CN113628821B - Preparation and resistance value adjustment method of 3D printing resistor - Google Patents
Preparation and resistance value adjustment method of 3D printing resistor Download PDFInfo
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- CN113628821B CN113628821B CN202110905239.3A CN202110905239A CN113628821B CN 113628821 B CN113628821 B CN 113628821B CN 202110905239 A CN202110905239 A CN 202110905239A CN 113628821 B CN113628821 B CN 113628821B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
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Abstract
The invention discloses a method for preparing and adjusting resistance of a 3D printing resistor, which comprises the steps of firstly preliminarily designing the graphic size of the printing resistor according to information including the space between electrodes, the space size and the required target resistance, secondly calculating the square resistance or the resistivity of a material to be printed, and screening printing resistor slurry or printing ink; generating a printing path file of the resistor; fixing the base material on a printer base station, and adjusting printing parameters to finish resistance printing; testing the resistor after the printed resistor is solidified and sintered, comparing the printed resistor with a target resistance value, and finishing printing if the target resistance value is designed; if the resistance value does not meet the requirement, the resistance value is adjusted by adopting the optimized design graph size or the printing parameters, or the resistance value is adjusted on the basis of the printed and cured resistor. The invention can avoid the manufacturing of the screen plate and the waste of materials in the traditional screen printing process, can flexibly adjust the resistance graph and the resistance thickness, and avoids the problem that the thickness is difficult to accurately adjust by screen printing.
Description
Technical Field
The invention belongs to the field of processing and manufacturing of resistor elements, and particularly relates to a method for preparing a 3D printing resistor and adjusting a resistance value.
Background
The resistor is one of the components commonly used in electronic equipment, and is generally formed by depositing a screen printing resistor characteristic material on an insulating substrate and sintering the material to form a thick film chip resistor; the metal chip resistor is manufactured by sputtering a resistor material on an insulating substrate by adopting the processes of evaporation, sputtering and the like in vacuum. After being packaged, the electronic circuit board is fixed on the electronic circuit board in a soldering mode, and usually, the electronic circuit board is fixed by professional equipment such as automatic mounting and reflow soldering. The chip resistor on the flexible film has small size, and the chip resistor is easy to fall off due to bending deformation or scraping of the packaging edges and corners in the subsequent bending or secondary processing process of the film, so that the problems of difficult and time-consuming subsequent repair and the like are caused. In addition, no mature mounting equipment can be applied to mounting of resistors on the curved circuit, and the efficiency of manual mounting is low.
The electronic 3D printing technology is additive manufacturing technology for depositing and molding electronic materials according to needs based on technologies such as micro-pen direct writing, piezoelectric ink jet, aerosol jet and the like, and can be used for manufacturing devices such as sensors, antennas, capacitors and the like. And in recent years, the application of piezoelectric ink jet and aerosol jet methods to printing of multilayer printed boards, curved sensors, array electrodes and the like is reported. The three-axis printing machine has great flexibility, and can be assembled based on the existing three-axis equipment and five-axis motion equipment, so that the laminated overlay printing of planar and curved circuit patterns is realized. In addition, the printing mode is also applicable to wide range of sizing agents, including electronic sizing agents such as silver paste, copper paste, nickel paste and carbon paste.
The resistors are manufactured by adopting the screen printing resistor paste, the thickness of the whole carbon paste tends to be consistent, and the controllable difference of the thickness of the resistors cannot be realized. Special silk screen or steel mesh is specially customized, and more slurry is wasted in the silk screen printing process. After printing, the resistance is inconsistent due to the flowing and spreading of the slurry, and the resistance trimming is usually performed by using a laser resistance trimming instrument, and the laser resistance trimming method is only suitable for trimming when the resistance value is lower than the target resistance value.
Disclosure of Invention
Aiming at the problems in the prior art, the invention discloses a method for preparing a 3D printing resistor and adjusting the resistance value, which can be applied to a flexible substrate or a rigid PCB and a curved surface conformal circuit to manufacture the resistor. The process method has the characteristics of high flexibility, material saving, elimination of the mounting and welding procedures of the original resistor device after the printed resistor is solidified, and avoidance of easy falling of the original chip resistor by selecting proper resistor paste. In addition, the resistor pattern and the thickness can be flexibly changed through a printing mode, and the adjustment of the resistance value of the printed resistor can be realized by superposing sizing agents with different patterns or tissues on the cured resistor pattern.
