JPH01265502A - Manufacture of resistance element - Google Patents
Manufacture of resistance elementInfo
- Publication number
- JPH01265502A JPH01265502A JP9266488A JP9266488A JPH01265502A JP H01265502 A JPH01265502 A JP H01265502A JP 9266488 A JP9266488 A JP 9266488A JP 9266488 A JP9266488 A JP 9266488A JP H01265502 A JPH01265502 A JP H01265502A
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- lead wire
- alloy
- wire
- resistance element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 5
- 239000000956 alloy Substances 0.000 claims abstract description 5
- 229910001020 Au alloy Inorganic materials 0.000 claims abstract description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims abstract description 4
- 229910001252 Pd alloy Inorganic materials 0.000 claims abstract description 4
- 238000005219 brazing Methods 0.000 claims description 8
- 239000011162 core material Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 238000000576 coating method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子回路等に用いる高性能な抵抗素子の製造
方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a high-performance resistance element used in electronic circuits and the like.
以下に従来の技術を図面を用いて説明する。 The conventional technology will be explained below with reference to the drawings.
第５図に示すような円筒状のセラミックからなる担体１
の表面に、所定の抵抗値に応じて５０人〜数千人のＰｔ
層を蒸着法によって形成してお（。A cylindrical ceramic carrier 1 as shown in FIG.
from 50 to several thousand Pt depending on the predetermined resistance value.
The layer is formed by vapor deposition (.
つぎに、Ｆｅ−Ｎｉ合金を芯材としてＰｔを被覆したク
ラッド線によるリード線２に第６図に示すようにヘッダ
ー加工を施してフランジ２ａを形成し、端部２ｂを上記
担体１の両端にそれぞれ挿入して導電性接合用ペースト
、材３を用いて接合し、担体１のＰｔ層に絶縁材のコー
ティングを施して第４図に示すような抵抗素子としてい
た。Next, as shown in FIG. 6, header processing is applied to the lead wire 2, which is a clad wire made of Fe-Ni alloy as a core material and coated with Pt, to form a flange 2a, and the end portions 2b are attached to both ends of the carrier 1. They were each inserted and bonded using a conductive bonding paste and material 3, and the Pt layer of the carrier 1 was coated with an insulating material to form a resistance element as shown in FIG.
以上の技術によると、製造工程中のクラッド線端部の担
体への挿入工程と導電性接合用ペースト材の塗布工程は
手作業であるためにクラッド線と担体の位置ずれや塗布
むら等が生じて製品の歩留まりが悪いという問題がある
。According to the above technology, since the process of inserting the end of the clad wire into the carrier and applying the conductive bonding paste material during the manufacturing process is done manually, misalignment of the clad wire and the carrier, uneven coating, etc. may occur. However, there is a problem that the yield of products is poor.
また、担体は円筒状のセラミックであるためにセラミッ
ク焼成後に偏心が生じやすく、さらに、Ｐｔ等からなる
金属皮膜抵抗層の蒸着工程、リード線を接合後のＰｔ等
からなる金属皮膜抵抗層への絶縁材のコーティング工程
において膜厚にむらが生じ、それ等の相乗作用によって
抵抗素子特性が一定しないという問題がある。In addition, since the carrier is a cylindrical ceramic, eccentricity is likely to occur after firing the ceramic.Furthermore, during the vapor deposition process of the metal film resistance layer made of Pt etc., the metal film resistance layer made of Pt etc. after the lead wires are bonded. There is a problem that unevenness occurs in the film thickness during the coating process of the insulating material, and due to the synergistic effect of these factors, the characteristics of the resistive element are not constant.
本発明は、セラミックによる円柱形の担体の両端面にメ
タライズ加工を施し、周面にＰｔ等からなる金属皮膜抵
抗層を形成しておき、Ｆｅ−Ｎｉ合金を芯材とし、Ｐｔ
を被覆したクラッド線材の端部に頭部を形成してリード
線とし、この頭部にＡｕ合金やＰｄ合金等からなるろう
材を設け、このリード線をろう材によって担体の両端面
のメタライズ面に接合することを特徴とする。In the present invention, both end surfaces of a cylindrical ceramic carrier are metallized, a metal film resistance layer made of Pt or the like is formed on the peripheral surface, a Fe-Ni alloy is used as a core material, and a Pt
A head is formed at the end of the clad wire coated with the clad wire to form a lead wire, a brazing material made of Au alloy, Pd alloy, etc. is provided on the head, and the metalized surface of both end surfaces of the carrier is It is characterized by being joined to.
