production method for burying resistance circuit plate |
| CN112533395A (en) * | 2020-12-21 | 2021-03-19 | 盐城华昱光电技术有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
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| CN101247699A (en) * | 2007-02-16 | 2008-08-20 | 财团法人工业技术研究院 | Circuit boards with embedded resistors |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102928671A (en) * | 2012-11-13 | 2013-02-13 | 大连太平洋电子有限公司 | Testing method of printed wiring board conductive ink resistance value |
| CN109640520A (en) * | 2018-12-10 | 2019-04-16 | 江门崇达电路技术有限公司 | A kind of production method for burying resistance circuit plate |
| CN109640520B (en) * | 2018-12-10 | 2021-07-23 | 江门崇达电路技术有限公司 | Manufacturing method of buried resistance circuit board |
| CN112533395A (en) * | 2020-12-21 | 2021-03-19 | 盐城华昱光电技术有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
| CN112533395B (en) * | 2020-12-21 | 2021-12-24 | 北京同方信息安全技术股份有限公司 | Method for embedding resistor in printed circuit board and printed circuit board thereof |
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Application publication date: 20120704 |