CN102506334B - Illumination device - Google Patents
Illumination device Download PDFInfo
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- CN102506334B CN102506334B CN201110370842.2A CN201110370842A CN102506334B CN 102506334 B CN102506334 B CN 102506334B CN 201110370842 A CN201110370842 A CN 201110370842A CN 102506334 B CN102506334 B CN 102506334B
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Abstract
The invention aims to provide an illumination device which has the advantages that the cost is low, the heat dissipation effect is good, a person is not scalded if the person directly contacts the illumination device, and the like. The illumination device comprises the following structures that: an LED (Light Emitting Diode) base plate unit (1) is arranged on a metal heat-conducting plate (3) with high heat conductivity, and resin heat-radiating plates (4, 5) with high heat dissipation and low heat conductivity are closely adhered onto two fully exposed surfaces of the heat-conducting plate (3), except a part for mounting the LED base plate unit (1); and a three-layer structure is formed by the heat-conducting plate and the heat-radiating plates arranged on the two surfaces of the heating-conducting plate, thus heat discharged by the LED base plate unit (1) dissipates in the heat-conducting plate, is transmitted to the resin heat-radiating plates (4, 5) and then is exhausted from the resin heat-radiating plates (4, 5) to outdoor air.
Description
Technical field
The present invention relates to as light source, utilized the ligthing paraphernalia of LED.
Background technology
In prior art, adopt than energy-saving illumination-LED base board unit of other light sources little power consumption.
In addition, LED base board unit is compared with other light sources such as incandescent lamp, fluorescent lamps, due to small and exquisite, so as the good slim ligthing paraphernalia of design.
But above-mentioned LED base board unit, when luminous, produces considerable heat, while LED temperature being raise because of heat thus, the conversion efficiency that electric energy conversion is luminous energy can reduce, and not only can not embody the feature of LED low power consuming, and the life-span of LED also can shorten.
In patent documentation 1, disclosed ligthing paraphernalia has solved such problem.Such ligthing paraphernalia is directly to pack LED installation base plate in a pair of aluminum casing, and the characteristic of the aluminium of so effective performance high-termal conductivity, improves thermal diffusivity.In addition, on above-mentioned casing, LED installation base plate, form passage, grooving.Put forth effort at present research by these passages, grooving, improve radiating effect.
Patent documentation 1: JP 2006-179443 communique
Patent documentation 2: No. 3965929 communique of patent.
Summary of the invention
In the ligthing paraphernalia of above-mentioned prior art, because the radiating effect of aluminium is limited, so as ligthing paraphernalia, the problem that existence can't be dispelled the heat effectively.
In addition, the thermal conductivity of aluminium that forms casing is high, so directly contact the aluminium of high temperature once objects such as hands, high heat is by the part of the contact loss heat by because of hand sustainable supply in rapid succession.Therefore, when user directly contacts aluminium, during compared with the low casing of contact pyroconductivity, feel hotter, user is felt under the weather.
Also have, in patent documentation 1, disclose also usable resins and formed above-mentioned casing.Really, if form above-mentioned casing with resin, as die casting aluminium casing, even if directly contact does not feel so hot yet.
But although resin thermal diffusivity is good, poor thermal conductivity, so heat when LED is luminous is difficult to be sent to casing surface entirely, correspondingly produces the problem of poor radiation.
In addition, with resin, form casing, the whole faces in the inner side of contact adopt the LED installation base plate of aluminium to be also considered simultaneously.So adopt aluminium sheet to form LED installation base plate, aluminothermy conductivity is high, so the heat in the time of can making LED luminous is promptly diffused into casing surface entirely, by resinous casing, effectively emits heat.
But, as mentioned above, if want to allow LED installation base plate have heat sinking function concurrently, just must make area and the resinous casing formed objects of LED installation base plate, reason is that the heat when making LED luminous is sent to resinous tank surface efficiently, just must make above-mentioned aluminum LED installation base plate be close to casing comprehensive.Like this, comprehensive owing to making LED installation base plate be close to casing, when casing size, change in shape, the size of aluminium sheet, character also must change.
And, when the aluminium sheet that adopts large plate to form is used as LED installation base plate, except insulation processing, also need the special processing as circuit, for configure LED on substrate.But at present commercially available LED installation base plate is so not large, and if want as mentioned above on large aluminium sheet, to implement electric treatment according to casing, need to customize article, can produce the problem that manufacturing cost increases.