［実 施 例］ 以下に本発明の一実施例を図面を用いて説明する。[Example] An embodiment of the present invention will be described below with reference to the drawings.
第２図に示す如く、直径０．５ ｍｙｎ、長さ２ｍｍの
円柱状のセラミ・ンクによる担体４の両端面にメタライ
ズ層を形成し、さらに担体４周面に２０００人のＰｔ層
をｙ着法によって形成し、焼成した。As shown in Fig. 2, a metallized layer was formed on both end faces of the carrier 4 made of cylindrical ceramic ink with a diameter of 0.5 min and a length of 2 mm, and a 2,000-layer Pt layer was further deposited on the circumferential surface of the carrier 4. It was formed and fired by a method.
つぎに、５２ＡＩＩｏｙを芯材とし、その周面に１０μ
のＰｔ層を形成したクラッド線にヘッダー加工を施して
第３図に示すような頭部５ａを有するリード綿５を形成
し、その線径は０．２ｍｍ、頭部５ａの径は０．４ ｍ
ｍ、長さ６ ｍｍとした。Next, 52AIIoy was used as the core material, and 10μ
The clad wire on which the Pt layer was formed was subjected to header processing to form a lead cotton 5 having a head 5a as shown in FIG. 3, the wire diameter being 0.2 mm, and the diameter of the head 5a being 0.4 mm. m
m, and the length was 6 mm.
このようにしたリード線５の頭部５ａ上面に８２Ａｕ−
Ｎｉ合金からなるろう材６を設ける。82Au-
A brazing filler metal 6 made of a Ni alloy is provided.
以上の担体４のメタライズ層にリード線５のろう材６を
当接させ、耐熱性のセラミックによる治具によって保持
し、炉中で加熱して第１図に示す如く担体４の両端にリ
ード線５を接続した。The brazing material 6 of the lead wire 5 is brought into contact with the metallized layer of the carrier 4, held by a jig made of heat-resistant ceramic, heated in a furnace, and the lead wires are attached to both ends of the carrier 4 as shown in FIG. 5 was connected.
その後、担体のＰｔ層表面に絶縁材のコーティングを施
して抵抗素子を形成した。Thereafter, the surface of the Pt layer of the carrier was coated with an insulating material to form a resistance element.
以上の実施例に対して比較のために従来の方法によって
従来品を作製した。For comparison with the above examples, a conventional product was manufactured by a conventional method.
それは、第５図に示す担体１は、夕■径０．５ ｍｍ、
内径０．２ ｍｍ、長さ２ ｍｍの円筒状のセラミック
の担体１の外周に上記実施例と同様にＰｔ層を形成して
おく。The carrier 1 shown in FIG. 5 has a diameter of 0.5 mm,
A Pt layer was formed on the outer periphery of a cylindrical ceramic carrier 1 having an inner diameter of 0.2 mm and a length of 2 mm in the same manner as in the above embodiment.
つぎに、上記実施例のクラッド線と同様のクラッド線を
ヘッダー加工によって第６図に示す如く線径０．２ｍｍ
、フランジ径０．４ｍｍ、長さ５ｍｍ、端部長さ０．５
ｍｍのリード線２に形成する。Next, a clad wire similar to the clad wire of the above example was processed into a wire with a wire diameter of 0.2 mm as shown in FIG. 6 by header processing.
, flange diameter 0.4mm, length 5mm, end length 0.5
A lead wire 2 of mm is formed.
このようにしたリード線２の端部に導電性接合用ペース
ト材を塗布した後世体１の両側に挿入して加熱接合し、
担体のＰ を層表面に絶縁材のコーティングを施して抵
抗素子を形成した。The end portions of the lead wires 2 thus prepared are inserted into both sides of the poster body 1 coated with a conductive bonding paste material and bonded by heating.
A resistive element was formed by coating the layer surface of the carrier P with an insulating material.
以上説明した実施例と従来技術の抵抗素子特性を以下の
表に示す。The resistance element characteristics of the embodiments described above and the conventional technology are shown in the table below.
