TWI565558B - Device for detecting surface topography of polish pad, cmp polish machine with the same and method of dectecting surface topography of polish pad - Google Patents

Description

Polishing pad surface morphology detecting device, chemical mechanical polishing machine having the same, and method for detecting surface morphology of polishing pad

The present invention relates to a polishing pad surface morphology detecting device, a chemical mechanical polishing machine having the same, and a method for detecting the surface morphology of the polishing pad.

Chemical mechanical polishing technology is an indispensable "global planarization" technology in semiconductor manufacturing. However, the polishing pad used in the chemical mechanical polishing machine is a major consumable. Usually the polishing pad has to be replaced after several hundred grindings. However, since the process conditions at each polishing are different, and the manufacturing quality of the polishing pad itself is also different, it is difficult to judge the life end of the polishing pad. Moreover, there is currently no known objective assessment of the degree of wear and end of life of the polishing pad. It is generally based on empirical values, such as the number of accumulated abrasive pieces, or the length of time used for grinding to determine whether the polishing pad should be replaced. However, this method is too rough, can not accurately grasp the degree of wear of the polishing pad, can not be effectively used to the end of life, thus easily causing unnecessary waste, and can not be immediately found when the polishing pad is abnormally worn, resulting in a polishing profile (polish profile Variation, affecting the flatness of the polish wafer. Therefore, objectively grasping the wear level and end of life of the polishing pad is the subject of current breakthrough.

The invention provides a chemical mechanical polishing machine which can self-detect the topography of the polishing pad and objectively grasp the abrasion degree and the end of life of the polishing pad.

The invention provides a polishing pad surface morphology detecting device, which can immediately find the abrasive pad abnormal wear, and effectively use the polishing pad to the end of life.

The invention provides a method for detecting the surface morphology of a polishing pad, which can accurately grasp the abrasion degree of the polishing pad and enable the polishing pad to be effectively used to the end of life.

The invention provides a chemical mechanical polishing machine capable of self-detecting the configuration of the polishing pad, comprising a polishing table, a polishing pad, a first electrode, a plurality of second electrodes and a control module. The polishing pad is disposed on the polishing table. The first electrode is disposed between the polishing table and the first surface of the polishing pad. A plurality of second electrodes are disposed on the second surface of the polishing pad. The control module is connected to the first electrode and the second electrode, and obtains a surface shape of the second surface of the polishing pad by measuring a plurality of capacitances between the first electrode and the second electrode, thereby controlling Grinding conditions.

According to an embodiment of the invention, the chemical mechanical polishing machine capable of self-detecting the polishing pad configuration further comprises a diamond dresser, a polishing head, a polishing table, and a slurry flow controller, which are disposed on the grinding device. Above the pad, the controlled polishing condition controls parameters of the polishing pad conditioner, the polishing head, the polishing table, and the polishing liquid flow controller.

According to an embodiment of the invention, the parameters of the polishing pad conditioner, the polishing head, and the polishing table include a rotation speed, a down force, or a sweep frequency.

According to an embodiment of the invention, the chemical mechanical polishing machine capable of self-detecting the polishing pad configuration further comprises a slurry supply module pipeline, and the control polishing condition is controlled by the pipeline of the slurry supply module. The flow rate of the slurry.

According to an embodiment of the invention, the control module comprises a control unit and a main unit. The control unit connects the first electrode and the second electrode and the main unit, and can measure a plurality of capacitances between the first electrode and the second electrode to obtain a surface morphology of the polishing pad, and the grinding A signal of the surface morphology of the mat is supplied to the main unit. The main unit receives the signal of the surface shape of the polishing pad provided by the control unit, and controls the parameters of the polishing pad dresser, the polishing head or the polishing liquid provided by the slurry supply module pipeline according to the signal flow.

According to an embodiment of the invention, the main unit further includes a warning device for issuing a warning message when the surface morphology of the polishing pad reaches a critical value.