The object of the present invention is to provide a kind of ligthing paraphernalia, its cost is low, high efficiency and heat radiation, and people directly contacts and also can not scald.
The 1st invention, it is characterized in that, on the high metal of pyroconductivity heat-conducting plate processed, LED base board unit is installed, in the middle of above-mentioned heat-conducting plate two sides, exposing on face except the mounting portion of above-mentioned LED base board unit, be close to the resin heat sink that rate of heat dissipation is high, pyroconductivity is low, form the three-layer structure that heat sink is set on its two sides of above-mentioned heat-conducting plate, the heat that above-mentioned LED base board unit is emitted spreads in above-mentioned heat-conducting plate, be sent on above-mentioned resinous heat sink the heat being transmitted to outside air venting from above-mentioned resinous heat sink.
The 2nd invention, is characterized in that, the heat-conducting plate in the 1st invention is aluminium sheet.
Also have, above-mentioned LED base board unit is that LED chip is installed on substrate, the parts of blocking.
Invention effect
By the 1st, the 2nd invention, with resinous heat sink, covered the two sides of the metal heat-conducting plate processed that LED base board unit is installed, so heat rapid diffusion on above-mentioned heat-conducting plate of generation in the time of can making LED luminous is emitted the heat of diffusion by above-mentioned heat sink simultaneously.And, because heat sink forms with the high resin of rate of heat dissipation, so can reach sufficient radiating effect.Like this, because radiating effect is high, can improve the durability of LED.
And, as mentioned above, owing to covering the two sides of heat-conducting plate with the low resin heat sink of pyroconductivity, so even if the direct contact of people can not felt the sense of discomfort being caused by heat yet.
In addition, due to LED base board unit being installed on heat-conducting plate, even so aluminum installation base plate that does not use spy to order, also can on the optional position on heat-conducting plate, configure LED, can maintain the characteristic as ligthing paraphernalia, so as in the past according to the configuration of the shape of casing, LED, design circuit on aluminium sheet, cost can not increase yet.
Also have, heat-conducting plate, heat sink are comprised of sheet material, and have formed three-layer structure, so can thicken or thickness that attenuate is all.Like this, can freely determine all thickness, the free degree of its design also improves.Particularly, each plate only possesses heat conduction or heat release function, so while wanting its thickness of attenuate, also can be thinned to the limit.For example, when this ligthing paraphernalia is applied to electric desk lamp, can realizes brand-new ultrathin type that in the past do not have, complete and newly design.
On the other hand, if make this ligthing paraphernalia be thinned to the limit, also can realize lightweight.When this light-weighted ligthing paraphernalia is applied on desk lamp, even if reduce base part, also can keep its stability, can lightweight can reduce base part again like this, so packaging efficiency, conevying efficiency all can improve.
Also have, while forming the structure from upper this ligthing paraphernalia of suspension, lightweight is associated with security.
In addition, owing to covering the two sides of heat-conducting plate with resinous heat sink, so the three-layer structure body that these heat-conducting plates and heat sink form can be not crooked under heat effect.For example, while only resinous heat sink being set in the one side of metal heat-conducting plate, because both expansion rates are different, this tectosome occurs crooked.But with the two sides that resinous heat sink covers heat-conducting plate, form three-layer structure as described above, the both sides of clamping heat-conducting plate with the heat sink of same expansion rate, even heat effect they also can be crooked.
On the other hand, if as mentioned above during this ligthing paraphernalia of attenuate, usually can pinch its tabular utensil with finger.Yet, as mentioned above owing to covering the two sides of heat-conducting plate with resinous heat sink, so use its utensil of finger contact also can not feel the sense of discomfort that heat causes.
By the 2nd invention, can make all lightweights of ligthing paraphernalia.
Accompanying drawing explanation
Fig. 1 is the sectional view of embodiment.
Fig. 2 is the partial cross section figure of other embodiments.
1-LED base board unit
2—LED
3-(metal system) heat-conducting plates
4,5-(resin) heat sinks.
The specific embodiment
Fig. 1 is the sectional view of the ligthing paraphernalia of embodiment of the present invention.
