CN102441841B - Method for improving grinding uniformity of chemical mechanical planarization (CMP) - Google Patents
Method for improving grinding uniformity of chemical mechanical planarization (CMP) Download PDFInfo
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- CN102441841B CN102441841B CN201110250220.6A CN201110250220A CN102441841B CN 102441841 B CN102441841 B CN 102441841B CN 201110250220 A CN201110250220 A CN 201110250220A CN 102441841 B CN102441841 B CN 102441841B
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- guard ring
- thickness
- air cushion
- retainer
- cmp
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Abstract
The invention discloses a method for improving the grinding uniformity of chemical mechanical planarization (CMP). The method is implemented through a monitoring loop, wherein the monitoring loop comprises a controller, an air cushion and a thickness sensor connected in sequence; the air cushion is arranged on the joint between the upper side of a retainer and other components; the thickness sensor is used for monitoring the loss degree in real time; the controller is used for controlling the air cushion to move after receiving a signal of the thickness sensor; the air cushion is used for pushing the retainer out to ensure that the relative height of the retainer and a film gasket is kept constant in the using period of the retainer; and when the consumption of the thickness of the retainer to a certain degree is detected by using the thickness sensor, the controller transmits an alarm signal. In the method, the loss degree of the retainer is detected, and the retainer is pushed out in real time, so that the relative height of the retainer and the film gasket is kept constant in the using period of the retainer, and the problem of the influence of pressure fluctuation of the retainer on the grinding uniformity in the CMP technical process is well solved.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly relate to a kind of method improving the cmp grinding uniformity.
Background technology
In semiconductor fabrication, cmp (CMP, Chemical Mechanical Planarization) technology can realize the planarized of whole wafer, becomes one of step important in chip manufacturing process.In the manufacture craft process of CMP, the uniformity of the oxide thickness of silicon chip surface is extremely important, silicon chip surface oxide thickness will have influence on the unit for electrical property parameters of electronic device, and meeting in uneven thickness makes the device performance that same silicon chip is produced produce difference, affects yield rate.
CMP guard ring Main Function exactly for preventing wafer from skidding off grinding head in CMP process of lapping, and applies certain pressure to grinding pad, to improve the overall uniformity of CMP.Guard ring in use can be worn, and its thickness is thinning gradually, when the thickness of guard ring is thinned to a certain degree, just need the guard ring renewed, to ensure that guard ring can live wafer by geosphere very well in CMP process of lapping, prevent wafer from motion process, departing from the control of grinding head, cause slide plate.And in a cmp process, guard ring in process of lapping to grinding pad (pad) surperficial applied pressure be also an important parameter.In the use procedure of guard ring, the consumption of guard ring makes the minimizing of guard ring thickness, and namely the projecting height d of the relative film gasket of guard ring can reduce, thus makes the actual pressure of guard ring to grinding pad have certain fluctuation, can affect the overall uniformity of CMP.
Chinese patent CN201283537Y discloses a kind of CMP edge pressure dressing ring, establishes with observable mark in the periphery of this CMP edge pressure dressing ring, as the reference data in this CMP edge pressure dressing ring service life.When pressure dressing ring in CMP edge is in use worn, thickness is thinning gradually, when touching the mark established in advance, can think that this CMP edge pressure dressing ring reaches service life.But there is following defect in this invention: only realize monitoring service life, cannot life-time dilatation be realized, also cannot improve CMP and grind the uniformity, US Patent No. 7311586(has chemical mechanical grinding head device and the manufacture method thereof of direct pneumatic grinding wafer pressure, Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure) disclose one by moving up and down at controlling diaphragm pad (membrane) method extending guard ring service time, but there is following defect in this invention: 1. film gasket area is larger, quality is softer, displacement is consistent to be everywhere not easy accurate controlling diaphragm pad, 2. method is complicated.
Summary of the invention
For above-mentioned Problems existing, the object of this invention is to provide a kind of method improving the cmp grinding uniformity, under the prerequisite of effect ensureing guard ring, by maintaining guard ring, the pressure of grinding pad is not fluctuated with guard ring consumption, improve CMP and grind the uniformity, method is simple, implements easily.
