CN102456594A - Removed edge width detection method and device - Google Patents
Removed edge width detection method and device Download PDFInfo
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- CN102456594A CN102456594A CN2010105281361A CN201010528136A CN102456594A CN 102456594 A CN102456594 A CN 102456594A CN 2010105281361 A CN2010105281361 A CN 2010105281361A CN 201010528136 A CN201010528136 A CN 201010528136A CN 102456594 A CN102456594 A CN 102456594A
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Abstract
The embodiment of the invention discloses a removed edge width detection method and device, wherein the method comprises the following steps: carrying out initial coordinate positioning on a wafer by utilizing an overlay measuring instrument; educing a ray from the initial coordinate and enabling the ray to be respectively crossed with the removed edge of the water and the physical edge of the water, thus obtaining a first point on the physical edge of the wafer and a second point on the removed edge of the wafer; acquiring the coordinate of the first point on the physical edge of the wafer, and marking the coordinate as a first coordinate; acquiring the coordinate of the second point on the removed edge of the wafer, and marking the coordinate as a second coordinate; and calculating and acquiring the removed edge width of the wafer according to the first coordinate and the second coordinate. The result of the removed edge width calculated according to the method provided by the invention is more accurate compared with the result calculated by the traditional method, and the accuracy requirement of the removed edge width is met; and moreover, the overlay measuring instrument adopted by the invention is lower in cost and is suitable for being used in each enterprise, so the using range is not restricted.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, more particularly, relate to a kind of trimming checking method for width and device.
Background technology
In the fabrication of semiconductor device, because the limitation of technology, Waffer edge is the very high place of defective often, in order to improve the rate of finished products of product, need behind the spin coating photoresist, possibly cause photoresist defective, certain width to remove Waffer edge.
The method of removing Waffer edge certain width photoresist has two kinds; A kind of is EBR (Edge BeadRemoval removes flange) method: behind the spin coating photoresist, photoresist flows to the edge or the back side of wafer under action of centrifugal force; After the drying; These photoresists peel off and produce particle easily, thereby in follow-up technical process, become the source of defective or fault, and the EBR method is nozzle of assembling on photoresist rotation gluer; Can remove edge and the back side of the solvent of photoresist to wafer on a small quantity from ejection in the said nozzle, the solvent that utilization is sprayed and the characteristic of photoresist similar compatibility are removed photoresist.Another kind is WEE (Wafer Edge Exposure; Waffer edge exposure trimming) method: the photoresist to the Waffer edge certain width makes public; Utilize developer solution that the photoresist of Waffer edge certain width is removed then; Thereby avoid edge's photoresist to transfer to the back side (for example, photoresist just might flow to the back side in the roasting firmly process), follow-up technical process is kept clean.
Above-mentioned two kinds of methods all can be used to remove the photoresist of Waffer edge certain width, still, remove the accuracy of the width (being called for short the trimming width) of photoresist; Directly have influence on the effective area on the wafer, for example, when wafer is 8 inches; If the trimming width is 3 millimeters, the effective tube core that then obtains on the wafer is 844, if the trimming width is 1.6 millimeters; Then effectively tube core becomes 860, and both differ 2%; When wafer was 12 inches, if the trimming width is become 3 millimeters from original 1.5 millimeters, the effective area that then loses on the wafer was about 1400 square millimeters, and when the area of tube core more little, the tube core number of loss is just many more.Therefore, in order accurately to control actual producible tube core number, need accurately to detect the trimming width.
The method of detection trimming width commonly used has two kinds at present: first; Adopt ruler or vernier caliper (general designation ruler) to measure, when adopting the method to measure, can scratch wafer surface in view of ruler is placed on the wafer; Therefore; Need measure ruler is unsettled,, read the physical edge 102 of wafer 101 and the distance between the trimming edge 103 from ruler 104 referring to Fig. 1.This method one is because ruler is unsettled, the 2nd, because range estimation, so measurement result is very inaccurate.Second; Adopt the microscope of eyepiece band scale to measure, the method also is through artificially reading the trimming width, and the trimming width that therefore records has the error of 0.5mm at least; Compare the required precision of general trimming width 0.1mm, the result that this method obtains is also not accurate enough; And the microscope cost of eyepiece band scale is higher, and not all semiconductor enterprise all has, and the scope of application is limited.