In this embodiment, LED base board unit 1 is arranged on this aluminum heat-conducting plate 3, in the middle of the two sides of entirely exposing of above-mentioned heat-conducting plate 3, exposing on face except the mounting portion of above-mentioned LED base board unit 1, the heat sink 4,5 of being close to the ABS resin that rate of heat dissipation is high, pyroconductivity is low (acrylonitrile butadient styrene) system, forms three-layer structure by these heat sinks 4,5 and heat-conducting plate 3.And, as the surface of above-mentioned heat-conducting plate 3, the opening 6 that forms the mounting portion of corresponding LED base board unit 1 on the heat sink 5 arranging on the side of LED base board unit 1 is being installed.
Also have, above-mentioned LED base board unit 1, is the commercial goods that LED chip 2, blocking are installed on substrate.
In addition, the aluminium that forms above-mentioned heat-conducting plate 3 is that conductivity is 230[W/(mK)] high conductance metal, rate of heat dissipation is 0.05.On the other hand, form the above-mentioned ABS resin of heat sink 4,5, pyroconductivity is 0.1～0.18[W/(mK)], rate of heat dissipation is 0.6～0.9.Especially compare with aluminium, known its pyroconductivity is low, rate of heat dissipation is very high.
That is to say, in the exposed portions serve of the high heat-conducting plate 3 of pyroconductivity, fit tightly the resin heat sink 4,5 that pyroconductivity is low, rate of heat dissipation is high.
The ligthing paraphernalia of this embodiment, owing to making above-mentioned LED base board unit 1, be close to the aluminum heat-conducting plate 3 that pyroconductivity is high, though institute is so that the luminous time heating of LED2, its heat is diffused into from LED base board unit 1 in the heat-conducting plate 3 of aluminum, is sent to rapidly on heat sink 4,5.
The heat transmitting in the interior high speed of above-mentioned heat-conducting plate 3, arrives after the contact-making surface of heat-conducting plate 3 and heat sink 4,5, in heat sink 4,5 interior conduction, from its surface, emits to extraneous air.
That is to say, owing to covering the two sides of heat-conducting plate 3 with heat sink 4,5, the heat of rapid diffusion on heat-conducting plate 3, is sent to heat sink 4,5 efficiently from its surface.Like this, heat is transmitted to heat sink 4,5 rapidly, and more effective utilization plays the high rate of heat dissipation of heat sink 4,5, forms heat radiation efficiently.
Its result all becomes fabulous with all thermal diffusivities of the high heat-conducting plate 3 of high heat sink 4, the 5 cover heating conductivities of rate of heat dissipation, makes LED base board unit 1 keep needed low temperature.
By this embodiment, make the temperature of LED base board unit 1 keep than low with contact, so can guarantee very high LED light conversion efficiency, also lengthen the life-span of LED simultaneously.
In addition, as mentioned above, the pyroconductivity of heat sink 4,5 is low, so the surface of using the object contact heat sinks such as hand 4,5 to cover, not only can not scald etc., the temperature not feeling well does not all have, although reason is to be taken away at the local heat of the object contacts such as hand, making to contact local temperature moment declines, but during the metal case body that can in the past not install as contact, the heat in above-mentioned contact place is directly passed.
Therefore, even if being placed on the place that people can contact, the ligthing paraphernalia of this embodiment also can feel at ease to arrange.
Like this, the surface of above-mentioned resinous heat sink 4,5 is compared with the metal member made of uniform temp under original state, the danger that does not have to scald, produces sense of discomfort etc., so even if consider hot countermeasure, also can improve the temperature of setting LED base board unit 1.In other words, also can increase the supply electric current to LED, increase the lightness of illumination.
In addition, in the above-described embodiment, only by heat-conducting plate 3 and the resinous heat sink 4,5 that covers its surface, realize heat radiation efficiently, in the ligthing paraphernalia of this embodiment, do not need to arrange fin, radiator fan etc., also do not need the cover that hand can not be contacted is set, so can make this safe ligthing paraphernalia miniaturization, its ease of use is also better.
Also have, if the luminaire prodigiosin miniaturization shown in Fig. 1 utilizes all design freedoms of device of this ligthing paraphernalia also to uprise, can also form the device that design is good.