The object of the invention is to be achieved through the following technical solutions:
Improve a method for the cmp grinding uniformity, wherein, realized by a monitoring loop, described monitoring loop comprises the controller, air cushion and the thickness transducer that connect successively, and described air cushion is located at top and the miscellaneous part junction of guard ring; The extent of deterioration of guard ring described in described thickness transducer Real-Time Monitoring, described controller controls described air cushion after obtaining described thickness transducer signal and moves, described air cushion by extrapolated for described guard ring, to ensure that the relative altitude of described guard ring and film gasket between the operating period of described guard ring remains unchanged; When described thickness transducer detects that described guard ring thickness is depleted to a certain degree, described controller sends alarm signal.
The above-mentioned method improving the cmp grinding uniformity, wherein, is also included in the scale mark that certain length scope is made in described guard ring side.
The above-mentioned method improving the cmp grinding uniformity, wherein, in described guard ring side from its surface, every 0.5 millimeter is done a scale, until institute's length that makes marks meets 1 centimetre, for simply estimating the consumption degree of guard ring thickness.
The above-mentioned method improving the cmp grinding uniformity, wherein, described air cushion inflation expansion carrys out the thickness that supplementary described guard ring is consumed, to extend the service time of described guard ring.
The above-mentioned method improving the cmp grinding uniformity, wherein, described thickness transducer is positioned on grinding head bogey.
Compared with the prior art, beneficial effect of the present invention is: by detecting the extent of deterioration of guard ring, real-time by guard ring toward extrapolated mode, ensure that the relative altitude of guard ring and film gasket (membrane) between the operating period of guard ring remains unchanged.So just can avoid guard ring pressure oscillation in CMP process well and affect the problem of grinding the uniformity, improve guard ring operating efficiency during use; Meanwhile, this method is also to having certain prolongation the service time of single guard ring.
Accompanying drawing explanation
Fig. 1 is that the present invention improves monitoring loop in the method for the cmp grinding uniformity and the structural representation of grinding head.
Detailed description of the invention
Below in conjunction with schematic diagram and concrete operations embodiment, the invention will be further described.
As shown in Figure 1, the method that the present invention improves the cmp grinding uniformity is realized by a monitoring loop, monitoring loop comprises the controller 1 connected successively, air cushion 2 and thickness transducer 3, controller 1 is for data, the reception of order and transmission, air cushion 2 is located at top and the miscellaneous part junction of guard ring 4, thickness transducer 3 is located on grinding head 0 year device, for the extent of deterioration of Real-Time Monitoring guard ring 4, controller 1 controls air cushion 2 after obtaining thickness transducer 3 signal and moves, air cushion 2 is by extrapolated for guard ring 4, to ensure that guard ring 4 remains unchanged with the relative altitude d of film gasket 5 between the operating period of guard ring 4.When thickness transducer 3 detects that guard ring 4 thickness is depleted to a certain degree, controller 1 sends alarm signal.
In addition, also need the mark 41 making certain length scope in advance in guard ring 4 side, such as from guard ring 4 surface, every 0.5 millimeter is done a scale, mark one centimetre always, can be used for the consumption degree of simply estimating guard ring thickness, and it has been generally acknowledged that guard ring 4 reached service life place be different from other scale marks in advance out.
Thickness transducer 3 detects the thickness that guard ring 4 is consumed, simultaneously above guard ring 4, carry out by inflation the thickness that supplementary guard ring 4 is consumed with the air cushion 2 of miscellaneous part junction, namely pass through by guard ring 4 toward extrapolated certain thickness mode, extend the service time of guard ring 4.
Thickness transducer 3 and air cushion 2 are controlled by controller 1, and controller 1 can adopt single-chip microcomputer or other small-sized control device, to ensure that the projecting height d of the relative film gasket 5 of guard ring 4 remains unchanged.
When thickness transducer 3 detects that guard ring 4 thickness is depleted to a certain degree, namely represent that guard ring 4 has soon arrived service life, now needs the guard ring renewed.
