CN102468401A - LED (Light Emitting Diode) module - Google Patents
LED (Light Emitting Diode) module Download PDFInfo
- Publication number
- CN102468401A CN102468401A CN2010105423625A CN201010542362A CN102468401A CN 102468401 A CN102468401 A CN 102468401A CN 2010105423625 A CN2010105423625 A CN 2010105423625A CN 201010542362 A CN201010542362 A CN 201010542362A CN 102468401 A CN102468401 A CN 102468401A
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- CN
- China
- Prior art keywords
- pin
- emitting diode
- circuit layer
- light
- circuit board
- Prior art date
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Abstract
The invention relates to an LED (Light Emitting Diode) module, which comprises a circuit board and an LED. The LED comprises a first pin, a second pin and a luminescent chip. The second pin is separated from the first pin through an insulating layer, and the luminescent chip is electrically connected with the first pin and the second pin. The circuit board comprises a first circuit layer and a second circuit layer, the second circuit layer is separated from the first circuit layer, the first pin of the LED is butt-joint with the first circuit layer, and the second pin is connected with the second circuit layer through interference fit. According to the LED module disclosed by the invention, elements of the LED module can be convenient to be changed.
Description
Technical field
The present invention relates to a kind of diode modules, be meant a kind of light emitting diode module especially.
Background technology
Light-emitting diode relies on its high light efficiency, low energy consumption, advantage such as pollution-free, has been applied among the increasing occasion, has much the trend that replaces conventional light source.
Existing light-emitting diode normally is fixed on the circuit board through scolding tin, is connected with the circuit of circuit board with realization.Yet, owing in welding process, need to adopt high temperature, improper like Position Control, cause the damage of light-emitting diode easily.And, in a single day to weld between light-emitting diode and the circuit board, the two just is difficult to separate, and brings inconvenience for the replacing of light-emitting diode.
Summary of the invention
Therefore, be necessary to provide a kind of light emitting diode module of changing easily.
A kind of light emitting diode module; Comprise circuit board and light-emitting diode; Second pin that light-emitting diode comprises first pin, separate through the insulating barrier and first pin and be electrically connected first pin and the luminescence chip of second pin; The second circuit layer that circuit board has first circuit layer and separates with first circuit layer, the mutual butt of first circuit layer of first pin of light-emitting diode and circuit board, the second circuit layer interference fit on second pin and the circuit board.
First pin of the light-emitting diode of this light emitting diode module and the mutual butt of first circuit layer on the circuit board; Second pin is connected through the second circuit layer on interference and the circuit board; Therefore can be separated from one another easily between light-emitting diode and the circuit board, help replacement of element.
With reference to the accompanying drawings, in conjunction with specific embodiment the present invention is done further description.
Description of drawings
Fig. 1 is the stereogram of the light-emitting diode in the light emitting diode module of first embodiment of the invention.
Fig. 2 is the exploded view of Fig. 1.
Fig. 3 is that light-emitting diode is removed lens vertical view afterwards among Fig. 2.
Fig. 4 shows the section of circuit board of the light emitting diode module of first embodiment of the invention.
Fig. 5 is the vertical view of the circuit board of Fig. 4.
Fig. 6 shows light-emitting diode and the assembled state of the circuit board among Fig. 4 among Fig. 1.
Fig. 7 is the stereogram of light-emitting diode of the light emitting diode module of second embodiment of the invention.
Fig. 8 is the profile of Fig. 7.
Fig. 9 shows the section of circuit board of the light emitting diode module of second embodiment of the invention.
Figure 10 is the vertical view of the circuit board of Fig. 9.
Figure 11 shows circuit board and the assembled state of the light-emitting diode among Fig. 7 among Fig. 9.
The main element symbol description
| |
10 |
| Perforate | 12 |
| |
120 |
| The |
14 |
| |
140 |
| |
16 |
| |
160 |
| The |
18 |
| Light- |
20 |
| |
30 |
| |
32 |
| |
34 |
| |
40 |
| |
42 |
| |
44 |
| Insulating |
50 |
| |
52 |
| |
60 |
| |
70 |
| |
80 |
Embodiment
See also Fig. 1-4, show the light emitting diode module of first embodiment of the invention.This light emitting diode module comprises a circuit board 10 and is fixed in the light-emitting diode 20 on the circuit board 10.