According to an embodiment of the invention, the chemical mechanical polishing machine for self-detecting the polishing pad configuration further comprises a flexible electrode integration module, wherein the second electrode is attached to the flexible electrode integration module to make the second electrode It is in substantial contact with the second surface of the polishing pad.

The invention further provides a polishing pad surface morphology detecting device, comprising a first electrode, a plurality of second electrodes and a control module. The first electrode is disposed on the first surface of the polishing pad. The second electrode is disposed on the second surface of the polishing pad. The control module is connected to the first electrode and the second electrode, and obtains a surface shape of the second surface of the polishing pad by measuring a capacitance value of a plurality of capacitors between the first electrode and the second electrode And to control the grinding conditions.

According to an embodiment of the invention, the control module is further connected to the polishing pad dresser, the polishing head, the polishing table, and the polishing liquid flow controller for controlling the polishing pad dresser, the polishing head, the polishing table or the slurry flow control The parameters of the device.

According to an embodiment of the invention, the parameters of the polishing pad dresser, the polishing head, and the polishing table include a rotational speed, a downward pressure, or a sweep frequency.

According to an embodiment of the invention, the control module is further connected to a slurry supply module pipeline for controlling the flow rate of the slurry provided by the slurry supply module pipeline.

According to an embodiment of the invention, the control module comprises a control unit and a main unit. The control unit connects the first electrode and the second electrode and the main unit, and obtains a surface morphology of the polishing pad by measuring a plurality of capacitances between the first electrode and the second electrode, and the polishing pad is The signal of the surface morphology is supplied to the above main unit. The main unit receives the signal of the surface morphology of the polishing pad provided by the control unit, and controls the parameters of a polishing pad dresser, the polishing head, the polishing table, or the grinding provided by the slurry supply module pipeline according to the signal. The flow rate of the liquid.

According to an embodiment of the invention, the main unit further includes a warning device that issues a warning when the surface morphology of the polishing pad reaches a critical value.

According to an embodiment of the invention, the polishing pad surface morphology detecting device further includes a flexible electrode integration module, wherein the second electrode is attached to the flexible electrode integration module, and the second electrode and the polishing pad are respectively The two surfaces are in substantial contact.

A method for detecting a surface morphology of a polishing pad, comprising: disposing a first electrode on a first surface of the polishing pad, and providing at least one second electrode on the second surface of the polishing pad, and then measuring the first electrode and a plurality of capacitances between the second electrodes to obtain a surface morphology of the second surface of the polishing pad.

According to an embodiment of the invention, the method for detecting the surface morphology of the polishing pad further includes providing a flexible electrode integration module, wherein the second electrode is attached to the flexible electrode integration module, and the second electrode and the polishing pad are The above second surface is substantially in contact.

The above-mentioned chemical mechanical polishing machine of the invention can self-detect the configuration of the polishing pad, and objectively grasp the abrasion degree and the end of life of the polishing pad.

According to the above-mentioned polishing pad surface morphology detecting device of the present invention, the polishing pad can be immediately found to be abnormally worn, and the polishing pad can be effectively used to the end of life.

According to the method for detecting the surface morphology of the polishing pad of the present invention, the degree of wear of the polishing pad can be accurately grasped, and the polishing pad can be effectively used to the end of life.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a cross-sectional view showing a surface morphology detecting device of a polishing pad according to an embodiment of the invention. Figure 2 is a diagram showing a chemical mechanical polishing machine having means for detecting the surface morphology of the polishing pad.

Referring to FIG. 1 , a polishing pad surface morphology detecting apparatus 100 according to an embodiment of the present invention includes a first electrode 10 , a second electrode 12 , and a control module 14 . The chemical mechanical polishing machine 200 of FIG. 2 includes a polishing table 20, a polishing pad 22, a polishing pad conditioner 24, a polishing liquid supply module line 26, and a polishing pad surface morphology detecting device 100.

