CN102534715A - Process method for electroplating copper on surface of micro aluminum wire - Google Patents
Process method for electroplating copper on surface of micro aluminum wire Download PDFInfo
- Publication number
- CN102534715A CN102534715A CN2012100365143A CN201210036514A CN102534715A CN 102534715 A CN102534715 A CN 102534715A CN 2012100365143 A CN2012100365143 A CN 2012100365143A CN 201210036514 A CN201210036514 A CN 201210036514A CN 102534715 A CN102534715 A CN 102534715A
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- China
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- copper
- aluminum wire
- process method
- aluminium wire
- plating solution
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- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a process method for electroplating copper on the surface of a micro aluminum wire. The process method is characterized by comprising the following step of: putting the pretreated micro aluminum wire into a copper plating solution, wherein current density is 3A.dm<-2>, plating temperature is 25 DEG C, ultrasonic power is 160W, plating time is 3 minutes, and 1L of copper plating solution is prepared from the following raw materials by weight: 150 to 220g of CuSO4.5H2O, 50 to 70g of H2SO4, 0.01 to 0.08g of chloride ion Cl<-> and 0.05 to 0.2g of sodium dodecyl sulfate. After the copper is electroplated on the surface of the aluminum wire by the method, the aluminum wire has a smooth and compact surface and a uniform color, fine grains are tightly arranged, and the original defect on the aluminum wire is repaired.
Description
Technical field
The present invention relates to the process method of a kind of fine aluminium wire surface electrical copper facing, copper plating process is carried out on the surface that is used for fine aluminium wire is disposed in earlier stage.
Background technology
Along with developing rapidly of electronic information technology, metal wire material in the application of aspects such as various precision instruments, miniature automatically controlled instrument, wireless, electronics more and more widely.Aluminium has a wide range of applications in microelectronics as the conductivity good metal, but aluminium have the surface very easily oxidation and sull again extremely difficulty shortcoming such as remove, cause contact resistance big, can not weld with scolding tin, thereby had a strong impact on the performance of aluminium wire.The copper facing aluminium wire promptly has the high-frequency transmission performance of copper, have the advantage such as lightweight, softness of aluminium again, and conductivity is better than aluminium, and bending property is better than pure copper wire.So the instead of pure copper cash is made the best materials of high frequency cable and mobile communication cable inner wire during copper-clad aluminum conductor.
Summary of the invention
The technical problem that the present invention will solve provides the process method of a kind of fine aluminium wire surface electrical copper facing, adopts aluminium wire surfacing, densification after this method electro-coppering, and crystal grain is careful, arrange closely, and the color and luster uniformity, originally the defective on the aluminium wire is also repaired.
For overcoming the above problems, concrete technical scheme of the present invention is following: the process method of a kind of fine aluminium wire surface electrical copper facing is characterized in that: the fine aluminium wire that dispose early stage is put in the copper plating solution, and the employing current density is 3Adm
-2, plating temperature is that 25 ℃, ultrasonic power are 160W, plating time is 3min; Wherein copper plating solution adopts following preparation of raw material to form:
CuSO
4·5H
2O 150～220g/L、 H
2SO
4 50～70g/L、
Cl ions Cl
-0.01～0.08g/L, sodium lauryl sulphate 0.05～0.2g/L.
Adopt the process method of this fine aluminium wire surface electrical copper facing, the aluminium wire surfacing after the electro-coppering, densification, crystal grain is careful, arranges closely, and the color and luster uniformity, originally the defective on the aluminium wire is also repaired.
Embodiment
The technical process of fine aluminium wire copper coating is generally: and alkali soaks-and hot water cleaning-cold water cleaning-acidleach-cold water clean-once soaks zinc-cold water and clean-moves back zinc-cold water cleaning-secondary soaking zinc-cold water cleaning-nickel preplating-cold water cleaning-activation-copper facing
The pretreatment process of trickle aluminium wire surface electrical copper facing, the applicant has submitted patented claim in addition to, and the application's protection domain is only in pretreated electro-coppering process.
Embodiment one
The process method of a kind of fine aluminium wire surface electrical copper facing is put into the fine aluminium wire that dispose early stage in the copper plating solution, and the employing current density is 3Adm
-2, plating temperature is that 25 ℃, ultrasonic power are 160W, plating time is 3min; Wherein copper plating solution adopts following preparation of raw material to form:
CuSO
4·5H
2O 150g/L、 H
2SO
4 50g/L、
Cl ions Cl
-0.01g/L, sodium lauryl sulphate 0.05g/L.
