CN102496587A - 晶圆在位检测装置以及晶圆在位检测方法 - Google Patents
晶圆在位检测装置以及晶圆在位检测方法 Download PDFInfo
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- CN102496587A CN102496587A CN2011103822339A CN201110382233A CN102496587A CN 102496587 A CN102496587 A CN 102496587A CN 2011103822339 A CN2011103822339 A CN 2011103822339A CN 201110382233 A CN201110382233 A CN 201110382233A CN 102496587 A CN102496587 A CN 102496587A
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- wafer
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000011065 in-situ storage Methods 0.000 title abstract 8
- 238000001514 detection method Methods 0.000 claims description 142
- 239000011148 porous material Substances 0.000 claims description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 160
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
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CN201110382233.9A CN102496587B (zh) | 2011-11-25 | 2011-11-25 | 晶圆在位检测装置以及晶圆在位检测方法 |
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CN201110382233.9A CN102496587B (zh) | 2011-11-25 | 2011-11-25 | 晶圆在位检测装置以及晶圆在位检测方法 |
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CN102496587A true CN102496587A (zh) | 2012-06-13 |
CN102496587B CN102496587B (zh) | 2014-06-11 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102931115A (zh) * | 2012-10-15 | 2013-02-13 | 清华大学 | 晶圆在位检测装置、晶圆托架以及晶圆在位检测方法 |
CN107546145A (zh) * | 2017-08-18 | 2018-01-05 | 清华大学 | 晶圆在位检测装置、晶圆托架以及晶圆在位检测方法 |
CN112234011A (zh) * | 2020-09-03 | 2021-01-15 | 北京烁科精微电子装备有限公司 | 位置检测装置及位置检测方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004063528A (ja) * | 2002-07-25 | 2004-02-26 | Renesas Technology Corp | 半導体ウエハ吸着・パージシステム |
JP2008053391A (ja) * | 2006-08-24 | 2008-03-06 | Tokyo Ohka Kogyo Co Ltd | 基板保持装置 |
CN101196693A (zh) * | 2007-11-28 | 2008-06-11 | 上海微电子装备有限公司 | 硅片固定部件 |
CN201259887Y (zh) * | 2008-08-21 | 2009-06-17 | 中国电子科技集团公司第四十五研究所 | 丢失芯片的检测装置 |
CN101494188A (zh) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | 对中单元 |
CN101545764A (zh) * | 2009-04-22 | 2009-09-30 | 大连现代辅机开发制造有限公司 | 工件落座检测方法及装置 |
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2011
- 2011-11-25 CN CN201110382233.9A patent/CN102496587B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004063528A (ja) * | 2002-07-25 | 2004-02-26 | Renesas Technology Corp | 半導体ウエハ吸着・パージシステム |
JP2008053391A (ja) * | 2006-08-24 | 2008-03-06 | Tokyo Ohka Kogyo Co Ltd | 基板保持装置 |
CN101196693A (zh) * | 2007-11-28 | 2008-06-11 | 上海微电子装备有限公司 | 硅片固定部件 |
CN101494188A (zh) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | 对中单元 |
CN201259887Y (zh) * | 2008-08-21 | 2009-06-17 | 中国电子科技集团公司第四十五研究所 | 丢失芯片的检测装置 |
CN101545764A (zh) * | 2009-04-22 | 2009-09-30 | 大连现代辅机开发制造有限公司 | 工件落座检测方法及装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102931115A (zh) * | 2012-10-15 | 2013-02-13 | 清华大学 | 晶圆在位检测装置、晶圆托架以及晶圆在位检测方法 |
CN102931115B (zh) * | 2012-10-15 | 2015-05-20 | 清华大学 | 晶圆在位检测装置、晶圆托架以及晶圆在位检测方法 |
CN107546145A (zh) * | 2017-08-18 | 2018-01-05 | 清华大学 | 晶圆在位检测装置、晶圆托架以及晶圆在位检测方法 |
CN112234011A (zh) * | 2020-09-03 | 2021-01-15 | 北京烁科精微电子装备有限公司 | 位置检测装置及位置检测方法 |
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CN102496587B (zh) | 2014-06-11 |
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Denomination of invention: Wafer in-situ detecting device and wafer in-situ detecting method Effective date of registration: 20180206 Granted publication date: 20140611 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Registration number: 2018120000003 |
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Date of cancellation: 20191022 Granted publication date: 20140611 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Registration number: 2018120000003 |
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Address after: 300350, No. 8, building 9, ha Hing Road, Haihe science and Technology Park, Jinnan District, Tianjin Patentee after: Huahaiqingke Co.,Ltd. Address before: 300350, No. 8, building 9, ha Hing Road, Haihe science and Technology Park, Jinnan District, Tianjin Patentee before: TSINGHUA University |