CN102436991A - Method for reducing electroplating thickness of electrode conducting rod - Google Patents

Method for reducing electroplating thickness of electrode conducting rod Download PDF

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Publication number
CN102436991A
CN102436991A CN2011102263671A CN201110226367A CN102436991A CN 102436991 A CN102436991 A CN 102436991A CN 2011102263671 A CN2011102263671 A CN 2011102263671A CN 201110226367 A CN201110226367 A CN 201110226367A CN 102436991 A CN102436991 A CN 102436991A
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CN
China
Prior art keywords
conducting rod
terminal
electroplating
contact rod
nickel
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Application number
CN2011102263671A
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Chinese (zh)
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CN102436991B (en
Inventor
何达强
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FOSHAN HAIXIN PHOTOELECTRICITY TECHNOLOGY Co Ltd
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FOSHAN HAIXIN PHOTOELECTRICITY TECHNOLOGY Co Ltd
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Priority to CN201110226367.1A priority Critical patent/CN102436991B/en
Publication of CN102436991A publication Critical patent/CN102436991A/en
Application granted granted Critical
Publication of CN102436991B publication Critical patent/CN102436991B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a method for reducing the electroplating thickness of an electrode conducting rod, which comprises the following steps that: 1) the surface of the conducting rod made of molybdenum as raw materials is ground until the surface is smooth and flat; 2) the conducting rod obtained in the first step is cut by a cutting machine according to the specified length; 3) the tail end part of the cut conducting rod obtained in the second step is subjected to chamfering, grinding or linear cutting processing; 4) a terminal and the conducting rod obtained in the third step are subjected to full nickel electroplating treatment, and the electroplating thickness is 0.2mum to 0.6mum; 5) the terminal and the fully nickel electroplated conducting rod obtained in the fourth step are subjected to partial nickel electroplating treatment, and the electroplating thickness is 0.2mum to 1.0mum; and 6) the terminal and the partially electroplated conducting rod obtained in the fifth step are subjected to heat treatment. The method has the advantages that the fraction defective caused by the peeling during the heat treatment and the problem of gap occurrence after welding are greatly reduced, and the manufacturing cost is further saved.

Description

A kind of method that reduces electrodes conduct rod electroplating thickness
Technical field
The present invention relates to a kind of processing method, be specifically related to a kind of method that reduces electrodes conduct rod electroplating thickness.
Background technology
The electrodes conduct of the general magnetron that is used in microwave oven etc. is with the structure of parts; Be at the lug boss that forms on the upper terminal with between the recess that forms on the lower terminal; The insertion filament is also fixed; Insert the upper guide torch and weld fixingly with getter at the inside diameter of filament then, in addition lower guide torch and lower terminal are carried out solder joints with the fixed lower part terminal.Impact for the electronics in the work; Should keep stable intensity; The terminal part of contact rod carried out chamfering, line are cut, attrition process, in order to make the weldability easy operating that improves, to the part of molybdenum contact rod or carry out nickel and electroplate comprehensively; Weld with the both sides of lower terminal, intrinsic method is that the electroplating thickness with nickel is more than 2 μ m to the 5 μ m.At this moment, the situation of particularly comprehensively electroplating is because the thickness of electroplating is too thick, when welding on the weld part of lower terminal and lower guide torch; Nickel dam spreads on one side, makes weld part more deeply not enter, and then reduces weld strength, occurs lower terminal and situation such as the lower guide torch separates during assembling; The product fraction defective is high, and in addition, the material of contact rod is a molybdenum; Owing to be heating resisting metal originally, there are the characteristics of welding difficulty, solder joints is difficult; Welding back weld part, the slit appears in the centre of lower terminal and lower guide torch, is difficult to produce stable parts.
Summary of the invention
In order to overcome the deficiency of prior art, the present invention provides a kind of method that reduces electrodes conduct rod electroplating thickness.
The technical solution adopted for the present invention to solve the technical problems is:
1) it is smooth the contact rod surface that is made up of the raw material molybdenum to be ground to smooth surface;
2) use cutting machine that the contact rod length according to the rules that step 1) obtains is cut;
3) with step 2) end portion of contact rod through cutting that obtains carries out chamfering, grinding and line and cuts processing;
4) contact rod that terminal and step 3) is obtained carries out comprehensive nickel electroplating processes, and its electroplating thickness is: 0.2um~0.6um;
5) contact rod after the comprehensive nickel that terminal and step 4) is obtained is electroplated carries out the nickel parcel plating to be handled, and its electroplating thickness is: 0.2um~1.0um;
6) parcel plating that terminal and step 5) is obtained is handled the back contact rod and is heat-treated.
The invention has the beneficial effects as follows: contact rod comprehensively or carry out nickel on the part when electroplating, electroplating thickness is become thinner than intrinsic, thereby the area that scatters on the contact rod welded joint becomes big and diffusivity improves; Weld strength is compared with intrinsic intensity; When electroplating after-baking, obviously reduced, had the ability to provide the good contact rod that constitutes by the raw material molybdenum owing to peel off the fraction defective that causes; And the fraction defective that produces when assembling is minimized, and then save manufacturing expense.
Embodiment
A kind of welding processing that reduces the method for electrodes conduct rod electroplating thickness, step is following:
1) it is smooth the contact rod surface that is made up of the raw material molybdenum to be ground to smooth surface;
2) use cutting machine that the contact rod length according to the rules that step 1) obtains is cut;
3) with step 2) end portion of contact rod through cutting that obtains carries out chamfering, grinding and line and cuts processing;
4) contact rod that terminal and step 3) is obtained carries out comprehensive nickel electroplating processes, and its electroplating thickness is: 0.2um~0.6um;
5) contact rod after the comprehensive nickel that terminal and step 4) is obtained is electroplated carries out the nickel parcel plating to be handled, and its electroplating thickness is: 0.2um~1.0um;
6) parcel plating that terminal and step 5) is obtained is handled the back contact rod and is heat-treated.
In addition; After above-mentioned each step processed; At the lug boss that forms on the upper terminal with between the recess that forms on the lower terminal; Insert filament and also fix, insert the upper guide torch and weld fixingly with getter at the inside diameter of filament then, in addition lower guide torch and lower terminal are carried out solder joints with the fixed lower part terminal.
The present invention carries out having adopted the moment solder technology in the nickel electroplating work procedure on to the contact rod that is made up of the raw material molybdenum, and product nickel dam after welding can melt moment; All flow to the end to increase weld strength; Also can reduce processing to portion's article then, through the reduction furnace high temperature reduction, the thickness of nickel dam can be controlled at claimed range basically; Be specially; Thickness when taking comprehensively to electroplate is: 0.2 μ m~0.6 μ m, the thickness during parcel plating is: the electro-plating method of 0.2 μ m~1.0 μ m, the method is thinner than intrinsic electroplating thickness 1 μ m~5 μ m.In the production of goods and during the solder joints of lower terminal, nickel dam indiffusion and welding performance improve so, and the intensity of weld part is increased to 2.5Kg-cm~3.0Kg-cm from the 1.5Kg-cm.~2.2Kg-cm of benchmark.In addition; After the thickness attenuation of electroplating and since occur when occurring problem and the heat treatment in slit after the welding peel off the fraction defective that causes, be reduced to below 0.5% significantly from intrinsic 5~20%; And the fraction defective that produces when assembling is minimized, and then save manufacturing expense.
In addition, the present invention is not limited to above-mentioned execution mode, as long as it reaches technique effect of the present invention with essentially identical means, all should belong to protection scope of the present invention.