Referring to FIG. 2, the polishing pad 22 is disposed on the polishing table 20. The first surface 22a of the polishing pad 22 corresponds to the second surface 22b. In one embodiment, the flatness of the first surface 22a of the polishing pad 22 is greater than the flatness of the second surface 22b of the polishing pad 22; the height of the second surface 22b of the polishing pad 22 is greater than the first of the polishing pad 22 Surface 22a. In other words, in one embodiment, the second surface 22b refers to a surface that is in contact with the surface on which the wafer is polished during the grinding process, or is in contact with the polishing pad conditioner 24 or the polishing head 25, or receives a slurry or solution supply tube. The surface of the polishing pad 22 of the slurry supplied by the road.

Referring to FIGS. 1 and 2 , the first electrode 10 is disposed between the first surface 22 a of the polishing pad 22 and the polishing table 20 . The material of the first electrode 10 includes a conductor material. The plurality of second electrodes 12 are disposed at different positions of the second surface 22b of the polishing pad 22. The material of the second electrode 12 includes a conductor material.

In one embodiment, the polishing pad surface morphology detecting device may further include a flexible electrode integration module 13 so that the plurality of second electrodes 12 can be attached to the flexible electrode integration module 13 and electrically connected. The plurality of second electrodes 12 described above may be brought into substantial contact with the second surface 22b of the polishing pad 22. The material of the flexible electrode integration module 13 can be a recyclable material, and can follow the surface deformation of the polishing pad to measure the surface morphology of the polishing pad. The material of the flexible electrode integration module 13 is, for example, an organic material or a polymer material. In an embodiment, the second electrode 12 can be integrated into the flexible electrode integration module 13 to reduce the wear of the second electrode 12. The second electrode 12 can be suspended from top to bottom close to the polishing pad, and like the polishing head, the fixed downforce can be controlled.

The control module 14 connects the first electrode 10 and the second electrode 12, and detects the plurality of capacitances C ₁ , C ₂ , C ₃ , ... between the first electrode 10 and the second electrode 12 through the principle of the plate capacitor. C _n to obtain thicknesses d ₁ , d ₂ , d ₃ , ... d _{n of the} polishing pad 22 in each region. The formula for its calculation is as follows:

C _n = ε ₀ A/d _n

Where A is the plate area, dn is the thickness of the polishing pad 22, and n is the number of second electrodes. The surface morphology of the second surface 22b can be known by the thickness of the obtained polishing pad 22 in each region, and the control module 14 can adjust the control polishing condition or timely remind or stop according to the obtained surface shape information.

Furthermore, the control module 14 can be connected to the polishing pad conditioner 24, the polishing head 25, and the polishing table 20 to control the parameters of the polishing pad conditioner 24, the polishing head 25, and the polishing table 20. The parameters of the polishing pad conditioner 24, the polishing head 25, and the polishing table 20 include the rotational speed, the downward pressure, or the sweep frequency. The control module 14 can also be connected to the slurry supply module line 26 for controlling the flow rate of the slurry supplied by the slurry supply module line 26. When the thickness of the obtained polishing pad 22 in the first region is larger than the thickness of the second region, or when the thickness of the first region is larger than the average thickness of all the regions measured, the polishing pad conditioner 24 can be adjusted and ground. The head 25, the rotational speed of the first stage, the downforce or the sweep frequency of the polishing table 20, or the flow rate of the slurry supplied to the first area by the slurry supply module line 26 to increase the polishing pad 22 in the first zone Abrasion; or adjusting the polishing pad conditioner 24, the polishing head 25, the rotational speed of the polishing table 20 in the second region, the downforce or the sweep frequency, or adjusting the slurry supplied to the second region by the slurry supply module line 26. The flow rate to reduce the wear of the polishing pad 22 in the second zone, such that the difference in wear of the polishing pad between the first zone and the second zone is reduced, or the difference in wear between the first zone and the other zone is reduced. . The polishing pad conditioner 24 can be adjusted when the resulting polishing pad 22 has a thickness in the first region that is smaller than the thickness of the second region, or when the thickness of the first region is smaller than the average thickness of all of the measured regions. , the grinding head 25, the rotating table 20 in the first zone of the rotational speed, the downforce or the sweep frequency, or adjust the flow rate of the slurry supplied to the first zone by the slurry supply module line 26 to reduce the polishing pad 22 Wear of a zone; or adjusting the rotational pad conditioner 24, the polishing head 25, the rotational speed of the polishing table 20 in the second zone, the downforce or the sweep frequency, or adjusting the supply of the slurry supply module 26 to the second zone The flow rate of the slurry increases the wear of the polishing pad 22 in the second zone, so that the difference in wear of the polishing pad between the first zone and the second zone is reduced, or the polishing pad between the first zone and the other zone is worn. The difference is reduced.