（検数１．０００）
一表一
〔発明の効果〕
以上詳細に説明した本発明によると、セラミックによる
円柱形の担体の両端面にメタライズ加工を施し、周面に
ＰＣ等かなる金属皮膜抵抗層を形成しておき、Ｆｅ−Ｎ
ｉ合金を芯材とし、Ｐｔを被覆したクラッド線材の端部
に頭部を形成してリード線とし、この頭部にＡｕ合金や
Ｐｄ合金等からなるろう材を設け、このリード線をろう
材によって担体′の両端面のメタライズ面に接合するこ
とにより、担体の両端面にリード線を正確にろう付けす
ることができ、しかも担体を円柱形とするとセラミック
焼成後の変形や偏心がおきにくく、その結果製品歩留が
充分に向上し、さらに、抵抗値のばらつきがきわめて低
減してきわめて優れた特性を有する抵抗素子となる効果
を有する。(Number 1.000) Table 1 [Effects of the Invention] According to the present invention described in detail above, both end faces of a cylindrical ceramic carrier are metallized, and the peripheral surface is coated with a metal film resistor such as PC. After forming a layer, Fe-N
A lead wire is formed by forming a head at the end of a clad wire with an i-alloy core and Pt coating, and a brazing material made of Au alloy, Pd alloy, etc. is provided on this head, and this lead wire is used as a brazing material. By joining the metallized surfaces of both end faces of the carrier, it is possible to accurately braze the lead wires to both end faces of the carrier.Moreover, the cylindrical shape of the carrier prevents deformation and eccentricity after ceramic firing. As a result, the product yield is sufficiently improved, and furthermore, the variation in resistance value is extremely reduced, resulting in a resistive element having extremely excellent characteristics.
第１図は本発明による抵抗素子の斜視図、第２図は担体
の斜視図、第３図はリード線の斜視図、第４図は従来例
による抵抗素子の斜視図、第５図は担体の斜視図、第６
図はリード線の斜視図である。
４・・・担体
５・・ ・リード線
６・・・ろう材
紬 ６ 囮Fig. 1 is a perspective view of a resistance element according to the present invention, Fig. 2 is a perspective view of a carrier, Fig. 3 is a perspective view of a lead wire, Fig. 4 is a perspective view of a resistance element according to a conventional example, and Fig. 5 is a perspective view of a carrier. Perspective view of 6th
The figure is a perspective view of the lead wire. 4...Carrier 5... -Lead wire 6...Brazing material pongee 6 Decoy
Claims (1)
ズ加工を施し、周面にＰｔ等からなる金属皮膜抵抗層を
形成しておき、Ｆｅ−Ｎｉ合金を芯材とし、Ｐｔを被覆
したクラッド線材の端部に頭部を形成してリード線とし
、この頭部にＡｕ合金やＰｄ合金等からなるろう材を設
け、このリード線をろう材によって担体の両端面のメタ
ライズ面に接合することを特徴とする抵抗素子の製造方
法。1. Both ends of a cylindrical ceramic carrier are metallized, a metal film resistance layer made of Pt or the like is formed on the circumferential surface, and the end of a clad wire with a core made of Fe-Ni alloy and coated with Pt. A lead wire is formed by forming a head, a brazing material made of an Au alloy, a Pd alloy, etc. is provided on the head, and the lead wire is bonded to the metallized surfaces of both end surfaces of the carrier using the brazing material. A method of manufacturing a resistive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266488A JPH01265502A (en) | 1988-04-16 | 1988-04-16 | Manufacture of resistance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266488A JPH01265502A (en) | 1988-04-16 | 1988-04-16 | Manufacture of resistance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01265502A true JPH01265502A (en) | 1989-10-23 |
Family
ID=14060745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9266488A Pending JPH01265502A (en) | 1988-04-16 | 1988-04-16 | Manufacture of resistance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01265502A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102436991A (en) * | 2011-08-05 | 2012-05-02 | 佛山市海欣光电科技有限公司 | Method for reducing electroplating thickness of electrode conducting rod |
| JP2013197127A (en) * | 2012-03-16 | 2013-09-30 | Mitsubishi Materials Corp | Thermistor element |
-
1988
- 1988-04-16 JP JP9266488A patent/JPH01265502A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102436991A (en) * | 2011-08-05 | 2012-05-02 | 佛山市海欣光电科技有限公司 | Method for reducing electroplating thickness of electrode conducting rod |
| JP2013197127A (en) * | 2012-03-16 | 2013-09-30 | Mitsubishi Materials Corp | Thermistor element |
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