CN102497170A - Carrier device for laminate surface diagram mounting and reflow soldering - Google Patents
Carrier device for laminate surface diagram mounting and reflow soldering Download PDFInfo
- Publication number
- CN102497170A CN102497170A CN2011103996684A CN201110399668A CN102497170A CN 102497170 A CN102497170 A CN 102497170A CN 2011103996684 A CN2011103996684 A CN 2011103996684A CN 201110399668 A CN201110399668 A CN 201110399668A CN 102497170 A CN102497170 A CN 102497170A
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- carrier
- laminated sheet
- reflow soldering
- locator
- laminate surface
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Abstract
The invention provides a carrier device for laminate surface diagram mounting and reflow soldering, and aims to improve the strength of laminates, so as to make the laminates can meet the process requirement of the laminate surface diagram mounting and the reflow soldering. The carrier device comprises a laminate, and is characterized in that: the carrier device is laid under the laminate; and the laminate is fixed with the carrier device, wherein the thickness of the carrier device is 1 millimeter and 90 Mn stainless steel is chosen as the material of the carrier device.
Description
Technical field
The present invention relates to the device in the production technology of chip surface acoustic wave filter product; Be particularly related to the surface mount of the chip surface acoustic wave filter product after the improvement and the device in the reflow soldering process, be specially a kind of laminate surface figure that is used for and mount the carrier with Reflow Soldering.
Background technology
Develop rapidly along with relevant industries such as communication, electronics; The surface acoustic wave product demand is increasing; Compete also more and more fierce simultaneously; In order to reduce whole cost, at present, having occurred with the laminated sheet is that to substitute existing be the chip surface acoustic wave filter product of basic material with the ceramic substrate to basic material.The laminate sheet material general thickness is between 0.15mm～0.3mm; Though doing cost has like this reduced; But the intensity of laminated sheet is compared with original ceramic material and has been reduced a lot; Laminated sheet is easy to generate warpage and distortion, and this has brought a lot of inconvenience to Product transport and production, can't satisfy exterior view and mount the technological requirement with Reflow Soldering.
Summary of the invention
There are the problems referred to above to prior art, the invention provides a kind of laminate surface figure that is used for and mount the carrier with Reflow Soldering,, make it can satisfy laminate surface figure and mount the technological requirement with Reflow Soldering to improve the intensity of laminated sheet.
Its technical scheme is such: it comprises laminated sheet, it is characterized in that: under said laminated sheet, lay carrier, said laminated sheet and said carrier are fixed together, and the thickness of said carrier is 1mm, the material selection 90Mn stainless steel of said carrier.
It is further characterized in that: said carrier is a square plate, and the overall dimension of said carrier is greater than the overall dimension of said laminated sheet; Said laminated sheet sticks on through the antistatic high temperature gummed tape with said carrier; Align with the boundary line on two limits of said carrier in the boundary line on two limits of said laminated sheet, the boundary line on the two other limit of said laminated sheet is positioned within the boundary line on said carrier two other limit; Lining is established locator below said carrier, and said locator body is a square plate, is provided with shallow deep gouge at the upper surface of said locator body, and said carrier places in the said shallow deep gouge, and the border of said carrier and the border of said shallow deep gouge are that three faces fit tightly; Left side at said locator is provided with notch, is symmetrical in the right side same notch also is set, and at two edges of said locator front side portion the shallow slot mouth is set respectively.