In an embodiment, the control module 14 includes a control unit 16 and a main unit 18. The control unit 16 connects the first electrode 10 and the second electrode 12, and obtains a surface morphology of the polishing pad 22 via a plurality of capacitances between the first electrode 10 and the second electrode 12. The main unit 18 receives the signal of the surface morphology of the polishing pad 22 provided by the control unit 16, and controls the parameters of the polishing pad conditioner 24, the polishing head 25, the polishing table 20, or the slurry supply module line 26 according to the signal. The flow rate of the slurry provided. In an embodiment, the main unit 18 may further include a warning device to issue a warning when the surface morphology of the polishing pad 22 reaches a critical value. The critical values described herein are, for example, the difference in thickness of the polishing pad 22 in different regions, the minimum thickness value of the polishing pad 22 in a particular region or an unspecified region.

In short, the above-mentioned polishing pad surface morphology detecting device can form a closed loop system (CLOSE LOOP system), and the parameters can be adjusted through the control module (down pressure, rotational speed, flow rate of the slurry or sweep frequency), and a warning can be issued. The message is promptly reminded or stopped, so that the polishing pad can be used to maximize efficiency, and the abnormal wear of the polishing pad can be immediately found, thereby reducing the abnormality, thereby improving the quality of the polishing and prolonging the service life of the polishing pad.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10. . . First electrode

12. . . Second electrode

13‧‧‧Soft electrode integration module

14‧‧‧Control Module

16‧‧‧Control unit

18‧‧‧Main unit

20‧‧‧ polishing table

22‧‧‧ polishing pad

22a‧‧‧ first surface

22b‧‧‧ second surface

24‧‧‧ polishing pad dresser

25‧‧‧ polishing head

26‧‧‧grinding fluid supply module piping

100‧‧‧ polishing pad surface shape detecting device

200‧‧‧Chemical mechanical grinding machine

1 is a cross-sectional view showing a surface morphology detecting device of a polishing pad according to an embodiment of the invention.

Figure 2 is a diagram showing a chemical mechanical polishing machine having means for detecting the surface morphology of the polishing pad.

10. . . First electrode

12. . . Second electrode

13. . . Flexible electrode integration module

14. . . Control module

16. . . control unit

18. . . Main unit

20. . . Grinding table

twenty two. . . Abrasive pad

22a. . . First surface

22b. . . Second surface

twenty four. . . Abrasive pad dresser

25. . . Grinding head

26. . . Slurry supply module piping

100. . . Abrasive pad surface shape detecting device

200. . . Chemical mechanical grinding machine

Claims (16)

