CN102483642B - 为快速热循环提供低热不均匀的热块组件和仪器 - Google Patents

为快速热循环提供低热不均匀的热块组件和仪器 Download PDF

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Publication number
CN102483642B
CN102483642B CN201080038911.3A CN201080038911A CN102483642B CN 102483642 B CN102483642 B CN 102483642B CN 201080038911 A CN201080038911 A CN 201080038911A CN 102483642 B CN102483642 B CN 102483642B
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China
Prior art keywords
thermal
block assembly
sample
block
thermal block
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201080038911.3A
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English (en)
Chinese (zh)
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CN102483642A (zh
Inventor
J.沃托维奇
G.达尔霍夫
D.W.格鲁内瓦尔德
T.A.康纳
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Life Technologies Corp
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Life Technologies Corp
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0829—Multi-well plates; Microtitration plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • B01L2300/1822—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Molecular Biology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Clinical Laboratory Science (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
CN201080038911.3A 2009-09-01 2010-09-01 为快速热循环提供低热不均匀的热块组件和仪器 Expired - Fee Related CN102483642B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23901209P 2009-09-01 2009-09-01
US61/239012 2009-09-01
PCT/US2010/047573 WO2011028834A2 (en) 2009-09-01 2010-09-01 Thermal block assemblies and instruments providing low thermal non-uniformity for rapid thermal cycling

Publications (2)

Publication Number Publication Date
CN102483642A CN102483642A (zh) 2012-05-30
CN102483642B true CN102483642B (zh) 2014-12-24

Family

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Family Applications (1)

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CN201080038911.3A Expired - Fee Related CN102483642B (zh) 2009-09-01 2010-09-01 为快速热循环提供低热不均匀的热块组件和仪器

Country Status (7)

Country Link
US (2) US10049895B2 (enExample)
EP (1) EP2473893B1 (enExample)
JP (2) JP5781513B2 (enExample)
CN (1) CN102483642B (enExample)
IN (1) IN2012DN02105A (enExample)
SG (1) SG178411A1 (enExample)
WO (1) WO2011028834A2 (enExample)

Cited By (1)

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US10137452B2 (en) 2010-04-09 2018-11-27 Life Technologies Corporation Thermal uniformity for thermal cycler instrumentation using dynamic control

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SG11201606590UA (en) 2014-02-18 2016-09-29 Life Technologies Corp Apparatuses, systems and methods for providing scalable thermal cyclers and isolating thermoelectric devices
US11003808B2 (en) * 2015-09-30 2021-05-11 Siemens Industry Software Inc. Subtractive design for heat sink improvement
WO2018132896A1 (en) * 2017-01-18 2018-07-26 Bigz Tech Inc. Transient heat absorption and delayed dissipation by high heat capacity material
GB201812192D0 (en) * 2018-07-26 2018-09-12 Ttp Plc Variable temperature reactor, heater and control circuit for the same
WO2020150007A1 (en) * 2019-01-14 2020-07-23 Bio-Rad Laboratories, Inc. Heat pump device and assembly
US20220184612A1 (en) * 2019-03-18 2022-06-16 Seegene, Inc. Thermal cycler comprising sample holder assembly
CN212084987U (zh) * 2020-07-09 2020-12-04 宁波市哈雷换热设备有限公司 一种承压能力强的芯片冷却器
KR20240056761A (ko) * 2021-10-29 2024-04-30 주식회사 씨젠 열블록

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* Cited by examiner, † Cited by third party
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Also Published As

Publication number Publication date
US20110056661A1 (en) 2011-03-10
SG178411A1 (en) 2012-04-27
IN2012DN02105A (enExample) 2015-08-21
US20180350628A1 (en) 2018-12-06
JP5781513B2 (ja) 2015-09-24
EP2473893B1 (en) 2021-07-28
WO2011028834A3 (en) 2011-07-07
JP2013504181A (ja) 2013-02-04
EP2473893A4 (en) 2017-03-01
JP2014158505A (ja) 2014-09-04
EP2473893A2 (en) 2012-07-11
US10049895B2 (en) 2018-08-14
WO2011028834A2 (en) 2011-03-10
CN102483642A (zh) 2012-05-30

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