In sum, the present invention improves the method for the cmp grinding uniformity under the prerequisite of effect ensureing guard ring, can by the service condition of guard ring side scale range estimation guard ring, the service life of the guard ring also can automatically predicted and extend simultaneously, ensure not fluctuate because guard ring is consumed to grinding pad applied pressure between the guard ring operating period, compatible with conventional chemical-mechanical lapping mode.
Be described in detail specific embodiments of the invention above, but the present invention is not restricted to specific embodiment described above, it is just as example.To those skilled in the art, any method equivalent modifications of carrying out to this improvement cmp grinding uniformity and substituting also all among category of the present invention.Therefore, equalization conversion done without departing from the spirit and scope of the invention and amendment, all should contain within the scope of the invention.
Claims (2)
1. one kind is improved the method for the cmp grinding uniformity, it is characterized in that, realized by a monitoring loop, described monitoring loop comprises the controller, air cushion and the thickness transducer that connect successively, and described air cushion is located at top and the miscellaneous part junction of guard ring; The extent of deterioration of guard ring described in described thickness transducer Real-Time Monitoring, described controller controls described air cushion after obtaining described thickness transducer signal and moves, described air cushion by extrapolated for described guard ring, to ensure that the relative altitude of described guard ring and film gasket between the operating period of described guard ring remains unchanged; When described thickness transducer detects that described guard ring thickness is depleted to a certain degree, described controller sends alarm signal;
Wherein, described air cushion inflation expansion carrys out the thickness that supplementary described guard ring is consumed, to extend the service time of described guard ring; Described thickness transducer is positioned on grinding head bogey; Also be included in the scale mark that certain length scope is made in described guard ring side.
2. the method improving the cmp grinding uniformity according to claim 1, it is characterized in that, in described guard ring side from its surface, every 0.5 millimeter is done a scale, until institute's length that makes marks meets 1 centimetre, for simply estimating the consumption degree of guard ring thickness.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110250220.6A CN102441841B (en) | 2011-08-29 | 2011-08-29 | Method for improving grinding uniformity of chemical mechanical planarization (CMP) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110250220.6A CN102441841B (en) | 2011-08-29 | 2011-08-29 | Method for improving grinding uniformity of chemical mechanical planarization (CMP) |
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| CN102441841A CN102441841A (en) | 2012-05-09 |
| CN102441841B true CN102441841B (en) | 2015-01-21 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103737479A (en) * | 2013-11-29 | 2014-04-23 | 上海华力微电子有限公司 | Polishing device and method for improving uniformity of chemical mechanical polishing by means of same |
| CN104029112A (en) * | 2014-06-23 | 2014-09-10 | 昆山永续智财技术服务有限公司 | Grinding method of chip reverse process |
| CN105345652A (en) * | 2015-10-14 | 2016-02-24 | 上海华力微电子有限公司 | Fixing ring with abrasion remaining thickness capable of being detected in real time |
| CN105364701A (en) * | 2015-10-19 | 2016-03-02 | 上海华力微电子有限公司 | Automatic grinding retainer abrasion compensation device and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0652110A2 (en) * | 1993-11-10 | 1995-05-10 | Brother Kogyo Kabushiki Kaisha | Tape printing apparatus having manual tape cutting device |
| CN2733586Y (en) * | 2004-08-31 | 2005-10-12 | 台湾积体电路制造股份有限公司 | Automatic control device for grinding slurry arm |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217145A (en) * | 2001-01-16 | 2002-08-02 | Lapmaster Sft Corp | Chuck for polishing apparatus |
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- 2011-08-29 CN CN201110250220.6A patent/CN102441841B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0652110A2 (en) * | 1993-11-10 | 1995-05-10 | Brother Kogyo Kabushiki Kaisha | Tape printing apparatus having manual tape cutting device |
| CN2733586Y (en) * | 2004-08-31 | 2005-10-12 | 台湾积体电路制造股份有限公司 | Automatic control device for grinding slurry arm |
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| CN102441841A (en) | 2012-05-09 |
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