CN102436991B - Method for reducing electroplating thickness of electrode conducting rod - Google Patents
Method for reducing electroplating thickness of electrode conducting rod Download PDFInfo
- Publication number
- CN102436991B CN102436991B CN201110226367.1A CN201110226367A CN102436991B CN 102436991 B CN102436991 B CN 102436991B CN 201110226367 A CN201110226367 A CN 201110226367A CN 102436991 B CN102436991 B CN 102436991B
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- CN
- China
- Prior art keywords
- conducting rod
- electroplating
- contact rod
- nickel
- electroplating thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 20
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 8
- 239000011733 molybdenum Substances 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims description 9
- 238000003466 welding Methods 0.000 abstract description 8
- 230000002950 deficient Effects 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for reducing the electroplating thickness of an electrode conducting rod, which comprises the following steps that: 1) the surface of the conducting rod made of molybdenum as raw materials is ground until the surface is smooth and flat; 2) the conducting rod obtained in the first step is cut by a cutting machine according to the specified length; 3) the tail end part of the cut conducting rod obtained in the second step is subjected to chamfering, grinding or linear cutting processing; 4) a terminal and the conducting rod obtained in the third step are subjected to full nickel electroplating treatment, and the electroplating thickness is 0.2mum to 0.6mum; 5) the fully nickel electroplated conducting rod obtained in the fourth step are subjected to partial nickel electroplating treatment, and the electroplating thickness is 0.2mum to 1.0mum; and 6) the partially electroplated conducting rod obtained in the fifth step are subjected to heat treatment. The method has the advantages that the fraction defective caused by the peeling during the heat treatment and the problem of gap occurrence after welding are greatly reduced, and the manufacturing cost is further saved.
Description
Technical field.
The present invention relates to a kind of processing method, be specifically related to a kind of method that reduces electroplating thickness of electrode conducting rod.
Background technology
The structure of the electrodes conduct parts of the general magnetron that is used in microwave oven etc., between the lug boss forming in upper terminal and the recess forming in lower terminal, insert filament and be fixed, then insert upper guide torch and be welded and fixed with getter at the inside diameter of filament, in addition lower guide torch and lower terminal being carried out to solder joints to fix lower terminal.For the impact of the electronics in work, should maintain stable intensity, the terminal part of contact rod is carried out to chamfering, line are cut, attrition process, in order to make weldability become more wicked easy operating, a part to molybdenum contact rod or comprehensively carry out nickel plating, weld with the both sides of lower terminal, intrinsic method is to be more than 2 μ m to 5 μ m by the electroplating thickness of nickel.At this moment, the situation of particularly comprehensively electroplating, because the thickness of electroplating is too thick, when welding lower terminal and the weld part of lower guide torch on, nickel dam is diffusion on one side, weld part can not more deeply be entered, and then reduction weld strength, when assembling, there is lower terminal and the situation such as lower guide torch separates, product fraction defective is high, in addition, the material of contact rod is molybdenum, owing to being heating resisting metal originally, there is the feature that welding is difficult, solder joints difficulty, weld part after welding, there is gap in the centre of lower terminal and lower guide torch, be difficult to produce stable parts.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of method that reduces electroplating thickness of electrode conducting rod.
The technical solution adopted for the present invention to solve the technical problems is:
1) the contact rod surface being made up of raw material molybdenum is ground to smooth surface smooth;
2) using cutting machine by step 1) contact rod that obtains length according to the rules cuts;
3) by step 2) end portion of contact rod through cutting that obtains carries out chamfering, grinding and line and cuts processing;
4) by terminal and step 3) contact rod that obtains carries out comprehensive nickel electroplating processes, and its electroplating thickness is: 0.2u～0.6um;
5) by step 4) terminal and contact rod after the comprehensive nickel that obtains is electroplated carry out nickel parcel plating processing, and its electroplating thickness is 0.2um～1.0um;
6) by step 5) the parcel plating terminal after treatment and the contact rod that obtain heat-treat.
The invention has the beneficial effects as follows: carry out nickel plating in a comprehensive or part for contact rod time, electroplating thickness is become to thinner than intrinsic, thereby the area scattering in contact rod welded joint becomes large and diffusivity raising, weld strength is compared with intrinsic intensity, while electroplating after-baking, obviously reduced owing to peeling off the fraction defective causing, had the ability to provide the good contact rod being formed by raw material molybdenum, and the fraction defective that when assembling is produced is minimized, and then save manufacturing expense.
Embodiment
A welding processing that reduces the method for electroplating thickness of electrode conducting rod, step is as follows:
1) the contact rod surface being made up of raw material molybdenum is ground to smooth surface smooth;
2) using cutting machine by step 1) contact rod that obtains length according to the rules cuts;
3) by step 2) end portion of contact rod through cutting that obtains carries out chamfering, grinding and line and cuts processing;
4) by terminal and step 3) contact rod that obtains carries out comprehensive nickel electroplating processes, and its electroplating thickness is: 0.2um～0.6um;
5) by step 4) terminal and contact rod after the comprehensive nickel that obtains is electroplated carry out nickel parcel plating processing, and its electroplating thickness is: 0.2um～1.0um;
6) by step 5) the parcel plating terminal after treatment and the contact rod that obtain heat-treat.