The present invention adopts after the said structure, laminated sheet get into exterior view mount with the Reflow Soldering operation before, be fixed together with carrier earlier; It is 1mm that carrier is selected 90Mn stainless steel, thickness for use, and its special material has guaranteed the intensity of laminated sheet, because the too thick meeting of carrier is made troubles to the rear end automatic visual inspection; The too thin product that can make again is easy to generate distortion under Reflow Soldering high temperature; Carrier and laminated sheet are fitted through the antistatic high temperature resistant adhesive tape, have guaranteed the fixing evenness of laminated sheet, fix with locator again; Can guarantee accurate positioning, firmly, make laminated sheet can satisfy exterior view and mount the technological requirement with Reflow Soldering.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Embodiment:
See Fig. 1, the present invention includes laminated sheet 1, lay carrier 21 time at laminated sheet; Carrier 2 is a square plate, and the overall dimension of carrier 2 is greater than the overall dimension of laminated sheet 1, and the thickness of carrier 2 is 1mm; The material selection 90Mn stainless steel of carrier 2, laminated sheet 1 sticks on through antistatic high temperature gummed tape (the antistatic high temperature gummed tape does not draw among the figure) with carrier 2, guarantees its evenness; The slit is not stayed in contact fully; The boundary line 1-1 on two limits of laminated sheet 1 aligns with the boundary line 2-1 on two limits of carrier, and the boundary line 1-2 on the two other limit of laminated sheet 1 is positioned within the boundary line 2-2 on carrier 2 two other limits, and lining is established locator 3 below carrier 2; Locator 3 bodies are square plate; Upper surface at locator 3 bodies is provided with shallow deep gouge (shallow deep gouge does not draw among the figure), and carrier 2 places in the shallow deep gouge, and the border of carrier 2 and the border of shallow deep gouge are that three faces closely cooperate; In the left side of locator 3 notch 3-1 is set; Be symmetrical in the right side same notch 3-2 also is set; The be arranged so that laminated sheet 1 and the carrier 2 of this notch are accomplished more convenient the taking away in fixing back; Two edges at locator 3 front side portions are provided with shallow slot mouth 3-3 respectively, and the setting of this notch is to fit better through the antistatic high temperature gummed tape between carrier 2 and the laminated sheet 1 for ease.
The material of carrier 2, fixed form and dimensional thickness all have special requirement, satisfy ESD (electrostatic defending) protection, and will avoid because of change in size existing equipment being done bigger adjustment as far as possible; Most critical is the thickness of carrier 2 simultaneously, and too thick meeting is made troubles to the rear end automatic visual inspection, and the too thin product that can make again is easy to generate distortion under Reflow Soldering high temperature; Through repetition test; Selecting with the 90Mn stainless steel at last is material, and THICKNESS CONTROL is at 1mm, and fixing of carrier 2 and laminated sheet 1 also has specific (special) requirements; Few residual adhesive tape fixes with locator 3 after must tearing with antistatic high temperature resistant; Guaranteeing accurate positioning, firmly, the structural design of locator 3 also makes the fixing convenient operation of laminated sheet 1 and carrier 2, guarantees that with this understanding laminated sheet 1 produces and guarantee the welding quality of product smoothly; Make laminated sheet 1 replace ceramic substrate to become possibility, greatly reduce the cost of product.
Claims (5)
1. one kind is used for laminate surface figure and mounts the carrier with Reflow Soldering; It comprises laminated sheet, it is characterized in that: under said laminated sheet, lay carrier, said laminated sheet and said carrier are fixed together; The thickness of said carrier is 1mm, the material selection 90Mn stainless steel of said carrier.
2. a kind of laminate surface figure that is used for according to claim 1 mounts the carrier with Reflow Soldering, and it is characterized in that: said carrier is a square plate, and the overall dimension of said carrier is greater than the overall dimension of said laminated sheet.
3. a kind of laminate surface figure that is used for according to claim 1 mounts the carrier with Reflow Soldering; It is characterized in that: said laminated sheet sticks on through the antistatic high temperature gummed tape with said carrier; Align with the boundary line on two limits of said carrier in the boundary line on two limits of said laminated sheet, the boundary line on the two other limit of said laminated sheet is positioned within the boundary line on said carrier two other limit.
4. a kind of laminate surface figure that is used for according to claim 1 mounts the carrier with Reflow Soldering; It is characterized in that: lining is established locator below said carrier; Said locator body is a square plate; Upper surface at said locator body is provided with shallow deep gouge, and said carrier places in the said shallow deep gouge, and the border of said carrier and the border of said shallow deep gouge are that three faces fit tightly.