Summary of the invention
In view of this, the present invention provides a kind of trimming checking method for width and device, can accurately detect the trimming width, satisfy the required precision of trimming width, and the scope of application is unrestricted.
For realizing above-mentioned purpose, the present invention provides following technical scheme:
A kind of trimming checking method for width, said method comprises:
Utilize the overlay measuring instrument that wafer is carried out the initial coordinate location;
Draw ray from initial coordinate and intersect with wafer trimming edge and wafer physical edge respectively, obtain on the wafer physical edge first with wafer trimming edge on second point;
Obtain on the wafer physical edge first coordinate, this coordinate is designated as first coordinate;
Obtain on the wafer trimming edge second coordinate, this coordinate is designated as second coordinate;
According to said first coordinate and second coordinate, calculate the trimming width of wafer.
Preferably, utilizing the overlay measuring instrument that wafer is carried out the initial coordinate location specifically comprises:
Wafer is placed on the board of overlay measuring instrument;
The position of adjustment wafer makes center wafer be positioned at the origin of coordinates place of said board.
Preferably, obtaining on the wafer physical edge first coordinate specifically comprises:
Move wafer, make first geometric center that is in the visual windows of overlay measuring instrument on the wafer physical edge;
Read on the wafer physical edge first coordinate from the coordinate window of overlay measuring instrument.
Preferably, obtaining on the wafer trimming edge second coordinate specifically comprises:
Along moving wafer through said radius at first on the wafer, make second geometric center that is in the visual windows of overlay measuring instrument on the wafer trimming edge;
Read on the wafer trimming edge second coordinate from the coordinate window of overlay measuring instrument.
Preferably, the geometric center of said visual windows is the center with cross-like shape.
Preferably, the abscissa of said first coordinate and second coordinate is 0.
Preferably, the ordinate of said first coordinate and second coordinate is 0.
Preferably, also comprise after calculating the trimming width of wafer: measure the trimming width of other 2 correspondences except that said first on the wafer physical edge at least, and each trimming width is averaged.
The present invention also provides a kind of trimming width detecting, and said device comprises: positioning unit, read coordinate unit and computing unit;
Wherein:
Said positioning unit is used for wafer is carried out the initial coordinate location;
Saidly read the position that the coordinate unit is used for confirming tested point on wafer physical edge and the trimming edge, and read the coordinate of tested point on physical edge and the trimming edge respectively;
Said computing unit is used for the corresponding trimming width of coordinate Calculation that reads tested point on wafer physical edge that the coordinate unit reads and the trimming edge according to said.
Preferably, said positioning unit comprises judgment sub-unit and adjustment subelement;
Wherein:
Said judgment sub-unit is used to judge whether center wafer is positioned at the origin of coordinates place of board, if not, then by said adjustment subelement the position of wafer is adjusted, makes center wafer be positioned at the origin of coordinates place of board.
Can find out from technique scheme; Trimming checking method for width provided by the present invention; At first utilize the overlay measuring instrument that wafer is carried out the initial coordinate location; Then from initial coordinate draw ray find on the wafer physical edge first with wafer trimming edge on second point, then read on the said wafer physical edge on and the wafer trimming edge second coordinate respectively at first, can calculate the trimming width of wafer according to this coordinate of 2.Said overlay measuring instrument generally is used for the alignment precision between graph layer on the testing wafer and the layer; Be used for measuring the trimming width of wafer here; The trimming width of being measured by the overlay measuring instrument is compared the trimming width that artificial reading draws and is wanted accurately, and the trimming width of surveying satisfies required precision; In addition, because said overlay measuring instrument cost is lower, it is used to be suitable for each enterprise, and therefore, the scope of application is unrestricted.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is with the sketch map of ruler measurement trimming width in the prior art;
Fig. 2 is a kind of trimming checking method for width flow chart that the embodiment of the invention provided;
Fig. 3 is a kind of trimming width detecting sketch map that the embodiment of the invention provided.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Said as the background technology part, the trimming width of employing ruler measurement wafer, the result who obtains is extremely inaccurate; Adopt the microscope of eyepiece band scale to measure, the result also is barely satisfactory, and the microscope cost of eyepiece band scale is higher, can not popularize use.