And, in the ligthing paraphernalia of this embodiment, due to the two sides of clamping heat-conducting plate 3 with resinous heat sink 4,5, so have difference even if form the coefficient of thermal expansion of the aluminium of heat-conducting plate 3 and the ABS resin of formation heat sink 4,5, parts also can be crooked due to heat.For example, while the heat sink of ABS resin system being set in the one side at the heat-conducting plate 3 of aluminum only, due to the difference of both expansion rates, this tectosome can be crooked.But, with the two sides that resinous heat sink 4,5 covers heat-conducting plates 3, form three-layer structure as described above, owing to clamping the both sides of heat-conducting plate with the heat sink of same expansion rate, so even heat effect they also can be crooked.Therefore, can also each plate member of attenuate, form extra-thin ligthing paraphernalia.
For example, on the ligthing paraphernalia of this embodiment, making each thickness of slab of above-mentioned heat-conducting plate 3, heat sink 4,5 is 2[mm], three layers is 6[mm] thickness, in employing, 10[W has been installed] during the above-mentioned LED base board unit 1 of LED, irradiation distance 40[cm apart from light source] illuminance be 2000[1x], confirmation can also maintain sufficient thermal diffusivity.And, even if the illumination that above-mentioned illuminance is used as fine manipulation is also sufficient lightness.
Also have, for realizing this illuminance, both can a plurality of LED base board units 1 be set on above-mentioned heat transfer plate 3, obtain required light, also can adopt the LED base board unit 1 that a plurality of LED2 have been installed.
Like this, the ligthing paraphernalia of this embodiment, even thinness as described above also can realize fully and becoming clear, makes successfully to dispel the heat due to the heat of the luminous generation of LED.
Particularly, while using the ligthing paraphernalia of above-mentioned ultrathin desk lamp type, if adjust light source position with the two sides of finger contact ligthing paraphernalia, can not feel well or be burned yet.
In addition, in the ligthing paraphernalia of this embodiment, for the heat of LED2 being passed to fast to the heat-conducting plate 3 of heat sink 4,5, be the parts different from LED base board unit 1.Therefore, heat-conducting plate 3 does not need to consider electrically, according to LED unit 1 is set above it, can freely set the configuration of LED2.
Especially, the rectilinear propagation of LED light is high, and by its configuration, the lightness of shadow surface, the producing method of shadow etc. can change.Therefore, concerning ligthing paraphernalia, the configuration of a plurality of LED2 is very important, utilizes the ligthing paraphernalia of this embodiment, and the change of the configuration of LED2 is also easy to.
Also have, on heat-conducting plate 3, owing to having formed opening 6 having installed on the heat sink 5 arranging on the side of LED base board unit 1, so compared with the heat sink 4 arranging on opposite flank, little with the contact area of above-mentioned heat-conducting plate 3, formed the area difference that contacts the heat sink 4,5 on the two sides of clamping heat-conducting plate 3, if but it is poor very little, and in thermal expansion, there is difference also can not produce the crooked such situation of three-layer structure body.But, when a plurality of LED base board units 1 etc. are set, when the aperture area forming on heat sink 5 becomes large, need to thicken for the thickness thicker than heat sink 4, obtain and the balance that is arranged on the heat sink 4 on opposite face.
In addition, in the embodiment shown in Fig. 1, although be arranged on the resinous heat sink 4,5 on the two sides of heat-conducting plate 3, periphery is consistent with above-mentioned heat-conducting plate 3, as long as make heat sink 4,5 be close to the face that exposes that covers heat-conducting plate 3.As shown in Figure 2, heat sink 4,5 can be arranged to greatlyr than heat-conducting plate 3, the periphery of heat sink 4,5 is stretched out and also can more laterally than the periphery of heat-conducting plate 3.And, the overhang stretching out than the periphery of above-mentioned heat-conducting plate 3, above-mentioned heat sink 4,5 does not need identical, also can a heat sink 4 or a side of 5 stretch out.In addition, also available heat sink 4 or 5 covers the end face of above-mentioned heat-conducting plate 3.
Also have, although the ligthing paraphernalia of above-mentioned embodiment is the shape that may be used on desk lamp types of devices, the ligthing paraphernalia of this invention also may be used on from the device of upper pendant type.Can apply flexibly extra-thin well-designed like this, also can realize small-sized, light weight, radiating efficiency is high, and bright, life-span is long ligthing paraphernalia also.And the sense of discomfort that while also there is no hand contact, heat causes, so can be used on the very low position that can contact in one's hands.Especially, suspension member type, due to lightweight, also has safe advantage.