5. a kind of laminate surface figure that is used for according to claim 4 mounts the carrier with Reflow Soldering; It is characterized in that: the left side at said locator is provided with notch; Be symmetrical in the right side same notch also is set, the shallow slot mouth is set respectively at two edges of said locator front side portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103996684A CN102497170A (en) | 2011-12-06 | 2011-12-06 | Carrier device for laminate surface diagram mounting and reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103996684A CN102497170A (en) | 2011-12-06 | 2011-12-06 | Carrier device for laminate surface diagram mounting and reflow soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102497170A true CN102497170A (en) | 2012-06-13 |
Family
ID=46188968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103996684A Pending CN102497170A (en) | 2011-12-06 | 2011-12-06 | Carrier device for laminate surface diagram mounting and reflow soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102497170A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107238505A (en) * | 2017-05-24 | 2017-10-10 | 中国电子科技集团公司第四十研究所 | A kind of fixture tested for SAW filter high/low temperature |
Citations (10)
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|---|---|---|---|---|
| US4412123A (en) * | 1980-05-09 | 1983-10-25 | Bell Telephone Laboratories, Incorporated | Laminated electric heat generating member for reflow soldering devices |
| US5631079A (en) * | 1994-05-06 | 1997-05-20 | Minnesota Mining And Manufacturing Company | High temperature resistant antistatic pressure-sensitive adhesive tape |
| CN1590079A (en) * | 2003-09-05 | 2005-03-09 | 李健 | High temperature resistant resin board and its preparation method |
| US20060251892A1 (en) * | 2002-12-04 | 2006-11-09 | Marc Husemann | Anti-static self-adhesive strip |
| CN101282637A (en) * | 2007-04-06 | 2008-10-08 | 富葵精密组件(深圳)有限公司 | Carrying device for pasting and mounting surface of flexible circuit board |
| CN101775259A (en) * | 2009-01-09 | 2010-07-14 | 3M创新有限公司 | Anti-static heat-resistant polyimide adhesive tape |
| CN201805642U (en) * | 2010-09-28 | 2011-04-20 | 飞旭电子(苏州)有限公司 | Tool for fixing flexible circuit board |
| CN201888031U (en) * | 2010-12-15 | 2011-06-29 | 瑞华高科技电子工业园(厦门)有限公司 | Universal jig for alignment of flexible circuit board and placement carrier |
| CN202028849U (en) * | 2011-03-07 | 2011-11-09 | 苏州工业园区宏创科技有限公司 | General carrier used for bearing single-side mainboard |
| CN202364183U (en) * | 2011-12-06 | 2012-08-01 | 爱普科斯科技（无锡）有限公司 | Loading vehicle for surface picture mounting and reflow soldering of laminating plate |
-
2011
- 2011-12-06 CN CN2011103996684A patent/CN102497170A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4412123A (en) * | 1980-05-09 | 1983-10-25 | Bell Telephone Laboratories, Incorporated | Laminated electric heat generating member for reflow soldering devices |
| US5631079A (en) * | 1994-05-06 | 1997-05-20 | Minnesota Mining And Manufacturing Company | High temperature resistant antistatic pressure-sensitive adhesive tape |
| US20060251892A1 (en) * | 2002-12-04 | 2006-11-09 | Marc Husemann | Anti-static self-adhesive strip |
| CN1590079A (en) * | 2003-09-05 | 2005-03-09 | 李健 | High temperature resistant resin board and its preparation method |
| CN101282637A (en) * | 2007-04-06 | 2008-10-08 | 富葵精密组件(深圳)有限公司 | Carrying device for pasting and mounting surface of flexible circuit board |
| CN101775259A (en) * | 2009-01-09 | 2010-07-14 | 3M创新有限公司 | Anti-static heat-resistant polyimide adhesive tape |
| CN201805642U (en) * | 2010-09-28 | 2011-04-20 | 飞旭电子(苏州)有限公司 | Tool for fixing flexible circuit board |
| CN201888031U (en) * | 2010-12-15 | 2011-06-29 | 瑞华高科技电子工业园(厦门)有限公司 | Universal jig for alignment of flexible circuit board and placement carrier |
| CN202028849U (en) * | 2011-03-07 | 2011-11-09 | 苏州工业园区宏创科技有限公司 | General carrier used for bearing single-side mainboard |
| CN202364183U (en) * | 2011-12-06 | 2012-08-01 | 爱普科斯科技（无锡）有限公司 | Loading vehicle for surface picture mounting and reflow soldering of laminating plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107238505A (en) * | 2017-05-24 | 2017-10-10 | 中国电子科技集团公司第四十研究所 | A kind of fixture tested for SAW filter high/low temperature |
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Application publication date: 20120613 |