This light-emitting diode 20 comprises one first pin 40, one second pin 30, connect first pin 40 and second pin 30 an insulating barrier 50, be fixed in the luminescence chip 60 on second pin 30 and cover lens 70 of luminescence chip 60.This first pin 40 and second pin 30 are processed by metal material, such as copper, aluminium, silver etc.First pin 40 and second pin 30 all are semi-cylindrical, and all upwards protrude out and form a semi-circular sidewall 44,34.The bottom of the outside circumference of first pin 40 and second pin 30 all is formed with many screw threads 42,32.This insulating barrier 50 can be made by the insulating material of viscosity such as polyester, epoxy resin, polyurethane, polybutadiene acid, silica gel, polyester-imide and polyimides.Insulating barrier 50 is bonded to each other two smooth sides of first pin 40 and second pin 30, makes first pin 40 and second pin 30 be combined as a complete cylinder.Because insulating barrier 50 bonding, the sidewall of first pin 40 and second pin 30 44,34 is common to form a complete ring wall, and 42,32 on the screw thread of first pin 40 and second pin 30 breaks off at insulating barrier 50 places.The screw thread 42 of first pin 40 of insulating barrier 50 both sides is corresponding one by one with the screw thread 32 of second pin 30, thereby keeps on the whole continuously, to make things convenient for the process that is spirally connected follow-up and circuit board 10.
These lens 70 are made by transparent materials such as glass, epoxy resin, Merlon, polymethyl methacrylates.Lens 70 combine with ring wall and cover luminescence chip 60.The end face of lens 70 is protruding upward and form convex lens, assembles with the light that luminescence chip 60 is sent.Can be doped with fluorescent material (figure does not show) in the lens 70, to change the light color that of luminescence chip 60.This fluorescent material can be made by fluorescent materials such as yttrium-aluminium-garnet, silicate compound, nitride, nitrogen oxide.Adopt in the present embodiment and can send the material of the yttrium-aluminium-garnet of gold-tinted, go out white light with the blue light of sending with luminescence chip 60 as fluorescent material.In addition, also can further fill encapsulating material (figure does not show) in the space that lens 70 and ring wall institute one common peripheral set out, with protection luminescence chip 60 and gold thread 80.For further promoting the output light intensity, the inner peripheral surface of ring wall also can apply one deck reflector layer (figure does not show).This reflector layer can be formed by the higher metal of reflectivity, like silver, aluminium, gold etc.Certainly, reflector layer also can adopt the Bragg reflection film production, to promote reflector efficiency.
Please consult Fig. 5-6 in the lump, this circuit board 10 offers a perforate 12, and on the internal face of perforate 12, forms one first circuit layer 16 and a second circuit layer 14.This first circuit layer 16 and second circuit layer 14 all are formed with the screw thread 160,140 that first pin 40 and second pin 30 with light-emitting diode 20 are complementary.First circuit layer 16 and second circuit layer 14 are spirally connected with first pin 40 of light-emitting diode 20 and second pin 30 respectively and the electric current input are seted out in the optical diode 20.First circuit layer 16 and second circuit layer 14 all extend to the bottom of perforate 12 from the top of perforate 12, the two separates to avoid short circuit through gap 18.
Light-emitting diode 20 can pass through the screw thread 42,32 and the screw thread 160 of circuit board 10 first circuit layers 16 and second circuit layer 14, cooperating in the perforate 12 that screws in circuit board 10 between 140 of its first pin 40 and second pin 30, thereby is fixed on the circuit board 10.Owing to be to connect through screw thread 140,160,32,42, light-emitting diode 20 can screw out in the perforate 12 of circuit board 10 when needs are changed comparatively easily.And this kind mode that is spirally connected also need not under hot conditions, to carry out, thereby guarantees the safety of light-emitting diode 20.
In addition,, cause the problem damaged on the contrary, be equipped with an anchor point 52,120 near the insulating barrier 50 of light-emitting diode 20 and the perforate 12 of circuit board 10 for avoiding light-emitting diode 20 on circuit board 10, to be connect because there is polarity in light-emitting diode 20.Light-emitting diode 20 can align two anchor points 52,120 earlier before the perforate that screws in circuit board 10 12, and then was rotated, and can be connected with circuit board 10 with correct polarity to guarantee light-emitting diode 20.
Be appreciated that ground, the structure of above-mentioned first pin 40 and second pin 30 also can be done corresponding variation and connect anti-problem thoroughly to stop polarity.Referring to Fig. 7-11, first pin 40 of this light-emitting diode 20 is cylindric, and second pin 30 in the form of a ring.Second pin 30 surrounds first pin 40, and is bonding through insulating barrier 50 between the two.Luminescence chip 60 is fixed in first pin, 40 surfaces and is connected to first pin 40 and second pin, 30 end faces respectively through two gold threads 80.The screw thread 32 of this light-emitting diode 20 only is formed at the outside circumference of second pin 30 and is continuous distribution.Be formed with in the perforate 12 of circuit board 10 a figure second circuit layer 14 and by 14 on second circuit layer around first circuit layer 16.The bottom surface that this second circuit layer 14 covers the interior lateral circle surface of perforate 12 and extends to perforate 12.Second circuit layer 14 is formed with many screw threads 140 with the screw thread of second pin 30 32 couplings.First circuit layer 16 only covers the central region of perforate 12 bottom surfaces and separates through gap 18 and second circuit layer 14.Cooperating in the screw-in perforate 12 between the screw thread 140 of light-emitting diode 20 screw thread 32 through its second pin 30 and the second circuit layer 14 of circuit board 10; The bottom surface of its first pin 40 and the end face of circuit board 10 first circuit layers 16 are connected, thereby accomplish and being electrically connected of circuit board 10.This kind surrounds the pin configuration of formula and can avoid polarity to connect anti-problem effectively, thereby guarantees the safety of light-emitting diode 20.
