CN102509693A - Chemical unsealing method of plastic package electronic component using aluminum wire as connecting wire and preparation method of etching solution used in chemical unsealing method - Google Patents
Chemical unsealing method of plastic package electronic component using aluminum wire as connecting wire and preparation method of etching solution used in chemical unsealing method Download PDFInfo
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- CN102509693A CN102509693A CN2011103182099A CN201110318209A CN102509693A CN 102509693 A CN102509693 A CN 102509693A CN 2011103182099 A CN2011103182099 A CN 2011103182099A CN 201110318209 A CN201110318209 A CN 201110318209A CN 102509693 A CN102509693 A CN 102509693A
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Abstract
The invention relates to a chemical unsealing method of a plastic package electronic component which is connected by using an aluminum wire. The chemical unsealing method of the plastic package electronic component which uses the aluminum wire as a connecting wire is characterized by comprising the following steps of: preparing a sample, etching the sample by using an etching solution, and cleaning the sample by using a cleaning agent, wherein the preparation method of the etching solution comprises the following steps of: pouring concentrated sulfuric acid of which the mass fraction is 98 percent into an acid-resistant and high-temperature-resistant container, and heating the acid-resistant and high-temperature-resistant container at a heating temperature of 180 to 250 DEG C to obtain the etching solution. Compared with the prior art, the chemical unsealing method disclosed by the invention has the advantages that: a disabled electronic component which uses the aluminum wire as the connecting wire can be effectively unsealed, and the neatness of the surface of an internal chip of the electronic component and the integrity of the aluminum connecting wire are ensured.
Description
Technical field:
The present invention relates to a kind of plastic packaging electronic devices and components chemistry Kaifeng method, especially a kind of chemistry Kaifeng method that adopts the plastic packaging electronic devices and components of aluminum steel connection.
Background technology:
Have in the electronic device one type we be referred to as plastic device, promptly the outside of device be with a kind of plastic material wrap up the inside connecting circuit, this plastic material mainly is a doping silicon dioxide in the epoxy resin.This device need erode this layer plastic cement of outside when carrying out failure analysis with chemical method, do analysis thereby expose inner circuit.
The most general connected mode in plastic packaging electronic device inside is to make circuit connecting wire with gold thread at present; This type device that is used for breaking a seal has had the chemical corrosion method of comparative maturity; The fuming nitric aicd that normally adopts mass fraction >=95% in the industry is as corrosive agent, 70 ℃ of corrosion temperatures; The fuming nitric aicd of also useful mass fraction >=95% and mass fraction be the mixed solution of 98% the concentrated sulfuric acid as corrosive agent, the chances are 4: 1～5: 1 for their volume ratio, temperature is about 90 ℃.
But useful aluminum steel comes connecting circuit in the electronic device, to the chemical corrosion Kaifeng of this device, uses above caustic solution, easily with the aluminum steel corrosion, and does not also have the very ripe chemical corrosion method about this device in the industry.
Goal of the invention:
The purpose of this invention is to provide a kind of chemistry Kaifeng method that adopts aluminum steel as the plastic packaging electronic devices and components of connecting line, realize effective Kaifeng of electronic devices and components, guarantee the complete of the clean and tidy and aluminium connecting line in electronic devices and components inside chip surface.
Another object of the present invention provides a kind of compound method that adopts aluminum steel as the used corrosive liquid in plastic packaging electronic devices and components chemistry Kaifeng of connecting line.
For realizing above-mentioned purpose, the present invention adopts following technical scheme:
A kind of chemistry Kaifeng method that adopts aluminum steel as the plastic packaging electronic devices and components of connecting line; It is characterized in that comprising the steps: to prepare sample, corroding sample, clean sample with cleaning agent with corrosive liquid; The compound method of wherein said corrosive liquid is: with mass fraction is that 98% the concentrated sulfuric acid is poured the acid-resistant and anti-high-temperature container into; Then the acid-resistant and anti-high-temperature container is heated and make, heating-up temperature is 180 ℃～250 ℃.
Above-mentioned said heating-up temperature is 230 ℃.
Above-mentioned said use cleaning agent cleans the sample step: use washed with de-ionized water again with acetone earlier.
A kind of compound method that adopts aluminum steel as the used corrosive liquid in plastic packaging electronic devices and components chemistry Kaifeng of connecting line; It is characterized in that comprising the steps: with mass fraction is that 98% the concentrated sulfuric acid is poured the acid-resistant and anti-high-temperature container into; Then the acid-resistant and anti-high-temperature container is heated and make, heating-up temperature is 180 ℃～250 ℃.
