CN102468401B - LED (Light Emitting Diode) module - Google Patents
LED (Light Emitting Diode) module Download PDFInfo
- Publication number
- CN102468401B CN102468401B CN201010542362.5A CN201010542362A CN102468401B CN 102468401 B CN102468401 B CN 102468401B CN 201010542362 A CN201010542362 A CN 201010542362A CN 102468401 B CN102468401 B CN 102468401B
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- Prior art keywords
- pin
- emitting diode
- light
- circuit layer
- circuit board
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Abstract
The invention relates to an LED (Light Emitting Diode) module, which comprises a circuit board and an LED. The LED comprises a first pin, a second pin and a luminescent chip. The second pin is separated from the first pin through an insulating layer, and the luminescent chip is electrically connected with the first pin and the second pin. The circuit board comprises a first circuit layer and a second circuit layer, the second circuit layer is separated from the first circuit layer, the first pin of the LED is butt-joint with the first circuit layer, and the second pin is connected with the second circuit layer through interference fit. According to the LED module disclosed by the invention, elements of the LED module can be convenient to be changed.
Description
Technical field
The present invention relates to a kind of diode modules, refer to especially a kind of light emitting diode module.
Background technology
Light-emitting diode relies on its high light efficiency, low energy consumption, the advantage such as pollution-free, has been applied among increasing occasion, has greatly the trend that replaces conventional light source.
Existing light-emitting diode is normally fixed on circuit board by scolding tin, to realize with the circuit of circuit board, is connected.Yet, owing to needing to adopt high temperature in welding process, as improper in Position Control, easily cause the damage of light-emitting diode.And once weld between light-emitting diode and circuit board, the two is just difficult to separation, bring inconvenience to the replacing of light-emitting diode.
Summary of the invention
Therefore, be necessary to provide a kind of light emitting diode module of easily changing.
A kind of light emitting diode module, comprise circuit board and light-emitting diode, light-emitting diode comprises the first pin, the second pin separating with the first pin by insulating barrier and is electrically connected to the first pin and the luminescence chip of the second pin, the second circuit layer that circuit board has the first circuit layer and separates with the first circuit layer, the mutual butt of the first circuit layer of the first pin of light-emitting diode and circuit board, the second circuit layer interference fit on the second pin and circuit board.
The mutual butt of the first circuit layer on the first pin of the light-emitting diode of this light emitting diode module and circuit board, the second pin is connected by the second circuit layer on interference and circuit board, therefore can be separated from one another easily between light-emitting diode and circuit board, be conducive to replacement of element.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Accompanying drawing explanation
Fig. 1 is the stereogram of the light-emitting diode in the light emitting diode module of first embodiment of the invention.
Fig. 2 is the exploded view of Fig. 1.
Fig. 3 is that in Fig. 2, light-emitting diode is removed lens vertical view afterwards.
Fig. 4 shows the section of circuit board of the light emitting diode module of first embodiment of the invention.
Fig. 5 is the vertical view of the circuit board of Fig. 4.
Fig. 6 shows light-emitting diode in Fig. 1 and the assembled state of the circuit board in Fig. 4.
Fig. 7 is the stereogram of light-emitting diode of the light emitting diode module of second embodiment of the invention.
Fig. 8 is the profile of Fig. 7.
Fig. 9 shows the section of circuit board of the light emitting diode module of second embodiment of the invention.
Figure 10 is the vertical view of the circuit board of Fig. 9.
Figure 11 shows circuit board in Fig. 9 and the assembled state of the light-emitting diode in Fig. 7.
Main element symbol description
| Circuit board | 10 |
| Perforate | 12 |
| Anchor point | 120 |
| Second circuit layer | 14 |
| Screw thread | 140 |
| The first circuit layer | 16 |
| Screw thread | 160 |
| Gap | 18 |
| Light-emitting diode | 20 |
| The second pin | 30 |
| Screw thread | 32 |
| Sidewall | 34 |
| The first pin | 40 |
| Screw thread | 42 |
| Sidewall | 44 |
| Insulating barrier | 50 |
| Anchor point | 52 |
| Luminescence chip | 60 |
| Lens | 70 |
| Gold thread | 80 |
Embodiment
Refer to Fig. 1-4, show the light emitting diode module of first embodiment of the invention.This light emitting diode module comprises a circuit board 10 and is fixed on the light-emitting diode 20 on circuit board 10.