The process method is easy to integrate on the existing three-axis or five-axis equipment, and the flexibility and the popularization of the process are improved.
The technical scheme adopted by the invention is as follows:
a preparation and resistance value adjustment method for a 3D printing resistor comprises the following steps:
step 1: and preliminarily designing the graphic size of the printed resistor according to information including the distance between the electrodes, the space size and the required target resistance value. If the length of the resistor line can be lengthened according to the space by adopting an S-shaped design to adjust the resistance value, the resistor pattern is designed to be as thin as possible in the initial design, so that the resistance can be reduced by increasing the thickness to reach the target resistance value in the subsequent process.
Step 2: and (3) calculating the square resistance value or the resistivity of the required printing material according to the size designed in the step (1) and the target resistance value, and screening the printing resistance paste or the printing ink according to the characteristics and the use requirements of the substrate. The screening of the resistance paste mainly considers the matching of the curing temperature of the resistance paste and the temperature resistance of the substrate, the adhesion of the resistance paste on the substrate, the temperature impact resistance, the resistance drift rate with the temperature, the printability and the like.
And step 3: generating a printing path file of the resistor through slicing software or CAM software; the method aims to realize the quantitative deposition of the resistance paste according to tracks and form a resistance pattern.
And 4, step 4: and fixing the base material on a printer base station, positioning, adjusting printing parameters, executing a printing program, and finishing resistance printing. Generally, the films are fixed by adopting a negative pressure adsorption mode, and the hard substrate is fixed by adopting a pressing plate. Before fixing, the printed resistor part and the electrode surface should be cleaned, so as to ensure that the surface is clean and has no oil stain and no oxide layer on the electrode surface.
And 5: and (4) after the resistor printed in the step (4) is solidified or sintered, testing the resistor, comparing the resistor with a target resistance value, and finishing printing if the target resistance value is designed. The low-temperature resistance slurry, such as carbon slurry and graphene slurry, can be cured in a hot stage, an oven or the like, and the high-temperature resistance slurry, such as ruthenium oxide and platinum slurry, needs to be cured by high-temperature sintering or laser sintering.
Step 6: and 5, under the condition that the target resistance value is not met in the step 5, adjusting the resistance value by adopting the optimized design graph size or the printing parameters, or adjusting the resistance value on the basis of the printed and cured resistor. After the resistance value is controlled stably, methods such as resin material packaging and the like can be adopted, and influences of external environment temperature, humidity and the like on the resistance stability are avoided.
Furthermore, the size of the printed resistor pattern designed in step 1 is that the lapping amount of the resistor pattern on the electrode is more than 2 times of the diameter of the jet orifice of the printing head, so that the change of the resistance value caused by the unstable sizes of the printing starting point and ending point lines is mainly avoided, and the stable size of the effective resistor area is ensured as much as possible.
Further, the resistance paste in step 2 refers to carbon paste, ruthenium oxide paste, graphene paste, carbon ink or graphene oxide ink, and the sheet resistance value is not less than the sheet resistance value of the printing material required for calculation and not more than one time of the calculated sheet resistance value. The purpose is mainly to facilitate the realization of the regulation and control of the resistance in the micro-regulation of the graph size, otherwise, the resistance deviation value is larger and can not reach the target resistance or is difficult to be regulated to the target resistance.
Further, the printer in step 4 refers to a printing device based on aerosol jet technology, micro-straight writing technology or piezoelectric ink jet technology, wherein the corresponding printing device is selected according to the viscosity characteristics of the resistance paste screened in step 2. For example, the micro-pen technology is suitable for the slurry with the viscosity of above 1000Cp, the piezoelectric ink-jet technology is suitable for the slurry with the viscosity of 5-50 Cp, and the aerosol technology is suitable for the slurry with the viscosity of below 1000 Cp.
Furthermore, the step 4 of adjusting the printing parameters means that the printing lines are continuously and uniformly printed without breakpoint phenomenon by adjusting the layer height, the printing speed or the air pressure parameters and utilizing the printing line test. The main purpose is to realize the consistency of printed resistor graphs and finally realize the consistency of resistor resistance values.