The present invention compared with prior art has following advantage: realize adopting aluminum steel to connect effective Kaifeng of the inefficacy electronic devices and components of line, guarantee the complete of the clean and tidy and aluminium connecting line in electronic devices and components inside chip surface.
Embodiment:
One, the flow process that manually breaks a seal
1, sample is prepared:
The sample in needs Kaifeng is encased with masking foil, expose the position (need all not erode by the plastic packaging glue that entire device is outside usually during Kaifeng, only need the corrosion regional area) of needs corrosion.
2, corrosive liquid preparation:
Using the glass bar drainage slowly in beaker, to pour the 5ml mass fraction into is 98% concentrated sulfuric acid, beaker is placed on the heating plate and with temperature transfers to 230 ℃ again.
3, sample corrosion:
The plate to be heated temperature rises to temperature is set; Continue to wait for that 2min guarantees that the corrosive liquid temperature reaches requirement; Clamp the position that sample edge need not be corroded with tweezers; The another hand drips to the position that sample need corrode with the corrosive liquid that glue head dropper draws heat, note with tweezers with sample be put into the beaker mouth directly over, make the corrosive liquid that is added on the sample continue to be back in the beaker and recycle; Naked eyes are the observation sample corrosion condition at any time, in case plastic packaging glue erodes to the chip and the connecting line of the inside is come out fully, then stops to add acid immediately to sample.
4, clean:
After corrosion stops; Drawing ready acetone with another glue head dropper immediately drips to the position that is corroded and cleans; Use washed with de-ionized water then, if cleaning performance is not good like this, then with the about 2-3ml acetone of 50ml beaker splendid attire; Sample after the corrosion is put into acetone, beaker is placed in the supersonic wave cleaning machine cleans again.
Can directly observe and Measurement and analysis after the cleaning sample.
Two. the mail opener flow process that breaks a seal automatically
Use equipment: manufacturer-NISENE, model-JetEtch II
1, sample is prepared
Sample is put on the equipment etching head position alignment equipment etching head opening part that sample need break a seal.
2, parameter setting:
Etch temperature: the temperature that etching process needs is set to 230 ℃;
Etching period: etching head is sprayed the time of hot acid outward; Etching period depends on the thickness of sample external plastic glue and needs the area of corrosion that etching period is decided because of sample;
Warm-up time: etching head reaches the heating time that is provided with after the temperature sample, operated by rotary motion 50s; (this process etching head does not go out acid, finishes promptly to begin to calculate etching period warm-up time.)
The proportioning of corrosive liquid: corrosive liquid is merely the concentrated sulfuric acid of mass fraction 98%.
The flow of corrosive liquid: in etching process, mixed acid is pressed how many milliliters of per minute from the etching head ejection, is set to 3～4ml/min usually.
The pickling time: the concentrated sulfuric acid of cold fuming nitric aicd or mass fraction 98%, the chip washing time that after etching period is accomplished, etch exposed is gone out.Usually select the concentrated sulfuric acid flushing 20s of cold mass fraction 98%.
4, carry out etching program:
Parameter is provided with to be accomplished the back and preserves by " Start ", treats that the etching head temperature rises to design temperature (equipment can show real time temperature) and presses " Start " and promptly carry out whole etching processes, after pickling finishes, sample is taken off from etching head clean.
5, clean:
After taking off sample, draw ready acetone with glue head dropper immediately and drip to the position that is corroded and clean, use washed with de-ionized water then; If cleaning performance is not good like this; Then, the sample after the corrosion is put into acetone, again beaker is placed on to vibrate in the supersonic wave cleaning machine and cleans about 30s with the about 2-3ml acetone of 50ml beaker splendid attire; Must continue to use deionized water rinsing after taking out sample, treat at last can observe, measure, analyze after sample dries.
As shown in table 1 is the Comparative Examples of different etching parameters and the Kaifeng effect comparison table of embodiments of the invention.
Table 1
Choosing of corrosive liquid temperature is active temperature and the volatility with reference to every kind of acid, and nitric acid: 70 ℃ and highly volatile, sulfuric acid: 200 ℃ are not volatile.Therefore at nitric acid more for a long time, temperature should be hanged down as far as possible and prevented its too fast volatilization.Along with the increase of sulfuric acid proportion, temperature need raise and take into account the activity of sulfuric acid.Temperature can be corroded near the active temperature of acid, and just temperature is crossed the low slow and easy cull of chip surface of corrosion rate, and the too high nitric acid of temperature can volatilize fast or too high corrosive liquid temperature causes the damage of chip thermal stress easily.
Can be found out that by table 1 the Kaifeng effect of the selected corrosive liquid of the present invention obviously is superior to Comparative Examples, when the corrosive liquid temperature was 230 ℃, etching time was short, and can avoid the damage of thermal stress to chip to greatest extent.