This light-emitting diode 20 comprises one first pin 40, one second pin 30, connect an insulating barrier 50 of the first pin 40 and the second pin 30, be fixed on the luminescence chip 60 on the second pin 30 and cover lens 70 of luminescence chip 60.This first pin 40 and the second pin 30 are made by metal material, such as copper, aluminium, silver etc.The first pin 40 and the second pin 30 are all semi-cylindrical, and all upwards protrude out formation one semiorbicular sidewall 44,34.The bottom of the outside circumference of the first pin 40 and the second pin 30 is all formed with many screw threads 42,32.This insulating barrier 50 can be made by the insulating material of the viscosity such as polyester, epoxy resin, polyurethane, polybutadiene acid, silica gel, polyester-imide and polyimides.Insulating barrier 50 is bonded to each other two smooth sides of the first pin 40 and the second pin 30, makes the first pin 40 and the second pin 30 be combined as a complete cylinder.Bonding due to insulating barrier 50, the common complete ring wall that forms of sidewall 44,34 of the first pin 40 and the second pin 30,42,32, the screw thread of the first pin 40 and the second pin 30 disconnects at insulating barrier 50 places.The screw thread 42 of the first pin 40 of insulating barrier 50 both sides is corresponding one by one with the screw thread 32 of the second pin 30, thereby keeps on the whole continuously, to facilitate the follow-up and process that is spirally connected circuit board 10.
Luminescence chip 60 is fixed on the end face of the first pin 40 by heat-conducting glue (not shown).Luminescence chip 60 can be made by semiconductive luminescent materials such as gallium nitride, InGaN, aluminum indium nitride gallium, gallium phosphide, GaAs, specifically depends on actual luminous demand.In the present embodiment, adopt the gallium nitride of blue light-emitting as the material of luminescence chip 60, with final synthesize white light.Luminescence chip 60 is connected to its two electrodes (not shown) respectively the first pin 40 and the second pin 30 end faces by two gold threads 80, to realize and being electrically connected to of the first pin 40 and the second pin 30.Certainly, by adopting flip chip technology (flip-chip), also can directly two electrodes of luminescence chip 60 be fixed on to the end face of the first pin 40 and the second pin 30, the risk of being brought to reduce routing.
These lens 70 are made by transparent materials such as glass, epoxy resin, Merlon, polymethyl methacrylates.Lens 70 combine with ring wall and cover luminescence chip 60.The end face of lens 70 is protruding upward and form convex lens, with the light that luminescence chip 60 is sent, assembles.Can be doped with fluorescent material (not shown), to change the light color that of luminescence chip 60 in lens 70.This fluorescent material can be made by fluorescent materials such as yttrium-aluminium-garnet, silicate compound, nitride, nitrogen oxide.In the present embodiment, adopt and can send the yttrium-aluminium-garnet of gold-tinted as the material of fluorescent material, with the blue light of sending with luminescence chip 60, go out white light.In addition, in the space that lens 70 and ring wall surround jointly, also can further fill encapsulating material (not shown), to protect luminescence chip 60 and gold thread 80.For further promoting output light intensity, the inner peripheral surface of ring wall also can apply one deck reflector layer (not shown).This reflector layer can be formed by the higher metal of reflectivity, as silver, aluminium, gold etc.Certainly, reflector layer also can adopt Bragg reflection film production, to promote reflector efficiency.
See also Fig. 5-6, this circuit board 10 offers a perforate 12, and on the internal face of perforate 12, forms one first circuit layer 16 and a second circuit layer 14.This first circuit layer 16 and second circuit layer 14 are all formed with the screw thread 160,140 that the first pin 40 and the second pin 30 with light-emitting diode 20 match.The first circuit layer 16 and second circuit layer 14 are spirally connected with the first pin 40 of light-emitting diode 20 and the second pin 30 respectively and electric current input are seted out in optical diode 20.The first circuit layer 16 and second circuit layer 14 all extend to the bottom of perforate 12 from the top of perforate 12, the two separates to avoid short circuit by gap 18.
Light-emitting diode 20 can pass through coordinating in the perforate 12 that screws in circuit board 10 between its first pin 40 and the screw thread 42,32 of the second pin 30 and the screw thread 160,140 of circuit board 10 first circuit layers 16 and second circuit layer 14, thereby is fixed on circuit board 10.Because being connects by screw thread 140,160,32,42, light-emitting diode 20 can be comparatively easily in the time need to changing from the interior back-out of perforate 12 of circuit board 10.And this kind is spirally connected mode also without carrying out under hot conditions, thereby guarantee the safety of light-emitting diode 20.
In addition,, because light-emitting diode 20 exists polarity, for avoiding light-emitting diode 20 to be connect the problem that causes on the contrary damage on circuit board 10, near the insulating barrier 50 of light-emitting diode 20 and the perforate 12 of circuit board 10, be equipped with an anchor point 52,120.Light-emitting diode 20 can first align two anchor points 52,120 before the perforate 12 that screws in circuit board 10, and then was rotated, to guarantee that light-emitting diode 20 can be connected with circuit board 10 with correct polarity.