Further, in step 6, the optimally designed pattern refers to adjusting the resistance value by changing the width, length and/or thickness of the pattern, and the optimally printed parameter refers to adjusting the resistance by changing the printing thickness by changing the printing speed, the extrusion air pressure and/or the number of printed layers.
Further, in step 6, when the resistor needs to be finely adjusted, the width and thickness of the printed resistor line are changed by adjusting the printing parameters to realize the fine adjustment of the resistor; when a larger range of resistance adjustment is required, the resistance value is increased by increasing or shortening the length of the design pattern in the presence of sufficient space between the two electrodes.
Further, in step 6, performing resistance value adjustment on the basis of the printed cured resistor means that: under the condition that the actual printing resistance value is far larger than the target resistance value, the same or different patterns are printed on the original resistance pattern in a laminating mode, the whole thickness or the local thickness of the original resistance pattern is changed to adjust the resistance value, and the same type of resistance paste with the proper square resistance value can be selected according to the adjusting range. The method is characterized in that the same type of slurry is preferably selected, resistance adjustment is carried out according to the resistance adjusting range and the effect similar to the parallel connection of resistors in order to ensure the adhesion between the same curing system and the slurry, and the slurry with the appropriate sheet resistance value is screened by calculating the required resistance value. Of course, different types of resistor pastes may be selected where a match in physical properties is warranted, such as properties of cure temperature, interlayer adhesion, coefficient of expansion, and environmental compatibility.
Advantageous effects
Compared with the background art, the invention has the beneficial effects that:
1) Compared with the traditional screen printing process, the 3D printing resistance method provided by the invention has the advantages that the material waste is reduced, the process is simple, and the resistor element mounting and welding processes are avoided. And the printing resistor slurry is in a natural leveling state and has no sharp edges and corners, so that the falling risk of the traditional chip resistor caused by rubbing of foreign matters is reduced.
2) According to the 3D resistor printing method, the control of the resistor can be flexibly realized by adopting the patterning design and the thickness control of the resistor.
3) The mode of adjusting the resistance can complement the existing laser resistance adjusting mode, and the adjustable range of the resistance is enlarged.
4) The resistance printing process method is easy to integrate in the existing three-axis and five-axis motion systems, namely, the printing of a plane resistance can be realized, the printing of a curved surface resistance can also be realized, and the applicable flexibility of the resistance printing process method is greatly improved.
The invention can be derived and applied to the printing of electrode patterns, sensors, antennas and other patterns, and provides powerful support for improving the flexible manufacturing of electronic elements.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic flow chart of a 3D printing resistor and a resistance value adjusting method according to the present invention.
FIG. 2 is a schematic diagram of different resistance patterns according to the electrode spacing and spatial design of the present invention.
FIG. 3 is a schematic diagram of the micro-writing printing resistor and the resistance adjustment process according to the present invention.
Fig. 4 shows the profile before and after resistance trimming of an actual printed resistor. a) After the print resistor is cured, b) printing the adjustment resistor in a laminated mode.
FIG. 5 is a printed resistor topography for different design patterns. a) a strip resistor, b) a square wave resistor, c) a square block resistor, d) an S-type resistor, e) a circular resistor.
Detailed Description
To further illustrate the details of the present invention, reference is made to the accompanying drawings and examples which are described in detail below. FIG. 1 is a flow chart of a 3D printing resistor and a resistance value adjusting method according to the invention; FIG. 2 is a schematic diagram illustrating different resistance patterns designed according to the size between electrodes in step 1; such as a zigzag shape, a stripe shape, and a square shape, the theoretical resistance value should be calculated by the size of the effective area, and the area overlapping the electrode is the ineffective resistance area as shown by the corresponding effective resistance area in fig. 2. Fig. 3 illustrates a printing block resistor and a resistance adjustment process of printing carbon paste by using the micro straight writing technique, in which resistance adjustment is performed by performing stack printing on the basis of the original printing resistor. Fig. 4 and table 1 show the actual printed resistors and the changes in the shape of the resistors after resistance trimming and the resistance data, and the specific process is described in the following embodiment.