The inventor discovers; Cause the not accurate enough essential reason of trimming width measure result to be: to adopt the microscope of ruler or eyepiece band scale to measure; All need people to observe and read the scale of respective point on wafer physical edge and the trimming edge through naked eyes, and then calculate the trimming width of wafer.The people is for reading corresponding scale, makes the factor that has artificial subjectivity in the measurement result, so measurement result is not accurate enough.
Based on this, the present invention provides a kind of trimming checking method for width, and said method comprises: utilize the overlay measuring instrument that wafer is carried out the initial coordinate location; Draw ray from initial coordinate and intersect with wafer trimming edge and wafer physical edge respectively, obtain on the wafer physical edge first with wafer trimming edge on second point; Obtain on the wafer physical edge first coordinate, this coordinate is designated as first coordinate; Obtain on the wafer trimming edge second coordinate, this coordinate is designated as second coordinate; According to said first coordinate and second coordinate, calculate the trimming width of wafer.
Specify trimming checking method for width provided by the present invention below in conjunction with accompanying drawing.
Referring to Fig. 2, Fig. 2 is a kind of trimming checking method for width flow chart that the embodiment of the invention provided, and said method specifically comprises the steps:
Step 1: utilize the overlay measuring instrument that wafer is carried out the initial coordinate location.
Compare with prior art, the present invention adopts the microscope of overlay measuring instrument replacement ruler or eyepiece band scale, and then wafer trimming width is measured.
This step can comprise following two steps again:
Step 11: wafer is placed on the board of overlay measuring instrument.
The present invention adopts overlay (Overlay) measuring instrument that wafer trimming width is measured; Said Overlay measuring instrument is to be used for measuring alignment precision between graph layer on the wafer and the layer in the fabricate process; This instrument is provided with high-accuracy position system; Said high-accuracy position system can position the device that is positioned on the Overlay measuring instrument board; Promptly can provide the relative position coordinates of device on the board objectively, so before measuring wafer trimming width, need wafer to be measured be placed on the board of Overlay measuring instrument.
Step 12: the position of adjustment wafer makes center wafer be positioned at the origin of coordinates place of said board.
It is the coordinate system of a standard that the board of said Overlay measuring instrument is defaulted as by high-accuracy position system; When wafer to be measured is placed on the said board; Said high-accuracy position system can be provided with according to corresponding program carries out the position adjustment to the wafer to be measured on the board; Can adjust that breach all is in more suitable position on center wafer and the wafer, be convenient to follow-up measurement.The position of adjustment wafer makes center wafer be positioned at the origin of coordinates place of said board in the embodiment of the invention.Certainly, through different programs is set, can adjusts center wafer and be positioned at other the non-origin of coordinates places on the board, this is to not influence of follow-up measurement.
Step 2: draw ray from initial coordinate and intersect with wafer trimming edge and wafer physical edge respectively, obtain on the wafer physical edge first with wafer trimming edge on second point.
The wafer physical edge refers to the edge of wafer entity, because wafer is generally circle, so the wafer physical edge is circular.Wafer trimming edge refers to and adopts EBR or WEE method, removes the edge of residue photoresist behind the photoresist of Waffer edge certain width, and said wafer trimming edge generally also is circular.