Understandably, the structure of above-mentioned the first pin 40 and the second pin 30 also can be done corresponding variation thoroughly to stop the problem of reverse polarity connection.Referring to Fig. 7-11, the first pin 40 of this light-emitting diode 20 is cylindric, and the second pin 30 in the form of a ring.The second pin 30 surrounds the first pin 40, bonding by insulating barrier 50 between the two.Luminescence chip 60 is fixed on the first pin 40 surfaces and is connected to respectively the first pin 40 and the second pin 30 end faces by two gold threads 80.The screw thread 32 of this light-emitting diode 20 is only formed at the outside circumference of the second pin 30 and is continuous distribution.In the perforate 12 of circuit board 10, be formed with a figure second circuit layer 14 and by 14, second circuit layer around the first circuit layer 16.The bottom surface that this second circuit layer 14 covers the interior lateral circle surface of perforate 12 and extends to perforate 12.Second circuit layer 14 is formed with many screw threads 140 that mate with the screw thread 32 of the second pin 30.The first circuit layer 16 only covers the central region of perforate 12 bottom surfaces and separates by gap 18 and second circuit layer 14.Light-emitting diode 20 screwed in perforate 12 by coordinating between the screw thread 32 of its second pin 30 and the screw thread 140 of the second circuit layer 14 of circuit board 10, the bottom surface of its first pin 40 and the end face of circuit board 10 first circuit layers 16 are connected, thereby complete and being electrically connected to of circuit board 10.The pin configuration of this kind of enclosed can be avoided the problem of reverse polarity connection effectively, thereby guarantees the safety of light-emitting diode 20.
In addition, between the pin 30,40 in above-mentioned two embodiment and circuit board 10, all by screw thread 32,42,140,160, be connected, understandably, between pin 30,40 and circuit board 10, can also directly by interference fit, realize being connected of the two.Particularly, the first circuit layer 16/ second circuit layer 14 in circuit board 10 perforates 12 can not established screw thread 160,140 structures, the first pin 40/ second pin 30 of light-emitting diode 20 is not established screw thread 42,32 structures yet, but the diameter of the first pin 40/ second pin 30 is designed to be slightly larger than the internal diameter of perforate 12.Thus, light-emitting diode 20 be inserted in perforate 12 when interior by because the first pin 40/ second pin 30 stably engages with circuit board 10 compared with large frictional force with 14 generation of the first circuit layer 16/ second circuit layer in perforate 12.
Claims (4)
1. a light emitting diode module, comprise circuit board and light-emitting diode, light-emitting diode comprises the first pin, the second pin separating with the first pin by insulating barrier and be electrically connected to the first pin and the luminescence chip of the second pin, circuit board comprises the first circuit layer and the second circuit layer separating with the first circuit layer, it is characterized in that: the mutual butt of the first circuit layer of the first pin of light-emitting diode and circuit board, the second pin is connected by interference fit with the second circuit layer of circuit board, luminescence chip is fixed on the first pin surface, circuit board offers perforate, light-emitting diode is inserted in perforate, second circuit layer is positioned at the medial surface of perforate, on the lateral surface of the second pin, there is screw thread, second circuit layer is formed with screw thread, the second pin and second circuit layer are threadably engaged, the lateral surface of the first pin has screw thread, the first circuit layer is positioned at the medial surface of perforate and has screw thread, the first pin and the first circuit layer are by screw thread butt.
2. light emitting diode module as claimed in claim 1, is characterized in that: the screw thread of the first pin and the second pin disconnects in the position of insulating barrier.
3. light emitting diode module as claimed in claim 1, is characterized in that: light-emitting diode also comprises the ring wall extending from the first pin and the second pin surface, luminescence chip by ring wall institute around.
4. light emitting diode module as claimed in claim 1, is characterized in that: light-emitting diode also comprises the lens of being combined with ring wall and covering luminescence chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010542362.5A CN102468401B (en) | 2010-11-12 | 2010-11-12 | LED (Light Emitting Diode) module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010542362.5A CN102468401B (en) | 2010-11-12 | 2010-11-12 | LED (Light Emitting Diode) module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102468401A CN102468401A (en) | 2012-05-23 |
| CN102468401B true CN102468401B (en) | 2014-10-15 |
Family
ID=46071775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010542362.5A Expired - Fee Related CN102468401B (en) | 2010-11-12 | 2010-11-12 | LED (Light Emitting Diode) module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102468401B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101275735A (en) * | 2008-05-12 | 2008-10-01 | 张春涛 | High-power LED lamp structure and manufacturing method thereof |
| CN201242119Y (en) * | 2008-07-07 | 2009-05-20 | 莱特尔科技（深圳）有限公司 | LED and LED illumination module |
| CN101803125A (en) * | 2007-09-13 | 2010-08-11 | 泰科电子公司 | led socket |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7758223B2 (en) * | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
-
2010
- 2010-11-12 CN CN201010542362.5A patent/CN102468401B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101803125A (en) * | 2007-09-13 | 2010-08-11 | 泰科电子公司 | led socket |
| CN101275735A (en) * | 2008-05-12 | 2008-10-01 | 张春涛 | High-power LED lamp structure and manufacturing method thereof |
| CN201242119Y (en) * | 2008-07-07 | 2009-05-20 | 莱特尔科技（深圳）有限公司 | LED and LED illumination module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102468401A (en) | 2012-05-23 |
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Granted publication date: 20141015 Termination date: 20151112 |
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