Example 1:
the target resistance value is: 160 Ω ± 10%, the electrode spacing is: 0.3mm, the base material is PET; designing the size of a square resistor as follows: 1.6mm × 1.6mm, thickness: based on the actual printing thickness (20-50 μm), the printing resistance paste is as follows: carbon paste (sierrate three-dimensional technologies ltd), viscosity: (4-5). Times.10 4 Cp, sheet resistance: 1K omega/\ 9633, curing temperature 160 deg.C @0.5h. Equipment: double micro-pen direct-writing 3D printer (model: JD200Pro, three-dimensional science and technology Co., ltd., xianruit)
The printing parameters are as follows: needle diameter: 0.24mm, printing air pressure: 0.38MPa, layer height 0.1mm, and printing speed 100mm/min
Printing the resistance results: the resistance actually tested by using a multimeter is 250 omega +/-10%, the specific data are shown in table 1, and the morphology is shown in fig. 4 a).
Designing the size of a resistance trimming graph: 1.6mm × 0.4mm, height from substrate layer: 0.15mm, and other printing parameters and sizing agent for resistance adjustment are not changed.
The resistance value after resistance adjustment is as follows: the resistance value after resistance adjustment is 160 omega +/-10% by adopting a multimeter, the specific data are shown in table 1, and the appearance is shown in fig. 4 b).
Example 2:
different resistances between the fixed electrodes are realized by designing different patterns, such as designed strip, square, round, S-shaped and the like. The electrode spacing is 4mm, the electrode size is 2 x 2mm, the selected resistance slurry is graphene slurry, and the viscosity is 3-6 x 10 4 The sheet resistance is 25 omega @20 mu m, and the curing temperature is as follows: @ 150 ℃ for 30min, and the substrate is selected to be a PI film. Equipment: double micro-pen direct-writing 3D printer (model: JD200Pro, three-dimensional technology Co., ltd., xianruite)
Printing parameters: the diameter of the printing needle is 0.16mm, the air pressure is 0.2Mpa, the layer height is 0.1mm, and the printing speed is 400mm/min.
The printed resistors and patterns of the different design patterns are shown in table 2.
TABLE 1 print resistor and post stack resistance variation
TABLE 2 resistors printed with different designs
The invention uses the oven, the hot table or the sintering furnace to solidify or sinter the resistance material, after testing the printed resistance, the size of the resistance graph and the printing parameters are optimized according to the resistance test value, or the resistance value is adjusted on the basis of the printed and solidified resistance until the target set value of the resistance is reached. The resistance value adjusting method is a process of wholly or locally increasing the thickness of a resistor paste layer on the basis of an original resistor in a printing mode under the condition that the resistance value of a printing resistor is higher than a target resistance value, and then reducing the resistance value after curing.
The resistor preparation method provided by the invention has great flexibility, can avoid the manufacturing of the screen plate and the waste of materials in the traditional screen printing process, and can flexibly adjust the resistor graph and the resistor thickness by adopting a printing mode, thereby avoiding the problem that the thickness is difficult to accurately adjust by screen printing. Meanwhile, the problems that the conventional welded chip resistor is easy to fall off in the processes of external force and the like can be solved. The resistance is thickened by a secondary printing mode, so that the resistance value is reduced, the adjustment of the resistance value from high to low can be realized, and the adjustment mode can be complementary with the adjustment mode that the existing laser resistance trimming instrument can only realize the adjustment from the low resistance value to the high resistance value.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (7)
1. A preparation method of a 3D printing resistor is characterized by comprising the following steps: comprises the following steps:
step 1: preliminarily designing the graphic size of the printed resistor according to information including the distance between the electrodes, the space size and the required target resistance value; wherein the lapping quantity of the resistor pattern on the electrode is more than 2 times of the diameter of the jet orifice of the printing head;
and 2, step: calculating the square resistance value or the resistivity of the printing material according to the size designed in the step 1 and the target resistance value, and screening the printing resistance paste according to the characteristics and the use requirements of the base material;
and 3, step 3: generating a printing path file of the resistor through slicing software or CAM software;
and 4, step 4: fixing the base material on a base station of the printer, positioning, adjusting printing parameters, executing a printing program, and finishing resistance printing;
and 5: curing or sintering the resistor printed in the step 4, testing the resistor, comparing the resistor with a target resistance value, and finishing printing if the target resistance value is designed;
and 6: under the condition that the target resistance value is not met in the step 5, adjusting the resistance value by adopting the size of the optimally designed graph or printing parameters; and after the resistance value is controlled stably, packaging by using a resin material.