A chemical mechanical polishing machine capable of self-detecting a polishing pad configuration, comprising: a polishing table; a polishing pad disposed on the polishing table; a first electrode disposed on the polishing table and the first of the polishing pad Between the surfaces; a plurality of second electrodes disposed on a second surface of the polishing pad, wherein the second electrode is in direct contact with the second surface of the polishing pad; and a control module connecting the first electrode And the second electrode, the surface morphology of the second surface of the polishing pad can be obtained by measuring a plurality of capacitances between the first electrode and the second electrode, thereby controlling the polishing conditions. The chemical mechanical polishing machine capable of self-detecting the polishing pad configuration according to claim 1, further comprising a polishing pad dresser, a polishing head, and a slurry flow controller, which are disposed above the polishing pad, and the above Controlling the polishing conditions controls the parameters of the polishing dresser, the polishing head, the polishing table, and the slurry flow controller. A chemical mechanical polishing machine capable of self-detecting a polishing pad configuration as described in claim 2, wherein the parameters of the polishing pad dresser, the polishing head, and the polishing table include a rotational speed, a downward pressure, or a sweep frequency. The chemical mechanical polishing machine capable of self-detecting the polishing pad configuration according to the first aspect of the patent application, further comprising a slurry supply module pipeline, wherein the controlled polishing condition controls the slurry supply module pipeline The flow rate of the slurry provided. The chemical mechanical polishing machine capable of self-detecting the polishing pad configuration according to the first aspect of the invention, wherein the control module comprises: a control unit connecting the first electrode and the second electrode and the main unit; And measuring a plurality of capacitances between the first electrode and the second electrode to obtain a surface morphology of the polishing pad, and providing a signal of a surface morphology of the polishing pad to the main unit; and a main unit, Receiving a signal of the surface morphology of the polishing pad provided by the control unit, and controlling a polishing pad conditioner, parameters of the polishing head, or a flow rate of the slurry provided by the slurry supply module pipeline according to the signal. A chemical mechanical polishing machine for self-detecting a polishing pad configuration according to claim 5, wherein the main unit further comprises a warning device for issuing a warning message when the surface morphology of the polishing pad reaches a critical value. The chemical mechanical polishing machine for self-detecting the polishing pad configuration according to the first aspect of the patent application, further comprising a flexible electrode integration module, wherein the second electrode is attached to the flexible electrode integration module, so that The second electrode is in substantial contact with the second surface of the polishing pad. A polishing pad surface morphology detecting device includes: a first electrode disposed on a first surface of a polishing pad; and a plurality of second electrodes disposed on a second surface of the polishing pad, wherein the second electrode Directly contacting the second surface of the polishing pad; and a control module connecting the first electrode and the second electrode, and obtaining a plurality of capacitances between the first electrode and the second electrode a surface morphology of the second surface of the polishing pad, and thereby controlling the abrasive strip Pieces. The polishing pad surface morphology detecting device of claim 8, wherein the control module is further connected to a polishing pad conditioner for controlling parameters of the polishing pad conditioner and the polishing head. The polishing pad surface morphology detecting device according to claim 9, wherein the polishing pad conditioner, the parameters of the polishing head include a rotational speed, a downward pressure, or a sweep frequency. The polishing pad surface morphology detecting device according to claim 8, wherein the control module is further connected to a slurry supply module pipeline for controlling the slurry provided by the slurry supply module pipeline. flow. The polishing pad surface morphology detecting device of claim 8, wherein the control module comprises: a control unit connecting the first electrode and the second electrode and the main unit, and measuring the first a plurality of capacitances between the electrode and the second electrode to obtain a surface morphology of the polishing pad, and providing a signal of a surface morphology of the polishing pad to the main unit; and a main unit receiving the same provided by the control unit A signal of the surface morphology of the polishing pad, and according to the signal, a polishing pad conditioner, a parameter of the polishing head, or a flow rate of the slurry provided by the slurry supply module pipeline. The polishing pad surface morphology detecting device according to claim 12, wherein the main unit further comprises a warning device for issuing a warning when the surface morphology of the polishing pad reaches a critical value. Surface morphology inspection of the polishing pad as described in item 8 of the patent application scope The measuring device further includes a flexible electrode integration module, and the second electrode is attached to the flexible electrode integration module such that the second electrode is substantially in contact with the second surface of the polishing pad. A method for detecting a surface morphology of a polishing pad, comprising: disposing a first electrode on a first surface of a polishing pad; and disposing at least a second electrode on a second surface of the polishing pad, wherein the second electrode The second surface of the polishing pad is in direct contact; and a plurality of capacitances between the first electrode and the second electrode are measured to obtain a surface morphology of the second surface of the polishing pad. The method for detecting the surface morphology of the polishing pad according to claim 15 further includes providing a flexible electrode integration module, wherein the second electrode is attached to the flexible electrode integration module, and the second electrode and the second electrode are The second surface of the polishing pad is in substantial contact.