In step 1, wafer has been carried out the initial coordinate location, the origin of coordinates of center wafer and board is overlapped.Drawing ray from initial coordinate (that is center wafer) intersects with wafer trimming edge and wafer physical edge respectively; Obtain two intersection points; In the present embodiment intersection point on the wafer physical edge is designated as first point on the wafer physical edge; To distinguish other points on the wafer physical edge, the intersection point on the wafer trimming edge is designated as second point on the wafer trimming edge.
Step 3: obtain on the wafer physical edge first coordinate, this coordinate is designated as first coordinate.
The coordinate that obtains on the wafer physical edge described in this step at first can comprise the steps: again
Step 31: move wafer, make first geometric center that is in the visual windows of Overlay measuring instrument on the wafer physical edge.
In order to obtain on the wafer physical edge first coordinate; At first need move wafer; Make first visual windows that is positioned at the Overlay measuring instrument on the wafer physical edge, said visual windows is can see through camera lens and zone that on the display interface of Overlay measuring instrument, show for people.
The position that is positioned at the wafer on the Overlay measuring instrument board is adjusted in the step 12; At this moment; The relative position of said wafer and Overlay measuring instrument board no longer changes; The board that moves the Overlay measuring instrument can reach the purpose that moves wafer, and promptly said wafer and Overlay measuring instrument board are done as a whole mobile together.Concrete moving process; Can realize through the button up and down on the Overlay measuring instrument display interface; Through artificially manually pressing button; The board of said wafer and Overlay measuring instrument is moved together, move to first visual windows that is positioned at the Overlay measuring instrument on the wafer physical edge, and satisfy said first geometric center that is positioned at said visual windows.The geometric center of visual windows described in the present embodiment is the center with cross-like shape, can move wafer so exactly said first geometric center with said visual windows overlapped.Certainly, the geometric center of said visual windows can also be arranged to the geometric center of other figure, like the center of circle of circle, the center of rectangle etc.
Step 32: read on the wafer physical edge first coordinate from the coordinate window of Overlay measuring instrument.
Because the relative position of said wafer and Overlay measuring instrument board is constant; So the coordinate of said wafer in the coordinate system shown in the Overlay measuring instrument board is constant; On moving wafer to wafer physical edge during the geometric center of first visual windows that is in the Overlay measuring instrument; High-accuracy position system by the Overlay measuring instrument calculates said coordinate at first; And said first coordinate shown on the coordinate window of Overlay measuring instrument, read said coordinate intuitively at first thereby be convenient to people.Said coordinate window also is a zone on the Overlay measuring instrument display interface.
First coordinate is first coordinate on the record wafer physical edge.
Step 4: obtain on the wafer trimming edge second coordinate, this coordinate is designated as second coordinate.
The coordinate that obtains on the wafer trimming edge in this step at second can comprise the steps: again
Step 41:, make second geometric center that is in the visual windows of Overlay measuring instrument on the wafer trimming edge along moving wafer through said radius at first on the wafer.
No matter adopting EBR still is that the WEE method is removed photoresist; Resulting wafer trimming edge all refers to remove the edge of residue photoresist behind the photoresist of Waffer edge certain width; Said wafer trimming edge generally also is circular; And said wafer trimming edge and wafer physical edge are concentric circles, and the said concentrically ringed center of circle is the center of wafer.For any point on the wafer physical edge, on wafer trimming edge, all can find corresponding unique point with it, and on wafer physical edge and the trimming edge corresponding 2 line through the center of wafer.
Move wafer along the said radius of process on the wafer at first in this step; Find the point on the wafer trimming edge of said first correspondence; Be second point on the wafer trimming edge, and make said second geometric center that is in the visual windows of Overlay measuring instrument.
Step 42: read on the wafer trimming edge second coordinate from the coordinate window of Overlay measuring instrument.
When the geometric center of second visual windows that is in the Overlay measuring instrument on the wafer trimming edge; High-accuracy position system by the Overlay measuring instrument calculates said coordinate at second, and the coordinate window of this point coordinates at the Overlay measuring instrument shown.
Second coordinate is second coordinate on the record wafer trimming edge.