2. The method for preparing the 3D printing resistor according to claim 1, wherein the method comprises the following steps: in the step 6, the length of the resistor circuit is lengthened according to the space by adopting an S-shaped design to adjust the resistance value, and the resistor pattern is designed to be as thin as possible in the initial design, so that the resistance can be conveniently reduced by increasing the thickness to reach the target resistance value in the subsequent process.
3. The method for preparing the 3D printing resistor according to claim 1, wherein the method comprises the following steps: and 2, the resistance paste refers to carbon paste, ruthenium oxide paste, graphene paste or graphene oxide ink, and the sheet resistance value of the resistance paste is not less than the sheet resistance value of the printing material required by calculation and not more than one time of the calculated sheet resistance value.
4. The method for preparing the 3D printing resistor according to claim 1, wherein the method comprises the following steps: and 4, the printer is printing equipment based on an aerosol jet technology, a micro-straight writing technology or a piezoelectric ink jet technology, wherein the corresponding printing equipment is selected according to the viscosity characteristic of the resistance paste screened in the step 2.
5. The method for preparing the 3D printing resistor according to claim 1, wherein the method comprises the following steps: in the step 4, the film base materials are fixed in a negative pressure adsorption mode, and the hard substrate base materials are fixed by a pressing plate; before fixing, the printed resistor part and the electrode surface should be cleaned, so as to ensure that the surface is clean and has no oil stain and no oxide layer on the electrode surface.
6. The method for preparing the 3D printing resistor according to claim 1, wherein the method comprises the following steps: and 4, adjusting the printing parameters means that the printing lines are continuously and uniformly printed without breakpoint phenomena by adjusting the layer height, the printing speed or the air pressure parameters and utilizing the printing line test.
7. The method for preparing the 3D printing resistor according to claim 1, wherein the method comprises the following steps: in step 6, the size of the optimally designed graph refers to the size of a resistance value adjusted by changing the width, length and/or thickness of the graph; the optimized printing parameters refer to adjusting the resistance by changing the printing thickness by changing the printing speed, the extrusion air pressure and/or the printing layer number.
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| CN115453196B (en) * | 2022-08-12 | 2024-06-14 | 武汉大学 | Method for testing resistance performance of ink of water-based conductive pen |
| CN115332773B (en) * | 2022-09-19 | 2023-04-18 | 广东绿展科技有限公司 | IPDS antenna, communication equipment and preparation method thereof |
| CN115513662B (en) * | 2022-10-28 | 2024-04-26 | 中国电子科技集团公司第二十九研究所 | Curved surface resistance structure of curved surface antenna and in-situ additive manufacturing method thereof |
| FR3143942A1 (en) * | 2022-12-16 | 2024-06-21 | Safran Electronics & Defense | METHOD FOR MANUFACTURING AN ELECTRONIC CARD EQUIPPED WITH A HEATER |
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| KR20160114348A (en) * | 2015-03-24 | 2016-10-05 | 서울시립대학교 산학협력단 | Apparatus and method for producing resistor using 3d printer |
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| CN103763795B (en) * | 2014-01-20 | 2015-06-10 | 新乡市杰达精密电子器件有限公司 | Producing method of thick film heating element and method for determining using amount of resistor paste |
| US10665369B1 (en) * | 2018-11-16 | 2020-05-26 | Ge Global Sourcing Llc | Resistors for dynamic braking |
| CN113146007B (en) * | 2021-04-27 | 2022-09-13 | 东风柳州汽车有限公司 | Method and device for determining welding lap amount of resistance spot welding |
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| KR20160114348A (en) * | 2015-03-24 | 2016-10-05 | 서울시립대학교 산학협력단 | Apparatus and method for producing resistor using 3d printer |
| CN109786058A (en) * | 2019-01-24 | 2019-05-21 | 广西桂仪科技有限公司 | A kind of method that printing prepares thermistor |
| CN111565520A (en) * | 2020-04-17 | 2020-08-21 | 廖章明 | Resistor, preparation method of in-mold electronic film, resistor and in-mold electronic film |
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