Claims (5)
1. chemistry Kaifeng method that adopts aluminum steel as the plastic packaging electronic devices and components of connecting line; It is characterized in that comprising the steps: to prepare sample, corroding sample, clean sample with cleaning agent with corrosive liquid; The compound method of wherein said corrosive liquid is: with mass fraction is that 98% the concentrated sulfuric acid is poured the acid-resistant and anti-high-temperature container into; Then the acid-resistant and anti-high-temperature container is heated and make, heating-up temperature is 180 ℃～250 ℃.
2. a kind of chemistry Kaifeng method that adopts aluminum steel as the plastic packaging electronic devices and components of connecting line according to claim 1, it is characterized in that: said heating-up temperature is 230 ℃.
3. a kind of chemistry Kaifeng method that adopts aluminum steel as the plastic packaging electronic devices and components of connecting line according to claim 2 is characterized in that: said use cleaning agent cleans the sample step and is: use washed with de-ionized water again with acetone earlier.
4. compound method that adopts aluminum steel as the used corrosive liquid in the plastic packaging electronic devices and components of connecting line chemistry Kaifeng; It is characterized in that comprising the steps: with mass fraction is that 98% the concentrated sulfuric acid is poured the acid-resistant and anti-high-temperature container into; Then the acid-resistant and anti-high-temperature container is heated and make, heating-up temperature is 180 ℃～250 ℃.
5. a kind of compound method that adopts aluminum steel as the used corrosive liquid in plastic packaging electronic devices and components chemistry Kaifeng of connecting line according to claim 4, it is characterized in that: said heating-up temperature is 230 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103182099A CN102509693A (en) | 2011-10-19 | 2011-10-19 | Chemical unsealing method of plastic package electronic component using aluminum wire as connecting wire and preparation method of etching solution used in chemical unsealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103182099A CN102509693A (en) | 2011-10-19 | 2011-10-19 | Chemical unsealing method of plastic package electronic component using aluminum wire as connecting wire and preparation method of etching solution used in chemical unsealing method |
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| Publication Number | Publication Date |
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| CN102509693A true CN102509693A (en) | 2012-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011103182099A Withdrawn CN102509693A (en) | 2011-10-19 | 2011-10-19 | Chemical unsealing method of plastic package electronic component using aluminum wire as connecting wire and preparation method of etching solution used in chemical unsealing method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103065936A (en) * | 2012-12-27 | 2013-04-24 | 西安芯派电子科技有限公司 | Plastic package integrated circuit (IC) seal-opening method |
| CN105092326A (en) * | 2015-07-21 | 2015-11-25 | 中国工程物理研究院计量测试中心 | Unsealing method for flip-chip packaging device |
| CN106683977A (en) * | 2016-12-16 | 2017-05-17 | 贵州航天计量测试技术研究所 | Unsealing device and unsealing method of molded package device |
| CN106771949A (en) * | 2016-12-19 | 2017-05-31 | 广东威创视讯科技股份有限公司 | A kind of LED charactrons Kaifeng technique |
| CN108275330A (en) * | 2017-01-05 | 2018-07-13 | 富士康(昆山)电脑接插件有限公司 | A kind of method of ceramic package component rapid open |
| CN114578203A (en) * | 2022-05-05 | 2022-06-03 | 江山季丰电子科技有限公司 | Unsealing method, application and failure analysis method of chip packaged by adopting routing process |
-
2011
- 2011-10-19 CN CN2011103182099A patent/CN102509693A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103065936A (en) * | 2012-12-27 | 2013-04-24 | 西安芯派电子科技有限公司 | Plastic package integrated circuit (IC) seal-opening method |
| CN105092326A (en) * | 2015-07-21 | 2015-11-25 | 中国工程物理研究院计量测试中心 | Unsealing method for flip-chip packaging device |
| CN106683977A (en) * | 2016-12-16 | 2017-05-17 | 贵州航天计量测试技术研究所 | Unsealing device and unsealing method of molded package device |
| CN106771949A (en) * | 2016-12-19 | 2017-05-31 | 广东威创视讯科技股份有限公司 | A kind of LED charactrons Kaifeng technique |
| CN106771949B (en) * | 2016-12-19 | 2019-06-14 | 广东威创视讯科技股份有限公司 | A kind of LED charactrons Kaifeng technique |
| CN108275330A (en) * | 2017-01-05 | 2018-07-13 | 富士康(昆山)电脑接插件有限公司 | A kind of method of ceramic package component rapid open |
| CN114578203A (en) * | 2022-05-05 | 2022-06-03 | 江山季丰电子科技有限公司 | Unsealing method, application and failure analysis method of chip packaged by adopting routing process |
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Application publication date: 20120620 |