Need to prove that the order of step 3 and step 4 can be exchanged, promptly can obtain the coordinate of tested point on the wafer trimming edge earlier, obtain then with wafer trimming edge on the coordinate put on the corresponding wafer physical edge of tested point.
Step 5:, calculate the trimming width of wafer according to said first coordinate and second coordinate.
On the wafer physical edge of being obtained respectively according to step 3 and step 4 first with wafer trimming edge on second coordinate (being said first coordinate and second coordinate), in conjunction with the range formula of point-to-point transmission, calculate the trimming width of wafer.
Preferably; Through moving wafer to a correct position, the abscissa that makes said first coordinate is 0, like this in step 3; The abscissa of second coordinate that is obtained in the step 4 also is 0, last in step 5, calculate between said first coordinate and second coordinate apart from the time will become simple.In like manner, can move wafer and make the ordinate of said first coordinate and second coordinate be 0, and then calculate the trimming width of wafer.
After measuring the trimming width of wafer; In order to make result of calculation more accurately, reliably; Can also be different from said point more than two at first looking for again again on the wafer physical edge; Measure and calculate the corresponding trimming width of these points respectively, at last each measured trimming width is sued for peace, averaged.
No matter be to adopt EBR or WEE method to remove the photoresist of Waffer edge, the trimming width that obtains all can be detected by detection method provided by the present invention.
Can find out from technique scheme; The present invention confirms the coordinate of tested point on wafer physical edge and the trimming edge through the high-accuracy position system of Overlay measuring instrument; And then according to the trimming width of determined coordinate Calculation wafer; Because said high-accuracy position system can provide each point coordinates objective, exactly; So the trimming width that calculated is compared artificial reading gained result and wanted accurately, and the coordinate precision that said high-accuracy position system is determined reaches 0.1mm, satisfies the required precision of trimming width.In addition, said Overlay measuring instrument be in the general fabricate process the measuring instrument that generally uses, cost is lower, popularizes in each semiconductor enterprise, therefore, the scope of application is unrestricted.
The present invention also provides a kind of trimming width detecting, and said trimming width detecting has been done corresponding improvement on the basis of Overlay measuring instrument.Referring to Fig. 3, said device specifically comprises: positioning unit 201, read coordinate unit 202 and computing unit 203.
Wherein, said positioning unit 201 is used for wafer is carried out the initial coordinate location; Saidly read the position that coordinate unit 202 is used for confirming tested point on wafer physical edge and the trimming edge, and read the coordinate of tested point on wafer physical edge and the trimming edge respectively; Said computing unit 203 is used for the corresponding trimming width of coordinate Calculation that reads tested point on wafer physical edge that coordinate unit 202 reads and the trimming edge according to said.
Preferably, said positioning unit 201 comprises judgment sub-unit and adjustment subelement; Wherein, said judgment sub-unit is used to judge whether center wafer is positioned at the origin of coordinates place of board, if then carry out subsequent operation by reading coordinate unit 202; If not, then the position of wafer is adjusted, is made center wafer be positioned at the origin of coordinates place of board by said adjustment subelement.
For device embodiment, because it corresponds essentially to method embodiment, so relevant part gets final product referring to the part explanation of method embodiment.Device embodiment described above only is schematic; Wherein said unit as the separating component explanation can or can not be physically to separate also; The parts that show as the unit can be or can not be physical locations also; Promptly can be positioned at a place, perhaps also can be distributed on a plurality of NEs.Can realize the purpose of present embodiment scheme according to the needs selection some or all of module wherein of reality.Those of ordinary skills promptly can understand and implement under the situation of not paying creative work.