Claims (1)

1. method that reduces electrodes conduct rod electroplating thickness, it is characterized in that: step is following:
1) it is smooth the contact rod surface that is made up of the raw material molybdenum to be ground to smooth surface;
2) use cutting machine that the contact rod length according to the rules that step 1) obtains is cut;
3) with step 2) end portion of contact rod through cutting that obtains carries out chamfering, grinding and line and cuts processing;
4) contact rod that terminal and step 3) is obtained carries out comprehensive nickel electroplating processes, and its electroplating thickness is: 0.2um~0.6um;
5) contact rod after the comprehensive nickel that terminal and step 4) is obtained is electroplated carries out the nickel parcel plating to be handled, and its electroplating thickness is: 0.2um~1.0um;
6) parcel plating that terminal and step 5) is obtained is handled the back contact rod and is heat-treated.
CN201110226367.1A 2011-08-05 2011-08-05 Method for reducing electroplating thickness of electrode conducting rod Expired - Fee Related CN102436991B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110226367.1A CN102436991B (en) 2011-08-05 2011-08-05 Method for reducing electroplating thickness of electrode conducting rod

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110226367.1A CN102436991B (en) 2011-08-05 2011-08-05 Method for reducing electroplating thickness of electrode conducting rod

Publications (2)

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CN102436991A true CN102436991A (en) 2012-05-02
CN102436991B CN102436991B (en) 2014-05-21

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CN201110226367.1A Expired - Fee Related CN102436991B (en) 2011-08-05 2011-08-05 Method for reducing electroplating thickness of electrode conducting rod

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870227A (en) * 1987-01-09 1989-09-26 Sumitomo Electric Industries Ltd. Spot-welding nickel-plated metal terminal
JPH01265502A (en) * 1988-04-16 1989-10-23 Tokuriki Honten Co Ltd Manufacture of resistance element
CN1087196A (en) * 1992-06-11 1994-05-25 Tdk株式会社 positive temperature coefficient thermistor
EP0978720A2 (en) * 1998-08-03 2000-02-09 Denso Corporation Gas sensor with ceramic heater
CN101494147A (en) * 2009-03-05 2009-07-29 东莞市金华电子有限公司 Paster discharge tube and manufacturing technology
CN201347465Y (en) * 2009-01-22 2009-11-18 上海科德轧辊表面处理有限公司 Electrode bar

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4870227A (en) * 1987-01-09 1989-09-26 Sumitomo Electric Industries Ltd. Spot-welding nickel-plated metal terminal
JPH01265502A (en) * 1988-04-16 1989-10-23 Tokuriki Honten Co Ltd Manufacture of resistance element
CN1087196A (en) * 1992-06-11 1994-05-25 Tdk株式会社 positive temperature coefficient thermistor
EP0978720A2 (en) * 1998-08-03 2000-02-09 Denso Corporation Gas sensor with ceramic heater
CN201347465Y (en) * 2009-01-22 2009-11-18 上海科德轧辊表面处理有限公司 Electrode bar
CN101494147A (en) * 2009-03-05 2009-07-29 东莞市金华电子有限公司 Paster discharge tube and manufacturing technology

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Granted publication date: 20140521

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