Embodiment two
The process method of a kind of fine aluminium wire surface electrical copper facing is characterized in that: the fine aluminium wire that dispose early stage is put in the copper plating solution, and the employing current density is 3Adm
-2, plating temperature is that 25 ℃, ultrasonic power are 160W, plating time is 3min; Wherein copper plating solution adopts following preparation of raw material to form:
CuSO
4·5H
2O 190g/L、 H
2SO
4 60g/L、
Cl ions Cl
-0.05g/L, sodium lauryl sulphate 0.13g/L.
Embodiment three
The process method of a kind of fine aluminium wire surface electrical copper facing is characterized in that: the fine aluminium wire that dispose early stage is put in the copper plating solution, and the employing current density is 3Adm
-2, plating temperature is that 25 ℃, ultrasonic power are 160W, plating time is 3min; Wherein copper plating solution adopts following preparation of raw material to form:
CuSO
4·5H
2O 220g/L、 H
2SO
4 70g/L、
Cl ions Cl
-0.08g/L, sodium lauryl sulphate 0.2g/L.
Claims (1)
1. the process method of fine aluminium wire surface electrical copper facing is characterized in that: the fine aluminium wire that dispose early stage is put in the copper plating solution, and the employing current density is 3Adm
-2, plating temperature is that 25 ℃, ultrasonic power are 160W, plating time is 3min; Wherein copper plating solution adopts following preparation of raw material to form:
CuSO
4·5H
2O 150～220g/L、 H
2SO
4 50～70g/L、
Cl ions Cl
-0.01～0.08g/L, sodium lauryl sulphate 0.05～0.2g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100365143A CN102534715A (en) | 2012-02-18 | 2012-02-18 | Process method for electroplating copper on surface of micro aluminum wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100365143A CN102534715A (en) | 2012-02-18 | 2012-02-18 | Process method for electroplating copper on surface of micro aluminum wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102534715A true CN102534715A (en) | 2012-07-04 |
Family
ID=46342699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100365143A Pending CN102534715A (en) | 2012-02-18 | 2012-02-18 | Process method for electroplating copper on surface of micro aluminum wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102534715A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103334134A (en) * | 2013-04-19 | 2013-10-02 | 中山职业技术学院 | Method for ultrasonic electroplating of aluminum alloy |
| TWI466148B (en) * | 2013-11-15 | 2014-12-21 | Prosperity Dielectrics Co Ltd | High - frequency hollow inductance of the welding pin plating process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060157352A1 (en) * | 2005-01-19 | 2006-07-20 | Corus Aluminium Walzprodukte Gmbh | Method of electroplating and pre-treating aluminium workpieces |
| CN101187046A (en) * | 2007-08-24 | 2008-05-28 | 仲庆 | Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire |
| CN101250734A (en) * | 2007-11-23 | 2008-08-27 | 四川材料与工艺研究所 | Deep blind hole internal surface uniform electrochemical treatment method |
| CN101457375A (en) * | 2007-12-14 | 2009-06-17 | 深圳市天泽科技实业有限公司 | Electroplate copper liquor for printed circuit board |
-
2012
- 2012-02-18 CN CN2012100365143A patent/CN102534715A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060157352A1 (en) * | 2005-01-19 | 2006-07-20 | Corus Aluminium Walzprodukte Gmbh | Method of electroplating and pre-treating aluminium workpieces |
| CN101187046A (en) * | 2007-08-24 | 2008-05-28 | 仲庆 | Electroplating preparation method for copper cladded aluminum wire or copper cladded magnesium alloy wire |
| CN101250734A (en) * | 2007-11-23 | 2008-08-27 | 四川材料与工艺研究所 | Deep blind hole internal surface uniform electrochemical treatment method |
| CN101457375A (en) * | 2007-12-14 | 2009-06-17 | 深圳市天泽科技实业有限公司 | Electroplate copper liquor for printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103334134A (en) * | 2013-04-19 | 2013-10-02 | 中山职业技术学院 | Method for ultrasonic electroplating of aluminum alloy |
| CN103334134B (en) * | 2013-04-19 | 2016-02-24 | 中山职业技术学院 | A kind of method of electroplating in ultrasonic field aluminium alloy |
| TWI466148B (en) * | 2013-11-15 | 2014-12-21 | Prosperity Dielectrics Co Ltd | High - frequency hollow inductance of the welding pin plating process |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120704 |