In addition, all be connected between the pin 30,40 among above-mentioned two embodiment and the circuit board 10, be appreciated that ground, can also directly realize being connected of the two between pin 30,40 and the circuit board 10 through interference fit through screw thread 32,42,140,160.Particularly; First circuit layer, 16/ second circuit layer 14 in circuit board 10 perforates 12 can not established screw thread 160,140 structures; First pin, 40/ second pin 30 of light-emitting diode 20 is not established screw thread 42,32 structures yet, but the diameter of first pin, 40/ second pin 30 is designed to be slightly larger than the internal diameter of perforate 12.Will be when thus, light-emitting diode 20 is in being inserted in perforate 12 and stably engage with circuit board 10 owing to 14 the bigger frictional force of generation of first circuit layer, 16/ second circuit layer in first pin, 40/ second pin 30 and the perforate 12.
Claims (10)
1. light emitting diode module; Comprise circuit board and light-emitting diode; Second pin that light-emitting diode comprises first pin, separate through the insulating barrier and first pin and be electrically connected first pin and the luminescence chip of second pin; Circuit board comprises first circuit layer and the second circuit layer that separates with first circuit layer, and it is characterized in that: the mutual butt of first circuit layer of first pin of light-emitting diode and circuit board, second pin is connected through interference fit with the second circuit layer of circuit board.
2. light emitting diode module as claimed in claim 1, it is characterized in that: circuit board offers perforate, and light-emitting diode is inserted in the perforate.
3. light emitting diode module as claimed in claim 2 is characterized in that: the second circuit layer is positioned at the medial surface of perforate.
4. light emitting diode module as claimed in claim 3 is characterized in that: have screw thread on the lateral surface of second pin, the second circuit layer is formed with screw thread, and second pin and second circuit layer are threadably engaged.
5. like claim 3 or 4 described light emitting diode module, it is characterized in that: second pin surrounds first pin, first circuit layer be positioned at the perforate bottom surface and by the second circuit layer around, first circuit layer and first pin are directly fitted.
6. light emitting diode module as claimed in claim 4 is characterized in that: the lateral surface of first pin has screw thread, and first circuit layer is positioned at the medial surface of perforate and has screw thread, and first pin and first circuit layer are through the screw thread butt.
7. light emitting diode module as claimed in claim 6 is characterized in that: the screw thread of first pin and second pin breaks off in the position of insulating barrier.
8. like each described light emitting diode module of claim 1 to 4, it is characterized in that: luminescence chip is fixed in first pin surface.
9. like each described light emitting diode module of claim 1 to 4, it is characterized in that: light-emitting diode comprises that also luminescence chip is centered on by ring wall from the ring wall of first pin and the extension of second pin surface.
10. like each described light emitting diode module of claim 1 to 4, it is characterized in that: light-emitting diode also comprises the lens that combine and cover luminescence chip with ring wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010542362.5A CN102468401B (en) | 2010-11-12 | 2010-11-12 | LED (Light Emitting Diode) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010542362.5A CN102468401B (en) | 2010-11-12 | 2010-11-12 | LED (Light Emitting Diode) module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102468401A true CN102468401A (en) | 2012-05-23 |
| CN102468401B CN102468401B (en) | 2014-10-15 |
Family
ID=46071775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010542362.5A Expired - Fee Related CN102468401B (en) | 2010-11-12 | 2010-11-12 | LED (Light Emitting Diode) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102468401B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060227558A1 (en) * | 2005-04-08 | 2006-10-12 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
| CN101275735A (en) * | 2008-05-12 | 2008-10-01 | 张春涛 | High-power LED lamp structure and manufacturing method thereof |
| CN201242119Y (en) * | 2008-07-07 | 2009-05-20 | 莱特尔科技（深圳）有限公司 | LED and LED illumination module |
| CN101803125A (en) * | 2007-09-13 | 2010-08-11 | 泰科电子公司 | led socket |
-
2010
- 2010-11-12 CN CN201010542362.5A patent/CN102468401B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060227558A1 (en) * | 2005-04-08 | 2006-10-12 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
| CN101803125A (en) * | 2007-09-13 | 2010-08-11 | 泰科电子公司 | led socket |
| CN101275735A (en) * | 2008-05-12 | 2008-10-01 | 张春涛 | High-power LED lamp structure and manufacturing method thereof |
| CN201242119Y (en) * | 2008-07-07 | 2009-05-20 | 莱特尔科技（深圳）有限公司 | LED and LED illumination module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102468401B (en) | 2014-10-15 |
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Granted publication date: 20141015 Termination date: 20151112 |
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