Also have, in the above-described embodiment, as heat-conducting plate of the present invention, used aluminium sheet, but the material of heat-conducting plate is not limited to aluminium.If common metal, which type of metal can meet the function as heat-conducting plate.For example the pyroconductivity of copper is 420[W/mK], also higher than aluminium, it is also high that other metals and common resin etc. are compared pyroconductivity, but use more lightweight of aluminium as heat-conducting plate.And, if can realize miniaturization and, can also realize the ligthing paraphernalia that design is better.
In addition, the material that forms above-mentioned heat sink 4,5 is also not limited to the ABS resin of above-mentioned embodiment, can adopt the general resin that pyroconductivity is low, rate of heat dissipation is high of acrylic (Acrylic), polypropylene (polypropylene), polystyrene (Polystyrene), acrylonitritrile-styrene resin (Acrylonitrile-styrene copolymer (see SAN)) etc.
Also have, above-mentioned heat sink 4,5 can be the near material of coefficient of thermal expansion, also not necessarily will use identical material.
Claims (2)
1. a ligthing paraphernalia, is characterized in that,
On the high metal of pyroconductivity heat-conducting plate processed, LED base board unit is installed, and in the middle of the two sides of above-mentioned heat-conducting plate, exposing on face except the mounting portion of above-mentioned LED base board unit, be close to rate of heat dissipation high, the resin heat sink that pyroconductivity is low, form the three-layer structure that heat sink is set on the two sides of above-mentioned heat-conducting plate, the heat that above-mentioned LED base board unit is emitted spreads in above-mentioned heat-conducting plate, be sent on above-mentioned resinous heat sink, the heat being transmitted to outside air venting from above-mentioned resinous heat sink, described rate of heat dissipation is 0.6 ~ 0.9, described pyroconductivity is 0.1 ~ 0.18(W/m.K).
2. ligthing paraphernalia according to claim 1, is characterized in that,
Above-mentioned heat-conducting plate is aluminum.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110370842.2A CN102506334B (en) | 2008-06-10 | 2008-06-10 | Illumination device |
| HK12107545.1A HK1166839A1 (en) | 2008-06-10 | 2012-08-01 | Lighting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110370842.2A CN102506334B (en) | 2008-06-10 | 2008-06-10 | Illumination device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801297145A Division CN102057217A (en) | 2008-06-10 | 2008-06-10 | Lighting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102506334A CN102506334A (en) | 2012-06-20 |
| CN102506334B true CN102506334B (en) | 2014-11-12 |
Family
ID=46218446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110370842.2A Active CN102506334B (en) | 2008-06-10 | 2008-06-10 | Illumination device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102506334B (en) |
| HK (1) | HK1166839A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102538884B1 (en) * | 2017-03-31 | 2023-06-01 | 도레이 카부시키가이샤 | A reflector having a tray shape |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093206A (en) * | 2000-09-18 | 2002-03-29 | Stanley Electric Co Ltd | Led signal light |
| CN2657204Y (en) * | 2003-04-29 | 2004-11-17 | 洪千惠 | Circuit board with luminous diode |
| CN2788353Y (en) * | 2004-10-10 | 2006-06-14 | 宏齐科技股份有限公司 | Base material structure of semiconductor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007201405A (en) * | 2005-07-22 | 2007-08-09 | Toshiba Lighting & Technology Corp | Light-emitting diode device |
-
2008
- 2008-06-10 CN CN201110370842.2A patent/CN102506334B/en active Active
-
2012
- 2012-08-01 HK HK12107545.1A patent/HK1166839A1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002093206A (en) * | 2000-09-18 | 2002-03-29 | Stanley Electric Co Ltd | Led signal light |
| CN2657204Y (en) * | 2003-04-29 | 2004-11-17 | 洪千惠 | Circuit board with luminous diode |
| CN2788353Y (en) * | 2004-10-10 | 2006-06-14 | 宏齐科技股份有限公司 | Base material structure of semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1166839A1 (en) | 2012-11-09 |
| CN102506334A (en) | 2012-06-20 |
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