Need to prove; In this article; Relational terms such as first and second grades only is used for an entity or operation are made a distinction with another entity or operation, and not necessarily requires or hint relation or the order that has any this reality between these entities or the operation.And; Term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability; Thereby make and comprise that process, method, article or the equipment of a series of key elements not only comprise those key elements; But also comprise other key elements of clearly not listing, or also be included as this process, method, article or equipment intrinsic key element.Under the situation that do not having much more more restrictions, the key element that limits by statement " comprising ... ", and be not precluded within process, method, article or the equipment that comprises said key element and also have other identical element.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments among this paper.Therefore, the present invention will can not be restricted to these embodiment shown in this paper, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (10)
1. a trimming checking method for width is characterized in that, comprising:
Utilize the overlay measuring instrument that wafer is carried out the initial coordinate location;
Draw ray from initial coordinate and intersect with wafer trimming edge and wafer physical edge respectively, obtain on the wafer physical edge first with wafer trimming edge on second point;
Obtain on the wafer physical edge first coordinate, this coordinate is designated as first coordinate;
Obtain on the wafer trimming edge second coordinate, this coordinate is designated as second coordinate;
According to said first coordinate and second coordinate, calculate the trimming width of wafer.
2. method according to claim 1 is characterized in that, utilizes the overlay measuring instrument that wafer is carried out the initial coordinate location and specifically comprises:
Wafer is placed on the board of overlay measuring instrument;
The position of adjustment wafer makes center wafer be positioned at the origin of coordinates place of said board.
3. method according to claim 1 is characterized in that, the coordinate that obtains on the wafer physical edge at first specifically comprises:
Move wafer, make first geometric center that is in the visual windows of overlay measuring instrument on the wafer physical edge;
Read on the wafer physical edge first coordinate from the coordinate window of overlay measuring instrument.
4. method according to claim 1 is characterized in that, the coordinate that obtains on the wafer trimming edge at second specifically comprises:
Along moving wafer through said radius at first on the wafer, make second geometric center that is in the visual windows of overlay measuring instrument on the wafer trimming edge;
Read on the wafer trimming edge second coordinate from the coordinate window of overlay measuring instrument.
5. according to claim 3 or 4 described methods, it is characterized in that the geometric center of said visual windows is the center with cross-like shape.
6. method according to claim 1 is characterized in that, the abscissa of said first coordinate and second coordinate is 0.
7. method according to claim 1 is characterized in that, the ordinate of said first coordinate and second coordinate is 0.
8. method according to claim 1 is characterized in that, the trimming width that calculates wafer also comprises afterwards: measure the trimming width of other 2 correspondences except that said first on the wafer physical edge at least, and each trimming width is averaged.
9. a trimming width detecting is characterized in that, comprising: positioning unit, read coordinate unit and computing unit;
Wherein:
Said positioning unit is used for wafer is carried out the initial coordinate location;
Saidly read the position that the coordinate unit is used for confirming tested point on wafer physical edge and the trimming edge, and read the coordinate of tested point on physical edge and the trimming edge respectively;
Said computing unit is used for the corresponding trimming width of coordinate Calculation that reads tested point on wafer physical edge that the coordinate unit reads and the trimming edge according to said.
10. device according to claim 9 is characterized in that, said positioning unit comprises judgment sub-unit and adjustment subelement;
Wherein:
Said judgment sub-unit is used to judge whether center wafer is positioned at the origin of coordinates place of board, if not, then by said adjustment subelement the position of wafer is adjusted, makes center wafer be positioned at the origin of coordinates place of board.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109273379A (en) * | 2018-12-07 | 2019-01-25 | 武汉新芯集成电路制造有限公司 | A kind of method and apparatus of detection crystal round fringes photoresist removal width |
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| CN101685271A (en) * | 2008-09-23 | 2010-03-31 | 和舰科技(苏州)有限公司 | Method for detecting wafer edge cleaning width of wafer |
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| JPH10125751A (en) * | 1996-10-23 | 1998-05-15 | Ricoh Co Ltd | Overlay accuracy measuring pattern and method of measuring overlay accuracy |
| CN201017864Y (en) * | 2007-03-28 | 2008-02-06 | 沈阳芯源先进半导体技术有限公司 | Wafer automatic position setting control device |
| CN101434046A (en) * | 2007-11-13 | 2009-05-20 | 株式会社迪思科 | Grinding device |
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Application publication date: 20120516 |