In addition, after above steps processing is processed, between the lug boss forming in upper terminal and the recess that forms in lower terminal, insert filament and be fixed, then insert upper guide torch and be welded and fixed with getter at the inside diameter of filament, in addition lower guide torch and lower terminal being carried out to solder joints to fix lower terminal.
The present invention carries out in nickel electroplating work procedure on to the contact rod being made up of raw material molybdenum, adopt moment solder technology, product nickel dam after welding can melt moment, all flow to end to increase weld strength, then also can reduce processing to component, through reduction furnace high temperature reduction, the thickness of nickel dam can be controlled at claimed range substantially, be specially, thickness while taking comprehensively to electroplate is: 0.2 μ m～0.6 μ m, thickness when parcel plating is: the electro-plating method of 0.2 μ m～1.0 μ m, the method is thinner than intrinsic electroplating thickness 1 μ m～5 μ m.So in the production of goods, and when the solder joints of lower terminal, nickel dam indiffusion and welding performance improve, and the intensity of weld part, is increased to 2.5Kg-cm～3.0Kg-cm from the 1.5Kg-cm2.2Kg-cm of benchmark.In addition, after the thickness attenuation of electroplating, what occur when there is the problem in gap and heat treatment after welding peels off the fraction defective causing, has been reduced to significantly below 0.5% from intrinsic 5～20%, and the fraction defective that when assembling is produced is minimized, and then save manufacturing expense.
In addition, the present invention is not limited to above-mentioned execution mode, as long as it reaches technique effect of the present invention with essentially identical means, all should belong to protection scope of the present invention.
Claims (1)
1. a method that reduces electroplating thickness of electrode conducting rod, is characterized in that: step is as follows:
1) the contact rod surface being made up of raw material molybdenum is ground to smooth surface smooth;
2) using cutting machine by step 1) contact rod that obtains length according to the rules cuts;
3) by step 2) end portion of contact rod through cutting that obtains carries out chamfering, grinding and line and cuts processing;
4) by terminal and step 3) contact rod that obtains carries out comprehensive nickel electroplating processes, and its electroplating thickness is: 0.2um～0.6um;
5) by step 4) terminal and contact rod after the comprehensive nickel that obtains is electroplated carry out nickel parcel plating processing, and its electroplating thickness is: 0.2um～1.0um;
6) by step 5) the parcel plating terminal after treatment and the contact rod that obtain heat-treat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110226367.1A CN102436991B (en) | 2011-08-05 | 2011-08-05 | Method for reducing electroplating thickness of electrode conducting rod |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110226367.1A CN102436991B (en) | 2011-08-05 | 2011-08-05 | Method for reducing electroplating thickness of electrode conducting rod |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102436991A CN102436991A (en) | 2012-05-02 |
| CN102436991B true CN102436991B (en) | 2014-05-21 |
Family
ID=45984990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110226367.1A Expired - Fee Related CN102436991B (en) | 2011-08-05 | 2011-08-05 | Method for reducing electroplating thickness of electrode conducting rod |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102436991B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4870227A (en) * | 1987-01-09 | 1989-09-26 | Sumitomo Electric Industries Ltd. | Spot-welding nickel-plated metal terminal |
| CN1087196A (en) * | 1992-06-11 | 1994-05-25 | Tdk株式会社 | positive temperature coefficient thermistor |
| EP0978720A2 (en) * | 1998-08-03 | 2000-02-09 | Denso Corporation | Gas sensor with ceramic heater |
| CN101494147A (en) * | 2009-03-05 | 2009-07-29 | 东莞市金华电子有限公司 | Paster discharge tube and manufacturing technology |
| CN201347465Y (en) * | 2009-01-22 | 2009-11-18 | 上海科德轧辊表面处理有限公司 | Electrode bar |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01265502A (en) * | 1988-04-16 | 1989-10-23 | Tokuriki Honten Co Ltd | Manufacture of resistance element |
-
2011
- 2011-08-05 CN CN201110226367.1A patent/CN102436991B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4870227A (en) * | 1987-01-09 | 1989-09-26 | Sumitomo Electric Industries Ltd. | Spot-welding nickel-plated metal terminal |
| CN1087196A (en) * | 1992-06-11 | 1994-05-25 | Tdk株式会社 | positive temperature coefficient thermistor |
| EP0978720A2 (en) * | 1998-08-03 | 2000-02-09 | Denso Corporation | Gas sensor with ceramic heater |
| CN201347465Y (en) * | 2009-01-22 | 2009-11-18 | 上海科德轧辊表面处理有限公司 | Electrode bar |
| CN101494147A (en) * | 2009-03-05 | 2009-07-29 | 东莞市金华电子有限公司 | Paster discharge tube and manufacturing technology |
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| Publication number | Publication date |
|---|---|
| CN102436991A (en) | 2012-05-02 |
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Granted publication date: 20140521 Termination date: 20180805 |